Wireless energy transfer with multi resonator arrays for vehicle applications

ABSTRACT

A vehicle powering wireless receiver for use with a first electromagnetic resonator coupled to a power supply. The wireless receiver includes a load configured to power the drive system of a vehicle using electrical power, and a second electromagnetic resonator adapted to be housed upon the vehicle and configured to be coupled to the load, at least one other electromagnetic resonator configured with the first electromagnetic resonator and the second electromagnetic resonator in an array of electromagnetic resonators to distribute power over an area, wherein the second electromagnetic resonator is configured to be wirelessly coupled to the array to provide resonant, non-radiative wireless power to the second electromagnetic resonator from the first electromagnetic resonator.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of U.S. Ser. No. 13/232,868filed Sep. 14, 2011.

This application is a continuation-in-part of U.S. Ser. No. 12/899,281filed Oct. 6, 2010.

This application is a continuation-in-part of U.S. Ser. No. 12/860,375filed Oct. 20, 2010.

This application is a continuation-in-part of U.S. Ser. No. 12/722,050filed Mar. 11, 2010.

This application is a continuation-in-part of U.S. Ser. No. 12/612,880filed Nov. 5, 2009.

This application claims the benefit of U.S. Provisional patentapplication 61/523,998 filed Aug. 16, 2011.

The application Ser. No. 12/722,050 is a continuation-in-part of U.S.Ser. No. 12/698,523 filed Feb. 2, 2010 which claims the benefit of U.S.Provisional patent application 61/254,559 filed Oct. 23, 2009. Theapplication Ser. No. 12/698,523 is a continuation-in-part of U.S. Ser.No. 12/567,716 filed Sep. 25, 2009.

The application Ser. No. 12/612,880 is a continuation-in-part of U.S.Ser. No. 12/567,716 filed Sep. 25, 2009 and claims the benefit of U.S.Provisional App. No. 61/254,559 filed Oct. 23, 2009.

The application Ser. No. 12/899,281 is a continuation-in-part of U.S.Ser. No. 12/770,137 filed Apr. 29, 2010, a continuation-in-part of U.S.Ser. No. 12/721,118 filed, Mar. 10, 2010, a continuation-in-part of U.S.Ser. No. 12/613,686 filed Nov. 6, 2009.

The application Ser. No. 12/613,686 is a continuation of U.S.application Ser. No. 12/567,716 filed Sep. 25, 2009.

The application Ser. No. 13/232,868 claims the benefit of U.S.Provisional Appl. No. 61/382,806 filed Sep. 14, 2010.

The application Ser. No. 13/232,868 is a continuation-in-part of U.S.Ser. No. 13/222,915 filed Aug. 31, 2011 which claims the benefit of U.S.Provisional Appl. No. 61/378,600 filed Aug. 31, 2010 and U.S.Provisional Appl. No. 61/411,490 filed Nov. 9, 2010.

The application Ser. No. 13/222,915 is a continuation-in-part of U.S.Ser. No. 13/154,131 filed Jun. 6, 2011 which claims the benefit of U.S.Provisional Appl. No. 61/351,492 filed Jun. 4, 2010.

The application Ser. No. 13/154,131 is a continuation-in-part of U.S.Ser. No. 13/090,369 filed Apr. 20, 2011 which claims the benefit of U.S.Provisional Appl. No. 61/326,051 filed Apr. 20, 2010.

The application Ser. No. 13/090,369 application is acontinuation-in-part of U.S. patent application Ser. No. 13/021,965filed Feb. 7, 2011 which is a continuation-in-part of U.S. patentapplication Ser. No. 12/986,018 filed Jan. 6, 2011, which claims thebenefit of U.S. Provisional Appl. No. 61/292,768 filed Jan. 6, 2010.

The application Ser. No. 13/154,131 is also a continuation-in-part ofU.S. patent application Ser. No. 12/986,018 filed Jan. 6, 2011 whichclaims the benefit of U.S. Provisional Appl. No. 61/292,768 filed Jan.6, 2010.

The application Ser. No. 12/986,018 is a continuation-in-part of U.S.patent application Ser. No. 12/789,611 filed May 28, 2010.

The application Ser. No. 12/789,611 is a continuation-in-part of U.S.patent application Ser. No. 12/770,137 filed Apr. 29, 2010 which claimsthe benefit of U.S. Provisional Application No. 61/173,747 filed Apr.29, 2009.

The application Ser. No. 12/770,137 is a continuation-in-part of U.S.application Ser. No. 12/767,633 filed Apr. 26, 2010, which claims thebenefit of U.S. Provisional Application No. 61/172,633 filed Apr. 24,2009.

Application Ser. No. 12/767,633 is a continuation-in-part of U.S.application Ser. No. 12/759,047 filed Apr. 13, 2010.

Application Ser. No. 12/860,375 is a continuation-in-part of U.S.application Ser. No. 12/759,047 filed Apr. 13, 2010.

Application Ser. No. 12/759,047 is a continuation-in-part of U.S.application Ser. No. 12/757,716 filed Apr. 9, 2010, which is acontinuation-in-part of U.S. application Ser. No. 12/749,571 filed Mar.30, 2010.

The application Ser. No. 12/749,571 is a continuation-in-part of thefollowing U.S. Applications: U.S. application Ser. No. 12/639,489 filedDec. 16, 2009; U.S. application Ser. No. 12/647,705 filed Dec. 28, 2009,and U.S. application Ser. No. 12/567,716 filed Sep. 25, 2009.

U.S. application Ser. No. 12/567,716 claims the benefit of the followingU.S. Provisional patent applications: U.S. App. No. 61/100,721 filedSep. 27, 2008; U.S. App. No. 61/108,743 filed Oct. 27, 2008; U.S. App.No. 61/147,386 filed Jan. 26, 2009; U.S. App. No. 61/152,086 filed Feb.12, 2009; U.S. App. No. 61/178,508 filed May 15, 2009; U.S. App. No.61/182,768 filed Jun. 1, 2009; U.S. App. No. 61/121,159 filed Dec. 9,2008; U.S. App. No. 61/142,977 filed Jan. 7, 2009; U.S. App. No.61/142,885 filed Jan. 6, 2009; U.S. App. No. 61/142,796 filed Jan. 6,2009; U.S. App. No. 61/142,889 filed Jan. 6, 2009; U.S. App. No.61/142,880 filed Jan. 6, 2009; U.S. App. No. 61/142,818 filed Jan. 6,2009; U.S. App. No. 61/142,887 filed Jan. 6, 2009; U.S. ProvisionalApplication No. 61/152,390 filed Feb. 13, 2009; U.S. App. No. 61/156,764filed Mar. 2, 2009; U.S. App. No. 61/143,058 filed Jan. 7, 2009; U.S.App. No. 61/163,695 filed Mar. 26, 2009; U.S. App. No. 61/172,633 filedApr. 24, 2009; U.S. App. No. 61/169,240 filed Apr. 14, 2009, U.S. App.No. 61/173,747 filed Apr. 29, 2009.

The application Ser. No. 12/757,716 is a continuation-in-part of U.S.application Ser. No. 12/721,118 filed Mar. 10, 2010.

The application Ser. No. 12/721,118 is a continuation-in-part of U.S.application Ser. No. 12/705,582 filed Feb. 13, 2010.

The application Ser. No. 12/705,582 claims the benefit of U.S.Provisional Application No. 61/152,390 filed Feb. 13, 2009.

Each of the foregoing applications is incorporated herein by referencein its entirety.

BACKGROUND

1. Field

This disclosure relates to wireless energy transfer, also referred to aswireless power transmission.

2. Description of the Related Art

Energy or power may be transferred wirelessly using a variety of knownradiative, or far-field, and non-radiative, or near-field, techniques.For example, radiative wireless information transfer usinglow-directionality antennas, such as those used in radio and cellularcommunications systems and home computer networks, may be consideredwireless energy transfer. However, this type of radiative transfer isvery inefficient because only a tiny portion of the supplied or radiatedpower, namely, that portion in the direction of, and overlapping with,the receiver is picked up. The vast majority of the power is radiatedaway in all the other directions and lost in free space. Suchinefficient power transfer may be acceptable for data transmission, butis not practical for transferring useful amounts of electrical energyfor the purpose of doing work, such as for powering or chargingelectrical devices. One way to improve the transfer efficiency of someradiative energy transfer schemes is to use directional antennas toconfine and preferentially direct the radiated energy towards areceiver. However, these directed radiation schemes may require anuninterruptible line-of-sight and potentially complicated tracking andsteering mechanisms in the case of mobile transmitters and/or receivers.In addition, such schemes may pose hazards to objects or people thatcross or intersect the beam when modest to high amounts of power arebeing transmitted. A known non-radiative, or near-field, wireless energytransfer scheme, often referred to as either induction or traditionalinduction, does not (intentionally) radiate power, but uses anoscillating current passing through a primary coil, to generate anoscillating magnetic near-field that induces currents in a near-byreceiving or secondary coil. Traditional induction schemes havedemonstrated the transmission of modest to large amounts of power,however only over very short distances, and with very small offsettolerances between the primary power supply unit and the secondaryreceiver unit. Electric transformers and proximity chargers are examplesof devices that utilize this known short range, near-field energytransfer scheme.

Therefore a need exists for a wireless power transfer scheme that iscapable of transferring useful amounts of electrical power overmid-range distances or alignment offsets. Such a wireless power transferscheme should enable useful energy transfer over greater distances andalignment offsets than those realized with traditional inductionschemes, but without the limitations and risks inherent in radiativetransmission schemes.

SUMMARY

There is disclosed herein a non-radiative or near-field wireless energytransfer scheme that is capable of transmitting useful amounts of powerover mid-range distances and alignment offsets. This inventive techniqueuses coupled electromagnetic resonators with long-lived oscillatoryresonant modes to transfer power from a power supply to a power drain.The technique is general and may be applied to a wide range ofresonators, even where the specific examples disclosed herein relate toelectromagnetic resonators. If the resonators are designed such that theenergy stored by the electric field is primarily confined within thestructure and that the energy stored by the magnetic field is primarilyin the region surrounding the resonator. Then, the energy exchange ismediated primarily by the resonant magnetic near-field. These types ofresonators may be referred to as magnetic resonators. If the resonatorsare designed such that the energy stored by the magnetic field isprimarily confined within the structure and that the energy stored bythe electric field is primarily in the region surrounding the resonator.Then, the energy exchange is mediated primarily by the resonant electricnear-field. These types of resonators may be referred to as electricresonators. Either type of resonator may also be referred to as anelectromagnetic resonator. Both types of resonators are disclosedherein.

The omni-directional but stationary (non-lossy) nature of thenear-fields of the resonators we disclose enables efficient wirelessenergy transfer over mid-range distances, over a wide range ofdirections and resonator orientations, suitable for charging, powering,or simultaneously powering and charging a variety of electronic devices.As a result, a system may have a wide variety of possible applicationswhere a first resonator, connected to a power source, is in onelocation, and a second resonator, potentially connected toelectrical/electronic devices, batteries, powering or charging circuits,and the like, is at a second location, and where the distance from thefirst resonator to the second resonator is on the order of centimetersto meters. For example, a first resonator connected to the wiredelectricity grid could be placed on the ceiling of a room, while otherresonators connected to devices, such as robots, vehicles, computers,communication devices, medical devices, and the like, move about withinthe room, and where these devices are constantly or intermittentlyreceiving power wirelessly from the source resonator. From this oneexample, one can imagine many applications where the systems and methodsdisclosed herein could provide wireless power across mid-rangedistances, including consumer electronics, industrial applications,infrastructure power and lighting, transportation vehicles, electronicgames, military applications, and the like.

Energy exchange between two electromagnetic resonators can be optimizedwhen the resonators are tuned to substantially the same frequency andwhen the losses in the system are minimal. Wireless energy transfersystems may be designed so that the “coupling-time” between resonatorsis much shorter than the resonators' “loss-times”. Therefore, thesystems and methods described herein may utilize high quality factor(high-Q) resonators with low intrinsic-loss rates. In addition, thesystems and methods described herein may use sub-wavelength resonatorswith near-fields that extend significantly longer than thecharacteristic sizes of the resonators, so that the near-fields of theresonators that exchange energy overlap at mid-range distances. This isa regime of operation that has not been practiced before and thatdiffers significantly from traditional induction designs.

It is important to appreciate the difference between the high-magneticresonator scheme disclosed here and the known close-range or proximityinductive schemes, namely, that those known schemes do notconventionally utilize high-Q resonators. Using coupled-mode theory(CMT), (see, for example, Waves and Fields in Optoelectronics, H. A.Haus, Prentice Hall, 1984), one may show that a high-Qresonator-coupling mechanism can enable orders of magnitude moreefficient power delivery between resonators spaced by mid-rangedistances than is enabled by traditional inductive schemes. Coupledhigh-Q resonators have demonstrated efficient energy transfer overmid-range distances and improved efficiencies and offset tolerances inshort range energy transfer applications.

The systems and methods described herein may provide for near-fieldwireless energy transfer via strongly coupled high-Q resonators, atechnique with the potential to transfer power levels from picowatts tokilowatts, safely, and over distances much larger than have beenachieved using traditional induction techniques. Efficient energytransfer may be realized for a variety of general systems of stronglycoupled resonators, such as systems of strongly coupled acousticresonators, nuclear resonators, mechanical resonators, and the like, asoriginally described by researchers at M.I.T. in their publications,“Efficient wireless non-radiative mid-range energy transfer”, Annals ofPhysics, vol. 323, Issue 1, p. 34 (2008) and “Wireless Power Transfervia Strongly Coupled Magnetic Resonances”, Science, vol. 317, no. 5834,p. 83, (2007). Disclosed herein are electromagnetic resonators andsystems of coupled electromagnetic resonators, also referred to morespecifically as coupled magnetic resonators and coupled electricresonators, with operating frequencies below 10 GHz.

This disclosure describes wireless energy transfer technologies, alsoreferred to as wireless power transmission technologies. Throughout thisdisclosure, we may use the terms wireless energy transfer, wirelesspower transfer, wireless power transmission, and the like,interchangeably. We may refer to supplying energy or power from asource, an AC or DC source, a battery, a source resonator, a powersupply, a generator, a solar panel, and thermal collector, and the like,to a device, a remote device, to multiple remote devices, to a deviceresonator or resonators, and the like. We may describe intermediateresonators that extend the range of the wireless energy transfer systemby allowing energy to hop, transfer through, be temporarily stored, bepartially dissipated, or for the transfer to be mediated in any way,from a source resonator to any combination of other device andintermediate resonators, so that energy transfer networks, or strings,or extended paths may be realized. Device resonators may receive energyfrom a source resonator, convert a portion of that energy to electricpower for powering or charging a device, and simultaneously pass aportion of the received energy onto other device or mobile deviceresonators. Energy may be transferred from a source resonator tomultiple device resonators, significantly extending the distance overwhich energy may be wirelessly transferred. The wireless powertransmission systems may be implemented using a variety of systemarchitectures and resonator designs. The systems may include a singlesource or multiple sources transmitting power to a single device ormultiple devices. The resonators may be designed to be source or deviceresonators, or they may be designed to be repeaters. In some cases, aresonator may be a device and source resonator simultaneously, or it maybe switched from operating as a source to operating as a device or arepeater. One skilled in the art will understand that a variety ofsystem architectures may be supported by the wide range of resonatordesigns and functionalities described in this application.

In the wireless energy transfer systems we describe, remote devices maybe powered directly, using the wirelessly supplied power or energy, orthe devices may be coupled to an energy storage unit such as a battery,a super-capacitor, an ultra-capacitor, or the like (or other kind ofpower drain), where the energy storage unit may be charged or re-chargedwirelessly, and/or where the wireless power transfer mechanism is simplysupplementary to the main power source of the device. The devices may bepowered by hybrid battery/energy storage devices such as batteries withintegrated storage capacitors and the like. Furthermore, novel batteryand energy storage devices may be designed to take advantage of theoperational improvements enabled by wireless power transmission systems.

Other power management scenarios include using wirelessly supplied powerto recharge batteries or charge energy storage units while the devicesthey power are turned off, in an idle state, in a sleep mode, and thelike. Batteries or energy storage units may be charged or recharged athigh (fast) or low (slow) rates. Batteries or energy storage units maybe trickle charged or float charged. Multiple devices may be charged orpowered simultaneously in parallel or power delivery to multiple devicesmay be serialized such that one or more devices receive power for aperiod of time after which other power delivery is switched to otherdevices. Multiple devices may share power from one or more sources withone or more other devices either simultaneously, or in a timemultiplexed manner, or in a frequency multiplexed manner, or in aspatially multiplexed manner, or in an orientation multiplexed manner,or in any combination of time and frequency and spatial and orientationmultiplexing. Multiple devices may share power with each other, with atleast one device being reconfigured continuously, intermittently,periodically, occasionally, or temporarily, to operate as wireless powersources. It would be understood by one of ordinary skill in the art thatthere are a variety of ways to power and/or charge devices, and thevariety of ways could be applied to the technologies and applicationsdescribed herein.

Wireless energy transfer has a variety of possible applicationsincluding for example, placing a source (e.g. one connected to the wiredelectricity grid) on the ceiling, under the floor, or in the walls of aroom, while devices such as robots, vehicles, computers, PDAs or similarare placed or move freely within the room. Other applications mayinclude powering or recharging electric-engine vehicles, such as busesand/or hybrid cars and medical devices, such as wearable or implantabledevices. Additional example applications include the ability to power orrecharge autonomous electronics (e.g. laptops, cell-phones, portablemusic players, house-hold robots, GPS navigation systems, displays,etc), sensors, industrial and manufacturing equipment, medical devicesand monitors, home appliances and tools (e.g. lights, fans, drills,saws, heaters, displays, televisions, counter-top appliances, etc.),military devices, heated or illuminated clothing, communications andnavigation equipment, including equipment built into vehicles, clothingand protective-wear such as helmets, body armor and vests, and the like,and the ability to transmit power to physically isolated devices such asto implanted medical devices, to hidden, buried, implanted or embeddedsensors or tags, to and/or from roof-top solar panels to indoordistribution panels, and the like.

In one aspect, disclosed herein is a system including a source resonatorhaving a Q-factor Q₁ and a characteristic size x₁, coupled to a powergenerator with direct electrical connections; and a second resonatorhaving a Q-factor Q₂ and a characteristic size x₂, coupled to a loadwith direct electrical connections, and located a distance D from thesource resonator, wherein the source resonator and the second resonatorare coupled to exchange energy wirelessly among the source resonator andthe second resonator in order to transmit power from the power generatorto the load, and wherein √{square root over (Q₁Q₂)} is greater than 100.

Q₁ may be greater than 100 and Q₂ may be less than 100. Q₁ may begreater than 100 and Q₂ may be greater than 100. A useful energyexchange may be maintained over an operating distance from 0 to D, whereD is larger than the smaller of x₁ and x₂. At least one of the sourceresonator and the second resonator may be a coil of at least one turn ofa conducting material connected to a first network of capacitors. Thefirst network of capacitors may include at least one tunable capacitor.The direct electrical connections of at least one of the sourceresonator to the ground terminal of the power generator and the secondresonator to the ground terminal of the load may be made at a point onan axis of electrical symmetry of the first network of capacitors. Thefirst network of capacitors may include at least one tunablebutterfly-type capacitor, wherein the direct electrical connection tothe ground terminal is made on a center terminal of the at least onetunable butterfly-type capacitor. The direct electrical connection of atleast one of the source resonator to the power generator and the secondresonator to the load may be made via a second network of capacitors,wherein the first network of capacitors and the second network ofcapacitors form an impedance matching network. The impedance matchingnetwork may be designed to match the coil to a characteristic impedanceof the power generator or the load at a driving frequency of the powergenerator.

At least one of the first network of capacitors and the second networkof capacitors may include at least one tunable capacitor. The firstnetwork of capacitors and the second network of capacitors may beadjustable to change an impedance of the impedance matching network at adriving frequency of the power generator. The first network ofcapacitors and the second network of capacitors may be adjustable tomatch the coil to the characteristic impedance of the power generator orthe load at a driving frequency of the power generator. At least one ofthe first network of capacitors and the second network of capacitors mayinclude at least one fixed capacitor that reduces a voltage across theat least one tunable capacitor. The direct electrical connections of atleast one of the source resonator to the power generator and the secondresonator to the load may be configured to substantially preserve aresonant mode. At least one of the source resonator and the secondresonator may be a tunable resonator. The source resonator may bephysically separated from the power generator and the second resonatormay be physically separated from the load. The second resonator may becoupled to a power conversion circuit to deliver DC power to the load.The second resonator may be coupled to a power conversion circuit todeliver AC power to the load. The second resonator may be coupled to apower conversion circuit to deliver both AC and DC power to the load.The second resonator may be coupled to a power conversion circuit todeliver power to a plurality of loads.

In another aspect, a system disclosed herein includes a source resonatorhaving a Q-factor Q₁ and a characteristic size x₁, and a secondresonator having a Q-factor Q₂ and a characteristic size x₂, and locateda distance D from the source resonator; wherein the source resonator andthe second resonator are coupled to exchange energy wirelessly among thesource resonator and the second resonator; and wherein √{square rootover (Q₁Q₂)} is greater than 100, and wherein at least one of theresonators is enclosed in a low loss tangent material.

In another aspect, a system disclosed herein includes a source resonatorhaving a Q-factor Q₁ and a characteristic size x₁, and a secondresonator having a Q-factor Q₂ and a characteristic size x₂, and locateda distance D from the source resonator; wherein the source resonator andthe second resonator are coupled to exchange energy wirelessly among thesource resonator and the second resonator, and wherein √{square rootover (Q₁Q₂)} is greater than 100; and wherein at least one of theresonators includes a coil of a plurality of turns of a conductingmaterial connected to a network of capacitors, wherein the plurality ofturns are in a common plane, and wherein a characteristic thickness ofthe at least one of the resonators is much less than a characteristicsize of the at least one of the resonators.

Throughout this disclosure we may refer to the certain circuitcomponents such as capacitors, inductors, resistors, diodes, switchesand the like as circuit components or elements. We may also refer toseries and parallel combinations of these components as elements,networks, topologies, circuits, and the like. We may describecombinations of capacitors, diodes, varactors, transistors, and/orswitches as adjustable impedance networks, tuning networks, matchingnetworks, adjusting elements, and the like. We may also refer to“self-resonant” objects that have both capacitance, and inductancedistributed (or partially distributed, as opposed to solely lumped)throughout the entire object. It would be understood by one of ordinaryskill in the art that adjusting and controlling variable componentswithin a circuit or network may adjust the performance of that circuitor network and that those adjustments may be described generally astuning, adjusting, matching, correcting, and the like. Other methods totune or adjust the operating point of the wireless power transfer systemmay be used alone, or in addition to adjusting tunable components suchas inductors and capacitors, or banks of inductors and capacitors.

Unless otherwise defined, all technical and scientific terms used hereinhave the same meaning as commonly understood by one of ordinary skill inthe art to which this disclosure belongs. In case of conflict withpublications, patent applications, patents, and other referencesmentioned or incorporated herein by reference, the presentspecification, including definitions, will control.

Any of the features described above may be used, alone or incombination, without departing from the scope of this disclosure. Otherfeatures, objects, and advantages of the systems and methods disclosedherein will be apparent from the following detailed description andfigures.

BRIEF DESCRIPTION OF FIGURES

FIGS. 1 (a) and (b) depict exemplary wireless power systems containing asource resonator 1 and device resonator 2 separated by a distance D.

FIG. 2 shows an exemplary resonator labeled according to the labelingconvention described in this disclosure. Note that there are noextraneous objects or additional resonators shown in the vicinity ofresonator 1.

FIG. 3 shows an exemplary resonator in the presence of a “loading”object, labeled according to the labeling convention described in thisdisclosure.

FIG. 4 shows an exemplary resonator in the presence of a “perturbing”object, labeled according to the labeling convention described in thisdisclosure.

FIG. 5 shows a plot of efficiency, η, vs. strong coupling factor,U=κ/√{square root over (Γ_(s)Γ_(d))}=k√{square root over (Q_(s)Q_(d))}.

FIG. 6 (a) shows a circuit diagram of one example of a resonator (b)shows a diagram of one example of a capacitively-loaded inductor loopmagnetic resonator, (c) shows a drawing of a self-resonant coil withdistributed capacitance and inductance, (d) shows a simplified drawingof the electric and magnetic field lines associated with an exemplarymagnetic resonator of the current disclosure, and (e) shows a diagram ofone example of an electric resonator.

FIG. 7 shows a plot of the “quality factor”, Q (solid line), as afunction of frequency, of an exemplary resonator that may be used forwireless power transmission at MHz frequencies. The absorptive Q (dashedline) increases with frequency, while the radiative Q (dotted line)decreases with frequency, thus leading the overall Q to peak at aparticular frequency.

FIG. 8 shows a drawing of a resonator structure with its characteristicsize, thickness and width indicated.

FIGS. 9 (a) and (b) show drawings of exemplary inductive loop elements.

FIGS. 10 (a) and (b) show two examples of trace structures formed onprinted circuit boards and used to realize the inductive element inmagnetic resonator structures.

FIG. 11 (a) shows a perspective view diagram of a planar magneticresonator, (b) shows a perspective view diagram of a two planar magneticresonator with various geometries, and c) shows is a perspective viewdiagram of a two planar magnetic resonators separated by a distance D.

FIG. 12 is a perspective view of an example of a planar magneticresonator.

FIG. 13 is a perspective view of a planar magnetic resonator arrangementwith a circular resonator coil.

FIG. 14 is a perspective view of an active area of a planar magneticresonator.

FIG. 15 is a perspective view of an application of the wireless powertransfer system with a source at the center of a table powering severaldevices placed around the source.

FIG. 16( a) shows a 3D finite element model of a copper and magneticmaterial structure driven by a square loop of current around the chokepoint at its center. In this example, a structure may be composed of twoboxes made of a conducting material such as copper, covered by a layerof magnetic material, and connected by a block of magnetic material. Theinside of the two conducting boxes in this example would be shieldedfrom AC electromagnetic fields generated outside the boxes and may houselossy objects that might lower the Q of the resonator or sensitivecomponents that might be adversely affected by the AC electromagneticfields. Also shown are the calculated magnetic field streamlinesgenerated by this structure, indicating that the magnetic field linestend to follow the lower reluctance path in the magnetic material. FIG.16( b) shows interaction, as indicated by the calculated magnetic fieldstreamlines, between two identical structures as shown in (a). Becauseof symmetry, and to reduce computational complexity, only one half ofthe system is modeled (but the computation assumes the symmetricalarrangement of the other half).

FIG. 17 shows an equivalent circuit representation of a magneticresonator including a conducting wire wrapped N times around astructure, possibly containing magnetically permeable material. Theinductance is realized using conducting loops wrapped around a structurecomprising a magnetic material and the resistors represent lossmechanisms in the system (R_(wire) for resistive losses in the loop,R_(μ) denoting the equivalent series resistance of the structuresurrounded by the loop). Losses may be minimized to realize high-Qresonators.

FIG. 18 shows a Finite Element Method (FEM) simulation of two highconductivity surfaces above and below a disk composed of lossydielectric material, in an external magnetic field of frequency 6.78MHz. Note that the magnetic field was uniform before the disk andconducting materials were introduced to the simulated environment. Thissimulation is performed in cylindrical coordinates. The image isazimuthally symmetric around the r=0 axis. The lossy dielectric disk has∈_(r)=1 and σ=10 S/m.

FIG. 19 shows a drawing of a magnetic resonator with a lossy object inits vicinity completely covered by a high-conductivity surface.

FIG. 20 shows a drawing of a magnetic resonator with a lossy object inits vicinity partially covered by a high-conductivity surface.

FIG. 21 shows a drawing of a magnetic resonator with a lossy object inits vicinity placed on top of a high-conductivity surface.

FIG. 22 shows a diagram of a completely wireless projector.

FIG. 23 shows the magnitude of the electric and magnetic fields along aline that contains the diameter of the circular loop inductor and alongthe axis of the loop inductor.

FIG. 24 shows a drawing of a magnetic resonator and its enclosure alongwith a necessary but lossy object placed either (a) in the corner of theenclosure, as far away from the resonator structure as possible or (b)in the center of the surface enclosed by the inductive element in themagnetic resonator.

FIG. 25 shows a drawing of a magnetic resonator with a high-conductivitysurface above it and a lossy object, which may be brought into thevicinity of the resonator, but above the high-conductivity sheet.

FIG. 26( a) shows an axially symmetric FEM simulation of a thinconducting (copper) cylinder or disk (20 cm in diameter, 2 cm in height)exposed to an initially uniform, externally applied magnetic field (grayflux lines) along the z-axis. The axis of symmetry is at r=0. Themagnetic streamlines shown originate at z=−∞, where they are spaced fromr=3 cm to r=10 cm in intervals of 1 cm. The axes scales are in meters.FIG. 26 (b) shows the same structure and externally applied field as in(a), except that the conducting cylinder has been modified to include a0.25 mm layer of magnetic material (not visible) with μ_(r)′=40, on itsoutside surface. Note that the magnetic streamlines are deflected awayfrom the cylinder significantly less than in (a).

FIG. 27 shows an axi-symmetric view of a variation based on the systemshown in FIG. 26. Only one surface of the lossy material is covered by alayered structure of copper and magnetic materials. The inductor loop isplaced on the side of the copper and magnetic material structureopposite to the lossy material as shown.

FIG. 28 (a) depicts a general topology of a matching circuit includingan indirect coupling to a high-Q inductive element.

FIG. 28 (b) shows a block diagram of a magnetic resonator that includesa conductor loop inductor and a tunable impedance network. Physicalelectrical connections to this resonator may be made to the terminalconnections.

FIG. 28 (c) depicts a general topology of a matching circuit directlycoupled to a high-Q inductive element.

FIG. 28 (d) depicts a general topology of a symmetric matching circuitdirectly coupled to a high-Q inductive element and drivenanti-symmetrically (balanced drive).

FIG. 28 (e) depicts a general topology of a matching circuit directlycoupled to a high-Q inductive element and connected to ground at a pointof symmetry of the main resonator (unbalanced drive).

FIGS. 29( a) and 29(b) depict two topologies of matching circuitstransformer-coupled (i.e. indirectly or inductively) to a high-Qinductive element. The highlighted portion of the Smith chart in (c)depicts the complex impedances (arising from L and R of the inductiveelement) that may be matched to an arbitrary real impedance Z₀ by thetopology of FIG. 31( b) in the case ωL₂=1/ωC₂.

FIGS. 30( a),(b),(c),(d),(e),(f) depict six topologies of matchingcircuits directly coupled to a high-Q inductive element and includingcapacitors in series with Z₀. The topologies shown in FIGS. 30(a),(b),(c) are driven with a common-mode signal at the input terminals,while the topologies shown in FIGS. 30( d),(e),(f) are symmetric andreceive a balanced drive. The highlighted portion of the Smith chart in30(g) depicts the complex impedances that may be matched by thesetopologies. FIGS. 30( h),(i),(j),(k),(l),(m) depict six topologies ofmatching circuits directly coupled to a high-Q inductive element andincluding inductors in series with Z₀.

FIGS. 31( a),(b),(c) depict three topologies of matching circuitsdirectly coupled to a high-Q inductive element and including capacitorsin series with Z₀. They are connected to ground at the center point of acapacitor and receive an unbalanced drive. The highlighted portion ofthe Smith chart in FIG. 31( d) depicts the complex impedances that maybe matched by these topologies. FIGS. 31( e),(f),(g) depict threetopologies of matching circuits directly coupled to a high-Q inductiveelement and including inductors in series with Z₀.

FIGS. 32( a),(b),(c) depict three topologies of matching circuitsdirectly coupled to a high-Q inductive element and including capacitorsin series with Z₀. They are connected to ground by tapping at the centerpoint of the inductor loop and receive an unbalanced drive. Thehighlighted portion of the Smith chart in (d) depicts the compleximpedances that may be matched by these topologies, (e),(f),(g) depictthree topologies of matching circuits directly coupled to a high-Qinductive element and including inductors in series with Z₀.

FIGS. 33( a),(b),(c),(d),(e),(f) depict six topologies of matchingcircuits directly coupled to a high-Q inductive element and includingcapacitors in parallel with Z₀. The topologies shown in FIGS. 33(a),(b),(c) are driven with a common-mode signal at the input terminals,while the topologies shown in FIGS. 33( d),(e),(f) are symmetric andreceive a balanced drive. The highlighted portion of the Smith chart inFIG. 33( g) depicts the complex impedances that may be matched by thesetopologies. FIGS. 33( h),(i),(j),(k),(l),(m) depict six topologies ofmatching circuits directly coupled to a high-Q inductive element andincluding inductors in parallel with Z₀.

FIGS. 34( a),(b),(c) depict three topologies of matching circuitsdirectly coupled to a high-Q inductive element and including capacitorsin parallel with Z₀. They are connected to ground at the center point ofa capacitor and receive an unbalanced drive. The highlighted portion ofthe Smith chart in (d) depicts the complex impedances that may bematched by these topologies. FIGS. 34( e),(f),(g) depict threetopologies of matching circuits directly coupled to a high-Q inductiveelement and including inductors in parallel with Z₀.

FIGS. 35( a),(b),(c) depict three topologies of matching circuitsdirectly coupled to a high-Q inductive element and including capacitorsin parallel with Z₀. They are connected to ground by tapping at thecenter point of the inductor loop and receive an unbalanced drive. Thehighlighted portion of the Smith chart in FIGS. 35( d),(e), and (f)depict the complex impedances that may be matched by these topologies.

FIGS. 36( a),(b),(c),(d) depict four topologies of networks of fixed andvariable capacitors designed to produce an overall variable capacitancewith finer tuning resolution and some with reduced voltage on thevariable capacitor.

FIGS. 37( a) and 37(b) depict two topologies of networks of fixedcapacitors and a variable inductor designed to produce an overallvariable capacitance.

FIG. 38 depicts a high level block diagram of a wireless powertransmission system.

FIG. 39 depicts a block diagram of an exemplary wirelessly powereddevice.

FIG. 40 depicts a block diagram of the source of an exemplary wirelesspower transfer system.

FIG. 41 shows an equivalent circuit diagram of a magnetic resonator. Theslash through the capacitor symbol indicates that the representedcapacitor may be fixed or variable. The port parameter measurementcircuitry may be configured to measure certain electrical signals andmay measure the magnitude and phase of signals.

FIG. 42 shows a circuit diagram of a magnetic resonator where thetunable impedance network is realized with voltage controlledcapacitors. Such an implementation may be adjusted, tuned or controlledby electrical circuits including programmable or controllable voltagesources and/or computer processors. The voltage controlled capacitorsmay be adjusted in response to data measured by the port parametermeasurement circuitry and processed by measurement analysis and controlalgorithms and hardware. The voltage controlled capacitors may be aswitched bank of capacitors.

FIG. 43 shows an end-to-end wireless power transmission system. In thisexample, both the source and the device contain port measurementcircuitry and a processor. The box labeled “coupler/switch” indicatesthat the port measurement circuitry may be connected to the resonator bya directional coupler or a switch, enabling the measurement, adjustmentand control of the source and device resonators to take place inconjunction with, or separate from, the power transfer functionality.

FIG. 44 shows an end-to-end wireless power transmission system. In thisexample, only the source contains port measurement circuitry and aprocessor. In this case, the device resonator operating characteristicsmay be fixed or may be adjusted by analog control circuitry and withoutthe need for control signals generated by a processor.

FIG. 45 shows an end-to-end wireless power transmission system. In thisexample, both the source and the device contain port measurementcircuitry but only the source contains a processor. Data from the deviceis transmitted through a wireless communication channel, which could beimplemented either with a separate antenna, or through some modulationof the source drive signal.

FIG. 46 shows an end-to-end wireless power transmission system. In thisexample, only the source contains port measurement circuitry and aprocessor. Data from the device is transmitted through a wirelesscommunication channel, which could be implemented either with a separateantenna, or through some modulation of the source drive signal.

FIG. 47 shows coupled magnetic resonators whose frequency and impedancemay be automatically adjusted using algorithms implemented using aprocessor or a computer.

FIG. 48 shows a varactor array.

FIG. 49 shows a device (laptop computer) being wirelessly powered orcharged by a source, where both the source and device resonator arephysically separated from, but electrically connected to, the source anddevice.

FIG. 50 (a) is an illustration of a wirelessly powered or charged laptopapplication where the device resonator is inside the laptop case and isnot visible.

FIG. 50 (b) is an illustration of a wirelessly powered or charged laptopapplication where the resonator is underneath the laptop base and iselectrically connected to the laptop power input by an electrical cable.

FIG. 50 (c) is an illustration of a wirelessly powered or charged laptopapplication where the resonator is attached to the laptop base.

FIG. 50 (d) is an illustration of a wirelessly powered or charged laptopapplication where the resonator is attached to the laptop display.

FIG. 51 is a diagram of rooftop PV panels with wireless power transfer.

FIG. 52 (a) is a diagram showing routing of individual traces in fourlayers of a layered PCB (b) is a perspective three dimensional diagramshowing routing of individual traces and via connections.

FIG. 53 (a) is a diagram showing routing of individual traces in fourlayers of a layered PCB with one of the individual traces highlighted toshow its path through the layer, (b) is a perspective three dimensionaldiagram showing routing of conductor traces and via connection with oneof the conductor traces highlighted to show its path through the layersfor the stranded trace.

FIGS. 54( a) and 54(b) is a diagram showing examples of alternativerouting of individual traces.

FIG. 55 is a diagram showing routing of individual traces in one layerof a PCB.

FIG. 56 is a diagram showing routing direction between conducting layersof a PCB.

FIG. 57 is a diagram showing sharing of via space of two stranded tracesrouted next to each other.

FIGS. 58( a)-(d) are diagrams of cross sections of stranded traces withvarious feature sizes and aspect ratios.

FIG. 59( a) is a plot of wireless power transfer efficiency between afixed size device resonator and different sized source resonators as afunction of separation distance and (b) is a diagram of the resonatorconfiguration used for generating the plot.

FIG. 60( a) is a plot of wireless power transfer efficiency between afixed size device resonator and different sized source resonators as afunction of lateral offset and (b) is a diagram of the resonatorconfiguration used for generating the plot.

FIG. 61 is a diagram of a conductor arrangement of an exemplary systemembodiment.

FIG. 62 is a diagram of another conductor arrangement of an exemplarysystem embodiment.

FIG. 63 is a diagram of an exemplary system embodiment of a sourcecomprising an array of equally sized resonators.

FIG. 64 is a diagram of an exemplary system embodiment of a sourcecomprising an array of multi-sized resonators.

FIG. 65 is a diagram of an exemplary embodiment of an adjustable sizesource comprising planar resonator structures.

FIGS. 66( a)-(d) are diagrams showing usage scenarios for an adjustablesource size.

FIGS. 67( a-b) is a diagram showing resonators with different keep outzones.

FIG. 68 is a diagram showing a resonator with a symmetric keep out zone.

FIG. 69 is a diagram showing a resonator with an asymmetric keep outzone.

FIG. 70 is a diagram showing an application of wireless power transfer.

FIGS. 71( a-b) is a diagram arrays of resonators used to reduce lateraland angular alignment dependence between the source and device.

FIG. 72 is a plot showing the effect of resonator orientation onefficiency due to resonator displacement.

FIGS. 73( a-b) are diagrams showing lateral and angular misalignmentsbetween resonators.

FIGS. 74( a-b) are diagram showing two resonator configurations withrepeater resonators.

FIGS. 75( a-b) are diagram showing two resonator configurations withrepeater resonators.

FIG. 76( a) is a diagram showing a configuration with two repeaterresonators (b) is a diagram showing a resonator configuration with adevice resonator acting as a repeater resonator.

FIG. 77 is a diagram showing under the cabinet lighting application withrepeater resonators.

FIG. 78 is a diagram showing a source integrated into an outlet cover.

FIG. 79 is an exploded view of a resonator enclosure.

FIG. 80 (a) is a vehicle with device resonators mounded on theunderside, (b) is a source resonator integrated into a mat, (c) is avehicle with a device resonator and a source integrated with a mat, and(d) is a robot with a device resonator mounted to the underside.

FIG. 81 is a graph showing capacitance changes due to temperature of oneceramic capacitor.

FIG. 82( a) are example capacitance versus temperature profiles of twocomponents which can be used for passive compensation (b) are examplecapacitance versus temperature profiles of three components which can beused for passive compensations.

FIG. 83 (a) is diagram of a resonator showing the span of the conductor,(b) is a cross section of resonator that has a hollow compartment.

FIG. 84 (a) is an isometric view of a resonator with a conductor shieldcomprising flaps, (b) is a side view of a resonator with a conductorshield comprising flaps.

FIG. 85 is a diagram of a system utilizing a repeater resonator with adesk environment.

FIG. 86 is a diagram of a system utilizing a resonator that may beoperated in multiple modes.

FIG. 87 is a circuit block diagram of the power and control circuitry ofa resonator configured to have multiple modes of operation.

FIG. 88( a) is a block diagram of a configuration of a system utilizinga wireless power converter, (b) is a block diagram of a configuration ofa system utilizing a wireless power converter that may also function asa repeater.

FIG. 89 is a block diagram showing different configurations and uses ofa wireless power converter.

FIG. 90( a) is a block diagram of a wireless power converter that usestwo separate resonators and a AC to DC converter, (b) is a block diagramof a wireless power converter that uses two separate resonators and anAC to AC converter.

FIG. 91 is a circuit block diagram of a wireless power converterutilizing one resonator.

FIGS. 92( a-b) are circuit diagrams of system configurations utilizing awireless power converter with differently sized resonators.

FIG. 93 is a diagram showing relative source and device resonatordimensions to allow lateral displacement or side to side positioninguncertainty of a vehicle.

FIG. 94( a) is a resonator comprising a single block of magneticmaterial, (b-d) are resonator comprising of multiple separate blocks ofmagnetic material.

FIGS. 95( a-c) is an isometric view of resonator configurations used forcomparison of wireless power transfer characteristics between resonatorscomprising one and more than one separate block of magnetic material.

FIG. 96 is an isometric view of a resonator comprising four separateblocks of magnetic material each wrapped with a conductor.

FIG. 97 (a) is a top view of a resonator comprising two blocks ofmagnetic material with staggered conductor windings, (b) is a top viewof a resonator comprising two block of magnetic material shaped todecrease the spacing between them.

FIG. 98 (a) is an isometric view of a resonator with a conductor shield,(b) is an isometric view of an embodiment of a resonator with anintegrated conductor shield, and (c) is an isometric view of a resonatorwith an integrated conductor shield with individual conductor segments.

FIG. 99 (a)(b)(c) are the top, side, and front views of an embodiment ofan integrated resonator-shield structure respectively.

FIG. 100 is an exploded view of an embodiment of an integratedresonator-shield structure.

FIG. 101 (a) is the top view of an embodiment of an integratedresonator-shield structure with symmetric conductor segments on theconductor shield, (b) is an isometric view of another embodiment of anintegrated resonator-shield structure.

FIG. 102 (a) is an isometric view of an integrated resonator-shieldstructure with a cavity in the block of magnetic material, (b) is anisometric view of an embodiment of the conductor parts of the integratedresonator-shield structure.

FIG. 103 is an isometric view of an embodiment of an integratedresonator-shield structure with two dipole moments.

FIG. 104 is a block diagram of a wireless source with a single-endedamplifier.

FIG. 105 is a block diagram of a wireless source with a differentialamplifier.

FIGS. 106 a and 106 b are block diagrams of sensing circuits.

FIGS. 107 a, 107 b, and 107 c are block diagrams of a wireless source.

FIG. 108 is a plot showing the effects of a duty cycle on the parametersof an amplifier.

FIG. 109 is a simplified circuit diagram of a wireless power source witha switching amplifier.

FIG. 110 shows plots of the effects of changes of parameters of awireless power source.

FIG. 111 shows plots of the effects of changes of parameters of awireless power source.

FIGS. 112 a, 112 b, and 112 c are plots showing the effects of changesof parameters of a wireless power source.

FIG. 113 shows plots of the effects of changes of parameters of awireless power source.

FIG. 114 is a simplified circuit diagram of a wireless energy transfersystem comprising a wireless power source with a switching amplifier anda wireless power device.

FIG. 115 shows plots of the effects of changes of parameters of awireless power source.

FIG. 116 is a diagram of a resonator showing possible nonuniformmagnetic field distributions due to irregular spacing between tiles ofmagnetic material.

FIG. 117 is a resonator with an arrangement of tiles in a block ofmagnetic material that may reduce hotspots in the magnetic materialblock.

FIG. 118 a is a resonator with a block of magnetic material comprisingsmaller individual tiles and 118 b and 118 c is the resonator withadditional strips of thermally conductive material used for thermalmanagement.

FIG. 119 is block diagram of a wireless energy transfer system within-band and out-of-band communication channels.

FIG. 120 a and FIG. 120 b are steps that may be used to verify theenergy transfer channel using an out-of-band communication channel.

FIG. 121 is an isometric view of a conductor wire comprising multipleconductor shells.

FIG. 122 is an isometric view of a conductor wire comprising multipleconductor shells.

FIG. 123 is a plot showing the current distributions for a solidconductor wire.

FIG. 124 is a plot showing the current distributions for a conductorwire comprising 25 conductor shells.

FIG. 125 is a plot showing the current distributions for a conductorwire comprising 25 conductor shells.

FIG. 126 is plot showing the ratio of the resistance of an optimizedconducting-shell structure with overall diameter 1 mm to the ACresistance of a solid conductor of the same diameter.

FIG. 127 is plot showing the ratio of the resistance of an optimizedconducting-shell structure with overall diameter 1 mm to the DCresistance of the same conductor (21.6 mΩ/m).

FIG. 128 is plot showing the ratio of the resistance of an optimizedconducting-shell structure with overall diameter 1 mm to the resistancewith the same number of elements, but with shells of (optimized) uniformthickness around a copper core.

FIG. 129 a and FIG. 129 b are diagrams of embodiments of a wirelesspower enabled floor tile.

FIG. 130 is a block diagram of an embodiment of a wireless power enabledfloor tile.

FIG. 131 is diagram of a wireless power enables floor system.

FIG. 132 is diagram of a cuttable sheet of resonators.

FIG. 133 is an embodiment of a surgical robot and a hospital bed withwireless energy sources and devices.

FIG. 134 is an embodiment of a surgical robot and a hospital bed withwireless energy sources and devices.

FIG. 135 a is a medical cart with a wireless energy transfer resonator.FIG. 135 b is a computer cart with a wireless energy transfer resonator.

FIG. 136 is block diagrams of a wireless power surgical apparatus.

FIGS. 137 a and 137 b are block diagrams of a wireless power transfersystem for implantable devices.

FIGS. 138 a, 138 b, 138 c, and 138 d are diagrams depicting source anddevice configurations of wireless energy transfer for implantabledevices.

FIG. 139 is a side view of an automobile parked in a parking areaequipped with a vehicle charging system and corresponding safety system.

FIG. 140 a is an isometric view illustrating use of heat-sensitive paintover a vehicle charging system resonator, and FIG. 140 b is an isometricview illustrating the shape of a source resonator enclosure.

FIG. 141 is a high-level block diagram of a vehicle charger safetysystem in accordance with an embodiment described herein.

FIG. 142 a is an isometric view of an embodiment of a resonator with anarray of temperature sensors and indicators, and FIG. 142 b is anisometric view of an embodiment of a resonator with strip sensors fordetecting heat.

FIG. 143 is a diagram of a wirelessly powered security light.

FIG. 144 is a diagram of locations of wireless power transfer sources ina refrigerator.

FIG. 145 is a diagram of a refrigerator with a built in wireless powertransfer source.

FIG. 146 is a diagram of a refrigerator with external planar sourceresonators and devices.

FIG. 147 is a diagram of a computer and wirelessly powered computerperipherals.

FIG. 148 is a diagram of a computer, wirelessly powered computerperipherals, and a passive repeater resonator.

FIG. 149 is a diagram of a computer showing the active area around thecomputer of a exemplary experimental system configuration.

FIG. 150 is a diagram of power transfer system which uses a passiverepeater resonator at the base of the computer.

FIG. 151 is an exploded view diagram of a computer keyboard withintegrated device magnetic resonator.

FIG. 152 is an exploded view diagram of a computer with an integratedsource magnetic resonator.

FIG. 153 is an exploded view diagram of a computer mouse with anintegrated device magnetic resonator.

DETAILED DESCRIPTION

As described above, this disclosure relates to coupled electromagneticresonators with long-lived oscillatory resonant modes that maywirelessly transfer power from a power supply to a power drain. However,the technique is not restricted to electromagnetic resonators, but isgeneral and may be applied to a wide variety of resonators and resonantobjects. Therefore, we first describe the general technique, and thendisclose electromagnetic examples for wireless energy transfer.

Resonators

A resonator may be defined as a system that can store energy in at leasttwo different forms, and where the stored energy is oscillating betweenthe two forms. The resonance has a specific oscillation mode with aresonant (modal) frequency, f, and a resonant (modal) field. The angularresonant frequency, ω, may be defined as ω=2πf, the resonant wavelength,λ, may be defined as λ=c/f, where c is the speed of light, and theresonant period, T, may be defined as T=1/f=2π/ω. In the absence of lossmechanisms, coupling mechanisms or external energy supplying or drainingmechanisms, the total resonator stored energy, W, would stay fixed andthe two forms of energy would oscillate, wherein one would be maximumwhen the other is minimum and vice versa.

In the absence of extraneous materials or objects, the energy in theresonator 102 shown in FIG. 1 may decay or be lost by intrinsic losses.The resonator fields then obey the following linear equation:

${\frac{\mathbb{d}{a(t)}}{\mathbb{d}t} = {{- {{\mathbb{i}}\left( {\omega - {\mathbb{i}\Gamma}} \right)}}{a(t)}}},$where the variable a(t) is the resonant field amplitude, defined so thatthe energy contained within the resonator is given by |a(t)|². Γ is theintrinsic energy decay or loss rate (e.g. due to absorption andradiation losses).

The Quality Factor, or Q-factor, or Q, of the resonator, whichcharacterizes the energy decay, is inversely proportional to theseenergy losses. It may be defined as Q=Ω*W/P, where P is thetime-averaged power lost at steady state. That is, a resonator 102 witha high-Q has relatively low intrinsic losses and can store energy for arelatively long time. Since the resonator loses energy at its intrinsicdecay rate, 2Γ, its Q, also referred to as its intrinsic Q, is given byQ=ω/2Γ. The quality factor also represents the number of oscillationperiods, T, it takes for the energy in the resonator to decay by afactor of e.

As described above, we define the quality factor or Q of the resonatoras that due only to intrinsic loss mechanisms. A subscript index such asQ₁, indicates the resonator (resonator 1 in this case) to which the Qrefers. FIG. 2 shows an electromagnetic resonator 102 labeled accordingto this convention. Note that in this figure, there are no extraneousobjects or additional resonators in the vicinity of resonator 1.

Extraneous objects and/or additional resonators in the vicinity of afirst resonator may perturb or load the first resonator, therebyperturbing or loading the Q of the first resonator, depending on avariety of factors such as the distance between the resonator and objector other resonator, the material composition of the object or otherresonator, the structure of the first resonator, the power in the firstresonator, and the like. Unintended external energy losses or couplingmechanisms to extraneous materials and objects in the vicinity of theresonators may be referred to as “perturbing” the Q of a resonator, andmay be indicated by a subscript within rounded parentheses, ( ).Intended external energy losses, associated with energy transfer viacoupling to other resonators and to generators and loads in the wirelessenergy transfer system may be referred to as “loading” the Q of theresonator, and may be indicated by a subscript within square brackets, [].

The Q of a resonator 102 connected or coupled to a power generator, g,or load 302, l, may be called the “loaded quality factor” or the “loadedQ” and may be denoted by Q_([g]) or Q_([l]), as illustrated in FIG. 3.In general, there may be more than one generator or load 302 connectedto a resonator 102. However, we do not list those generators or loadsseparately but rather use “g” and “l” to refer to the equivalent circuitloading imposed by the combinations of generators and loads. In generaldescriptions, we may use the subscript “l” to refer to either generatorsor loads connected to the resonators.

In some of the discussion herein, we define the “loading quality factor”or the “loading Q” due to a power generator or load connected to theresonator, as δQ_([l]), where, 1/δQ_([l])≡1/Q_([l])−1/Q. Note that thelarger the loading Q, δQ_([l]), of a generator or load, the less theloaded Q, Q_([l]), deviates from the unloaded Q of the resonator.

The Q of a resonator in the presence of an extraneous object 402, p,that is not intended to be part of the energy transfer system may becalled the “perturbed quality factor” or the “perturbed Q” and may bedenoted by Q_((p)), as illustrated in FIG. 4. In general, there may bemany extraneous objects, denoted as p1,p2, etc., or a set of extraneousobjects {p}, that perturb the Q of the resonator 102. In this case, theperturbed Q may be denoted Q_((p1+p2+ . . . )) or Q_(({p})). Forexample, Q_(1(brick+wood)) may denote the perturbed quality factor of afirst resonator in a system for wireless power exchange in the presenceof a brick and a piece of wood, and Q_(2({office})) may denote theperturbed quality factor of a second resonator in a system for wirelesspower exchange in an office environment.

In some of the discussion herein, we define the “perturbing qualityfactor” or the “perturbing Q” due to an extraneous object, p, asδQ_((p)), where 1/δQ_((p))≡1Q_((p))−1/Q. As stated before, theperturbing quality factor may be due to multiple extraneous objects,p1,p2, etc. or a set of extraneous objects, {p}. The larger theperturbing Q, δQ_((p)), of an object, the less the perturbed Q, Q_((p)),deviates from the unperturbed Q of the resonator.

In some of the discussion herein, we also define Θ_((p))≡Q_((p))/Q andcall it the “quality factor insensitivity” or the “Q-insensitivity” ofthe resonator in the presence of an extraneous object. A subscriptindex, such as Θ_(1(p)), indicates the resonator to which the perturbedand unperturbed quality factors are referring, namely,Θ_(1(p))≡Q_(1(p))/Q₁.

Note that the quality factor, Q, may also be characterized as“unperturbed”, when necessary to distinguish it from the perturbedquality factor, Q_((p)), and “unloaded”, when necessary to distinguishit from the loaded quality factor, Q_([l]). Similarly, the perturbedquality factor, Q_((p)), may also be characterized as “unloaded”, whennecessary to distinguish them from the loaded perturbed quality factor,Q_((p)[l]).

Coupled Resonators

Resonators having substantially the same resonant frequency, coupledthrough any portion of their near-fields may interact and exchangeenergy. There are a variety of physical pictures and models that may beemployed to understand, design, optimize and characterize this energyexchange. One way to describe and model the energy exchange between twocoupled resonators is using coupled mode theory (CMT).

In coupled mode theory, the resonator fields obey the following set oflinear equations:

$\frac{\mathbb{d}{a_{m}(t)}}{\mathbb{d}t} = {{{- {{\mathbb{i}}\left( {\omega_{m} - {\mathbb{i}\Gamma}_{m}} \right)}}{a_{m}(t)}} + {{\mathbb{i}}{\sum\limits_{n \neq m}\;{\kappa_{mn}{a_{n}(t)}}}}}$where the indices denote different resonators and κ_(mn) are thecoupling coefficients between the resonators. For a reciprocal system,the coupling coefficients may obey the relation κ_(mn)=κ_(nm). Notethat, for the purposes of the present specification, far-field radiationinterference effects will be ignored and thus the coupling coefficientswill be considered real. Furthermore, since in all subsequentcalculations of system performance in this specification the couplingcoefficients appear only with their square, κ_(mn) ², we use κ_(mn) todenote the absolute value of the real coupling coefficients.

Note that the coupling coefficient, κ_(mn), from the CMT described aboveis related to the so-called coupling factor, k_(mn), between resonatorsm and n by k_(mn)=2κ_(mn)/√{square root over (ω_(m)ω_(n))}. We define a“strong-coupling factor”, U_(mn), as the ratio of the coupling and lossrates between resonators m and n, by U_(mn)=κ_(mn)/√{square root over(Γ_(m)Γ_(n))}=k_(mn)√{square root over (Q_(m)Q_(n))}.

The quality factor of a resonator m, in the presence of a similarfrequency resonator n or additional resonators, may be loaded by thatresonator n or additional resonators, in a fashion similar to theresonator being loaded by a connected power generating or consumingdevice. The fact that resonator m may be loaded by resonator n and viceversa is simply a different way to see that the resonators are coupled.

The loaded Q's of the resonators in these cases may be denoted asQ_(m[n]) and Q_(n[m]). For multiple resonators or loading supplies ordevices, the total loading of a resonator may be determined by modelingeach load as a resistive loss, and adding the multiple loads in theappropriate parallel and/or series combination to determine theequivalent load of the ensemble.

In some of the discussion herein, we define the “loading quality factor”or the “loading Q_(m)” of resonator m due to resonator n as δQ_(m[n]),where 1/δQ_(m[n])≡1/Q_(m[n])−1/Q_(m). Note that resonator n is alsoloaded by resonator m and its “loading Q_(n)” is given by1/δQ_(n[m])≡1/Q_(n[m])−1/Q_(n).

When one or more of the resonators are connected to power generators orloads, the set of linear equations is modified to:

$\mspace{20mu}{\frac{\mathbb{d}{a_{m}(t)}}{\mathbb{d}t} = {{{- {{\mathbb{i}}\left( {\omega_{m} - {\mathbb{i}\Gamma}_{m}} \right)}}{a_{m}(t)}} + {{\mathbb{i}}{\sum\limits_{n \neq m}\;{\kappa_{m\; n}{a_{n}(t)}}}} - {\kappa_{m}{a_{m}(t)}} + {\sqrt{2\kappa_{m}}{s_{+ m}(t)}}}}$$\mspace{20mu}{{{s_{- m}(t)} = {{\sqrt{2\kappa_{m}}{a_{m}(t)}} - {s_{+ m}(t)}}},}$where s_(+m)(t) and s_(−m)(t) are respectively the amplitudes of thefields coming from a generator into the resonator m and going out of theresonator m either back towards the generator or into a load, defined sothat the power they carry is given by |s_(+m)(t)|² and |s_(−m)(t)|². Theloading coefficients κ_(m) relate to the rate at which energy isexchanged between the resonator m and the generator or load connected toit.

Note that the loading coefficient, κ_(m), from the CMT described aboveis related to the loading quality factor, δQ_(m[l]), defined earlier, byδQ_(m[l])=ω_(m)/2κ_(m).

We define a “strong-loading factor”, U_(m[l]), as the ratio of theloading and loss rates of resonator m,U_(m[l])=κ_(m)/Γ_(m)=Q_(m)/δQ_(m[l]).

FIG. 1( a) shows an example of two coupled resonators 1000, a firstresonator 102S, configured as a source resonator and a second resonator102D, configured as a device resonator. Energy may be transferred over adistance D between the resonators. The source resonator 102S may bedriven by a power supply or generator (not shown). Work may be extractedfrom the device resonator 102D by a power consuming drain or load (e.g.a load resistor, not shown). Let us use the subscripts “s” for thesource, “d” for the device, “g” for the generator, and “l” for the load,and, since in this example there are only two resonators andκ_(sd)=κ_(ds), let us drop the indices on κ_(sd), k_(sd), and U_(sd),and denote them as κ, k, and U, respectively.

The power generator may be constantly driving the source resonator at aconstant driving frequency, f, corresponding to an angular drivingfrequency, ω, where ω=2πf.

In this case, the efficiency, η=|s_(−d)|²/|s_(+s)|², of the powertransmission from the generator to the load (via the source and deviceresonators) is maximized under the following conditions: The sourceresonant frequency, the device resonant frequency and the generatordriving frequency have to be matched, namelyω_(s)=ω_(d)=ω.Furthermore, the loading Q of the source resonator due to the generator,δQ_(s[g]), has to be matched (equal) to the loaded Q of the sourceresonator due to the device resonator and the load, Q_(s[dl]), andinversely the loading Q of the device resonator due to the load,δQ_(d[l]), has to be matched (equal) to the loaded Q of the deviceresonator due to the source resonator and the generator, Q_(d[sg]),namelyδQ _(s[g]) =Q _(s[dl]) and δQ _(d[l]) =Q _(d[sg]).These equations determine the optimal loading rates of the sourceresonator by the generator and of the device resonator by the load as

$U_{d{\lbrack l\rbrack}} = {{\kappa_{d}/\Gamma_{d}} = {{{Q_{d}/\delta}\; Q_{d{\lbrack l\rbrack}}} = {\sqrt{1 + U^{2}} = {\sqrt{1 + \left( {\kappa/\sqrt{\Gamma_{s}\Gamma_{d}}} \right)^{2}} = {{{Q_{s}/\delta}\; Q_{s{\lbrack g\rbrack}}} = {{\kappa_{s}/\Gamma_{s}} = {U_{s{\lbrack g\rbrack}}.}}}}}}}$Note that the above frequency matching and Q matching conditions aretogether known as “impedance matching” in electrical engineering.

Under the above conditions, the maximized efficiency is a monotonicallyincreasing function of only the strong-coupling factor, U=κ/√{squareroot over (Γ_(s)Γ_(d))}=k√{square root over (Q_(s)Q_(d))}, between thesource and device resonators and is given by, η=U²/(1+√{square root over(1+U²)})², as shown in FIG. 5. Note that the coupling efficiency, η, isgreater than 1% when U is greater than 0.2, is greater than 10% when Uis greater than 0.7, is greater than 17% when U is greater than 1, isgreater than 52% when U is greater than 3, is greater than 80% when U isgreater than 9, is greater than 90% when U is greater than 19, and isgreater than 95% when U is greater than 45. In some applications, theregime of operation where U>1 may be referred to as the“strong-coupling” regime.

Since a large U=κ/√{square root over (Γ_(s)Γ_(d))}=(2κ/√{square rootover (ω_(s)ω_(d))}) √{square root over (Q_(s)Q_(d))} is desired incertain circumstances, resonators may be used that are high-Q. The Q ofeach resonator may be high. The geometric mean of the resonator Q's,√{square root over (Q_(s)Q_(d))} may also or instead be high.

The coupling factor, k, is a number between 0≦k≦1, and it may beindependent (or nearly independent) of the resonant frequencies of thesource and device resonators, rather it may determined mostly by theirrelative geometry and the physical decay-law of the field mediatingtheir coupling. In contrast, the coupling coefficient, κ=k√{square rootover (ω_(s)ω_(d))}/2, may be a strong function of the resonantfrequencies. The resonant frequencies of the resonators may be chosenpreferably to achieve a high Q rather than to achieve a low Γ, as thesetwo goals may be achievable at two separate resonant frequency regimes.

A high-Q resonator may be defined as one with Q>100. Two coupledresonators may be referred to as a system of high-Q resonators when eachresonator has a Q greater than 100, Q_(s)>100 and Q_(d)>100. In otherimplementations, two coupled resonators may be referred to as a systemof high-Q resonators when the geometric mean of the resonator Q's isgreater than 100, √{square root over (Q_(s)Q_(d))}>100.

The resonators may be named or numbered. They may be referred to assource resonators, device resonators, first resonators, secondresonators, repeater resonators, and the like. It is to be understoodthat while two resonators are shown in FIG. 1, and in many of theexamples below, other implementations may include three (3) or moreresonators. For example, a single source resonator 102S may transferenergy to multiple device resonators 102D or multiple devices. Energymay be transferred from a first device to a second, and then from thesecond device to the third, and so forth. Multiple sources may transferenergy to a single device or to multiple devices connected to a singledevice resonator or to multiple devices connected to multiple deviceresonators. Resonators 102 may serve alternately or simultaneously assources, devices, or they may be used to relay power from a source inone location to a device in another location. Intermediateelectromagnetic resonators 102 may be used to extend the distance rangeof wireless energy transfer systems. Multiple resonators 102 may bedaisy chained together, exchanging energy over extended distances andwith a wide range of sources and devices. High power levels may be splitbetween multiple sources 102S, transferred to multiple devices andrecombined at a distant location.

The analysis of a single source and a single device resonator may beextended to multiple source resonators and/or multiple device resonatorsand/or multiple intermediate resonators. In such an analysis, theconclusion may be that large strong-coupling factors, U_(mn), between atleast some or all of the multiple resonators is preferred for a highsystem efficiency in the wireless energy transfer. Again,implementations may use source, device and intermediate resonators thathave a high Q. The Q of each resonator may be high. The geometric mean√{square root over (Q_(m)Q_(n))} of the Q's for pairs of resonators mand n, for which a large U_(mn) is desired, may also or instead be high.

Note that since the strong-coupling factor of two resonators may bedetermined by the relative magnitudes of the loss mechanisms of eachresonator and the coupling mechanism between the two resonators, thestrength of any or all of these mechanisms may be perturbed in thepresence of extraneous objects in the vicinity of the resonators asdescribed above.

Continuing the conventions for labeling from the previous sections, wedescribe k as the coupling factor in the absence of extraneous objectsor materials. We denote the coupling factor in the presence of anextraneous object, p, as k_((p)), and call it the “perturbed couplingfactor” or the “perturbed k”. Note that the coupling factor, k, may alsobe characterized as “unperturbed”, when necessary to distinguish fromthe perturbed coupling factor k_((p)).

We define δk_((p))≡k_((p))−k and we call it the “perturbation on thecoupling factor” or the “perturbation on k” due to an extraneous object,p.

We also define β_((p))≡k_((p))/k and we call it the “coupling factorinsensitivity” or the “k-insensitivity”. Lower indices, such asβ_(12(p)), indicate the resonators to which the perturbed andunperturbed coupling factor is referred to, namelyβ_(12(p))≡k_(12(p))/k₁₂.

Similarly, we describe U as the strong-coupling factor in the absence ofextraneous objects. We denote the strong-coupling factor in the presenceof an extraneous object, p, as U_((p)), U_((p))=k_((p))/√{square rootover (Q_(1(p))Q_(2(p)))}{square root over (Q_(1(p))Q_(2(p)))}, and callit the “perturbed strong-coupling factor” or the “perturbed U”. Notethat the strong-coupling factor U may also be characterized as“unperturbed”, when necessary to distinguish from the perturbedstrong-coupling factor U_((p)). Note that the strong-coupling factor Umay also be characterized as “unperturbed”, when necessary todistinguish from the perturbed strong-coupling factor U_((p)).

We define δU_((p))≡U_((p))−U and call it the “perturbation on thestrong-coupling factor” or the “perturbation on U” due to an extraneousobject, p.

We also define Ξ_((p))≡U_((p))/U and call it the “strong-coupling factorinsensitivity” or the “U-insensitivity”. Lower indices, such asΞ_(12(p)), indicate the resonators to which the perturbed andunperturbed coupling factor refers, namely Ξ_(12(p))≡U_(12(p))/U₁₂.

The efficiency of the energy exchange in a perturbed system may be givenby the same formula giving the efficiency of the unperturbed system,where all parameters such as strong-coupling factors, coupling factors,and quality factors are replaced by their perturbed equivalents. Forexample, in a system of wireless energy transfer including one sourceand one device resonator, the optimal efficiency may calculated asη_((p))=[U_((p))/(1+√{square root over (1+U_((p)) ²)})]². Therefore, ina system of wireless energy exchange which is perturbed by extraneousobjects, large perturbed strong-coupling factors, U_(mn(p)), between atleast some or all of the multiple resonators may be desired for a highsystem efficiency in the wireless energy transfer. Source, device and/orintermediate resonators may have a high Q_((p)).

Some extraneous perturbations may sometimes be detrimental for theperturbed strong-coupling factors (via large perturbations on thecoupling factors or the quality factors). Therefore, techniques may beused to reduce the effect of extraneous perturbations on the system andpreserve large strong-coupling factor insensitivites.

Efficiency of Energy Exchange

The so-called “useful” energy in a useful energy exchange is the energyor power that must be delivered to a device (or devices) in order topower or charge the device. The transfer efficiency that corresponds toa useful energy exchange may be system or application dependent. Forexample, high power vehicle charging applications that transferkilowatts of power may need to be at least 80% efficient in order tosupply useful amounts of power resulting in a useful energy exchangesufficient to recharge a vehicle battery, without significantly heatingup various components of the transfer system. In some consumerelectronics applications, a useful energy exchange may include anyenergy transfer efficiencies greater than 10%, or any other amountacceptable to keep rechargeable batteries “topped off” and running forlong periods of time. For some wireless sensor applications, transferefficiencies that are much less than 1% may be adequate for poweringmultiple low power sensors from a single source located a significantdistance from the sensors. For still other applications, where wiredpower transfer is either impossible or impractical, a wide range oftransfer efficiencies may be acceptable for a useful energy exchange andmay be said to supply useful power to devices in those applications. Ingeneral, an operating distance is any distance over which a usefulenergy exchange is or can be maintained according to the principlesdisclosed herein.

A useful energy exchange for a wireless energy transfer in a powering orrecharging application may be efficient, highly efficient, or efficientenough, as long as the wasted energy levels, heat dissipation, andassociated field strengths are within tolerable limits. The tolerablelimits may depend on the application, the environment and the systemlocation. Wireless energy transfer for powering or rechargingapplications may be efficient, highly efficient, or efficient enough, aslong as the desired system performance may be attained for thereasonable cost restrictions, weight restrictions, size restrictions,and the like. Efficient energy transfer may be determined relative tothat which could be achieved using traditional inductive techniques thatare not high-Q systems. Then, the energy transfer may be defined asbeing efficient, highly efficient, or efficient enough, if more energyis delivered than could be delivered by similarly sized coil structuresin traditional inductive schemes over similar distances or alignmentoffsets.

Note that, even though certain frequency and Q matching conditions mayoptimize the system efficiency of energy transfer, these conditions maynot need to be exactly met in order to have efficient enough energytransfer for a useful energy exchange. Efficient energy exchange may berealized so long as the relative offset of the resonant frequencies(|ω_(m)−ω_(n)|/√{square root over (ω_(m)ω_(n))}) is less thanapproximately the maximum among 1/Q_(m(p)), 1/Q_(n(p)) and k_(mn(p)).The Q matching condition may be less critical than the frequencymatching condition for efficient energy exchange. The degree by whichthe strong-loading factors, U_(m[l]), of the resonators due togenerators and/or loads may be away from their optimal values and stillhave efficient enough energy exchange depends on the particular system,whether all or some of the generators and/or loads are Q-mismatched andso on.

Therefore, the resonant frequencies of the resonators may not be exactlymatched, but may be matched within the above tolerances. Thestrong-loading factors of at least some of the resonators due togenerators and/or loads may not be exactly matched to their optimalvalue. The voltage levels, current levels, impedance values, materialparameters, and the like may not be at the exact values described in thedisclosure but will be within some acceptable tolerance of those values.The system optimization may include cost, size, weight, complexity, andthe like, considerations, in addition to efficiency, Q, frequency,strong coupling factor, and the like, considerations. Some systemperformance parameters, specifications, and designs may be far fromoptimal in order to optimize other system performance parameters,specifications and designs.

In some applications, at least some of the system parameters may bevarying in time, for example because components, such as sources ordevices, may be mobile or aging or because the loads may be variable orbecause the perturbations or the environmental conditions are changingetc. In these cases, in order to achieve acceptable matching conditions,at least some of the system parameters may need to be dynamicallyadjustable or tunable. All the system parameters may be dynamicallyadjustable or tunable to achieve approximately the optimal operatingconditions. However, based on the discussion above, efficient enoughenergy exchange may be realized even if some system parameters are notvariable. In some examples, at least some of the devices may not bedynamically adjusted. In some examples, at least some of the sources maynot be dynamically adjusted. In some examples, at least some of theintermediate resonators may not be dynamically adjusted. In someexamples, none of the system parameters may be dynamically adjusted.

Electromagnetic Resonators

The resonators used to exchange energy may be electromagneticresonators. In such resonators, the intrinsic energy decay rates, Γ_(m),are given by the absorption (or resistive) losses and the radiationlosses of the resonator.

The resonator may be constructed such that the energy stored by theelectric field is primarily confined within the structure and that theenergy stored by the magnetic field is primarily in the regionsurrounding the resonator. Then, the energy exchange is mediatedprimarily by the resonant magnetic near-field. These types of resonatorsmay be referred to as magnetic resonators.

The resonator may be constructed such that the energy stored by themagnetic field is primarily confined within the structure and that theenergy stored by the electric field is primarily in the regionsurrounding the resonator. Then, the energy exchange is mediatedprimarily by the resonant electric near-field. These types of resonatorsmay be referred to as electric resonators.

Note that the total electric and magnetic energies stored by theresonator have to be equal, but their localizations may be quitedifferent. In some cases, the ratio of the average electric field energyto the average magnetic field energy specified at a distance from aresonator may be used to characterize or describe the resonator.

Electromagnetic resonators may include an inductive element, adistributed inductance, or a combination of inductances with inductance,L, and a capacitive element, a distributed capacitance, or a combinationof capacitances, with capacitance, C. A minimal circuit model of anelectromagnetic resonator 102 is shown in FIG. 6 a. The resonator mayinclude an inductive element 108 and a capacitive element 104. Providedwith initial energy, such as electric field energy stored in thecapacitor 104, the system will oscillate as the capacitor dischargestransferring energy into magnetic field energy stored in the inductor108 which in turn transfers energy back into electric field energystored in the capacitor 104.

The resonators 102 shown in FIGS. 6( b)(c)(d) may be referred to asmagnetic resonators. Magnetic resonators may be preferred for wirelessenergy transfer applications in populated environments because mosteveryday materials including animals, plants, and humans arenon-magnetic (i.e., μ_(r)≈1), so their interaction with magnetic fieldsis minimal and due primarily to eddy currents induced by thetime-variation of the magnetic fields, which is a second-order effect.This characteristic is important both for safety reasons and because itreduces the potential for interactions with extraneous environmentalobjects and materials that could alter system performance.

FIG. 6 d shows a simplified drawing of some of the electric and magneticfield lines associated with an exemplary magnetic resonator 102B. Themagnetic resonator 102B may include a loop of conductor acting as aninductive element 108 and a capacitive element 104 at the ends of theconductor loop. Note that this drawing depicts most of the energy in theregion surrounding the resonator being stored in the magnetic field, andmost of the energy in the resonator (between the capacitor plates)stored in the electric field. Some electric field, owing to fringingfields, free charges, and the time varying magnetic field, may be storedin the region around the resonator, but the magnetic resonator may bedesigned to confine the electric fields to be close to or within theresonator itself, as much as possible.

The inductor 108 and capacitor 104 of an electromagnetic resonator 102may be bulk circuit elements, or the inductance and capacitance may bedistributed and may result from the way the conductors are formed,shaped, or positioned, in the structure. For example, the inductor 108may be realized by shaping a conductor to enclose a surface area, asshown in FIGS. 6(b)(c)(d). This type of resonator 102 may be referred toas a capacitively-loaded loop inductor. Note that we may use the terms“loop” or “coil” to indicate generally a conducting structure (wire,tube, strip, etc.), enclosing a surface of any shape and dimension, withany number of turns. In FIG. 6 b, the enclosed surface area is circular,but the surface may be any of a wide variety of other shapes and sizesand may be designed to achieve certain system performancespecifications. As an example to indicate how inductance scales withphysical dimensions, the inductance for a length of circular conductorarranged to form a circular single-turn loop is approximately,

${L = {\mu_{0}{x\left( {{\ln\frac{8\; x}{a}} - 2} \right)}}},$where μ₀ is the magnetic permeability of free space, x, is the radius ofthe enclosed circular surface area and, a, is the radius of theconductor used to form the inductor loop. A more precise value of theinductance of the loop may be calculated analytically or numerically.

The inductance for other cross-section conductors, arranged to formother enclosed surface shapes, areas, sizes, and the like, and of anynumber of wire turns, may be calculated analytically, numerically or itmay be determined by measurement. The inductance may be realized usinginductor elements, distributed inductance, networks, arrays, series andparallel combinations of inductors and inductances, and the like. Theinductance may be fixed or variable and may be used to vary impedancematching as well as resonant frequency operating conditions.

There are a variety of ways to realize the capacitance required toachieve the desired resonant frequency for a resonator structure.Capacitor plates 110 may be formed and utilized as shown in FIG. 6 b, orthe capacitance may be distributed and be realized between adjacentwindings of a multi-loop conductor 114, as shown in FIG. 6 c. Thecapacitance may be realized using capacitor elements, distributedcapacitance, networks, arrays, series and parallel combinations ofcapacitances, and the like. The capacitance may be fixed or variable andmay be used to vary impedance matching as well as resonant frequencyoperating conditions.

It is to be understood that the inductance and capacitance in anelectromagnetic resonator 102 may be lumped, distributed, or acombination of lumped and distributed inductance and capacitance andthat electromagnetic resonators may be realized by combinations of thevarious elements, techniques and effects described herein.

Electromagnetic resonators 102 may be include inductors, inductances,capacitors, capacitances, as well as additional circuit elements such asresistors, diodes, switches, amplifiers, diodes, transistors,transformers, conductors, connectors and the like.

Resonant Frequency of an Electromagnetic Resonator

An electromagnetic resonator 102 may have a characteristic, natural, orresonant frequency determined by its physical properties. This resonantfrequency is the frequency at which the energy stored by the resonatoroscillates between that stored by the electric field, W_(E),(W_(E)=q²/2C, where q is the charge on the capacitor, C) and that storedby the magnetic field, W_(B), (W_(B)=Li²/2, where i is the currentthrough the inductor, L) of the resonator. In the absence of any lossesin the system, energy would continually be exchanged between theelectric field in the capacitor 104 and the magnetic field in theinductor 108. The frequency at which this energy is exchanged may becalled the characteristic frequency, the natural frequency, or theresonant frequency of the resonator, and is given by ω,

$\omega = {{2\pi\; f} = {\sqrt{\frac{1}{L\; C}}.}}$

The resonant frequency of the resonator may be changed by tuning theinductance, L, and/or the capacitance, C, of the resonator. Theresonator frequency may be design to operate at the so-called ISM(Industrial, Scientific and Medical) frequencies as specified by theFCC. The resonator frequency may be chosen to meet certain field limitspecifications, specific absorption rate (SAR) limit specifications,electromagnetic compatibility (EMC) specifications, electromagneticinterference (EMI) specifications, component size, cost or performancespecifications, and the like.

Quality Factor of an Electromagnetic Resonator

The energy in the resonators 102 shown in FIG. 6 may decay or be lost byintrinsic losses including absorptive losses (also called ohmic orresistive losses) and/or radiative losses. The Quality Factor, or Q, ofthe resonator, which characterizes the energy decay, is inverselyproportional to these losses. Absorptive losses may be caused by thefinite conductivity of the conductor used to form the inductor as wellas by losses in other elements, components, connectors, and the like, inthe resonator. An inductor formed from low loss materials may bereferred to as a “high-Q inductive element” and elements, components,connectors and the like with low losses may be referred to as having“high resistive Q's”. In general, the total absorptive loss for aresonator may be calculated as the appropriate series and/or parallelcombination of resistive losses for the various elements and componentsthat make up the resonator. That is, in the absence of any significantradiative or component/connection losses, the Q of the resonator may begiven by, Q_(abs),

${Q_{abs} = \frac{\omega\; L}{R_{abs}}},$where ω, is the resonant frequency, L, is the total inductance of theresonator and the resistance for the conductor used to form theinductor, for example, may be given by R_(abs)=lρ/A, (1 is the length ofthe wire, ρ is the resistivity of the conductor material, and A is thecross-sectional area over which current flows in the wire). Foralternating currents, the cross-sectional area over which current flowsmay be less than the physical cross-sectional area of the conductorowing to the skin effect. Therefore, high-Q magnetic resonators may becomposed of conductors with high conductivity, relatively large surfaceareas and/or with specially designed profiles (e.g. Litz wire) tominimize proximity effects and reduce the AC resistance.

The magnetic resonator structures may include high-Q inductive elementscomposed of high conductivity wire, coated wire, Litz wire, ribbon,strapping or plates, tubing, paint, gels, traces, and the like. Themagnetic resonators may be self-resonant, or they may include externalcoupled elements such as capacitors, inductors, switches, diodes,transistors, transformers, and the like. The magnetic resonators mayinclude distributed and lumped capacitance and inductance. In general,the Q of the resonators will be determined by the Q's of all theindividual components of the resonator.

Because Q is proportional to inductance, L, resonators may be designedto increase L, within certain other constraints. One way to increase L,for example, is to use more than one turn of the conductor to form theinductor in the resonator. Design techniques and trade-offs may dependon the application, and a wide variety of structures, conductors,components, and resonant frequencies may be chosen in the design ofhigh-Q magnetic resonators.

In the absence of significant absorption losses, the Q of the resonatormay be determined primarily by the radiation losses, and given by,Q_(rad)=ωL/R_(rad), where R_(rad) is the radiative loss of the resonatorand may depend on the size of the resonator relative to the frequency,ω, or wavelength, λ, of operation. For the magnetic resonators discussedabove, radiative losses may scale as R_(rad)˜(x/λ)⁴ (characteristic ofmagnetic dipole radiation), where x is a characteristic dimension of theresonator, such as the radius of the inductive element shown in FIG. 6b, and where λ=c/f, where c is the speed of light and f is as definedabove. The size of the magnetic resonator may be much less than thewavelength of operation so radiation losses may be very small. Suchstructures may be referred to as sub-wavelength resonators. Radiationmay be a loss mechanism for non-radiative wireless energy transfersystems and designs may be chosen to reduce or minimize R_(rad). Notethat a high-Q_(rad) may be desirable for non-radiative wireless energytransfer schemes.

Note too that the design of resonators for non-radiative wireless energytransfer differs from antennas designed for communication or far-fieldenergy transmission purposes. Specifically, capacitively-loadedconductive loops may be used as resonant antennas (for example in cellphones), but those operate in the far-field regime where the radiationQ's are intentionally designed to be small to make the antenna efficientat radiating energy. Such designs are not appropriate for the efficientnear-field wireless energy transfer technique disclosed in thisapplication.

The quality factor of a resonator including both radiative andabsorption losses is Q=ωL/(R_(abs)+R_(rad)). Note that there may be amaximum Q value for a particular resonator and that resonators may bedesigned with special consideration given to the size of the resonator,the materials and elements used to construct the resonator, theoperating frequency, the connection mechanisms, and the like, in orderto achieve a high-Q resonator. FIG. 7 shows a plot of Q of an exemplarymagnetic resonator (in this case a coil with a diameter of 60 cm made ofcopper pipe with an outside diameter (OD) of 4 cm) that may be used forwireless power transmission at MHz frequencies. The absorptive Q (dashedline) 702 increases with frequency, while the radiative Q (dotted line)704 decreases with frequency, thus leading the overall Q to peak 708 ata particular frequency. Note that the Q of this exemplary resonator isgreater than 100 over a wide frequency range. Magnetic resonators may bedesigned to have high-Q over a range of frequencies and system operatingfrequency may set to any frequency in that range.

When the resonator is being described in terms of loss rates, the Q maybe defined using the intrinsic decay rate, 2Γ, as described previously.The intrinsic decay rate is the rate at which an uncoupled and undrivenresonator loses energy. For the magnetic resonators described above, theintrinsic loss rate may be given by Γ=(R_(abs)+R_(rad))2L, and thequality factor, Q, of the resonator is given by Q=ω/2Γ.

Note that a quality factor related only to a specific loss mechanism maybe denoted as Q_(mechanism), if the resonator is not specified, or asQ_(1,mechanism), if the resonator is specified (e.g. resonator 1). Forexample, Q_(1,rad) is the quality factor for resonator 1 related to itsradiation losses.

Electromagnetic Resonator Near-Fields

The high-Q electromagnetic resonators used in the near-field wirelessenergy transfer system disclosed here may be sub-wavelength objects.That is, the physical dimensions of the resonator may be much smallerthan the wavelength corresponding to the resonant frequency.Sub-wavelength magnetic resonators may have most of the energy in theregion surrounding the resonator stored in their magnetic near-fields,and these fields may also be described as stationary or non-propagatingbecause they do not radiate away from the resonator. The extent of thenear-field in the area surrounding the resonator is typically set by thewavelength, so it may extend well beyond the resonator itself for asub-wavelength resonator. The limiting surface, where the field behaviorchanges from near-field behavior to far-field behavior may be called the“radiation caustic”.

The strength of the near-field is reduced the farther one gets away fromthe resonator. While the field strength of the resonator near-fieldsdecays away from the resonator, the fields may still interact withobjects brought into the general vicinity of the resonator. The degreeto which the fields interact depends on a variety of factors, some ofwhich may be controlled and designed, and some of which may not. Thewireless energy transfer schemes described herein may be realized whenthe distance between coupled resonators is such that one resonator lieswithin the radiation caustic of the other.

The near-field profiles of the electromagnetic resonators may be similarto those commonly associated with dipole resonators or oscillators. Suchfield profiles may be described as omni-directional, meaning themagnitudes of the fields are non-zero in all directions away from theobject.

Characteristic Size of an Electromagnetic Resonator

Spatially separated and/or offset magnetic resonators of sufficient Qmay achieve efficient wireless energy transfer over distances that aremuch larger than have been seen in the prior art, even if the sizes andshapes of the resonator structures are different. Such resonators mayalso be operated to achieve more efficient energy transfer than wasachievable with previous techniques over shorter range distances. Wedescribe such resonators as being capable of mid-range energy transfer.

Mid-range distances may be defined as distances that are larger than thecharacteristic dimension of the smallest of the resonators involved inthe transfer, where the distance is measured from the center of oneresonator structure to the center of a spatially separated secondresonator structure. In this definition, two-dimensional resonators arespatially separated when the areas circumscribed by their inductiveelements do not intersect and three-dimensional resonators are spatiallyseparated when their volumes do not intersect. A two-dimensionalresonator is spatially separated from a three-dimensional resonator whenthe area circumscribed by the former is outside the volume of thelatter.

FIG. 8 shows some example resonators with their characteristicdimensions labeled. It is to be understood that the characteristic sizes802 of resonators 102 may be defined in terms of the size of theconductor and the area circumscribed or enclosed by the inductiveelement in a magnetic resonator and the length of the conductor formingthe capacitive element of an electric resonator. Then, thecharacteristic size 802 of a resonator 102, x_(char), may be equal tothe radius of the smallest sphere that can fit around the inductive orcapacitive element of the magnetic or electric resonator respectively,and the center of the resonator structure is the center of the sphere.The characteristic thickness 804, t_(char), of a resonator 102 may bethe smallest possible height of the highest point of the inductive orcapacitive element in the magnetic or capacitive resonator respectively,measured from a flat surface on which it is placed. The characteristicwidth 808 of a resonator 102, w_(char) may be the radius of the smallestpossible circle through which the inductive or capacitive element of themagnetic or electric resonator respectively, may pass while traveling ina straight line. For example, the characteristic width 808 of acylindrical resonator may be the radius of the cylinder.

In this inventive wireless energy transfer technique, energy may beexchanged efficiently over a wide range of distances, but the techniqueis distinguished by the ability to exchange useful energy for poweringor recharging devices over mid-range distances and between resonatorswith different physical dimensions, components and orientations. Notethat while k may be small in these circumstances, strong coupling andefficient energy transfer may be realized by using high-Q resonators toachieve a high U, U=k/√{square root over (Q_(s)Q_(d))}. That is,increases in Q may be used to at least partially overcome decreases ink, to maintain useful energy transfer efficiencies.

Note too that while the near-field of a single resonator may bedescribed as omni-directional, the efficiency of the energy exchangebetween two resonators may depend on the relative position andorientation of the resonators. That is, the efficiency of the energyexchange may be maximized for particular relative orientations of theresonators. The sensitivity of the transfer efficiency to the relativeposition and orientation of two uncompensated resonators may be capturedin the calculation of either k or κ. While coupling may be achievedbetween resonators that are offset and/or rotated relative to eachother, the efficiency of the exchange may depend on the details of thepositioning and on any feedback, tuning, and compensation techniquesimplemented during operation.

High-Q Magnetic Resonators

In the near-field regime of a sub-wavelength capacitively-loaded loopmagnetic resonator (x<<λ), the resistances associated with a circularconducting loop inductor composed of N turns of wire whose radius islarger than the skin depth, are approximately R_(abs)=√{square root over(μ_(o)ρω/2)}·Nx/a and R_(rad)=π/6·η_(o)N²(ωx/c)⁴, where ρ is theresistivity of the conductor material and η_(o)≈120πΩ is the impedanceof free space. The inductance, L, for such a N-turn loop isapproximately N² times the inductance of a single-turn loop givenpreviously. The quality factor of such a resonator,Q=ωL/(R_(abs)+R_(rad)), is highest for a particular frequency determinedby the system parameters (FIG. 4). As described previously, at lowerfrequencies the Q is determined primarily by absorption losses and athigher frequencies the Q is determined primarily by radiation losses.

Note that the formulas given above are approximate and intended toillustrate the functional dependence of R_(abs), R_(rad) and L on thephysical parameters of the structure. More accurate numericalcalculations of these parameters that take into account deviations fromthe strict quasi-static limit, for example a non-uniform current/chargedistribution along the conductor, may be useful for the precise designof a resonator structure.

Note that the absorptive losses may be minimized by using low lossconductors to form the inductive elements. The loss of the conductorsmay be minimized by using large surface area conductors such asconductive tubing, strapping, strips, machined objects, plates, and thelike, by using specially designed conductors such as Litz wire, braidedwires, wires of any cross-section, and other conductors with lowproximity losses, in which case the frequency scaled behavior describedabove may be different, and by using low resistivity materials such ashigh-purity copper and silver, for example. One advantage of usingconductive tubing as the conductor at higher operating frequencies isthat it may be cheaper and lighter than a similar diameter solidconductor, and may have similar resistance because most of the currentis traveling along the outer surface of the conductor owing to the skineffect.

To get a rough estimate of achievable resonator designs made from copperwire or copper tubing and appropriate for operation in the microwaveregime, one may calculate the optimum Q and resonant frequency for aresonator composed of one circular inductive element (N=1) of copperwire (ρ=1.69·10⁻⁸ Ωm) with various cross sections. Then for an inductiveelement with characteristic size x=1 cm and conductor diameter a=1 mm,appropriate for a cell phone for example, the quality factor peaks atQ=1225 when f=380 MHz. For x=30 cm and a=2 mm, an inductive element sizethat might be appropriate for a laptop or a household robot, Q=1103 atf=17 MHz. For a larger source inductive element that might be located inthe ceiling for example, x=1 m and a=4 mm, Q may be as high as Q=1315 atf=5 MHz. Note that a number of practical examples yield expected qualityfactors of Q≈1000-1500 at λ/x≈50-80. Measurements of a wider variety ofcoil shapes, sizes, materials and operating frequencies than describedabove show that Q's>100 may be realized for a variety of magneticresonator structures using commonly available materials.

As described above, the rate for energy transfer between two resonatorsof characteristic size x₁ and x₂, and separated by a distance D betweentheir centers, may be given by κ. To give an example of how the definedparameters scale, consider the cell phone, laptop, and ceiling resonatorexamples from above, at three (3) distances; D/x=10, 8, 6. In theexamples considered here, the source and device resonators are the samesize, x₁=x₂, and shape, and are oriented as shown in FIG. 1( b). In thecell phone example, ω/2κ=3033, 1553, 655 respectively. In the laptopexample, ω/2κ=7131, 3651, 1540 respectively and for the ceilingresonator example, ω/2κ=6481, 3318, 1400. The correspondingcoupling-to-loss ratios peak at the frequency where the inductiveelement Q peaks and are κ/Γ=0.4, 0.79, 1.97 and 0.15, 0.3, 0.72 and 0.2,0.4, 0.94 for the three inductive element sizes and distances describedabove. An example using different sized inductive elements is that of anx₁=1 m inductor (e.g. source in the ceiling) and an x₂=30 cm inductor(e.g. household robot on the floor) at a distance D=3 m apart (e.g. roomheight). In this example, the strong-coupling figure of merit,U=κ/√{square root over (Γ₁Γ₂)}=0.88, for an efficiency of approximately14%, at the optimal operating frequency of f=6.4 MHz. Here, the optimalsystem operating frequency lies between the peaks of the individualresonator Q's.

Inductive elements may be formed for use in high-Q magnetic resonators.We have demonstrated a variety of high-Q magnetic resonators based oncopper conductors that are formed into inductive elements that enclose asurface. Inductive elements may be formed using a variety of conductorsarranged in a variety of shapes, enclosing any size or shaped area, andthey may be single turn or multiple turn elements. Drawings of exemplaryinductive elements 900A-B are shown in FIG. 9. The inductive elementsmay be formed to enclose a circle, a rectangle, a square, a triangle, ashape with rounded corners, a shape that follows the contour of aparticular structure or device, a shape that follows, fills, orutilizes, a dedicated space within a structure or device, and the like.The designs may be optimized for size, cost, weight, appearance,performance, and the like.

These conductors may be bent or formed into the desired size, shape, andnumber of turns. However, it may be difficult to accurately reproduceconductor shapes and sizes using manual techniques. In addition, it maybe difficult to maintain uniform or desired center-to-center spacingsbetween the conductor segments in adjacent turns of the inductiveelements. Accurate or uniform spacing may be important in determiningthe self capacitance of the structure as well as any proximity effectinduced increases in AC resistance, for example.

Molds may be used to replicate inductor elements for high-Q resonatordesigns. In addition, molds may be used to accurately shape conductorsinto any kind of shape without creating kinks, buckles or otherpotentially deleterious effects in the conductor. Molds may be used toform the inductor elements and then the inductor elements may be removedfrom the forms. Once removed, these inductive elements may be built intoenclosures or devices that may house the high-Q magnetic resonator. Theformed elements may also or instead remain in the mold used to formthem.

The molds may be formed using standard CNC (computer numerical control)routing or milling tools or any other known techniques for cutting orforming grooves in blocks. The molds may also or instead be formed usingmachining techniques, injection molding techniques, casting techniques,pouring techniques, vacuum techniques, thermoforming techniques,cut-in-place techniques, compression forming techniques and the like.

The formed element may be removed from the mold or it may remain in themold. The mold may be altered with the inductive element inside. Themold may be covered, machined, attached, painted and the like. The moldand conductor combination may be integrated into another housing,structure or device. The grooves cut into the molds may be any dimensionand may be designed to form conducting tubing, wire, strapping, strips,blocks, and the like into the desired inductor shapes and sizes.

The inductive elements used in magnetic resonators may contain more thanone loop and may spiral inward or outward or up or down or in somecombination of directions. In general, the magnetic resonators may havea variety of shapes, sizes and number of turns and they may be composedof a variety of conducing materials.

The magnetic resonators may be free standing or they may be enclosed inan enclosure, container, sleeve or housing. The magnetic resonators mayinclude the form used to make the inductive element. These various formsand enclosures may be composed of almost any kind of material. Low lossmaterials such as Teflon, REXOLITE, styrene, and the like may bepreferable for some applications. These enclosures may contain fixturesthat hold the inductive elements.

Magnetic resonators may be composed of self-resonant coils of copperwire or copper tubing. Magnetic resonators composed of self resonantconductive wire coils may include a wire of length l, and cross sectionradius a, wound into a helical coil of radius x, height h, and number ofturns N, which may for example be characterized as N=√{square root over(l²−h²)}/2πx.

A magnetic resonator structure may be configured so that x is about 30cm, h is about 20 cm, a is about 3 mm and N is about 5.25, and, duringoperation, a power source coupled to the magnetic resonator may drivethe resonator at a resonant frequency, f, where f is about 10.6 MHz.Where x is about 30 cm, h is about 20 cm, a is about 1 cm and N is about4, the resonator may be driven at a frequency, f, where f is about 13.4MHz. Where x is about 10 cm, h is about 3 cm, a is about 2 mm and N isabout 6, the resonator may be driven at a frequency, f, where f is about21.4 MHz.

High-Q inductive elements may be designed using printed circuit boardtraces. Printed circuit board traces may have a variety of advantagescompared to mechanically formed inductive elements including that theymay be accurately reproduced and easily integrated using establishedprinted circuit board fabrication techniques, that their AC resistancemay be lowered using custom designed conductor traces, and that the costof mass-producing them may be significantly reduced.

High-Q inductive elements may be fabricated using standard PCBtechniques on any PCB material such as FR-4 (epoxy E-glass),multi-functional epoxy, high performance epoxy, bismalaimidetriazine/epoxy, polyimide, Cyanate Ester, polytetraflouroethylene(Teflon), FR-2, FR-3, CEM-1, CEM-2, Rogers, Resolute, and the like. Theconductor traces may be formed on printed circuit board materials withlower loss tangents.

The conducting traces may be composed of copper, silver, gold, aluminum,nickel and the like, and they may be composed of paints, inks, or othercured materials. The circuit board may be flexible and it may be aflex-circuit. The conducting traces may be formed by chemicaldeposition, etching, lithography, spray deposition, cutting, and thelike. The conducting traces may be applied to form the desired patternsand they may be formed using crystal and structure growth techniques.

The dimensions of the conducting traces, as well as the number of layerscontaining conducting traces, the position, size and shape of thosetraces and the architecture for interconnecting them may be designed toachieve or optimize certain system specifications such as resonator Q,Q_((p)), resonator size, resonator material and fabrication costs, U,U_((p)), and the like.

As an example, a three-turn high-Q inductive element 1001A wasfabricated on a four-layer printed circuit board using the rectangularcopper trace pattern as shown in FIG. 10( a). The copper trace is shownin black and the PCB in white. The width and thickness of the coppertraces in this example was approximately 1 cm (400 mils) and 43 μm (1.7mils) respectively. The edge-to-edge spacing between turns of theconducting trace on a single layer was approximately 0.75 cm (300 mils)and each board layer thickness was approximately 100 μm (4 mils). Thepattern shown in FIG. 10( a) was repeated on each layer of the board andthe conductors were connected in parallel. The outer dimensions of the3-loop structure were approximately 30 cm by 20 cm. The measuredinductance of this PCB loop was 5.3 μH. A magnetic resonator using thisinductor element and tunable capacitors had a quality factor, Q, of 550at its designed resonance frequency of 6.78 MHz. The resonant frequencycould be tuned by changing the inductance and capacitance values in themagnetic resonator.

As another example, a two-turn inductor 1001B was fabricated on afour-layer printed circuit board using the rectangular copper tracepattern shown in FIG. 10( b). The copper trace is shown in black and thePCB in white. The width and height of the copper traces in this examplewere approximately 0.75 cm (300 mils) and 43 μm (1.7 mils) respectively.The edge-to-edge spacing between turns of the conducting trace on asingle layer was approximately 0.635 cm (250 mils) and each board layerthickness was approximately 100 μm (4 mils). The pattern shown in FIG.10( b) was repeated on each layer of the board and the conductors wereconnected in parallel. The outer dimensions of the two-loop structurewere approximately 7.62 cm by 26.7 cm. The measured inductance of thisPCB loop was 1.3 μH. Stacking two boards together with a verticalseparation of approximately 0.635 cm (250 mils) and connecting the twoboards in series produced a PCB inductor with an inductance ofapproximately 3.4 μH. A magnetic resonator using this stacked inductorloop and tunable capacitors had a quality factor, Q, of 390 at itsdesigned resonance frequency of 6.78 MHz. The resonant frequency couldbe tuned by changing the inductance and capacitance values in themagnetic resonator.

The inductive elements may be formed using magnetic materials of anysize, shape thickness, and the like, and of materials with a wide rangeof permeability and loss values. These magnetic materials may be solidblocks, they may enclose hollow volumes, they may be formed from manysmaller pieces of magnetic material tiled and or stacked together, andthey may be integrated with conducting sheets or enclosures made fromhighly conducting materials. Wires may be wrapped around the magneticmaterials to generate the magnetic near-field. These wires may bewrapped around one or more than one axis of the structure. Multiplewires may be wrapped around the magnetic materials and combined inparallel, or in series, or via a switch to form customized near-fieldpatterns.

The magnetic resonator may include 15 turns of Litz wire wound around a19.2 cm×10 cm×5 mm tiled block of 3F3 ferrite material. The Litz wiremay be wound around the ferrite material in any direction or combinationof directions to achieve the desire resonator performance. The number ofturns of wire, the spacing between the turns, the type of wire, the sizeand shape of the magnetic materials and the type of magnetic materialare all design parameters that may be varied or optimized for differentapplication scenarios.

High-Q Magnetic Resonators Using Magnetic Material Structures

It may be possible to use magnetic materials assembled to form an openmagnetic circuit, albeit one with an air gap on the order of the size ofthe whole structure, to realize a magnetic resonator structure. In thesestructures, high conductivity materials are wound around a structuremade from magnetic material to form the inductive element of themagnetic resonator. Capacitive elements may be connected to the highconductivity materials, with the resonant frequency then determined asdescribed above. These magnetic resonators have their dipole moment inthe plane of the two dimensional resonator structures, rather thanperpendicular to it, as is the case for the capacitively-loaded inductorloop resonators.

A diagram of a single planar resonator structure is shown in FIG. 11(a). The planar resonator structure is constructed of a core of magneticmaterial 1121, such as ferrite with a loop or loops of conductingmaterial 1122 wrapped around the core 1121. The structure may be used asthe source resonator that transfers power and the device resonator thatcaptures energy. When used as a source, the ends of the conductor may becoupled to a power source. Alternating electrical current flowingthrough the conductor loops excites alternating magnetic fields. Whenthe structure is being used to receive power, the ends of the conductormay be coupled to a power drain or load. Changing magnetic fields inducean electromotive force in the loop or loops of the conductor woundaround the core magnetic material. The dipole moment of these types ofstructures is in the plane of the structures and is, for example,directed along the Y axis for the structure in FIG. 11( a). Two suchstructures have strong coupling when placed substantially in the sameplane (i.e. the X,Y plane of FIG. 11). The structures of FIG. 11( a)have the most favorable orientation when the resonators are aligned inthe same plane along their Y axis.

The geometry and the coupling orientations of the described planarresonators may be preferable for some applications. The planar or flatresonator shape may be easier to integrate into many electronic devicesthat are relatively flat and planar. The planar resonators may beintegrated into the whole back or side of a device without requiring achange in geometry of the device. Due to the flat shape of many devices,the natural position of the devices when placed on a surface is to laywith their largest dimension being parallel to the surface they areplaced on. A planar resonator integrated into a flat device is naturallyparallel to the plane of the surface and is in a favorable couplingorientation relative to the resonators of other devices or planarresonator sources placed on a flat surface.

As mentioned, the geometry of the planar resonators may allow easierintegration into devices. Their low profile may allow a resonator to beintegrated into or as part of a complete side of a device. When a wholeside of a device is covered by the resonator, magnetic flux can flowthrough the resonator core without being obstructed by lossy materialthat may be part of the device or device circuitry.

The core of the planar resonator structure may be of a variety of shapesand thicknesses and may be flat or planar such that the minimumdimension does not exceed 30% of the largest dimension of the structure.The core may have complex geometries and may have indentations, notches,ridges, and the like. Geometric enhancements may be used to reduce thecoupling dependence on orientation and they may be used to facilitateintegration into devices, packaging, packages, enclosures, covers,skins, and the like. Two exemplary variations of core geometries areshown in FIG. 11( b). For example, the planar core 1131 may be shapedsuch that the ends are substantially wider than the middle of thestructure to create an indentation for the conductor winding. The corematerial may be of varying thickness with ends that are thicker andwider than the middle. The core material 1132 may have any number ofnotches or cutouts 1133 of various depths, width, and shapes toaccommodate conductor loops, housing, packaging, and the like.

The shape and dimensions of the core may be further dictated by thedimensions and characteristics of the device that they are integratedinto. The core material may curve to follow the contours of the device,or may require non-symmetric notches or cutouts to allow clearance forparts of the device. The core structure may be a single monolithic pieceof magnetic material or may be composed of a plurality of tiles, blocks,or pieces that are arranged together to form the larger structure. Thedifferent layers, tiles, blocks, or pieces of the structure may be ofsimilar or may be of different materials. It may be desirable to usematerials with different magnetic permeability in different locations ofthe structure. Core structures with different magnetic permeability maybe useful for guiding the magnetic flux, improving coupling, andaffecting the shape or extent of the active area of a system.

The conductor of the planar resonator structure may be wound at leastonce around the core. In certain circumstances, it may be preferred towind at least three loops. The conductor can be any good conductorincluding conducting wire, Litz wire, conducting tubing, sheets, strips,gels, inks, traces and the like.

The size, shape, or dimensions of the active area of source may befurther enhanced, altered, or modified with the use of materials thatblock, shield, or guide magnetic fields. To create non-symmetric activearea around a source once side of the source may be covered with amagnetic shield to reduce the strength of the magnetic fields in aspecific direction. The shield may be a conductor or a layeredcombination of conductor and magnetic material which can be used toguide magnetic fields away from a specific direction. Structurescomposed of layers of conductors and magnetic materials may be used toreduce energy losses that may occur due to shielding of the source.

The plurality of planar resonators may be integrated or combined intoone planar resonator structure. A conductor or conductors may be woundaround a core structure such that the loops formed by the two conductorsare not coaxial. An example of such a structure is shown in FIG. 12where two conductors 1201,1202 are wrapped around a planar rectangularcore 1203 at orthogonal angles. The core may be rectangular or it mayhave various geometries with several extensions or protrusions. Theprotrusions may be useful for wrapping of a conductor, reducing theweight, size, or mass of the core, or may be used to enhance thedirectionality or omni-directionality of the resonator. A multi wrappedplanar resonator with four protrusions is shown by the inner structure1310 in FIG. 13, where four conductors 1301, 1302, 1303, 1304 arewrapped around the core. The core may have extensions1305,1306,1307,1308 with one or more conductor loops. A single conductormay be wrapped around a core to form loops that are not coaxial. Thefour conductor loops of FIG. 13, for example, may be formed with onecontinuous piece of conductor, or using two conductors where a singleconductor is used to make all coaxial loops.

Non-uniform or asymmetric field profiles around the resonator comprisinga plurality of conductor loops may be generated by driving someconductor loops with non-identical parameters. Some conductor loops of asource resonator with a plurality of conductor loops may be driven by apower source with a different frequency, voltage, power level, dutycycle, and the like all of which may be used to affect the strength ofthe magnetic field generated by each conductor.

The planar resonator structures may be combined with acapacitively-loaded inductor resonator coil to provide anomni-directional active area all around, including above and below thesource while maintaining a flat resonator structure. As shown in FIG.13, an additional resonator loop coil 1309 comprising of a loop or loopsof a conductor, may be placed in a common plane as the planar resonatorstructure 1310. The outer resonator coil provides an active area that issubstantially above and below the source. The resonator coil can bearranged with any number of planar resonator structures and arrangementsdescribed herein.

The planar resonator structures may be enclosed in magneticallypermeable packaging or integrated into other devices. The planar profileof the resonators within a single, common plane allows packaging andintegration into flat devices. A diagram illustrating the application ofthe resonators is shown in FIG. 14. A flat source 1411 comprising one ormore planar resonators 1414 each with one or more conductor loops maytransfer power to devices 1412,1413 that are integrated with otherplanar resonators 1415,1416 and placed within an active area 1417 of thesource. The devices may comprise a plurality of planar resonators suchthat regardless of the orientation of the device with respect to thesource the active area of the source does not change. In addition toinvariance to rotational misalignment, a flat device comprising ofplanar resonators may be turned upside down without substantiallyaffecting the active area since the planar resonator is still in theplane of the source.

Another diagram illustrating a possible use of a power transfer systemusing the planar resonator structures is shown in FIG. 15. A planarsource 1521 placed on top of a surface 1525 may create an active areathat covers a substantial surface area creating an “energized surface”area. Devices such as computers 1524, mobile handsets 1522, games, andother electronics 1523 that are coupled to their respective planardevice resonators may receive energy from the source when placed withinthe active area of the source, which may be anywhere on top of thesurface. Several devices with different dimensions may be placed in theactive area and used normally while charging or being powered from thesource without having strict placement or alignment constraints. Thesource may be placed under the surface of a table, countertop, desk,cabinet, and the like, allowing it to be completely hidden whileenergizing the top surface of the table, countertop, desk, cabinet andthe like, creating an active area on the surface that is much largerthan the source.

The source may include a display or other visual, auditory, or vibrationindicators to show the direction of charging devices or what devices arebeing charged, error or problems with charging, power levels, chargingtime, and the like.

The source resonators and circuitry may be integrated into any number ofother devices. The source may be integrated into devices such as clocks,keyboards, monitors, picture frames, and the like. For example, akeyboard integrated with the planar resonators and appropriate power andcontrol circuitry may be used as a source for devices placed around thekeyboard such as computer mice, webcams, mobile handsets, and the likewithout occupying any additional desk space.

While the planar resonator structures have been described in the contextof mobile devices it should be clear to those skilled in the art that aflat planar source for wireless power transfer with an active area thatextends beyond its physical dimensions has many other consumer andindustrial applications. The structures and configuration may be usefulfor a large number of applications where electronic or electric devicesand a power source are typically located, positioned, or manipulated insubstantially the same plane and alignment. Some of the possibleapplication scenarios include devices on walls, floor, ceilings or anyother substantially planar surfaces.

Flat source resonators may be integrated into a picture frame or hung ona wall thereby providing an active area within the plane of the wallwhere other electronic devices such as digital picture frames,televisions, lights, and the like can be mounted and powered withoutwires. Planar resonators may be integrated into a floor resulting in anenergized floor or active area on the floor on which devices can beplaced to receive power. Audio speakers, lamps, heaters, and the likecan be placed within the active are and receive power wirelessly.

The planar resonator may have additional components coupled to theconductor. Components such as capacitors, inductors, resistors, diodes,and the like may be coupled to the conductor and may be used to adjustor tune the resonant frequency and the impedance matching for theresonators.

A planar resonator structure of the type described above and shown inFIG. 11( a), may be created, for example, with a quality factor, Q, of100 or higher and even Q of 1,000 or higher. Energy may be wirelesslytransferred from one planar resonator structure to another over adistance larger than the characteristic size of the resonators, as shownin FIG. 11( c).

In addition to utilizing magnetic materials to realize a structure withproperties similar to the inductive element in the magnetic resonators,it may be possible to use a combination of good conductor materials andmagnetic material to realize such inductive structures. FIG. 16( a)shows a magnetic resonator structure 1602 that may include one or moreenclosures made of high-conductivity materials (the inside of whichwould be shielded from AC electromagnetic fields generated outside)surrounded by at least one layer of magnetic material and linked byblocks of magnetic material 1604.

A structure may include a high-conductivity sheet of material covered onone side by a layer of magnetic material. The layered structure mayinstead be applied conformally to an electronic device, so that parts ofthe device may be covered by the high-conductivity and magnetic materiallayers, while other parts that need to be easily accessed (such asbuttons or screens) may be left uncovered. The structure may also orinstead include only layers or bulk pieces of magnetic material. Thus, amagnetic resonator may be incorporated into an existing device withoutsignificantly interfering with its existing functions and with little orno need for extensive redesign. Moreover, the layers of good conductorand/or magnetic material may be made thin enough (of the order of amillimeter or less) that they would add little extra weight and volumeto the completed device. An oscillating current applied to a length ofconductor wound around the structure, as shown by the square loop in thecenter of the structure in FIG. 16 may be used to excite theelectromagnetic fields associated with this structure.

Quality Factor of the Structure

A structure of the type described above may be created with a qualityfactor, Q, of the order of 1,000 or higher. This high-Q is possible evenif the losses in the magnetic material are high, if the fraction ofmagnetic energy within the magnetic material is small compared to thetotal magnetic energy associated with the object. For structurescomposed of layers conducting materials and magnetic materials, thelosses in the conducting materials may be reduced by the presence of themagnetic materials as described previously. In structures where themagnetic material layer's thickness is of the order of 1/100 of thelargest dimension of the system (e.g., the magnetic material may be ofthe order of 1 mm thick, while the area of the structure is of the orderof 10 cm×10 cm), and the relative permeability is of the order of 1,000,it is possible to make the fraction of magnetic energy contained withinthe magnetic material only a few hundredths of the total magnetic energyassociated with the object or resonator. To see how that comes about,note that the expression for the magnetic energy contained in a volumeis U_(m)=∫_(V)drB(r)²/(2μ_(r)μ₀), so as long as B (rather than H) is themain field conserved across the magnetic material-air interface (whichis typically the case in open magnetic circuits), the fraction ofmagnetic energy contained in the high-μ_(r) region may be significantlyreduced compared to what it is in air.

If the fraction of magnetic energy in the magnetic material is denotedby frac, and the loss tangent of the material is tan δ, then the Q ofthe resonator, assuming the magnetic material is the only source oflosses, is Q=1/(frac×tan δ). Thus, even for loss tangents as high as0.1, it is possible to achieve Q's of the order of 1,000 for these typesof resonator structures.

If the structure is driven with N turns of wire wound around it, thelosses in the excitation inductor loop can be ignored if N issufficiently high. FIG. 17 shows an equivalent circuit 1700 schematicfor these structures and the scaling of the loss mechanisms andinductance with the number of turns, N, wound around a structure made ofconducting and magnetic material. If proximity effects can be neglected(by using an appropriate winding, or a wire designed to minimizeproximity effects, such as Litz wire and the like), the resistance 1702due to the wire in the looped conductor scales linearly with the lengthof the loop, which is in turn proportional to the number of turns. Onthe other hand, both the equivalent resistance 1708 and equivalentinductance 1704 of these special structures are proportional to thesquare of the magnetic field inside the structure. Since this magneticfield is proportional to N, the equivalent resistance 1708 andequivalent inductance 1704 are both proportional to N². Thus, for largeenough N, the resistance 1702 of the wire is much smaller than theequivalent resistance 1708 of the magnetic structure, and the Q of theresonator asymptotes to Q_(max)=ωL_(μ)/R_(μ).

FIG. 16 (a) shows a drawing of a copper and magnetic material structure1602 driven by a square loop of current around the narrowed segment atthe center of the structure 1604 and the magnetic field streamlinesgenerated by this structure 1608. This exemplary structure includes two20 cm×8 cm×2 cm hollow regions enclosed with copper and then completelycovered with a 2 mm layer of magnetic material having the propertiesμ_(r)′=1,400, μ_(r)″=5, and σ=0.5 S/m. These two parallelepipeds arespaced 4 cm apart and are connected by a 2 cm×4 cm×2 cm block of thesame magnetic material. The excitation loop is wound around the centerof this block. At a frequency of 300 kHz, this structure has acalculated Q of 890. The conductor and magnetic material structure maybe shaped to optimize certain system parameters. For example, the sizeof the structure enclosed by the excitation loop may be small to reducethe resistance of the excitation loop, or it may be large to mitigatelosses in the magnetic material associated with large magnetic fields.Note that the magnetic streamlines and Q's associated with the samestructure composed of magnetic material only would be similar to thelayer conductor and magnetic material design shown here.

Electromagnetic Resonators Interacting with Other Objects

For electromagnetic resonators, extrinsic loss mechanisms that perturbthe intrinsic Q may include absorption losses inside the materials ofnearby extraneous objects and radiation losses related to scattering ofthe resonant fields from nearby extraneous objects. Absorption lossesmay be associated with materials that, over the frequency range ofinterest, have non-zero, but finite, conductivity, σ, (or equivalently anon-zero and finite imaginary part of the dielectric permittivity), suchthat electromagnetic fields can penetrate it and induce currents in it,which then dissipate energy through resistive losses. An object may bedescribed as lossy if it at least partly includes lossy materials.

Consider an object including a homogeneous isotropic material ofconductivity, σ and magnetic permeability, μ. The penetration depth ofelectromagnetic fields inside this object is given by the skin depth,δ=√{square root over (2/ωμσ)}. The power dissipated inside the object,P_(d), can be determined from P_(d)=∫_(V)drσ|E|²=∫_(V)dr|J|²/σ where wemade use of Ohm's law, J=σE, and where E is the electric field and J isthe current density.

If over the frequency range of interest, the conductivity, σ, of thematerial that composes the object is low enough that the material's skindepth, δ, may be considered long, (i.e. δ is longer than the objects'characteristic size, or δ is longer than the characteristic size of theportion of the object that is lossy) then the electromagnetic fields, Eand H, where H is the magnetic field, may penetrate significantly intothe object. Then, these finite-valued fields may give rise to adissipated power that scales as P_(d)˜σV_(ol)

|E|²

, where V_(ol) is the volume of the object that is lossy and

|E|²

is the spatial average of the electric-field squared, in the volumeunder consideration. Therefore, in the low-conductivity limit, thedissipated power scales proportionally to the conductivity and goes tozero in the limit of a non-conducting (purely dielectric) material.

If over the frequency range of interest, the conductivity, σ, of thematerial that composes the object is high enough that the material'sskin depth may be considered short, then the electromagnetic fields, Eand H, may penetrate only a short distance into the object (namely theystay close to the ‘skin’ of the material, where δ is smaller than thecharacteristic thickness of the portion of the object that is lossy). Inthis case, the currents induced inside the material may be concentratedvery close to the material surface, approximately within a skin depth,and their magnitude may be approximated by the product of a surfacecurrent density (mostly determined by the shape of the incidentelectromagnetic fields and, as long as the thickness of the conductor ismuch larger than the skin-depth, independent of frequency andconductivity to first order) K(x, y) (where x and y are coordinatesparameterizing the surface) and a function decaying exponentially intothe surface: exp(−z/δ)/δ (where z denotes the coordinate locally normalto the surface): J(x, y, z)=K(x, y)exp(−z/δ)/δ. Then, the dissipatedpower, P_(d), may be estimated by,

$\begin{matrix}{P_{d} = {\int_{V}\ {{\mathbb{d}r}{{{J(r)}}^{2}/\sigma}}}} \\{\simeq {\left( {\int_{S}{{\mathbb{d}x}\ {\mathbb{d}y}{{K\left( {x,y} \right)}}^{2}}} \right)\left( {\int_{0}^{\infty}\ {{\mathbb{d}z}\;{{\exp\left( {2\;{z/\delta}} \right)}/\left( {\sigma\delta}^{2} \right)}}} \right)}} \\{= {\sqrt{{{\mu\omega}/8}\sigma}\left( {\int_{S}{{\mathbb{d}x}\ {\mathbb{d}y}{{K\left( {x,y} \right)}}^{2}}} \right)}}\end{matrix}$

Therefore, in the high-conductivity limit, the dissipated power scalesinverse proportionally to the square-root of the conductivity and goesto zero in the limit of a perfectly-conducting material.

If over the frequency range of interest, the conductivity, σ, of thematerial that composes the object is finite, then the material's skindepth, δ, may penetrate some distance into the object and some amount ofpower may be dissipated inside the object, depending also on the size ofthe object and the strength of the electromagnetic fields. Thisdescription can be generalized to also describe the general case of anobject including multiple different materials with different propertiesand conductivities, such as an object with an arbitrary inhomogeneousand anisotropic distribution of the conductivity inside the object.

Note that the magnitude of the loss mechanisms described above maydepend on the location and orientation of the extraneous objectsrelative to the resonator fields as well as the material composition ofthe extraneous objects. For example, high-conductivity materials mayshift the resonant frequency of a resonator and detune it from otherresonant objects. This frequency shift may be fixed by applying afeedback mechanism to a resonator that corrects its frequency, such asthrough changes in the inductance and/or capacitance of the resonator.These changes may be realized using variable capacitors and inductors,in some cases achieved by changes in the geometry of components in theresonators. Other novel tuning mechanisms, described below, may also beused to change the resonator frequency.

Where external losses are high, the perturbed Q may be low and steps maybe taken to limit the absorption of resonator energy inside suchextraneous objects and materials. Because of the functional dependenceof the dissipated power on the strength of the electric and magneticfields, one might optimize system performance by designing a system sothat the desired coupling is achieved with shorter evanescent resonantfield tails at the source resonator and longer at the device resonator,so that the perturbed Q of the source in the presence of other objectsis optimized (or vice versa if the perturbed Q of the device needs to beoptimized).

Note that many common extraneous materials and objects such as people,animals, plants, building materials, and the like, may have lowconductivities and therefore may have little impact on the wirelessenergy transfer scheme disclosed here. An important fact related to themagnetic resonator designs we describe is that their electric fields maybe confined primarily within the resonator structure itself, so itshould be possible to operate within the commonly accepted guidelinesfor human safety while providing wireless power exchange over mid rangedistances.

Electromagnetic Resonators with Reduced Interactions

One frequency range of interest for near-field wireless powertransmission is between 10 kHz and 100 MHz. In this frequency range, alarge variety of ordinary non-metallic materials, such as for exampleseveral types of wood and plastic may have relatively low conductivity,such that only small amounts of power may be dissipated inside them. Inaddition, materials with low loss tangents, tan Δ, where tan Δ=∈″/∈′,and ∈″ and ∈′ are the imaginary and real parts of the permittivityrespectively, may also have only small amounts of power dissipatedinside them. Metallic materials, such as copper, silver, gold, and thelike, with relatively high conductivity, may also have little powerdissipated in them, because electromagnetic fields are not able tosignificantly penetrate these materials, as discussed earlier. Thesevery high and very low conductivity materials, and low loss tangentmaterials and objects may have a negligible impact on the losses of amagnetic resonator.

However, in the frequency range of interest, there are materials andobjects such as some electronic circuits and some lower-conductivitymetals, which may have moderate (in general inhomogeneous andanisotropic) conductivity, and/or moderate to high loss tangents, andwhich may have relatively high dissipative losses. Relatively largeramounts of power may be dissipated inside them. These materials andobjects may dissipate enough energy to reduce Q_((p)) by non-trivialamounts, and may be referred to as “lossy objects”.

One way to reduce the impact of lossy materials on the Q_((p)) of aresonator is to use high-conductivity materials to shape the resonatorfields such that they avoid the lossy objects. The process of usinghigh-conductivity materials to tailor electromagnetic fields so thatthey avoid lossy objects in their vicinity may be understood byvisualizing high-conductivity materials as materials that deflect orreshape the fields. This picture is qualitatively correct as long as thethickness of the conductor is larger than the skin-depth because theboundary conditions for electromagnetic fields at the surface of a goodconductor force the electric field to be nearly completely perpendicularto, and the magnetic field to be nearly completely tangential to, theconductor surface. Therefore, a perpendicular magnetic field or atangential electric field will be “deflected away” from the conductingsurface. Furthermore, even a tangential magnetic field or aperpendicular electric field may be forced to decrease in magnitude onone side and/or in particular locations of the conducting surface,depending on the relative position of the sources of the fields and theconductive surface.

As an example, FIG. 18 shows a finite element method (FEM) simulation oftwo high conductivity surfaces 1802 above and below a lossy dielectricmaterial 1804 in an external, initially uniform, magnetic field offrequency f=6.78 MHz. The system is azimuthally symmetric around the r=0axis. In this simulation, the lossy dielectric material 1804 issandwiched between two conductors 1802, shown as the white lines atapproximately z=±0.01 m. In the absence of the conducting surfaces aboveand below the dielectric disk, the magnetic field (represented by thedrawn magnetic field lines) would have remained essentially uniform(field lines straight and parallel with the z-axis), indicating that themagnetic field would have passed straight through the lossy dielectricmaterial. In this case, power would have been dissipated in the lossydielectric disk. In the presence of conducting surfaces, however, thissimulation shows the magnetic field is reshaped. The magnetic field isforced to be tangential to surface of the conductor and so is deflectedaround those conducting surfaces 1802, minimizing the amount of powerthat may be dissipated in the lossy dielectric material 1804 behind orbetween the conducting surfaces. As used herein, an axis of electricalsymmetry refers to any axis about which a fixed or time-varyingelectrical or magnetic field is substantially symmetric during anexchange of energy as disclosed herein.

A similar effect is observed even if only one conducting surface, aboveor below, the dielectric disk, is used. If the dielectric disk is thin,the fact that the electric field is essentially zero at the surface, andcontinuous and smooth close to it, means that the electric field is verylow everywhere close to the surface (i.e. within the dielectric disk). Asingle surface implementation for deflecting resonator fields away fromlossy objects may be preferred for applications where one is not allowedto cover both sides of the lossy material or object (e.g. an LCDscreen). Note that even a very thin surface of conducting material, onthe order of a few skin-depths, may be sufficient (the skin depth inpure copper at 6.78 MHz is ˜20 μm, and at 250 kHz is ˜100 μm) tosignificantly improve the Q_((p)) of a resonator in the presence oflossy materials.

Lossy extraneous materials and objects may be parts of an apparatus, inwhich a high-Q resonator is to be integrated. The dissipation of energyin these lossy materials and objects may be reduced by a number oftechniques including:

-   -   by positioning the lossy materials and objects away from the        resonator, or, in special positions and orientations relative to        the resonator.    -   by using a high conductivity material or structure to partly or        entirely cover lossy materials and objects in the vicinity of a        resonator    -   by placing a closed surface (such as a sheet or a mesh) of        high-conductivity material around a lossy object to completely        cover the lossy object and shape the resonator fields such that        they avoid the lossy object.    -   by placing a surface (such as a sheet or a mesh) of a        high-conductivity material around only a portion of a lossy        object, such as along the top, the bottom, along the side, and        the like, of an object or material.    -   by placing even a single surface (such as a sheet or a mesh) of        high-conductivity material above or below or on one side of a        lossy object to reduce the strength of the fields at the        location of the lossy object.

FIG. 19 shows a capacitively-loaded loop inductor forming a magneticresonator 102 and a disk-shaped surface of high-conductivity material1802 that completely surrounds a lossy object 1804 placed inside theloop inductor. Note that some lossy objects may be components, such aselectronic circuits, that may need to interact with, communicate with,or be connected to the outside environment and thus cannot be completelyelectromagnetically isolated. Partially covering a lossy material withhigh conductivity materials may still reduce extraneous losses whileenabling the lossy material or object to function properly.

FIG. 20 shows a capacitively-loaded loop inductor that is used as theresonator 102 and a surface of high-conductivity material 1802,surrounding only a portion of a lossy object 1804, that is placed insidethe inductor loop.

Extraneous losses may be reduced, but may not be completely eliminated,by placing a single surface of high-conductivity material above, below,on the side, and the like, of a lossy object or material. An example isshown in FIG. 21, where a capacitively-loaded loop inductor is used asthe resonator 102 and a surface of high-conductivity material 1802 isplaced inside the inductor loop under a lossy object 1804 to reduce thestrength of the fields at the location of the lossy object. It may bepreferable to cover only one side of a material or object because ofconsiderations of cost, weight, assembly complications, air flow, visualaccess, physical access, and the like.

A single surface of high-conductivity material may be used to avoidobjects that cannot or should not be covered from both sides (e.g. LCDor plasma screens). Such lossy objects may be avoided using opticallytransparent conductors. High-conductivity optically opaque materials mayinstead be placed on only a portion of the lossy object, instead of, orin addition to, optically transparent conductors. The adequacy ofsingle-sided vs. multi-sided covering implementations, and the designtrade-offs inherent therein may depend on the details of the wirelessenergy transfer scenario and the properties of the lossy materials andobjects.

Below we describe an example using high-conductivity surfaces to improvethe Q-insensitivity, Θ_((p)), of an integrated magnetic resonator usedin a wireless energy-transfer system. FIG. 22 shows a wireless projector2200. The wireless projector may include a device resonator 102C, aprojector 2202, a wireless network/video adapter 2204, and powerconversion circuits 2208, arranged as shown. The device resonator 102Cmay include a three-turn conductor loop, arranged to enclose a surface,and a capacitor network 2210. The conductor loop may be designed so thatthe device resonator 102C has a high Q (e.g., >100) at its operatingresonant frequency. Prior to integration in the completely wirelessprojector 2200, this device resonator 102C has a Q of approximately 477at the designed operating resonant frequency of 6.78 MHz. Uponintegration, and placing the wireless network/video adapter card 2204 inthe center of the resonator loop inductor, the resonatorQ_((integrated)) was decreased to approximately 347. At least some ofthe reduction from Q to Q_((integrated)) was attributed to losses in theperturbing wireless network/video adapter card. As described above,electromagnetic fields associated with the magnetic resonator 102C mayinduce currents in and on the wireless network/video adapter card 2204,which may be dissipated in resistive losses in the lossy materials thatcompose the card. We observed that Q_((integrated)) of the resonator maybe impacted differently depending on the composition, position, andorientation, of objects and materials placed in its vicinity.

In a completely wireless projector example, covering the network/videoadapter card with a thin copper pocket (a folded sheet of copper thatcovered the top and the bottom of the wireless network/video adaptercard, but not the communication antenna) improved the Q_((integrated))of the magnetic resonator to a Q_((integrated+copper pocket)) ofapproximately 444. In other words, most of the reduction inQ_((integrated)) due to the perturbation caused by the extraneousnetwork/video adapter card could be eliminated using a copper pocket todeflect the resonator fields away from the lossy materials.

In another completely wireless projector example, covering thenetwork/video adapter card with a single copper sheet placed beneath thecard provided a Q_((integrated+copper sheet)) approximately equal toQ_((integrated+copper pocket)). In that example, the high perturbed Q ofthe system could be maintained with a single high-conductivity sheetused to deflect the resonator fields away from the lossy adapter card.

It may be advantageous to position or orient lossy materials or objects,which are part of an apparatus including a high-Q electromagneticresonator, in places where the fields produced by the resonator arerelatively weak, so that little or no power may be dissipated in theseobjects and so that the Q-insensitivity, Θ_((p)), may be large. As wasshown earlier, materials of different conductivity may responddifferently to electric versus magnetic fields. Therefore, according tothe conductivity of the extraneous object, the positioning technique maybe specialized to one or the other field.

FIG. 23 shows the magnitude of the electric 2312 and magnetic fields2314 along a line that contains the diameter of the circular loopinductor and the electric 2318 and magnetic fields 2320 along the axisof the loop inductor for a capacitively-loaded circular loop inductor ofwire of radius 30 cm, resonant at 10 MHz. It can be seen that theamplitude of the resonant near-fields reach their maxima close to thewire and decay away from the loop, 2312, 2314. In the plane of the loopinductor 2318, 2320, the fields reach a local minimum at the center ofthe loop. Therefore, given the finite size of the apparatus, it may bethat the fields are weakest at the extrema of the apparatus or it may bethat the field magnitudes have local minima somewhere within theapparatus. This argument holds for any other type of electromagneticresonator 102 and any type of apparatus. Examples are shown in FIGS. 24a and 24 b, where a capacitively-loaded inductor loop forms a magneticresonator 102 and an extraneous lossy object 1804 is positioned wherethe electromagnetic fields have minimum magnitude.

In a demonstration example, a magnetic resonator was formed using athree-turn conductor loop, arranged to enclose a square surface (withrounded corners), and a capacitor network. The Q of the resonator wasapproximately 619 at the designed operating resonant frequency of 6.78MHz. The perturbed Q of this resonator depended on the placement of theperturbing object, in this case a pocket projector, relative to theresonator. When the perturbing projector was located inside the inductorloop and at its center or on top of the inductor wire turns,Q_((projector)) was approximately 96, lower than when the perturbingprojector was placed outside of the resonator, in which caseQ_((projector)) was approximately 513. These measurements support theanalysis that shows the fields inside the inductor loop may be largerthan those outside it, so lossy objects placed inside such a loopinductor may yield lower perturbed Q's for the system than when thelossy object is placed outside the loop inductor. Depending on theresonator designs and the material composition and orientation of thelossy object, the arrangement shown in FIG. 24 b may yield a higherQ-insensitivity, Θ_((projector)), than the arrangement shown in FIG. 24a.

High-Q resonators may be integrated inside an apparatus. Extraneousmaterials and objects of high dielectric permittivity, magneticpermeability, or electric conductivity may be part of the apparatus intowhich a high-Q resonator is to be integrated. For these extraneousmaterials and objects in the vicinity of a high-Q electromagneticresonator, depending on their size, position and orientation relative tothe resonator, the resonator field-profile may be distorted and deviatesignificantly from the original unperturbed field-profile of theresonator. Such a distortion of the unperturbed fields of the resonatormay significantly decrease the Q to a lower Q_((p)), even if theextraneous objects and materials are lossless.

It may be advantageous to position high-conductivity objects, which arepart of an apparatus including a high-Q electromagnetic resonator, atorientations such that the surfaces of these objects are, as much aspossible, perpendicular to the electric field lines produced by theunperturbed resonator and parallel to the magnetic field lines producedby the unperturbed resonator, thus distorting the resonant fieldprofiles by the smallest amount possible. Other common objects that maybe positioned perpendicular to the plane of a magnetic resonator loopinclude screens (LCD, plasma, etc), batteries, cases, connectors,radiative antennas, and the like. The Q-insensitivity, Θ_((p)), of theresonator may be much larger than if the objects were positioned at adifferent orientation with respect to the resonator fields.

Lossy extraneous materials and objects, which are not part of theintegrated apparatus including a high-Q resonator, may be located orbrought in the vicinity of the resonator, for example, during the use ofthe apparatus. It may be advantageous in certain circumstances to usehigh conductivity materials to tailor the resonator fields so that theyavoid the regions where lossy extraneous objects may be located orintroduced to reduce power dissipation in these materials and objectsand to increase Q-insensitivity, Θ_((p)). An example is shown in FIG.25, where a capacitively-loaded loop inductor and capacitor are used asthe resonator 102 and a surface of high-conductivity material 1802 isplaced above the inductor loop to reduce the magnitude of the fields inthe region above the resonator, where lossy extraneous objects 1804 maybe located or introduced.

Note that a high-conductivity surface brought in the vicinity of aresonator to reshape the fields may also lead to Q_((cond surface))<Q.The reduction in the perturbed Q may be due to the dissipation of energyinside the lossy conductor or to the distortion of the unperturbedresonator field profiles associated with matching the field boundaryconditions at the surface of the conductor. Therefore, while ahigh-conductivity surface may be used to reduce the extraneous lossesdue to dissipation inside an extraneous lossy object, in some cases,especially in some of those where this is achieved by significantlyreshaping the electromagnetic fields, using such a high-conductivitysurface so that the fields avoid the lossy object may result effectivelyin Q_((p+cond.surface))<Q_((p)) rather than the desired resultQ_((p+cond.surface))>Q_((p)).

As described above, in the presence of loss inducing objects, theperturbed quality factor of a magnetic resonator may be improved if theelectromagnetic fields associated with the magnetic resonator arereshaped to avoid the loss inducing objects. Another way to reshape theunperturbed resonator fields is to use high permeability materials tocompletely or partially enclose or cover the loss inducing objects,thereby reducing the interaction of the magnetic field with the lossinducing objects.

Magnetic field shielding has been described previously, for example inElectrodynamics 3^(rd) Ed., Jackson, pp. 201-203. There, a sphericalshell of magnetically permeable material was shown to shield itsinterior from external magnetic fields. For example, if a shell of innerradius a, outer radius b, and relative permeability μ_(r), is placed inan initially uniform magnetic field H₀, then the field inside the shellwill have a constant magnitude,9μ_(r)H₀/[(2μ_(r)+1)(μ_(r)+2)−2/(a/b)³(μ_(r)−1)²], which tends to9H₀/2μ_(r)(1−(a/b)³) if μ_(r)>>1. This result shows that an incidentmagnetic field (but not necessarily an incident electric field) may begreatly attenuated inside the shell, even if the shell is quite thin,provided the magnetic permeability is high enough. It may beadvantageous in certain circumstances to use high permeability materialsto partly or entirely cover lossy materials and objects so that they areavoided by the resonator magnetic fields and so that little or no poweris dissipated in these materials and objects. In such an approach, theQ-insensitivity, Θ_((p)), may be larger than if the materials andobjects were not covered, possibly larger than 1.

It may be desirable to keep both the electric and magnetic fields awayfrom loss inducing objects. As described above, one way to shape thefields in such a manner is to use high-conductivity surfaces to eithercompletely or partially enclose or cover the loss inducing objects. Alayer of magnetically permeable material, also referred to as magneticmaterial, (any material or meta-material having a non-trivial magneticpermeability), may be placed on or around the high-conductivitysurfaces. The additional layer of magnetic material may present a lowerreluctance path (compared to free space) for the deflected magneticfield to follow and may partially shield the electric conductorunderneath it from the incident magnetic flux. This arrangement mayreduce the losses due to induced currents in the high-conductivitysurface. Under some circumstances the lower reluctance path presented bythe magnetic material may improve the perturbed Q of the structure.

FIG. 26 a shows an axially symmetric FEM simulation of a thin conducting2604 (copper) disk (20 cm in diameter, 2 cm in height) exposed to aninitially uniform, externally applied magnetic field (gray flux lines)along the z-axis. The axis of symmetry is at r=0. The magneticstreamlines shown originate at z=−∞, where they are spaced from r=3 cmto r=10 cm in intervals of 1 cm. The axes scales are in meters. Imagine,for example, that this conducing cylinder encloses loss-inducing objectswithin an area circumscribed by a magnetic resonator in a wirelessenergy transfer system such as shown in FIG. 19.

This high-conductivity enclosure may increase the perturbing Q of thelossy objects and therefore the overall perturbed Q of the system, butthe perturbed Q may still be less than the unperturbed Q because ofinduced losses in the conducting surface and changes to the profile ofthe electromagnetic fields. Decreases in the perturbed Q associated withthe high-conductivity enclosure may be at least partially recovered byincluding a layer of magnetic material along the outer surface orsurfaces of the high-conductivity enclosure. FIG. 26 b shows an axiallysymmetric FEM simulation of the thin conducting 2604A (copper) disk (20cm in diameter, 2 cm in height) from FIG. 26 a, but with an additionallayer of magnetic material placed directly on the outer surface of thehigh-conductivity enclosure. Note that the presence of the magneticmaterial may provide a lower reluctance path for the magnetic field,thereby at least partially shielding the underlying conductor andreducing losses due to induced eddy currents in the conductor.

FIG. 27 depicts a variation (in axi-symmetric view) to the system shownin FIG. 26 where not all of the lossy material 2708 may be covered by ahigh-conductivity surface 2706. In certain circumstances it may beuseful to cover only one side of a material or object, such as due toconsiderations of cost, weight, assembly complications, air flow, visualaccess, physical access, and the like. In the exemplary arrangementshown in FIG. 27, only one surface of the lossy material 2708 is coveredand the resonator inductor loop is placed on the opposite side of thehigh-conductivity surface.

Mathematical models were used to simulate a high-conductivity enclosuremade of copper and shaped like a 20 cm diameter by 2 cm high cylindricaldisk placed within an area circumscribed by a magnetic resonator whoseinductive element was a single-turn wire loop with loop radius r=11 cmand wire radius a=1 mm. Simulations for an applied 6.78 MHzelectromagnetic field suggest that the perturbing quality factor of thishigh-conductivity enclosure, δQ_((enclosure)), is 1,870. When thehigh-conductivity enclosure was modified to include a 0.25 cm-thicklayer of magnetic material with real relative permeability, μ_(r)′=40,and imaginary relative permeability, μ_(r)″=10⁻², simulations suggestthe perturbing quality factor is increased toδQ_((enclosure+magnetic material))=5,060.

The improvement in performance due to the addition of thin layers ofmagnetic material 2702 may be even more dramatic if thehigh-conductivity enclosure fills a larger portion of the areacircumscribed by the resonator's loop inductor 2704. In the exampleabove, if the radius of the inductor loop 2704 is reduced so that it isonly 3 mm away from the surface of the high-conductivity enclosure, theperturbing quality factor may be improved from 670 (conducting enclosureonly) to 2,730 (conducting enclosure with a thin layer of magneticmaterial) by the addition of a thin layer of magnetic material 2702around the outside of the enclosure.

The resonator structure may be designed to have highly confined electricfields, using shielding, or distributed capacitors, for example, whichmay yield high, even when the resonator is very close to materials thatwould typically induce loss.

Coupled Electromagnetic Resonators

The efficiency of energy transfer between two resonators may bedetermined by the strong-coupling figure-of-merit, U=κ/√{square rootover (Γ_(s)Γ_(d))}=(2κ/√{square root over (ω_(s)ω_(d))}) √{square rootover (Q_(s)Q_(d))}. In magnetic resonator implementations the couplingfactor between the two resonators may be related to the inductance ofthe inductive elements in each of the resonators, L₁ and L₂, and themutual inductance, M, between them by κ₁₂=ωM/2√{square root over(L₁L₂)}. Note that this expression assumes there is negligible couplingthrough electric-dipole coupling. For capacitively-loaded inductor loopresonators where the inductor loops are formed by circular conductingloops with N turns, separated by a distance D, and oriented as shown inFIG. 1( b), the mutual inductance is M=π/4·μ_(o)N₁N₂(x₁x₂)²/D³ where x₁,N₁ and x₂, N₂ are the characteristic size and number of turns of theconductor loop of the first and second resonators respectively. Notethat this is a quasi-static result, and so assumes that the resonator'ssize is much smaller than the wavelength and the resonators' distance ismuch smaller than the wavelength, but also that their distance is atleast a few times their size. For these circular resonators operated inthe quasi-static limit and at mid-range distances, as described above,k=2κ/√{square root over (ω₁ω₂)}˜(√{square root over (x₁x₂)}/D)³. Strongcoupling (a large U) between resonators at mid-range distances may beestablished when the quality factors of the resonators are large enoughto compensate for the small k at mid-range distances

For electromagnetic resonators, if the two resonators include conductingparts, the coupling mechanism may be that currents are induced on oneresonator due to electric and magnetic fields generated from the other.The coupling factor may be proportional to the flux of the magneticfield produced from the high-Q inductive element in one resonatorcrossing a closed area of the high-Q inductive element of the secondresonator.

Coupled Electromagnetic Resonators with Reduced Interactions

As described earlier, a high-conductivity material surface may be usedto shape resonator fields such that they avoid lossy objects, p, in thevicinity of a resonator, thereby reducing the overall extraneous lossesand maintaining a high Q-insensitivity Θ_((p+cond.surface)) of theresonator. However, such a surface may also lead to a perturbed couplingfactor, k_((p+cond.surface)), between resonators that is smaller thanthe perturbed coupling factor, k_((p)) and depends on the size,position, and orientation of the high-conductivity material relative tothe resonators. For example, if high-conductivity materials are placedin the plane and within the area circumscribed by the inductive elementof at least one of the magnetic resonators in a wireless energy transfersystem, some of the magnetic flux through the area of the resonator,mediating the coupling, may be blocked and k may be reduced.

Consider again the example of FIG. 19. In the absence of thehigh-conductivity disk enclosure, a certain amount of the externalmagnetic flux may cross the circumscribed area of the loop. In thepresence of the high-conductivity disk enclosure, some of this magneticflux may be deflected or blocked and may no longer cross the area of theloop, thus leading to a smaller perturbed coupling factork_(12(p+cond.surfaces)). However, because the deflected magnetic-fieldlines may follow the edges of the high-conductivity surfaces closely,the reduction in the flux through the loop circumscribing the disk maybe less than the ratio of the areas of the face of the disk to the areaof the loop.

One may use high-conductivity material structures, either alone, orcombined with magnetic materials to optimize perturbed quality factors,perturbed coupling factors, or perturbed efficiencies.

Consider the example of FIG. 21. Let the lossy object have a size equalto the size of the capacitively-loaded inductor loop resonator, thusfilling its area A 2102. A high-conductivity surface 1802 may be placedunder the lossy object 1804. Let this be resonator 1 in a system of twocoupled resonators 1 and 2, and let us consider howU_(12(object+cond.surface)) (scales compared to U₁₂ as the area A_(s)2104 of the conducting surface increases. Without the conducting surface1802 below the lossy object 1804, the k-insensitivity, β_(12(object)),may be approximately one, but the Q-insensitivity, Θ_(1(object)), may besmall, so the U-insensitivity Ξ_(12(object)) may be small.

Where the high-conductivity surface below the lossy object covers theentire area of the inductor loop resonator (A_(s)=A),k_(12(object+cond.surface)), may approach zero, because little flux isallowed to cross the inductor loop, so U_(12(object+cond.surface)), mayapproach zero. For intermediate sizes of the high-conductivity surface,the suppression of extrinsic losses and the associated Q-insensitivity,Θ_(1(object+cond.surface)), may be large enough compared toΘ_(1(object)), while the reduction in coupling may not be significantand the associated k-insensitivity, β_(12(object+cond.surface)), may benot much smaller than β_(12(object)) so that the overallU_(12(object+cond.surface)) may be increased compared to U_(12(object)).The optimal degree of avoiding of extraneous lossy objects viahigh-conductivity surfaces in a system of wireless energy transfer maydepend on the details of the system configuration and the application.

We describe using high-conductivity materials to either completely orpartially enclose or cover loss inducing objects in the vicinity ofhigh-Q resonators as one potential method to achieve high perturbed Q'sfor a system. However, using a good conductor alone to cover the objectsmay reduce the coupling of the resonators as described above, therebyreducing the efficiency of wireless power transfer. As the area of theconducting surface approaches the area of the magnetic resonator, forexample, the perturbed coupling factor, k_((p)), may approach zero,making the use of the conducting surface incompatible with efficientwireless power transfer.

One approach to addressing the aforementioned problem is to place alayer of magnetic material around the high-conductivity materialsbecause the additional layer of permeable material may present a lowerreluctance path (compared to free space) for the deflected magneticfield to follow and may partially shield the electric conductorunderneath it from incident magnetic flux. Under some circumstances thelower reluctance path presented by the magnetic material may improve theelectromagnetic coupling of the resonator to other resonators. Decreasesin the perturbed coupling factor associated with using conductingmaterials to tailor resonator fields so that they avoid lossy objects inand around high-Q magnetic resonators may be at least partiallyrecovered by including a layer of magnetic material along the outersurface or surfaces of the conducting materials. The magnetic materialsmay increase the perturbed coupling factor relative to its initialunperturbed value.

Note that the simulation results in FIG. 26 show that an incidentmagnetic field may be deflected less by a layered magnetic material andconducting structure than by a conducting structure alone. If a magneticresonator loop with a radius only slightly larger than that of the disksshown in FIGS. 26( a) and 26(b) circumscribed the disks, it is clearthat more flux lines would be captured in the case illustrated in FIG.26( b) than in FIG. 26( a), and therefore k_((disk)) would be larger forthe case illustrated in FIG. 26( b). Therefore, including a layer ofmagnetic material on the conducting material may improve the overallsystem performance. System analyses may be performed to determinewhether these materials should be partially, totally, or minimallyintegrated into the resonator.

As described above, FIG. 27 depicts a layered conductor 2706 andmagnetic material 2702 structure that may be appropriate for use whennot all of a lossy material 2708 may be covered by a conductor and/ormagnetic material structure. It was shown earlier that for a copperconductor disk with a 20 cm diameter and a 2 cm height, circumscribed bya resonator with an inductor loop radius of 11 cm and a wire radius a=1mm, the calculated perturbing Q for the copper cylinder was 1,870. Ifthe resonator and the conducting disk shell are placed in a uniformmagnetic field (aligned along the axis of symmetry of the inductorloop), we calculate that the copper conductor has an associated couplingfactor insensitivity of 0.34. For comparison, we model the samearrangement but include a 0.25 cm-thick layer of magnetic material witha real relative permeability, μ_(r)′=40, and an imaginary relativepermeability, μ_(r)″=10⁻². Using the same model and parameters describedabove, we find that the coupling factor insensitivity is improved to0.64 by the addition of the magnetic material to the surface of theconductor.

Magnetic materials may be placed within the area circumscribed by themagnetic resonator to increase the coupling in wireless energy transfersystems. Consider a solid sphere of a magnetic material with relativepermeability, μ_(r), placed in an initially uniform magnetic field. Inthis example, the lower reluctance path offered by the magnetic materialmay cause the magnetic field to concentrate in the volume of the sphere.We find that the magnetic flux through the area circumscribed by theequator of the sphere is enhanced by a factor of 3μ_(r)/(μ_(r)+2), bythe addition of the magnetic material. If μ_(r)>>1, this enhancementfactor may be close to 3.

One can also show that the dipole moment of a system comprising themagnetic sphere circumscribed by the inductive element in a magneticresonator would have its magnetic dipole enhanced by the same factor.Thus, the magnetic sphere with high permeability practically triples thedipole magnetic coupling of the resonator. It is possible to keep mostof this increase in coupling if we use a spherical shell of magneticmaterial with inner radius a, and outer radius b, even if this shell ison top of block or enclosure made from highly conducting materials. Inthis case, the enhancement in the flux through the equator is

$\frac{3{\mu_{r}\left( {1 - \left( \frac{a}{b} \right)^{3}} \right)}}{{\mu_{r}\left( {1 - \left( \frac{a}{b} \right)^{3}} \right)} + {2{\left( {1 + {\frac{1}{2}\left( \frac{a}{b} \right)^{3}}} \right).}}}$For μ_(r)=1,000 and (a/b)=0.99, this enhancement factor is still 2.73,so it possible to significantly improve the coupling even with thinlayers of magnetic material.

As described above, structures containing magnetic materials may be usedto realize magnetic resonators. FIG. 16( a) shows a 3 dimensional modelof a copper and magnetic material structure 1600 driven by a square loopof current around the choke point at its center. FIG. 16( b) shows theinteraction, indicated by magnetic field streamlines, between twoidentical structures 1600A-B with the same properties as the one shownin FIG. 16( a). Because of symmetry, and to reduce computationalcomplexity, only one half of the system is modeled. If we fix therelative orientation between the two objects and vary theircenter-to-center distance (the image shown is at a relative separationof 50 cm), we find that, at 300 kHz, the coupling efficiency varies from87% to 55% as the separation between the structures varies from 30 cm to60 cm. Each of the example structures shown 1600 A-B includes two 20cm×8 cm×2 cm parallelepipeds made of copper joined by a 4 cm×4 cm×2 cmblock of magnetic material and entirely covered with a 2 mm layer of thesame magnetic material (assumed to have μ_(r)=1,400+j5). Resistivelosses in the driving loop are ignored. Each structure has a calculatedQ of 815.

Electromagnetic Resonators and Impedance Matching

Impedance Matching Architectures for Low-Loss Inductive Elements

For purposes of the present discussion, an inductive element may be anycoil or loop structure (the ‘loop’) of any conducting material, with orwithout a (gapped or ungapped) core made of magnetic material, which mayalso be coupled inductively or in any other contactless way to othersystems. The element is inductive because its impedance, including boththe impedance of the loop and the so-called ‘reflected’ impedances ofany potentially coupled systems, has positive reactance, X, andresistance, R.

Consider an external circuit, such as a driving circuit or a driven loador a transmission line, to which an inductive element may be connected.The external circuit (e.g. a driving circuit) may be delivering power tothe inductive element and the inductive element may be delivering powerto the external circuit (e.g. a driven load). The efficiency and amountof power delivered between the inductive element and the externalcircuit at a desired frequency may depend on the impedance of theinductive element relative to the properties of the external circuit.Impedance-matching networks and external circuit control techniques maybe used to regulate the power delivery between the external circuit andthe inductive element, at a desired frequency, f.

The external circuit may be a driving circuit configured to form aamplifier of class A, B, C, D, DE, E, F and the like, and may deliverpower at maximum efficiency (namely with minimum losses within thedriving circuit) when it is driving a resonant network with specificimpedance Z₀*, where Z₀ may be complex and * denotes complexconjugation. The external circuit may be a driven load configured toform a rectifier of class A, B, C, D, DE, E, F and the like, and mayreceive power at maximum efficiency (namely with minimum losses withinthe driven load) when it is driven by a resonant network with specificimpedance Z₀*, where Z₀ may be complex. The external circuit may be atransmission line with characteristic impedance, Z₀, and may exchangepower at maximum efficiency (namely with zero reflections) whenconnected to an impedance Z₀*. We will call the characteristic impedanceZ₀ of an external circuit the complex conjugate of the impedance thatmay be connected to it for power exchange at maximum efficiency.

Typically the impedance of an inductive element, R+jX, may be muchdifferent from Z₀*. For example, if the inductive element has low loss(a high X/R), its resistance, R, may be much lower than the real part ofthe characteristic impedance, Z₀, of the external circuit. Furthermore,an inductive element by itself may not be a resonant network. Animpedance-matching network connected to an inductive element maytypically create a resonant network, whose impedance may be regulated.

Therefore, an impedance-matching network may be designed to maximize theefficiency of the power delivered between the external circuit and theinductive element (including the reflected impedances of any coupledsystems). The efficiency of delivered power may be maximized by matchingthe impedance of the combination of an impedance-matching network and aninductive element to the characteristic impedance of an external circuit(or transmission line) at the desired frequency.

An impedance-matching network may be designed to deliver a specifiedamount of power between the external circuit and the inductive element(including the reflected impedances of any coupled systems). Thedelivered power may be determined by adjusting the complex ratio of theimpedance of the combination of the impedance-matching network and theinductive element to the impedance of the external circuit (ortransmission line) at the desired frequency.

Impedance-matching networks connected to inductive elements may createmagnetic resonators. For some applications, such as wireless powertransmission using strongly-coupled magnetic resonators, a high Q may bedesired for the resonators. Therefore, the inductive element may bechosen to have low losses (high X/R).

Since the matching circuit may typically include additional sources ofloss inside the resonator, the components of the matching circuit mayalso be chosen to have low losses. Furthermore, in high-powerapplications and/or due to the high resonator Q, large currents may runin parts of the resonator circuit and large voltages may be presentacross some circuit elements within the resonator. Such currents andvoltages may exceed the specified tolerances for particular circuitelements and may be too high for particular components to withstand. Insome cases, it may be difficult to find or implement components, such astunable capacitors for example, with size, cost and performance (lossand current/voltage-rating) specifications sufficient to realize high-Qand high-power resonator designs for certain applications. We disclosematching circuit designs, methods, implementations and techniques thatmay preserve the high Q for magnetic resonators, while reducing thecomponent requirements for low loss and/or high current/voltage-rating.

Matching-circuit topologies may be designed that minimize the loss andcurrent-rating requirements on some of the elements of the matchingcircuit. The topology of a circuit matching a low-loss inductive elementto an impedance, Z₀, may be chosen so that some of its components lieoutside the associated high-Q resonator by being in series with theexternal circuit. The requirements for low series loss or highcurrent-ratings for these components may be reduced. Relieving the lowseries loss and/or high-current-rating requirement on a circuit elementmay be particularly useful when the element needs to be variable and/orto have a large voltage-rating and/or low parallel loss.

Matching-circuit topologies may be designed that minimize the voltagerating requirements on some of the elements of the matching circuit. Thetopology of a circuit matching a low-loss inductive element to animpedance, Z₀, may be chosen so that some of its components lie outsidethe associated high-Q resonator by being in parallel with Z₀. Therequirements for low parallel loss or high voltage-rating for thesecomponents may be reduced. Relieving the low parallel loss and/orhigh-voltage requirement on a circuit element may be particularly usefulwhen the element needs to be variable and/or to have a largecurrent-rating and/or low series loss.

The topology of the circuit matching a low-loss inductive element to anexternal characteristic impedance, Z₀, may be chosen so that the fieldpattern of the associated resonant mode and thus its high Q arepreserved upon coupling of the resonator to the external impedance.Otherwise inefficient coupling to the desired resonant mode may occur(potentially due to coupling to other undesired resonant modes),resulting in an effective lowering of the resonator Q.

For applications where the low-loss inductive element or the externalcircuit, may exhibit variations, the matching circuit may need to beadjusted dynamically to match the inductive element to the externalcircuit impedance, Z₀, at the desired frequency, f. Since there maytypically be two tuning objectives, matching or controlling both thereal and imaginary part of the impedance level, Z₀, at the desiredfrequency, f, there may be two variable elements in the matchingcircuit. For inductive elements, the matching circuit may need toinclude at least one variable capacitive element.

A low-loss inductive element may be matched by topologies using twovariable capacitors, or two networks of variable capacitors. A variablecapacitor may, for example, be a tunable butterfly-type capacitorhaving, e.g., a center terminal for connection to a ground or other leadof a power source or load, and at least one other terminal across whicha capacitance of the tunable butterfly-type capacitor can be varied ortuned, or any other capacitor having a user-configurable, variablecapacitance.

A low-loss inductive element may be matched by topologies using one, ora network of, variable capacitor(s) and one, or a network of, variableinductor(s).

A low-loss inductive element may be matched by topologies using one, ora network of, variable capacitor(s) and one, or a network of, variablemutual inductance(s), which transformer-couple the inductive elementeither to an external circuit or to other systems.

In some cases, it may be difficult to find or implement tunable lumpedelements with size, cost and performance specifications sufficient torealize high-Q, high-power, and potentially high-speed, tunableresonator designs. The topology of the circuit matching a variableinductive element to an external circuit may be designed so that some ofthe variability is assigned to the external circuit by varying thefrequency, amplitude, phase, waveform, duty cycle, and the like, of thedrive signals applied to transistors, diodes, switches and the like, inthe external circuit.

The variations in resistance, R, and inductance, L, of an inductiveelement at the resonant frequency may be only partially compensated ornot compensated at all. Adequate system performance may thus bepreserved by tolerances designed into other system components orspecifications. Partial adjustments, realized using fewer tunablecomponents or less capable tunable components, may be sufficient.

Matching-circuit architectures may be designed that achieve the desiredvariability of the impedance matching circuit under high-powerconditions, while minimizing the voltage/current rating requirements onits tunable elements and achieving a finer (i.e. more precise, withhigher resolution) overall tunability. The topology of the circuitmatching a variable inductive element to an impedance, Z₀, may includeappropriate combinations and placements of fixed and variable elements,so that the voltage/current requirements for the variable components maybe reduced and the desired tuning range may be covered with finer tuningresolution. The voltage/current requirements may be reduced oncomponents that are not variable.

The disclosed impedance matching architectures and techniques may beused to achieve the following:

-   -   To maximize the power delivered to, or to minimize impedance        mismatches between, the source low-loss inductive elements (and        any other systems wirelessly coupled to them) from the power        driving generators.    -   To maximize the power delivered from, or to minimize impedance        mismatches between, the device low-loss inductive elements (and        any other systems wirelessly coupled to them) to the power        driven loads.    -   To deliver a controlled amount of power to, or to achieve a        certain impedance relationship between, the source low-loss        inductive elements (and any other systems wirelessly coupled to        them) from the power driving generators.    -   To deliver a controlled amount of power from, or to achieve a        certain impedance relationship between, the device low-loss        inductive elements (and any other systems wirelessly coupled to        them) to the power driven loads.

Topologies for Preservation of Mode Profile (High-Q)

The resonator structure may be designed to be connected to the generatoror the load wirelessly (indirectly) or with a hard-wired connection(directly).

Consider a general indirectly coupled matching topology such as thatshown by the block diagram in FIG. 28( a). There, an inductive element2802, labeled as (R,L) and represented by the circuit symbol for aninductor, may be any of the inductive elements discussed in thisdisclosure or in the references provided herein, and where animpedance-matching circuit 2402 includes or consists of parts A and B. Bmay be the part of the matching circuit that connects the impedance2804, Z₀, to the rest of the circuit (the combination of A and theinductive element (A+(R,L)) via a wireless connection (an inductive orcapacitive coupling mechanism).

The combination of A and the inductive element 2802 may form a resonator102, which in isolation may support a high-Q resonator electromagneticmode, with an associated current and charge distribution. The lack of awired connection between the external circuit, Z₀ and B, and theresonator, A+(R,L), may ensure that the high-Q resonator electromagneticmode and its current/charge distributions may take the form of itsintrinsic (in-isolation) profile, so long as the degree of wirelesscoupling is not too large. That is, the electromagnetic mode,current/charge distributions, and thus the high-Q of the resonator maybe automatically maintained using an indirectly coupled matchingtopology.

This matching topology may be referred to as indirectly coupled, ortransformer-coupled, or inductively-coupled, in the case where inductivecoupling is used between the external circuit and the inductor loop.This type of coupling scenario was used to couple the power supply tothe source resonator and the device resonator to the light bulb in thedemonstration of wireless energy transfer over mid-range distancesdescribed in the referenced Science article.

Next consider examples in which the inductive element may include theinductive element and any indirectly coupled systems. In this case, asdisclosed above, and again because of the lack of a wired connectionbetween the external circuit or the coupled systems and the resonator,the coupled systems may not, with good approximation for not-too-largedegree of indirect coupling, affect the resonator electromagnetic modeprofile and the current/charge distributions of the resonator.Therefore, an indirectly-coupled matching circuit may work equally wellfor any general inductive element as part of a resonator as well as forinductive elements wirelessly-coupled to other systems, as definedherein. Throughout this disclosure, the matching topologies we discloserefer to matching topologies for a general inductive element of thistype, that is, where any additional systems may be indirectly coupled tothe low-loss inductive element, and it is to be understood that thoseadditional systems do not greatly affect the resonator electromagneticmode profile and the current/charge distributions of the resonator.

Based on the argument above, in a wireless power transmission system ofany number of coupled source resonators, device resonators andintermediate resonators the wireless magnetic (inductive) couplingbetween resonators does not affect the electromagnetic mode profile andthe current/charge distributions of each one of the resonators.Therefore, when these resonators have a high (unloaded and unperturbed)Q, their (unloaded and unperturbed) Q may be preserved in the presenceof the wireless coupling. (Note that the loaded Q of a resonator may bereduced in the presence of wireless coupling to another resonator, butwe may be interested in preserving the unloaded Q, which relates only toloss mechanisms and not to coupling/loading mechanisms.)

Consider a matching topology such as is shown in FIG. 28( b). Thecapacitors shown in FIG. 28( b) may represent capacitor circuits ornetworks. The capacitors shown may be used to form the resonator 102 andto adjust the frequency and/or impedance of the source and deviceresonators. This resonator 102 may be directly coupled to an impedance,Z₀, using the ports labeled “terminal connections” 2808. FIG. 28( c)shows a generalized directly coupled matching topology, where theimpedance-matching circuit 2602 includes or consists of parts A, B andC. Here, circuit elements in A, B and C may be considered part of theresonator 102 as well as part of the impedance matching 2402 (andfrequency tuning) topology. B and C may be the parts of the matchingcircuit 2402 that connect the impedance Z₀ 2804 (or the networkterminals) to the rest of the circuit (A and the inductive element) viaa single wire connection each. Note that B and C could be empty(short-circuits). If we disconnect or open circuit parts B and C (namelythose single wire connections), then, the combination of A and theinductive element (R,L) may form the resonator.

The high-Q resonator electromagnetic mode may be such that the profileof the voltage distribution along the inductive element has nodes,namely positions where the voltage is zero. One node may beapproximately at the center of the length of the inductive element, suchas the center of the conductor used to form the inductive element, (withor without magnetic materials) and at least one other node may be withinA. The voltage distribution may be approximately anti-symmetric alongthe inductive element with respect to its voltage node. A high Q may bemaintained by designing the matching topology (A, B, C) and/or theterminal voltages (V1, V2) so that this high-Q resonator electromagneticmode distribution may be approximately preserved on the inductiveelement. This high-Q resonator electromagnetic mode distribution may beapproximately preserved on the inductive element by preserving thevoltage node (approximately at the center) of the inductive element.Examples that achieve these design goals are provided herein.

A, B, and C may be arbitrary (namely not having any special symmetry),and V1 and V2 may be chosen so that the voltage across the inductiveelement is symmetric (voltage node at the center inductive). Theseresults may be achieved using simple matching circuits but potentiallycomplicated terminal voltages, because a topology-dependent common-modesignal (V1+V2)/2 may be required on both terminals.

Consider an ‘axis’ that connects all the voltage nodes of the resonator,where again one node is approximately at the center of the length of theinductive element and the others within A. (Note that the ‘axis’ isreally a set of points (the voltage nodes) within the electric-circuittopology and may not necessarily correspond to a linear axis of theactual physical structure. The ‘axis’ may align with a physical axis incases where the physical structure has symmetry.) Two points of theresonator are electrically symmetric with respect to the ‘axis’, if theimpedances seen between each of the two points and a point on the‘axis’, namely a voltage-node point of the resonator, are the same.

B and C may be the same (C=B), and the two terminals may be connected toany two points of the resonator (A+(R,L)) that are electricallysymmetric with respect to the ‘axis’ defined above and driven withopposite voltages (V2=−V1) as shown in FIG. 28( d). The two electricallysymmetric points of the resonator 102 may be two electrically symmetricpoints on the inductor loop. The two electrically symmetric points ofthe resonator may be two electrically symmetric points inside A. If thetwo electrically symmetric points, (to which each of the equal parts Band C is connected), are inside A, A may need to be designed so thatthese electrically-symmetric points are accessible as connection pointswithin the circuit. This topology may be referred to as a ‘balanceddrive’ topology. These balanced-drive examples may have the advantagethat any common-mode signal that may be present on the ground line, dueto perturbations at the external circuitry or the power network, forexample, may be automatically rejected (and may not reach theresonator). In some balanced-drive examples, this topology may requiremore components than other topologies.

In other examples, C may be chosen to be a short-circuit and thecorresponding terminal to be connected to ground (V=0) and to any pointon the electric-symmetry (zero-voltage) ‘axis’ of the resonator, and Bto be connected to any other point of the resonator not on theelectric-symmetry ‘axis’, as shown in FIG. 28( e). The ground-connectedpoint on the electric-symmetry ‘axis’ may be the voltage node on theinductive element, approximately at the center of its conductor length.The ground-connected point on the electric-symmetry ‘axis’ may be insidethe circuit A. Where the ground-connected point on the electric-symmetry‘axis’ is inside A, A may need to be designed to include one such pointon the electrical-symmetric ‘axis’ that is electrically accessible,namely where connection is possible.

This topology may be referred to as an ‘unbalanced drive’ topology. Theapproximately anti-symmetric voltage distribution of the electromagneticmode along the inductive element may be approximately preserved, eventhough the resonator may not be driven exactly symmetrically. The reasonis that the high Q and the large associated R-vs.-Z₀ mismatchnecessitate that a small current may run through B and ground, comparedto the much larger current that may flow inside the resonator,(A+(R,L)). In this scenario, the perturbation on the resonator mode maybe weak and the location of the voltage node may stay at approximatelythe center location of the inductive element. These unbalanced-driveexamples may have the advantage that they may be achieved using simplematching circuits and that there is no restriction on the drivingvoltage at the V1 terminal. In some unbalanced-drive examples,additional designs may be required to reduce common-mode signals thatmay appear at the ground terminal.

The directly-coupled impedance-matching circuit, generally including orconsisting of parts A, B and C, as shown in FIG. 28( c), may be designedso that the wires and components of the circuit do not perturb theelectric and magnetic field profiles of the electromagnetic mode of theinductive element and/or the resonator and thus preserve the highresonator Q. The wires and metallic components of the circuit may beoriented to be perpendicular to the electric field lines of theelectromagnetic mode. The wires and components of the circuit may beplaced in regions where the electric and magnetic field of theelectromagnetic mode are weak.

Topologies for Alleviating Low-Series-Loss and High-Current-RatingRequirements on Elements

If the matching circuit used to match a small resistance, R, of alow-loss inductive element to a larger characteristic impedance, Z₀, ofan external circuit may be considered lossless, then I_(Z) _(o)²Z_(o)=I_(R) ²R⇄I_(Z) _(o) /I_(R)=√{square root over (R/Z_(o))} and thecurrent flowing through the terminals is much smaller than the currentflowing through the inductive element. Therefore, elements connectedimmediately in series with the terminals (such as in directly-coupled B,C (FIG. 28( c))) may not carry high currents. Then, even if the matchingcircuit has lossy elements, the resistive loss present in the elementsin series with the terminals may not result in a significant reductionin the high-Q of the resonator. That is, resistive loss in those serieselements may not significantly reduce the efficiency of powertransmission from Z₀ to the inductive element or vice versa. Therefore,strict requirements for low-series-loss and/or high current-ratings maynot be necessary for these components. In general, such reducedrequirements may lead to a wider selection of components that may bedesigned into the high-Q and/or high-power impedance matching andresonator topologies. These reduced requirements may be especiallyhelpful in expanding the variety of variable and/or high voltage and/orlow-parallel-loss components that may be used in these high-Q and/orhigh-power impedance-matching circuits.

Topologies for Alleviating Low-Parallel-Loss and High-Voltage-RatingRequirements on Elements

If, as above, the matching circuit used to match a small resistance, R,of a low-loss inductive element to a larger characteristic impedance,Z₀, of an external circuit is lossless, then using the previousanalysis,|V _(Z) _(o) /V _(load) =|I _(Z) _(o) Z _(o) /I _(R)(R+jX)|≈√{squareroot over (R/Z _(o))}·Z _(o) /X=√{square root over (Z _(o) /R)}/(X/R),and, for a low-loss (high-X/R) inductive element, the voltage across theterminals may be typically much smaller than the voltage across theinductive element. Therefore, elements connected immediately in parallelto the terminals may not need to withstand high voltages. Then, even ifthe matching circuit has lossy elements, the resistive loss present inthe elements in parallel with the terminals may not result in asignificant reduction in the high-Q of the resonator. That is, resistiveloss in those parallel elements may not significantly reduce theefficiency of power transmission from Z₀ to the inductive element orvice versa. Therefore, strict requirements for low-parallel-loss and/orhigh voltage-ratings may not be necessary for these components. Ingeneral, such reduced requirements may lead to a wider selection ofcomponents that may be designed into the high-Q and/or high-powerimpedance matching and resonator topologies. These reduced requirementsmay be especially helpful in expanding the variety of variable and/orhigh current and/or low-series-loss components that may be used in thesehigh-Q and/or high-power impedance-matching and resonator circuits.

Note that the design principles above may reduce currents and voltageson various elements differently, as they variously suggest the use ofnetworks in series with Z₀ (such as directly-coupled B, C) or the use ofnetworks in parallel with Z₀. The preferred topology for a givenapplication may depend on the availability oflow-series-loss/high-current-rating orlow-parallel-loss/high-voltage-rating elements.

Combinations of Fixed and Variable Elements for Achieving FineTunability and Alleviating High-Rating Requirements on Variable Elements

Circuit Topologies

Variable circuit elements with satisfactory low-loss and high-voltage orcurrent ratings may be difficult or expensive to obtain. In thisdisclosure, we describe impedance-matching topologies that mayincorporate combinations of fixed and variable elements, such that largevoltages or currents may be assigned to fixed elements in the circuit,which may be more likely to have adequate voltage and current ratings,and alleviating the voltage and current rating requirements on thevariable elements in the circuit.

Variable circuit elements may have tuning ranges larger than thoserequired by a given impedance-matching application and, in those cases,fine tuning resolution may be difficult to obtain using only suchlarge-range elements. In this disclosure, we describe impedance-matchingtopologies that incorporate combinations of both fixed and variableelements, such that finer tuning resolution may be accomplished with thesame variable elements.

Therefore, topologies using combinations of both fixed and variableelements may bring two kinds of advantages simultaneously: reducedvoltage across, or current through, sensitive tuning components in thecircuit and finer tuning resolution. Note that the maximum achievabletuning range may be related to the maximum reduction in voltage across,or current through, the tunable components in the circuit designs.

Element Topologies

A single variable circuit-element (as opposed to the network of elementsdiscussed above) may be implemented by a topology using a combination offixed and variable components, connected in series or in parallel, toachieve a reduction in the rating requirements of the variablecomponents and a finer tuning resolution. This can be demonstratedmathematically by the fact that:If x _(|total|) =x _(|fixed|) +x _(|variable|),then Δx _(|total|) /x _(|total|) =Δx _(|variable|)/(x _(|fixed|) +x_(|variable|)),and X _(variable) /X _(total) =X _(variable)/(X _(fixed) +X_(variable)),where x_(|subscript|) is any element value (e.g. capacitance,inductance), X is voltage or current, and the “+ sign” denotes theappropriate (series-addition or parallel-addition) combination ofelements. Note that the subscript format for x_(|subscript|), is chosento easily distinguish it from the radius of the area enclosed by acircular inductive element (e.g. x, x₁, etc.).

Furthermore, this principle may be used to implement a variable electricelement of a certain type (e.g. a capacitance or inductance) by using avariable element of a different type, if the latter is combinedappropriately with other fixed elements.

In conclusion, one may apply a topology optimization algorithm thatdecides on the required number, placement, type and values of fixed andvariable elements with the required tunable range as an optimizationconstraint and the minimization of the currents and/or voltages on thevariable elements as the optimization objective.

EXAMPLES

In the following schematics, we show different specific topologyimplementations for impedance matching to and resonator designs for alow-loss inductive element. In addition, we indicate for each topology:which of the principles described above are used, the equations givingthe values of the variable elements that may be used to achieve thematching, and the range of the complex impedances that may be matched(using both inequalities and a Smith-chart description). For theseexamples, we assume that Z₀ is real, but an extension to acharacteristic impedance with a non-zero imaginary part isstraightforward, as it implies only a small adjustment in the requiredvalues of the components of the matching network. We will use theconvention that the subscript, n, on a quantity implies normalization to(division by) Z₀.

FIG. 29 shows two examples of a transformer-coupled impedance-matchingcircuit, where the two tunable elements are a capacitor and the mutualinductance between two inductive elements. If we define respectivelyX₂=ωL₂ for FIG. 29( a) and X₂=ωL₂−1/ωC₂ for FIG. 29( b), and X≡ωL, thenthe required values of the tunable elements are:

${\omega\; C_{1}} = \frac{1}{X + {R\; X_{2\; n}}}$${\omega\; M} = {\sqrt{Z_{o}{R\left( {1 + X_{2\; n}^{2}} \right)}}.}$For the topology of FIG. 29( b), an especially straightforward designmay be to choose X₂=0. In that case, these topologies may match theimpedances satisfying the inequalities:R _(n)>0,X _(n)>0,which are shown by the area enclosed by the bold lines on the Smithchart of FIG. 29( c).

Given a well pre-chosen fixed M, one can also use the above matchingtopologies with a tunable C₂ instead.

FIG. 30 shows six examples (a)-(f) of directly-coupledimpedance-matching circuits, where the two tunable elements arecapacitors, and six examples (h)-(m) of directly-coupledimpedance-matching circuits, where the two tunable elements are onecapacitor and one inductor. For the topologies of FIGS. 30(a),(b),(c),(h),(i),(j), a common-mode signal may be required at the twoterminals to preserve the voltage node of the resonator at the center ofthe inductive element and thus the high Q. Note that these examples maybe described as implementations of the general topology shown in FIG.28( c). For the symmetric topologies of FIGS. 30(d),(e),(f),(k),(l),(m), the two terminals may need to be drivenanti-symmetrically (balanced drive) to preserve the voltage node of theresonator at the center of the inductive element and thus the high Q.Note that these examples may be described as implementations of thegeneral topology shown in FIG. 28( d). It will be appreciated that anetwork of capacitors, as used herein, may in general refer to anycircuit topology including one or more capacitors, including withoutlimitation any of the circuits specifically disclosed herein usingcapacitors, or any other equivalent or different circuit structure(s),unless another meaning is explicitly provided or otherwise clear fromthe context.

Let us define respectively Z=R+jωL for FIGS. 30( a),(d),(h),(k),Z=R+jωL+1/jωC₃ for FIGS. 30( b),(e),(i),(l), and Z=(R+jωL)∥(1/jωC₃) forFIGS. 30(c),(f),(j),(m), where the symbol “∥” means “the parallelcombination of”, and then R≡Re{Z}, X≡Im{Z}. Then, for FIGS. 30( a)-(f)the required values of the tunable elements may be given by:

${{\omega\; C_{1}} = \frac{X - \sqrt{{X^{2}R_{n}} - {R^{2}\left( {1 - R_{n}} \right)}}}{X^{2} + R^{2}}},{{\omega\; C_{2}} = \frac{R_{n}\omega\; C_{1}}{1 - {X\;\omega\; C_{1}} - R_{n}}},$and these topologies can match the impedances satisfying theinequalities:R _(n)≦1,X _(n)≧√{square root over (R _(n)(1−R _(n)))}which are shown by the area enclosed by the bold lines on the Smithchart of FIG. 30( g). For FIGS. 30( h)-(m) the required values of thetunable elements may be given by:

${{\omega\; C_{1}} = \frac{X + \sqrt{{X^{2}R_{n}} - {R^{2}\left( {1 - R_{n}} \right)}}}{X^{2} + R^{2}}},{{\omega\; L_{2}} = {- {\frac{1 - {X\;\omega\; C_{1}} - R_{n}}{R_{n}\omega\; C_{1}}.}}}$

FIG. 31 shows three examples (a)-(c) of directly-coupledimpedance-matching circuits, where the two tunable elements arecapacitors, and three examples (e)-(g) of directly-coupledimpedance-matching circuits, where the two tunable elements are onecapacitor and one inductor. For the topologies of FIGS. 31(a),(b),(c),(e),(f),(g), the ground terminal is connected between twoequal-value capacitors, 2C₁, (namely on the axis of symmetry of the mainresonator) to preserve the voltage node of the resonator at the centerof the inductive element and thus the high Q. Note that these examplesmay be described as implementations of the general topology shown inFIG. 28( e).

Let us define respectively Z=R+jωL for FIGS. 31( a),(e), Z=R+jωL+1/jωC₃for FIGS. 31( b),(f), and Z=(R+jωL)∥(1/jωC₃) for FIG. 31(c),(g), andthen R≡Re{Z}, X≡Im{Z}. Then, for FIGS. 31( a)-(c) the required values ofthe tunable elements may be given by:

${{\omega\; C_{1}} = \frac{X - {\frac{1}{2}\sqrt{{X^{2}R_{n}} - {R^{2}\left( {4 - R_{n}} \right)}}}}{X^{2} + R^{2}}},{{\omega\; C_{2}} = \frac{R_{n}\omega\; C_{1}}{1 - {X\;\omega\; C_{1}} - \frac{R_{n}}{2}}},$and these topologies can match the impedances satisfying theinequalities:

${R_{n} \leq 1},{X_{n} \geq {\sqrt{\frac{R_{n}}{1 - R_{n}}}\left( {2 - R_{n}} \right)}}$which are shown by the area enclosed by the bold lines on the Smithchart of FIG. 31( d). For FIGS. 31( e)-(g) the required values of thetunable elements may be given by:

${{\omega\; C_{1}} = \frac{X + {\frac{1}{2}\sqrt{{X^{2}R_{n}} - {R^{2}\left( {4 - R_{n}} \right)}}}}{X^{2} + R^{2}}},{{\omega\; L_{2}} = {- {\frac{1 - {X\;\omega\; C_{1}} - \frac{R_{n}}{2}}{R_{n}\omega\; C_{1}}.}}}$

FIG. 32 shows three examples (a)-(c) of directly-coupledimpedance-matching circuits, where the two tunable elements arecapacitors, and three examples (e)-(g) of directly-coupledimpedance-matching circuits, where the two tunable elements are onecapacitor and one inductor. For the topologies of FIGS. 32(a),(b),(c),(e),(f),(g), the ground terminal may be connected at thecenter of the inductive element to preserve the voltage node of theresonator at that point and thus the high Q. Note that these example maybe described as implementations of the general topology shown in FIG.28( e).

Let us define respectively Z=R+jωL for FIG. 32( a), Z=R+jωL+1/jωC₃ forFIG. 32( b), and Z=(R+jωL)∥(1/jωC₃) for FIG. 32( c), and then R≡Re{Z},X≡Im{Z}. Then, for FIGS. 32( a)-(c) the required values of the tunableelements may be given by:

${{\omega\; C_{1}} = \frac{X - \sqrt{\frac{{X^{2}R_{n}} - {2{R^{2}\left( {2 - R_{n}} \right)}}}{4 - R_{n}}}}{X^{2} + R^{2}}},{{\omega\; C_{2}} = \frac{R_{n}\omega\; C_{1}}{1 - {X\;\omega\; C_{1}} - \frac{R_{n}}{2} + \frac{R_{n}X\;\omega\; C_{1}}{2\left( {1 + k} \right)}}},$where k is defined by M′=−kL′, where L′ is the inductance of each halfof the inductor loop and M′ is the mutual inductance between the twohalves, and these topologies can match the impedances satisfying theinequalities:R _(n)≦2,X _(n)≧√{square root over (2R _(n)(2−R _(n)))}which are shown by the area enclosed by the bold lines on the Smithchart of FIG. 32( d). For FIGS. 32( e)-(g) the required values of thetunable elements may be given by:

${{\omega\; C_{1}} = \frac{X + \sqrt{\frac{{X^{2}R_{n}} - {2{R^{2}\left( {2 - R_{n}} \right)}}}{4 - R_{n}}}}{X^{2} + R^{2}}},$

In the circuits of FIGS. 30, 31, 32, the capacitor, C₂, or the inductor,L₂, is (or the two capacitors, 2C₂, or the two inductors, L₂/2, are) inseries with the terminals and may not need to have very low series-lossor withstand a large current.

FIG. 33 shows six examples (a)-(f) of directly-coupledimpedance-matching circuits, where the two tunable elements arecapacitors, and six examples (h)-(m) of directly-coupledimpedance-matching circuits, where the two tunable elements are onecapacitor and one inductor. For the topologies of FIGS. 33(a),(b),(c),(h),(i),(j), a common-mode signal may be required at the twoterminals to preserve the voltage node of the resonator at the center ofthe inductive element and thus the high Q. Note that these examples maybe described as implementations of the general topology shown in FIG.28( c), where B and C are short-circuits and A is not balanced. For thesymmetric topologies of FIGS. 33( d),(e),(f),(k),(l),(m), the twoterminals may need to be driven anti-symmetrically (balanced drive) topreserve the voltage node of the resonator at the center of theinductive element and thus the high Q. Note that these examples may bedescribed as implementations of the general topology shown in FIG. 28(d), where B and C are short-circuits and A is balanced.

Let us define respectively Z=R+jωL for FIGS. 33( a),(d),(h),(k),Z=R+jωL+1/jωC₃ for FIGS. 33( b),(e),(i),(l), and Z=(R+jωL)∥(1/jωC₃) forFIGS. 33( c),(f),(j),(m), and then R≡Re{Z}, X≡Im{Z}. Then, for FIGS. 33(a)-(f) the required values of the tunable elements may be given by:

${{\omega\; C_{1}} = \frac{1}{X - {Z_{o}\sqrt{R_{n}\left( {1 - R_{n}} \right)}}}},{{\omega\; C_{2}} = {\frac{1}{Z_{o}}\sqrt{\frac{1}{R_{n}} - 1}}},$and these topologies can match the impedances satisfying theinequalities:R _(n)≦1,X _(n)≧√{square root over (R _(n)(1−R _(n)))}which are shown by the area enclosed by the bold lines on the Smithchart of FIG. 33( g). For FIGS. 35( h)-(m) the required values of thetunable elements may be given by:

${{\omega\; C_{1}} = \frac{1}{X + {Z_{o}\sqrt{R_{n}\left( {1 - R_{n}} \right)}}}},{{\omega\; L_{2}} = {\frac{Z_{o}}{\sqrt{\frac{1}{R_{n}} - 1}}.}}$

FIG. 34 shows three examples (a)-(c) of directly-coupledimpedance-matching circuits, where the two tunable elements arecapacitors, and three examples (e)-(g) of directly-coupledimpedance-matching circuits, where the two tunable elements are onecapacitor and one inductor. For the topologies of FIGS. 34(a),(b),(c),(e),(f),(g), the ground terminal is connected between twoequal-value capacitors, 2C₂, (namely on the axis of symmetry of the mainresonator) to preserve the voltage node of the resonator at the centerof the inductive element and thus the high Q. Note that these examplesmay be described as implementations of the general topology shown inFIG. 28( e).

Let us define respectively Z=R+jωL for FIG. 34( a),(e), Z=R+jωL+1/jωC₃for FIG. 34( b),(f), and Z=(R+jωL)∥(1/jωC₃) for FIG. 34( c),(g), andthen R≡Re{Z}, X≡Im{Z}. Then, for FIGS. 34( a)-(c) the required values ofthe tunable elements may be given by:

${{\omega\; C_{1}} = \frac{1}{X - {Z_{o}\sqrt{\frac{1 - R_{n}}{R_{n}}}\left( {2 - R_{n}} \right)}}},{{\omega\; C_{2}} = {\frac{1}{2\mspace{11mu} Z_{o}}\sqrt{\frac{1}{R_{n}} - 1}}},$and these topologies can match the impedances satisfying theinequalities:

${R_{n} \leq 1},{X_{n} \geq {\sqrt{\frac{R_{n}}{1 - R_{n}}}\left( {2 - R_{n}} \right)}}$which are shown by the area enclosed by the bold lines on the Smithchart of FIG. 34( d). For FIGS. 34( e)-(g) the required values of thetunable elements may be given by:

${{\omega\; C_{1}} = \frac{1}{X + {Z_{o}\sqrt{\frac{1 - R_{n}}{R_{n}}\left( {2 - R_{n}} \right)}}}},{{\omega\; L_{2}} = {\frac{2\; Z_{o}}{\sqrt{\frac{1}{R_{n}} - 1}}.}}$

FIG. 35 shows three examples of directly-coupled impedance-matchingcircuits, where the two tunable elements are capacitors. For thetopologies of FIG. 35, the ground terminal may be connected at thecenter of the inductive element to preserve the voltage node of theresonator at that point and thus the high Q. Note that these examplesmay be described as implementations of the general topology shown inFIG. 28( e).

Let us define respectively Z=R+jωL for FIG. 35( a), Z=R+jωL+1/jωC₃ forFIG. 35( b), and Z=(R+jωL)∥(1ωC₃) for FIG. 35( c), and then R≡Re{Z},X≡Im{Z}. Then, the required values of the tunable elements may be givenby:

${{\omega\; C_{1}} = \frac{2}{{X\left( {1 + a} \right)} - \sqrt{Z_{o}{R\left( {4 - R_{n}} \right)}\left( {1 + a^{2}} \right)}}},{{\omega\; C_{2}} = \frac{2}{{X\left( {1 + a} \right)} + \sqrt{Z_{o}{R\left( {4 - R_{n}} \right)}\left( {1 + a^{2}} \right)}}},$where

$a = {\frac{R}{{2\; Z_{o}} - R} \cdot \frac{k}{1 + k}}$and k is defined by M′=−kL′, where L′ is the inductance of each half ofthe inductive element and M′ is the mutual inductance between the twohalves. These topologies can match the impedances satisfying theinequalities:

${{{{R_{n} \leq 2}\mspace{14mu}\&}\mspace{14mu}\frac{2}{\gamma}} \leq R_{n} \leq 4},{X_{n} \geq \sqrt{\frac{{R_{n}\left( {4 - R_{n}} \right)}\left( {2 - R_{n}} \right)}{2 - {\gamma\; R_{n}}}}},{where}$$\gamma = {\frac{1 - {6\; k} + k^{2}}{1 + {2\; k} + k^{2}} \leq 1}$which are shown by the area enclosed by the bold lines on the threeSmith charts shown in FIG. 35( d) for k=0, FIG. 35( e) for k=0.05, andFIG. 35( f) for k=1. Note that for 0<k<1 there are two disconnectedregions of the Smith chart that this topology can match.

In the circuits of FIGS. 33, 34, 35, the capacitor, C₂, or the inductor,L₂, is (or one of the two capacitors, 2C₂, or one of the two inductors,2L₂, are) in parallel with the terminals and thus may not need to have ahigh voltage-rating. In the case of two capacitors, 2C₂, or twoinductors, 2L₂, both may not need to have a high voltage-rating, sinceapproximately the same current flows through them and thus theyexperience approximately the same voltage across them.

For the topologies of FIGS. 30-35, where a capacitor, C₃, is used, theuse of the capacitor, C₃, may lead to finer tuning of the frequency andthe impedance. For the topologies of FIGS. 30-35, the use of the fixedcapacitor, C₃, in series with the inductive element may ensure that alarge percentage of the high inductive-element voltage will be acrossthis fixed capacitor, C₃, thus potentially alleviating the voltagerating requirements for the other elements of the impedance matchingcircuit, some of which may be variable. Whether or not such topologiesare preferred depends on the availability, cost and specifications ofappropriate fixed and tunable components.

In all the above examples, a pair of equal-value variable capacitorswithout a common terminal may be implemented using ganged-typecapacitors or groups or arrays of varactors or diodes biased andcontrolled to tune their values as an ensemble. A pair of equal-valuevariable capacitors with one common terminal can be implemented using atunable butterfly-type capacitor or any other tunable or variablecapacitor or group or array of varactors or diodes biased and controlledto tune their capacitance values as an ensemble.

Another criterion which may be considered upon the choice of theimpedance matching network is the response of the network to differentfrequencies than the desired operating frequency. The signals generatedin the external circuit, to which the inductive element is coupled, maynot be monochromatic at the desired frequency but periodic with thedesired frequency, as for example the driving signal of a switchingamplifier or the reflected signal of a switching rectifier. In some suchcases, it may be desirable to suppress the amount of higher-orderharmonics that enter the inductive element (for example, to reduceradiation of these harmonics from this element). Then the choice ofimpedance matching network may be one that sufficiently suppresses theamount of such harmonics that enters the inductive element.

The impedance matching network may be such that the impedance seen bythe external circuit at frequencies higher than the fundamental harmonicis high, when the external periodic signal is a signal that can beconsidered to behave as a voltage-source signal (such as the drivingsignal of a class-D amplifier with a series resonant load), so thatlittle current flows through the inductive element at higherfrequencies. Among the topologies of FIGS. 30-35, those which use aninductor, L₂, may then be preferable, as this inductor presents a highimpedance at high frequencies.

The impedance matching network may be such that the impedance seen bythe external circuit at frequencies higher than the fundamental harmonicis low, when the external periodic signal is a signal that can beconsidered to behave as a current-source signal, so that little voltageis induced across the inductive element at higher frequencies. Among thetopologies of FIGS. 30-35, those which use a capacitor, C₂, are thenpreferable, as this capacitor presents a low impedance at highfrequencies.

FIG. 36 shows four examples of a variable capacitance, using networks ofone variable capacitor and the rest fixed capacitors. Using thesenetwork topologies, fine tunability of the total capacitance value maybe achieved. Furthermore, the topologies of FIGS. 36( a),(c),(d), may beused to reduce the voltage across the variable capacitor, since most ofthe voltage may be assigned across the fixed capacitors.

FIG. 37 shows two examples of a variable capacitance, using networks ofone variable inductor and fixed capacitors. In particular, thesenetworks may provide implementations for a variable reactance, and, atthe frequency of interest, values for the variable inductor may be usedsuch that each network corresponds to a net negative variable reactance,which may be effectively a variable capacitance.

Tunable elements such as tunable capacitors and tunable inductors may bemechanically-tunable, electrically-tunable, thermally-tunable and thelike. The tunable elements may be variable capacitors or inductors,varactors, diodes, Schottky diodes, reverse-biased PN diodes, varactorarrays, diode arrays, Schottky diode arrays and the like. The diodes maybe Si diodes, GaN diodes, SiC diodes, and the like. GaN and SiC diodesmay be particularly attractive for high power applications. The tunableelements may be electrically switched capacitor banks,electrically-switched mechanically-tunable capacitor banks,electrically-switched varactor-array banks, electrically-switchedtransformer-coupled inductor banks, and the like. The tunable elementsmay be combinations of the elements listed above.

As described above, the efficiency of the power transmission betweencoupled high-Q magnetic resonators may be impacted by how closelymatched the resonators are in resonant frequency and how well theirimpedances are matched to the power supplies and power consumers in thesystem. Because a variety of external factors including the relativeposition of extraneous objects or other resonators in the system, or thechanging of those relative positions, may alter the resonant frequencyand/or input impedance of a high-Q magnetic resonator, tunable impedancenetworks may be required to maintain sufficient levels of powertransmission in various environments or operating scenarios.

The capacitance values of the capacitors shown may be adjusted to adjustthe resonant frequency and/or the impedance of the magnetic resonator.The capacitors may be adjusted electrically, mechanically, thermally, orby any other known methods. They may be adjusted manually orautomatically, such as in response to a feedback signal. They may beadjusted to achieve certain power transmission efficiencies or otheroperating characteristics between the power supply and the powerconsumer.

The inductance values of the inductors and inductive elements in theresonator may be adjusted to adjust the frequency and/or impedance ofthe magnetic resonator. The inductance may be adjusted using coupledcircuits that include adjustable components such as tunable capacitors,inductors and switches. The inductance may be adjusted using transformercoupled tuning circuits. The inductance may be adjusted by switching inand out different sections of conductor in the inductive elements and/orusing ferro-magnetic tuning and/or mu-tuning, and the like.

The resonant frequency of the resonators may be adjusted to or may beallowed to change to lower or higher frequencies. The input impedance ofthe resonator may be adjusted to or may be allowed to change to lower orhigher impedance values. The amount of power delivered by the sourceand/or received by the devices may be adjusted to or may be allowed tochange to lower or higher levels of power. The amount of power deliveredto the source and/or received by the devices from the device resonatormay be adjusted to or may be allowed to change to lower or higher levelsof power. The resonator input impedances, resonant frequencies, andpower levels may be adjusted depending on the power consumer orconsumers in the system and depending on the objects or materials in thevicinity of the resonators. The resonator input impedances, frequencies,and power levels may be adjusted manually or automatically, and may beadjusted in response to feedback or control signals or algorithms.

Circuit elements may be connected directly to the resonator, that is, byphysical electrical contact, for example to the ends of the conductorthat forms the inductive element and/or the terminal connectors. Thecircuit elements may be soldered to, welded to, crimped to, glued to,pinched to, or closely position to the conductor or attached using avariety of electrical components, connectors or connection techniques.The power supplies and the power consumers may be connected to magneticresonators directly or indirectly or inductively. Electrical signals maybe supplied to, or taken from, the resonators through the terminalconnections.

It is to be understood by one of ordinary skill in the art that in realimplementations of the principles described herein, there may be anassociated tolerance, or acceptable variation, to the values of realcomponents (capacitors, inductors, resistors and the like) from thevalues calculated via the herein stated equations, to the values of realsignals (voltages, currents and the like) from the values suggested bysymmetry or anti-symmetry or otherwise, and to the values of realgeometric locations of points (such as the point of connection of theground terminal close to the center of the inductive element or the‘axis’ points and the like) from the locations suggested by symmetry orotherwise.

Examples System Block Diagrams

We disclose examples of high-Q resonators for wireless powertransmission systems that may wirelessly power or charge devices atmid-range distances. High-Q resonator wireless power transmissionsystems also may wirelessly power or charge devices with magneticresonators that are different in size, shape, composition, arrangement,and the like, from any source resonators in the system.

FIG. 1( a)(b) shows high level diagrams of two exemplary two-resonatorsystems. These exemplary systems each have a single source resonator102S or 104S and a single device resonator 102D or 104D. FIG. 38 shows ahigh level block diagram of a system with a few more featureshighlighted. The wirelessly powered or charged device 2310 may includeor consist of a device resonator 102D, device power and controlcircuitry 2304, and the like, along with the device 2308 or devices, towhich either DC or AC or both AC and DC power is transferred. The energyor power source for a system may include the source power and controlcircuitry 2302, a source resonator 102S, and the like. The device 2308or devices that receive power from the device resonator 102D and powerand control circuitry 2304 may be any kind of device 2308 or devices asdescribed previously. The device resonator 102D and circuitry 2304delivers power to the device/devices 2308 that may be used to rechargethe battery of the device/devices, power the device/devices directly, orboth when in the vicinity of the source resonator 102S.

The source and device resonators may be separated by many meters or theymay be very close to each other or they may be separated by any distancein between. The source and device resonators may be offset from eachother laterally or axially. The source and device resonators may bedirectly aligned (no lateral offset), or they may be offset by meters,or anything in between. The source and device resonators may be orientedso that the surface areas enclosed by their inductive elements areapproximately parallel to each other. The source and device resonatorsmay be oriented so that the surface areas enclosed by their inductiveelements are approximately perpendicular to each other, or they may beoriented for any relative angle (0 to 360 degrees) between them.

The source and device resonators may be free standing or they may beenclosed in an enclosure, container, sleeve or housing. These variousenclosures may be composed of almost any kind of material. Low losstangent materials such as Teflon, REXOLITE, styrene, and the like may bepreferable for some applications. The source and device resonators maybe integrated in the power supplies and power consumers. For example,the source and device resonators may be integrated into keyboards,computer mice, displays, cell phones, etc. so that they are not visibleoutside these devices. The source and device resonators may be separatefrom the power supplies and power consumers in the system and may beconnected by a standard or custom wires, cables, connectors or plugs.

The source 102S may be powered from a number of DC or AC voltage,current or power sources including a USB port of a computer. The source1025 may be powered from the electric grid, from a wall plug, from abattery, from a power supply, from an engine, from a solar cell, from agenerator, from another source resonator, and the like. The source powerand control circuitry 2302 may include circuits and components toisolate the source electronics from the power source, so that anyreflected power or signals are not coupled out through the source inputterminals. The source power and control circuits 2302 may include powerfactor correction circuits and may be configured to monitor power usagefor monitoring accounting, billing, control, and like functionalities.

The system may be operated bi-directionally. That is, energy or powerthat is generated or stored in a device resonator may be fed back to apower source including the electric grid, a battery, any kind of energystorage unit, and the like. The source power and control circuits mayinclude power factor correction circuits and may be configured tomonitor power usage for monitoring accounting, billing, control, andlike functionalities for bi-directional energy flow. Wireless energytransfer systems may enable or promote vehicle-to-grid (V2G)applications.

The source and the device may have tuning capabilities that allowadjustment of operating points to compensate for changing environmentalconditions, perturbations, and loading conditions that can affect theoperation of the source and device resonators and the efficiency of theenergy exchange. The tuning capability may also be used to multiplexpower delivery to multiple devices, from multiple sources, to multiplesystems, to multiple repeaters or relays, and the like. The tuningcapability may be manually controlled, or automatically controlled andmay be performed continuously, periodically, intermittently or atscheduled times or intervals.

The device resonator and the device power and control circuitry may beintegrated into any portion of the device, such as a batterycompartment, or a device cover or sleeve, or on a mother board, forexample, and may be integrated alongside standard rechargeable batteriesor other energy storage units. The device resonator may include a devicefield reshaper which may shield any combination of the device resonatorelements and the device power and control electronics from theelectromagnetic fields used for the power transfer and which may deflectthe resonator fields away from the lossy device resonator elements aswell as the device power and control electronics. A magnetic materialand/or high-conductivity field reshaper may be used to increase theperturbed quality factor Q of the resonator and increase the perturbedcoupling factor of the source and device resonators.

The source resonator and the source power and control circuitry may beintegrated into any type of furniture, structure, mat, rug, pictureframe (including digital picture frames, electronic frames), plug-inmodules, electronic devices, vehicles, and the like. The sourceresonator may include a source field reshaper which may shield anycombination of the source resonator elements and the source power andcontrol electronics from the electromagnetic fields used for the powertransfer and which may deflect the resonator fields away from the lossysource resonator elements as well as the source power and controlelectronics. A magnetic material and/or high-conductivity field reshapermay be used to increase the perturbed quality factor Q of the resonatorand increase the perturbed coupling factor of the source and deviceresonators.

A block diagram of the subsystems in an example of a wirelessly powereddevice is shown in FIG. 39. The power and control circuitry may bedesigned to transform the alternating current power from the deviceresonator 102D and convert it to stable direct current power suitablefor powering or charging a device. The power and control circuitry maybe designed to transform an alternating current power at one frequencyfrom the device resonator to alternating current power at a differentfrequency suitable for powering or charging a device. The power andcontrol circuitry may include or consist of impedance matching circuitry2402D, rectification circuitry 2404, voltage limiting circuitry (notshown), current limiting circuitry (not shown), AC-to-DC converter 2408circuitry, DC-to-DC converter 2408 circuitry, DC-to-AC converter 2408circuitry, AC-to-AC converter 2408 circuitry, battery charge controlcircuitry (not shown), and the like.

The impedance-matching 2402D network may be designed to maximize thepower delivered between the device resonator 102D and the device powerand control circuitry 2304 at the desired frequency. The impedancematching elements may be chosen and connected such that the high-Q ofthe resonators is preserved. Depending on the operating conditions, theimpedance matching circuitry 2402D may be varied or tuned to control thepower delivered from the source to the device, from the source to thedevice resonator, between the device resonator and the device power andcontrol circuitry, and the like. The power, current and voltage signalsmay be monitored at any point in the device circuitry and feedbackalgorithms circuits, and techniques, may be used to control componentsto achieve desired signal levels and system operation. The feedbackalgorithms may be implemented using analog or digital circuit techniquesand the circuits may include a microprocessor, a digital signalprocessor, a field programmable gate array processor and the like.

The third block of FIG. 39 shows a rectifier circuit 2404 that mayrectify the AC voltage power from the device resonator into a DCvoltage. In this configuration, the output of the rectifier 2404 may bethe input to a voltage clamp circuit. The voltage clamp circuit (notshown) may limit the maximum voltage at the input to the DC-to-DCconverter 2408D or DC-to-AC converter 2408D. In general, it may bedesirable to use a DC-to-DC/AC converter with a large input voltagedynamic range so that large variations in device position and operationmay be tolerated while adequate power is delivered to the device. Forexample, the voltage level at the output of the rectifier may fluctuateand reach high levels as the power input and load characteristics of thedevice change. As the device performs different tasks it may havevarying power demands. The changing power demands can cause highvoltages at the output of the rectifier as the load characteristicschange. Likewise as the device and the device resonator are broughtcloser and further away from the source, the power delivered to thedevice resonator may vary and cause changes in the voltage levels at theoutput of the rectifier. A voltage clamp circuit may prevent the voltageoutput from the rectifier circuit from exceeding a predetermined valuewhich is within the operating range of the DC-to-DC/AC converter. Thevoltage clamp circuitry may be used to extend the operating modes andranges of a wireless energy transfer system.

The next block of the power and control circuitry of the device is theDC-to-DC converter 2408D that may produce a stable DC output voltage.The DC-to-DC converter may be a boost converter, buck converter,boost-buck converter, single ended primary inductance converter (SEPIC),or any other DC-DC topology that fits the requirements of the particularapplication. If the device requires AC power, a DC-to-AC converter maybe substituted for the DC-to-DC converter, or the DC-to-DC converter maybe followed by a DC-to-AC converter. If the device contains arechargeable battery, the final block of the device power and controlcircuitry may be a battery charge control unit which may manage thecharging and maintenance of the battery in battery powered devices.

The device power and control circuitry 2304 may contain a processor2410D, such as a microcontroller, a digital signal processor, a fieldprogrammable gate array processor, a microprocessor, or any other typeof processor. The processor may be used to read or detect the state orthe operating point of the power and control circuitry and the deviceresonator. The processor may implement algorithms to interpret andadjust the operating point of the circuits, elements, components,subsystems and resonator. The processor may be used to adjust theimpedance matching, the resonator, the DC to DC converters, the DC to ACconverters, the battery charging unit, the rectifier, and the like ofthe wirelessly powered device.

The processor may have wireless or wired data communication links toother devices or sources and may transmit or receive data that can beused to adjust the operating point of the system. Any combination ofpower, voltage, and current signals at a single, or over a range offrequencies, may be monitored at any point in the device circuitry.These signals may be monitored using analog or digital or combinedanalog and digital techniques. These monitored signals may be used infeedback loops or may be reported to the user in a variety of known waysor they may be stored and retrieved at later times. These signals may beused to alert a user of system failures, to indicate performance, or toprovide audio, visual, vibrational, and the like, feedback to a user ofthe system.

FIG. 40 shows components of source power and control circuitry 2302 ofan exemplary wireless power transfer system configured to supply powerto a single or multiple devices. The source power and control circuitry2302 of the exemplary system may be powered from an AC voltage source2502 such as a home electrical outlet, a DC voltage source such as abattery, a USB port of a computer, a solar cell, another wireless powersource, and the like. The source power and control circuitry 2302 maydrive the source resonator 102S with alternating current, such as with afrequency greater than 10 kHz and less than 100 MHz. The source powerand control circuitry 2302 may drive the source resonator 102S withalternating current of frequency less than less than 10 GHz. The sourcepower and control circuitry 2302 may include a DC-to-DC converter 2408S,an AC-to-DC converter 2408S, or both an AC-to-DC converter 2408S and aDC-to-DC 2408S converter, an oscillator 2508, a power amplifier 2504, animpedance matching network 2402S, and the like.

The source power and control circuitry 2302 may be powered from multipleAC-or-DC voltage sources 2502 and may contain AC-to-DC and DC-to-DCconverters 2408S to provide necessary voltage levels for the circuitcomponents as well as DC voltages for the power amplifiers that may beused to drive the source resonator. The DC voltages may be adjustableand may be used to control the output power level of the poweramplifier. The source may contain power factor correction circuitry.

The oscillator 2508 output may be used as the input to a power amplifier2504 that drives the source resonator 102S. The oscillator frequency maybe tunable and the amplitude of the oscillator signal may be varied asone means to control the output power level from the power amplifier.The frequency, amplitude, phase, waveform, and duty cycle of theoscillator signal may be controlled by analog circuitry, by digitalcircuitry or by a combination of analog and digital circuitry. Thecontrol circuitry may include a processor 2410S, such as amicroprocessor, a digital signal processor, a field programmable gatearray processor, and the like.

The impedance matching blocks 2402 of the source and device resonatorsmay be used to tune the power and control circuits and the source anddevice resonators. For example, tuning of these circuits may adjust forperturbation of the quality factor Q of the source or device resonatorsdue to extraneous objects or changes in distance between the source anddevice in a system. Tuning of these circuits may also be used to sensethe operating environment, control power flow to one or more devices, tocontrol power to a wireless power network, to reduce power when unsafeor failure mode conditions are detected, and the like.

Any combination of power, voltage, and current signals may be monitoredat any point in the source circuitry. These signals may be monitoredusing analog or digital or combined analog and digital techniques. Thesemonitored signals may be used in feedback circuits or may be reported tothe user in a variety of known ways or they may be stored and retrievedat later times. These signals may be used to alert a user to systemfailures, to alert a user to exceeded safety thresholds, to indicateperformance, or to provide audio, visual, vibrational, and the like,feedback to a user of the system.

The source power and control circuitry may contain a processor. Theprocessor may be used to read the state or the operating point of thepower and control circuitry and the source resonator. The processor mayimplement algorithms to interpret and adjust the operating point of thecircuits, elements, components, subsystems and resonator. The processormay be used to adjust the impedance matching, the resonator, theDC-to-DC converters, the AC-to-DC converters, the oscillator, the poweramplifier of the source, and the like. The processor and adjustablecomponents of the system may be used to implement frequency and/or timepower delivery multiplexing schemes. The processor may have wireless orwired data communication links to devices and other sources and maytransmit or receive data that can be used to adjust the operating pointof the system.

Although detailed and specific designs are shown in these blockdiagrams, it should be clear to those skilled in the art that manydifferent modifications and rearrangements of the components andbuilding blocks are possible within the spirit of the exemplary system.The division of the circuitry was outlined for illustrative purposes andit should be clear to those skilled in the art that the components ofeach block may be further divided into smaller blocks or merged orshared. In equivalent examples the power and control circuitry may becomposed of individual discrete components or larger integratedcircuits. For example, the rectifier circuitry may be composed ofdiscrete diodes, or use diodes integrated on a single chip. A multitudeof other circuits and integrated devices can be substituted in thedesign depending on design criteria such as power or size or cost orapplication. The whole of the power and control circuitry or any portionof the source or device circuitry may be integrated into one chip.

The impedance matching network of the device and or source may include acapacitor or networks of capacitors, an inductor or networks ofinductors, or any combination of capacitors, inductors, diodes,switches, resistors, and the like. The components of the impedancematching network may be adjustable and variable and may be controlled toaffect the efficiency and operating point of the system. The impedancematching may be performed by controlling the connection point of theresonator, adjusting the permeability of a magnetic material,controlling a bias field, adjusting the frequency of excitation, and thelike. The impedance matching may use or include any number orcombination of varactors, varactor arrays, switched elements, capacitorbanks, switched and tunable elements, reverse bias diodes, air gapcapacitors, compression capacitors, BZT electrically tuned capacitors,MEMS-tunable capacitors, voltage variable dielectrics, transformercoupled tuning circuits, and the like. The variable components may bemechanically tuned, thermally tuned, electrically tuned,piezo-electrically tuned, and the like. Elements of the impedancematching may be silicon devices, gallium nitride devices, siliconcarbide devices and the like. The elements may be chosen to withstandhigh currents, high voltages, high powers, or any combination ofcurrent, voltage and power. The elements may be chosen to be high-Qelements.

The matching and tuning calculations of the source may be performed onan external device through a USB port that powers the device. The devicemay be a computer a PDA or other computational platform.

A demonstration system used a source resonator, coupled to a deviceresonator, to wirelessly power/recharge multiple electronic consumerdevices including, but not limited to, a laptop, a DVD player, aprojector, a cell-phone, a display, a television, a projector, a digitalpicture frame, a light, a TV/DVD player, a portable music player, acircuit breaker, a hand-held tool, a personal digital assistant, anexternal battery charger, a mouse, a keyboard, a camera, an active load,and the like. A variety of devices may be powered simultaneously from asingle device resonator. Device resonators may be operatedsimultaneously as source resonators. The power supplied to a deviceresonator may pass through additional resonators before being deliveredto its intended device resonator.

Monitoring, Feedback and Control

So-called port parameter measurement circuitry may measure or monitorcertain power, voltage, and current, signals in the system andprocessors or control circuits may adjust certain settings or operatingparameters based on those measurements. In addition to these portparameter measurements, the magnitude and phase of voltage and currentsignals, and the magnitude of the power signals, throughout the systemmay be accessed to measure or monitor the system performance. Themeasured signals referred to throughout this disclosure may be anycombination of the port parameter signals, as well as voltage signals,current signals, power signals, and the like. These parameters may bemeasured using analog or digital signals, they may be sampled andprocessed, and they may be digitized or converted using a number ofknown analog and digital processing techniques. Measured or monitoredsignals may be used in feedback circuits or systems to control theoperation of the resonators and/or the system. In general, we refer tothese monitored or measured signals as reference signals, or portparameter measurements or signals, although they are sometimes alsoreferred to as error signals, monitor signals, feedback signals, and thelike. We will refer to the signals that are used to control circuitelements such as the voltages used to drive voltage controlledcapacitors as the control signals.

In some cases the circuit elements may be adjusted to achieve aspecified or predetermined impedance value for the source and deviceresonators. In other cases the impedance may be adjusted to achieve adesired impedance value for the source and device resonators when thedevice resonator is connected to a power consumer or consumers. In othercases the impedance may be adjusted to mitigate changes in the resonantfrequency, or impedance or power level changes owing to movement of thesource and/or device resonators, or changes in the environment (such asthe movement of interacting materials or objects) in the vicinity of theresonators. In other cases the impedance of the source and deviceresonators may be adjusted to different impedance values.

The coupled resonators may be made of different materials and mayinclude different circuits, components and structural designs or theymay be the same. The coupled resonators may include performancemonitoring and measurement circuitry, signal processing and controlcircuitry or a combination of measurement and control circuitry. Some orall of the high-Q magnetic resonators may include tunable impedancecircuits. Some or all of the high-Q magnetic resonators may includeautomatically controlled tunable impedance circuits.

FIG. 41 shows a magnetic resonator with port parameter measurementcircuitry 3802 configured to measure certain parameters of theresonator. The port parameter measurement circuitry may measure theinput impedance of the structure, or the reflected power. Port parametermeasurement circuits may be included in the source and/or deviceresonator designs and may be used to measure two port circuit parameterssuch as S-parameters (scattering parameters), Z-parameters (impedanceparameters), Y-parameters (admittance parameters), T-parameters(transmission parameters), H-parameters (hybrid parameters),ABCD-parameters (chain, cascade or transmission parameters), and thelike. These parameters may be used to describe the electrical behaviorof linear electrical networks when various types of signals are applied.

Different parameters may be used to characterize the electrical networkunder different operating or coupling scenarios. For example,S-parameters may be used to measure matched and unmatched loads. Inaddition, the magnitude and phase of voltage and current signals withinthe magnetic resonators and/or within the sources and devices themselvesmay be monitored at a variety of points to yield system performanceinformation. This information may be presented to users of the systemvia a user interface such as a light, a read-out, a beep, a noise, avibration or the like, or it may be presented as a digital signal or itmay be provided to a processor in the system and used in the automaticcontrol of the system. This information may be logged, stored, or may beused by higher level monitoring and control systems.

FIG. 42 shows a circuit diagram of a magnetic resonator where thetunable impedance network may be realized with voltage controlledcapacitors 3902 or capacitor networks. Such an implementation may beadjusted, tuned or controlled by electrical circuits and/or computerprocessors, such as a programmable voltage source 3908, and the like.For example, the voltage controlled capacitors may be adjusted inresponse to data acquired by the port parameter measurement circuitry3802 and processed by a measurement analysis and control algorithmsubsystem 3904. Reference signals may be derived from the port parametermeasurement circuitry or other monitoring circuitry designed to measurethe degree of deviation from a desired system operating point. Themeasured reference signals may include voltage, current,complex-impedance, reflection coefficient, power levels and the like, atone or several points in the system and at a single frequency or atmultiple frequencies.

The reference signals may be fed to measurement analysis and controlalgorithm subsystem modules that may generate control signals to changethe values of various components in a tunable impedance matchingnetwork. The control signals may vary the resonant frequency and/or theinput impedance of the magnetic resonator, or the power level suppliedby the source, or the power level drawn by the device, to achieve thedesired power exchange between power supplies/generators and powerdrains/loads.

Adjustment algorithms may be used to adjust the frequency and/orimpedance of the magnetic resonators. The algorithms may take inreference signals related to the degree of deviation from a desiredoperating point for the system and output correction or control signalsrelated to that deviation that control variable or tunable elements ofthe system to bring the system back towards the desired operating pointor points. The reference signals for the magnetic resonators may beacquired while the resonators are exchanging power in a wireless powertransmission system, or they may be switched out of the circuit duringsystem operation. Corrections to the system may be applied or performedcontinuously, periodically, upon a threshold crossing, digitally, usinganalog methods, and the like.

FIG. 43 shows an end-to-end wireless power transmission system. Both thesource and the device may include port measurement circuitry 3802 and aprocessor 2410. The box labeled “coupler/switch” 4002 indicates that theport measurement circuitry 3802 may be connected to the resonator 102 bya directional coupler or a switch, enabling the measurement, adjustmentand control of the source and device resonators to take place inconjunction with, or separate from, the power transfer functionality.

The port parameter measurement and/or processing circuitry may residewith some, any, or all resonators in a system. The port parametermeasurement circuitry may utilize portions of the power transmissionsignal or may utilize excitation signals over a range of frequencies tomeasure the source/device resonator response (i.e. transmission andreflection between any two ports in the system), and may containamplitude and/or phase information. Such measurements may be achievedwith a swept single frequency signal or a multi-frequency signal. Thesignals used to measure and monitor the resonators and the wirelesspower transmission system may be generated by a processor or processorsand standard input/output (I/O) circuitry including digital to analogconverters (DACs), analog to digital converters (ADCs), amplifiers,signal generation chips, passive components and the like. Measurementsmay be achieved using test equipment such as a network analyzer or usingcustomized circuitry. The measured reference signals may be digitized byADCs and processed using customized algorithms running on a computer, amicroprocessor, a DSP chip, an ASIC, and the like. The measuredreference signals may be processed in an analog control loop.

The measurement circuitry may measure any set of two port parameterssuch as S-parameters, Y-parameters, Z-parameters, H-parameters,G-parameters, T-parameters, ABCD-parameters, and the like. Measurementcircuitry may be used to characterize current and voltage signals atvarious points in the drive and resonator circuitry, the impedanceand/or admittance of the source and device resonators at opposite endsof the system, i.e. looking into the source resonator matching network(“port 1” in FIG. 43) towards the device and vice versa.

The device may measure relevant signals and/or port parameters,interpret the measurement data, and adjust its matching network tooptimize the impedance looking into the coupled system independently ofthe actions of the source. The source may measure relevant portparameters, interpret the measurement data, and adjust its matchingnetwork to optimize the impedance looking into the coupled systemindependently of the actions of the device.

FIG. 43 shows a block diagram of a source and device in a wireless powertransmission system. The system may be configured to execute a controlalgorithm that actively adjusts the tuning/matching networks in eitherof or both the source and device resonators to optimize performance inthe coupled system. Port measurement circuitry 3802S may measure signalsin the source and communicate those signals to a processor 2410. Aprocessor 2410 may use the measured signals in a performanceoptimization or stabilization algorithm and generate control signalsbased on the outputs of those algorithms. Control signals may be appliedto variable circuit elements in the tuning/impedance matching circuits2402S to adjust the source's operating characteristics, such as power inthe resonator and coupling to devices. Control signals may be applied tothe power supply or generator to turn the supply on or off, to increaseor decrease the power level, to modulate the supply signal and the like.

The power exchanged between sources and devices may depend on a varietyof factors. These factors may include the effective impedance of thesources and devices, the Q's of the sources and devices, the resonantfrequencies of the sources and devices, the distances between sourcesand devices, the interaction of materials and objects in the vicinity ofsources and devices and the like. The port measurement circuitry andprocessing algorithms may work in concert to adjust the resonatorparameters to maximize power transfer, to hold the power transferconstant, to controllably adjust the power transfer, and the like, underboth dynamic and steady state operating conditions.

Some, all or none of the sources and devices in a system implementationmay include port measurement circuitry 3802S and processing 2410capabilities. FIG. 44 shows an end-to-end wireless power transmissionsystem in which only the source 102S contains port measurement circuitry3802 and a processor 2410S. In this case, the device resonator 102Doperating characteristics may be fixed or may be adjusted by analogcontrol circuitry and without the need for control signals generated bya processor.

FIG. 45 shows an end-to-end wireless power transmission system. Both thesource and the device may include port measurement circuitry 3802 but inthe system of FIG. 45, only the source contains a processor 2410S. Thesource and device may be in communication with each other and theadjustment of certain system parameters may be in response to controlsignals that have been wirelessly communicated, such as though wirelesscommunications circuitry 4202, between the source and the device. Thewireless communication channel 4204 may be separate from the wirelesspower transfer channel 4208, or it may be the same. That is, theresonators 102 used for power exchange may also be used to exchangeinformation. In some cases, information may be exchanged by modulating acomponent a source or device circuit and sensing that change with portparameter or other monitoring equipment.

Implementations where only the source contains a processor 2410 may bebeneficial for multi-device systems where the source can handle all ofthe tuning and adjustment “decisions” and simply communicate the controlsignals back to the device(s). This implementation may make the devicesmaller and cheaper because it may eliminate the need for, or reduce therequired functionality of, a processor in the device. A portion of or anentire data set from each port measurement at each device may be sentback to the source microprocessor for analysis, and the controlinstructions may be sent back to the devices. These communications maybe wireless communications.

FIG. 46 shows an end-to-end wireless power transmission system. In thisexample, only the source contains port measurement circuitry 3802 and aprocessor 2410S. The source and device may be in communication, such asvia wireless communication circuitry 4202, with each other and theadjustment of certain system parameters may be in response to controlsignals that have been wirelessly communicated between the source andthe device.

FIG. 47 shows coupled electromagnetic resonators 102 whose frequency andimpedance may be automatically adjusted using a processor or a computer.Resonant frequency tuning and continuous impedance adjustment of thesource and device resonators may be implemented with reverse biaseddiodes, Schottky diodes and/or varactor elements contained within thecapacitor networks shown as C1, C2, and C3 in FIG. 47. The circuittopology that was built and demonstrated and is described here isexemplary and is not meant to limit the discussion of automatic systemtuning and control in any way. Other circuit topologies could beutilized with the measurement and control architectures discussed inthis disclosure.

Device and source resonator impedances and resonant frequencies may bemeasured with a network analyzer 4402A-B, or by other means describedabove, and implemented with a controller, such as with Lab View 4404.The measurement circuitry or equipment may output data to a computer ora processor that implements feedback algorithms and dynamically adjuststhe frequencies and impedances via a programmable DC voltage source.

In one arrangement, the reverse biased diodes (Schottky, semiconductorjunction, and the like) used to realize the tunable capacitance drewvery little DC current and could be reverse biased by amplifiers havinglarge series output resistances. This implementation may enable DCcontrol signals to be applied directly to the controllable circuitelements in the resonator circuit while maintaining a very high-Q in themagnetic resonator.

C2 biasing signals may be isolated from C1 and/or C3 biasing signalswith a DC blocking capacitor as shown in FIG. 47, if the required DCbiasing voltages are different. The output of the biasing amplifiers maybe bypassed to circuit ground to isolate RF voltages from the biasingamplifiers, and to keep non-fundamental RF voltages from being injectedinto the resonator. The reverse bias voltages for some of the capacitorsmay instead be applied through the inductive element in the resonatoritself, because the inductive element acts as a short circuit at DC.

The port parameter measurement circuitry may exchange signals with aprocessor (including any required ADCs and DACs) as part of a feedbackor control system that is used to automatically adjust the resonantfrequency, input impedance, energy stored or captured by the resonatoror power delivered by a source or to a device load. The processor mayalso send control signals to tuning or adjustment circuitry in orattached to the magnetic resonator.

When utilizing varactors or diodes as tunable capacitors, it may bebeneficial to place fixed capacitors in parallel and in series with thetunable capacitors operating at high reverse bias voltages in thetuning/matching circuits. This arrangement may yield improvements incircuit and system stability and in power handling capability byoptimizing the operating voltages on the tunable capacitors.

Varactors or other reverse biased diodes may be used as a voltagecontrolled capacitor. Arrays of varactors may be used when highervoltage compliance or different capacitance is required than that of asingle varactor component. Varactors may be arranged in an N by M arrayconnected serially and in parallel and treated as a single two terminalcomponent with different characteristics than the individual varactorsin the array. For example, an N by N array of equal varactors wherecomponents in each row are connected in parallel and components in eachcolumn are connected in series may be used as a two terminal device withthe same capacitance as any single varactor in the array but with avoltage compliance that is N times that of a single varactor in thearray. Depending on the variability and differences of parameters of theindividual varactors in the array additional biasing circuits composedof resistors, inductors, and the like may be needed. A schematic of afour by four array of unbiased varactors 4502 that may be suitable formagnetic resonator applications is shown in FIG. 48.

Further improvements in system performance may be realized by carefulselection of the fixed value capacitor(s) that are placed in paralleland/or in series with the tunable (varactor/diode/capacitor) elements.Multiple fixed capacitors that are switched in or out of the circuit maybe able to compensate for changes in resonator Q's, impedances, resonantfrequencies, power levels, coupling strengths, and the like, that mightbe encountered in test, development and operational wireless powertransfer systems. Switched capacitor banks and other switched elementbanks may be used to assure the convergence to the operating frequenciesand impedance values required by the system design.

An exemplary control algorithm for isolated and coupled magneticresonators may be described for the circuit and system elements shown inFIG. 47. One control algorithm first adjusts each of the source anddevice resonator loops “in isolation”, that is, with the otherresonators in the system “shorted out” or “removed” from the system. Forpractical purposes, a resonator can be “shorted out” by making itresonant at a much lower frequency such as by maximizing the value of C1and/or C3. This step effectively reduces the coupling between theresonators, thereby effectively reducing the system to a singleresonator at a particular frequency and impedance.

Tuning a magnetic resonator in isolation includes varying the tunableelements in the tuning and matching circuits until the values measuredby the port parameter measurement circuitry are at their predetermined,calculated or measured relative values. The desired values for thequantities measured by the port parameter measurement circuitry may bechosen based on the desired matching impedance, frequency, strongcoupling parameter, and the like. For the exemplary algorithms disclosedbelow, the port parameter measurement circuitry measures S-parametersover a range of frequencies. The range of frequencies used tocharacterize the resonators may be a compromise between the systemperformance information obtained and computation/measurement speed. Forthe algorithms described below the frequency range may be approximately+/−20% of the operating resonant frequency.

Each isolated resonator may be tuned as follows. First, short out theresonator not being adjusted. Next minimize C1, C2, and C3, in theresonator that is being characterized and adjusted. In most cases therewill be fixed circuit elements in parallel with C1, C2, and C3, so thisstep does not reduce the capacitance values to zero. Next, startincreasing C2 until the resonator impedance is matched to the “target”real impedance at any frequency in the range of measurement frequenciesdescribed above. The initial “target” impedance may be less than theexpected operating impedance for the coupled system.

C2 may be adjusted until the initial “target” impedance is realized fora frequency in the measurement range. Then C1 and/or C3 may be adjusteduntil the loop is resonant at the desired operating frequency.

Each resonator may be adjusted according to the above algorithm. Aftertuning each resonator in isolation, a second feedback algorithm may beapplied to optimize the resonant frequencies and/or input impedances forwirelessly transferring power in the coupled system.

The required adjustments to C1 and/or C2 and/or C3 in each resonator inthe coupled system may be determined by measuring and processing thevalues of the real and imaginary parts of the input impedance fromeither and/or both “port(s)” shown in FIG. 43. For coupled resonators,changing the input impedance of one resonator may change the inputimpedance of the other resonator. Control and tracking algorithms mayadjust one port to a desired operating point based on measurements atthat port, and then adjust the other port based on measurements at thatother port. These steps may be repeated until both sides converge to thedesired operating point.

S-parameters may be measured at both the source and device ports and thefollowing series of measurements and adjustments may be made. In thedescription that follows, Z₀ is an input impedance and may be the targetimpedance. In some cases Z₀ is 50 ohms or is near 50 ohms. Z₁ and Z₂ areintermediate impedance values that may be the same value as Z₀ or may bedifferent than Z₀. Re{value} means the real part of a value andIm{value} means the imaginary part of a value.

An algorithm that may be used to adjust the input impedance and resonantfrequency of two coupled resonators is set forth below:

1) Adjust each resonator “in isolation” as described above.

2) Adjust source C1/C3 until, at ω_(o), Re{S11}=(Z₁+/−∈_(Re)) asfollows:

-   -   If Re{S11@ω_(o)}>(Z₁+∈_(Re)), decrease C1/C3. If        Re{S11@ω_(o)}<(Z₀−∈_(Re)), increase C1/C3.

3) Adjust source C2 until, at ω_(o), Im{S11}=(+/−∈_(Im)) as follows:

-   -   If Im{S11@ω_(o)}>∈_(Im), decrease C2. If Im{S11@ω_(o)}<−∈_(Im),        increase C2.    -   4) Adjust device C1/C3 until, at ω₀, Re{S22}=(Z₂+/−∈_(Re)) as        follows:    -   If Re{S22@ω_(o)}>(Z₂+∈_(Re)), decrease C1/C3. If        Re{S22@ω_(o)}<(Z₀−∈_(Re)), increase C1/C3.

5) Adjust device C2 until, at ω_(o), Im{S22}=0 as follows:

-   -   If Im{S22@ω_(o)}>∈_(Im), decrease C2. If Im{S22@ω_(o)}<−∈_(Im),        increase C2.

We have achieved a working system by repeating steps 1-4 until both(Re{S11}, Im{S11}) and (Re{S22}, Im{S22}) converge to ((Z₀+/−∈_(Re)),(+/−∈_(Im))) at ω_(o), where Z₀ is the desired matching impedance andω_(o) is the desired operating frequency. Here, ∈_(Im) represents themaximum deviation of the imaginary part, at ω_(o), from the desiredvalue of 0, and ∈_(Re) represents the maximum deviation of the real partfrom the desired value of Z₀. It is understood that ∈_(Im) and ∈_(Re)can be adjusted to increase or decrease the number of steps toconvergence at the potential cost of system performance (efficiency). Itis also understood that steps 1-4 can be performed in a variety ofsequences and a variety of ways other than that outlined above (i.e.first adjust the source imaginary part, then the source real part; orfirst adjust the device real part, then the device imaginary part, etc.)The intermediate impedances Z₁ and Z₂ may be adjusted during steps 1-4to reduce the number of steps required for convergence. The desire ortarget impedance value may be complex, and may vary in time or underdifferent operating scenarios.

Steps 1-4 may be performed in any order, in any combination and anynumber of times. Having described the above algorithm, variations to thesteps or the described implementation may be apparent to one of ordinaryskill in the art. The algorithm outlined above may be implemented withany equivalent linear network port parameter measurements (i.e.,Z-parameters, Y-parameters, T-parameters, H-parameters, ABCD-parameters,etc.) or other monitor signals described above, in the same way thatimpedance or admittance can be alternatively used to analyze a linearcircuit to derive the same result.

The resonators may need to be retuned owing to changes in the “loaded”resistances, Rs and Rd, caused by changes in the mutual inductance M(coupling) between the source and device resonators. Changes in theinductances, Ls and Ld, of the inductive elements themselves may becaused by the influence of external objects, as discussed earlier, andmay also require compensation. Such variations may be mitigated by theadjustment algorithm described above.

A directional coupler or a switch may be used to connect the portparameter measurement circuitry to the source resonator andtuning/adjustment circuitry. The port parameter measurement circuitrymay measure properties of the magnetic resonator while it is exchangingpower in a wireless power transmission system, or it may be switched outof the circuit during system operation. The port parameter measurementcircuitry may measure the parameters and the processor may controlcertain tunable elements of the magnetic resonator at start-up, or atcertain intervals, or in response to changes in certain system operatingparameters.

A wireless power transmission system may include circuitry to vary ortune the impedance and/or resonant frequency of source and deviceresonators. Note that while tuning circuitry is shown in both the sourceand device resonators, the circuitry may instead be included in only thesource or the device resonators, or the circuitry may be included inonly some of the source and/or device resonators. Note too that while wemay refer to the circuitry as “tuning” the impedance and or resonantfrequency of the resonators, this tuning operation simply means thatvarious electrical parameters such as the inductance or capacitance ofthe structure are being varied. In some cases, these parameters may bevaried to achieve a specific predetermined value, in other cases theymay be varied in response to a control algorithm or to stabilize atarget performance value that is changing. In some cases, the parametersare varied as a function of temperature, of other sources or devices inthe area, of the environment, at the like.

Applications

For each listed application, it will be understood by one of ordinaryskill-in-the-art that there are a variety of ways that the resonatorstructures used to enable wireless power transmission may be connectedor integrated with the objects that are supplying or being powered. Theresonator may be physically separate from the source and device objects.The resonator may supply or remove power from an object usingtraditional inductive techniques or through direct electricalconnection, with a wire or cable for example. The electrical connectionmay be from the resonator output to the AC or DC power input port on theobject. The electrical connection may be from the output power port ofan object to the resonator input.

FIG. 49 shows a source resonator 4904 that is physically separated froma power supply and a device resonator 4902 that is physically separatedfrom the device 4900, in this illustration a laptop computer. Power maybe supplied to the source resonator, and power may be taken from thedevice resonator directly, by an electrical connection. One of ordinaryskill in the art will understand from the materials incorporated byreference that the shape, size, material composition, arrangement,position and orientation of the resonators above are provided by way ofnon-limiting example, and that a wide variation in any and all of theseparameters could be supported by the disclosed technology for a varietyof applications.

Continuing with the example of the laptop, and without limitation, thedevice resonator may be physically connected to the device it ispowering or charging. For example, as shown in FIG. 50 a and FIG. 50 b,the device resonator 5002 may be (a) integrated into the housing of thedevice 5000 or (b) it may be attached by an adapter. The resonator 5002may (FIG. 50 b-d) or may not (FIG. 50 a) be visible on the device. Theresonator may be affixed to the device, integrated into the device,plugged into the device, and the like.

The source resonator may be physically connected to the source supplyingthe power to the system. As described above for the devices and deviceresonators, there are a variety of ways the resonators may be attachedto, connected to or integrated with the power supply. One of ordinaryskill in the art will understand that there are a variety of ways theresonators may be integrated in the wireless power transmission system,and that the sources and devices may utilize similar or differentintegration techniques.

Continuing again with the example of the laptop computer, and withoutlimitation, the laptop computer may be powered, charged or recharged bya wireless power transmission system. A source resonator may be used tosupply wireless power and a device resonator may be used to capture thewireless power. A device resonator 5002 may be integrated into the edgeof the screen (display) as illustrated in FIG. 50 d, and/or into thebase of the laptop as illustrated in FIG. 50 c. The source resonator5002 may be integrated into the base of the laptop and the deviceresonator may be integrated into the edge of the screen. The resonatorsmay also or instead be affixed to the power source and/or the laptop.The source and device resonators may also or instead be physicallyseparated from the power supply and the laptop and may be electricallyconnected by a cable. The source and device resonators may also orinstead be physically separated from the power supply and the laptop andmay be electrically coupled using a traditional inductive technique. Oneof ordinary skill in the art will understand that, while the precedingexamples relate to wireless power transmission to a laptop, that themethods and systems disclosed for this application may be suitablyadapted for use with other electrical or electronic devices. In general,the source resonator may be external to the source and supplying powerto a device resonator that in turn supplies power the device, or thesource resonator may be connected to the source and supplying power to adevice resonator that in turn supplies power to a portion of the device,or the source resonator may internal to the source and supplying powerto a device resonator that in turn supplies power to a portion of thedevice, as well as any combination of these.

In some systems, the source, or source resonator may be movable oractive and may track, follow, or attach to the source or sourceresonator. For a movable device it may be preferable to maintainalignment between the source resonator and the device resonator tomaximize power transfer efficiency. As a device moves a source or asource resonator may track the position of the device or deviceresonator and adjust its position to ensure optimum or improvedalignment. The device tracking by the source may be automatic. A sourcemay include sensors for determining the position of the device and meansfor adjusting its position, such as by actuators, motors, magnets, andthe like. The source may sense the position of the device by measuringpower efficiency, magnetic fields, signals generated by the device,optical recognition, and the like. In some embodiments the source maypartially attach to the device. A source and device may include magnetswhich attach the source and device together. A magnetic attachment maybe functional through a supporting structure such as a table. Themagnetic attachment will attach the source through the supportingstructure making a freely movable source to follow the device as itmoves. For example, continuing with the laptop example, a source mountedon a freely movable structure may be mounted under a supportingstructure such as a table surface, dock, box, and the like. A laptop,with a magnetic attachment placed on top of the table surface willattract the source below the supporting structure and result in properalignment. Furthermore, as the laptop with the device resonator ismoved, or slid on top of the supporting structure, the freely movablesource and source resonator may follow the device resonator of thelaptop due to the magnetic attraction between the source and the devicewithout requiring active movement mechanisms. In some embodiments, acombination of active and passive movement mechanisms may be used, suchthat for example, move the source into initial alignment with the devicewhereupon magnetic attachment means ensures that the source maypassively follow the device as it moves.

A system or method disclosed herein may provide power to an electricalor electronics device, such as, and not limited to, phones, cell phones,cordless phones, smart phones, PDAs, audio devices, music players, MP3players, radios, portable radios and players, wireless headphones,wireless headsets, computers, laptop computers, wireless keyboards,wireless mouse, televisions, displays, flat screen displays, computerdisplays, displays embedded in furniture, digital picture frames,electronic books, (e.g. the Kindle, e-ink books, magazines, and thelike), remote control units (also referred to as controllers, gamecontrollers, commanders, clickers, and the like, and used for the remotecontrol of a plurality of electronics devices, such as televisions,video games, displays, computers, audio visual equipment, lights, andthe like), lighting devices, cooling devices, air circulation devices,purification devices, personal hearing aids, power tools, securitysystems, alarms, bells, flashing lights, sirens, sensors, loudspeakers,electronic locks, electronic keypads, light switches, other electricalswitches, and the like. Here the term electronic lock is used toindicate a door lock which operates electronically (e.g. with electroniccombo-key, magnetic card, RFID card, and the like) which is placed on adoor instead of a mechanical key-lock. Such locks are often batteryoperated, risking the possibility that the lock might stop working whena battery dies, leaving the user locked-out. This may be avoided wherethe battery is either charged or completely replaced by a wireless powertransmission implementation as described herein.

Here, the term light switch (or other electrical switch) is meant toindicate any switch (e.g. on a wall of a room) in one part of the roomthat turns on/off a device (e.g. light fixture at the center of theceiling) in another part of the room. To install such a switch by directconnection, one would have to run a wire all the way from the device tothe switch. Once such a switch is installed at a particular spot, it maybe very difficult to move. Alternately, one can envision a ‘wirelessswitch’, where “wireless” means the switching (on/off) commands arecommunicated wirelessly, but such a switch has traditionally required abattery for operation. In general, having too many battery operatedswitches around a house may be impractical, because those many batterieswill need to be replaced periodically. So, a wirelessly communicatingswitch may be more convenient, provided it is also wirelessly powered.For example, there already exist communications wireless door-bells thatare battery powered, but where one still has to replace the battery inthem periodically. The remote doorbell button may be made to becompletely wireless, where there may be no need to ever replace thebattery again. Note that here, the term ‘cordless’ or ‘wireless’ or‘communications wireless’ is used to indicate that there is a cordlessor wireless communications facility between the device and anotherelectrical component, such as the base station for a cordless phone, thecomputer for a wireless keyboard, and the like. One skilled in the artwill recognize that any electrical or electronics device may include awireless communications facility, and that the systems and methodsdescribed herein may be used to add wireless power transmission to thedevice. As described herein, power to the electrical or electronicsdevice may be delivered from an external or internal source resonator,and to the device or portion of the device. Wireless power transmissionmay significantly reduce the need to charge and/or replace batteries fordevices that enter the near vicinity of the source resonator and therebymay reduce the downtime, cost and disposal issues often associated withbatteries.

The systems and methods described herein may provide power to lightswithout the need for either wired power or batteries. That is, thesystems and methods described herein may provide power to lights withoutwired connection to any power source, and provide the energy to thelight non-radiatively across mid-range distances, such as across adistance of a quarter of a meter, one meter, three meters, and the like.A ‘light’ as used herein may refer to the light source itself, such asan incandescent light bulb, florescent light bulb lamps, Halogen lamps,gas discharge lamps, fluorescent lamps, neon lamps, high-intensitydischarge lamps, sodium vapor lamps, Mercury-vapor lamps,electroluminescent lamps, light emitting diodes (LED) lamps, and thelike; the light as part of a light fixture, such as a table lamp, afloor lamp, a ceiling lamp, track lighting, recessed light fixtures, andthe like; light fixtures integrated with other functions, such as alight/ceiling fan fixture, and illuminated picture frame, and the like.As such, the systems and methods described herein may reduce thecomplexity for installing a light, such as by minimizing theinstallation of electrical wiring, and allowing the user to place ormount the light with minimal regard to sources of wired power. Forinstance, a light may be placed anywhere in the vicinity of a sourceresonator, where the source resonator may be mounted in a plurality ofdifferent places with respect to the location of the light, such as onthe floor of the room above, (e.g. as in the case of a ceiling light andespecially when the room above is the attic); on the wall of the nextroom, on the ceiling of the room below, (e.g. as in the case of a floorlamp); in a component within the room or in the infrastructure of theroom as described herein; and the like. For example, a light/ceiling fancombination is often installed in a master bedroom, and the masterbedroom often has the attic above it. In this instance a user may moreeasily install the light/ceiling fan combination in the master bedroom,such as by simply mounting the light/ceiling fan combination to theceiling, and placing a source coil (plugged into the house wired ACpower) in the attic above the mounted fixture. In another example, thelight may be an external light, such as a flood light or security light,and the source resonator mounted inside the structure. This way ofinstalling lighting may be particularly beneficial to users who renttheir homes, because now they may be able to mount lights and such otherelectrical components without the need to install new electrical wiring.The control for the light may also be communicated by near-fieldcommunications as described herein, or by traditional wirelesscommunications methods.

The systems and methods described herein may provide power from a sourceresonator to a device resonator that is either embedded into the devicecomponent, or outside the device component, such that the devicecomponent may be a traditional electrical component or fixture. Forinstance, a ceiling lamp may be designed or retrofitted with a deviceresonator integrated into the fixture, or the ceiling lamp may be atraditional wired fixture, and plugged into a separate electricalfacility equipped with the device resonator. In an example, theelectrical facility may be a wireless junction box designed to have adevice resonator for receiving wireless power, say from a sourceresonator placed on the floor of the room above (e.g. the attic), andwhich contains a number of traditional outlets that are powered from thedevice resonator. The wireless junction box, mounted on the ceiling, maynow provide power to traditional wired electrical components on theceiling (e.g. a ceiling light, track lighting, a ceiling fan). Thus, theceiling lamp may now be mounted to the ceiling without the need to runwires through the infrastructure of the building. This type of deviceresonator to traditional outlet junction box may be used in a pluralityof applications, including being designed for the interior or exteriorof a building, to be made portable, made for a vehicle, and the like.Wireless power may be transferred through common building materials,such as wood, wall board, insulation, glass. brick, stone, concrete, andthe like. The benefits of reduced installation cost, re-configurability,and increased application flexibility may provide the user significantbenefits over traditional wired installations. The device resonator fora traditional outlet junction box may include a plurality of electricalcomponents for facilitating the transfer of power from the deviceresonator to the traditional outlets, such as power source electronicswhich convert the specific frequencies needed to implement efficientpower transfer to line voltage, power capture electronics which mayconvert high frequency AC to usable voltage and frequencies (AC and/orDC), controls which synchronize the capture device and the power outputand which ensure consistent, safe, and maximally efficient powertransfer, and the like.

The systems and methods described herein may provide advantages tolights or electrical components that operate in environments that arewet, harsh, controlled, and the like, such has outside and exposed tothe rain, in a pool/sauna/shower, in a maritime application, inhermetically sealed components, in an explosive-proof room, on outsidesignage, a harsh industrial environment in a volatile environment (e.g.from volatile vapors or airborne organics, such as in a grain silo orbakery), and the like. For example, a light mounted under the waterlevel of a pool is normally difficult to wire up, and is required to bewater-sealed despite the need for external wires. But a pool light usingthe principles disclosed herein may more easily be made water sealed, asthere may be no external wires needed. In another example, an explosionproof room, such as containing volatile vapors, may not only need to behermetically sealed, but may need to have all electrical contacts (thatcould create a spark) sealed. Again, the principles disclosed herein mayprovide a convenient way to supply sealed electrical components for suchapplications.

The systems and methods disclosed herein may provide power to gamecontroller applications, such as to a remote handheld game controller.These game controllers may have been traditionally powered solely bybatteries, where the game controller's use and power profile causedfrequent changing of the battery, battery pack, rechargeable batteries,and the like, that may not have been ideal for the consistent use to thegame controller, such as during extended game play. A device resonatormay be placed into the game controller, and a source resonator,connected to a power source, may be placed in the vicinity. Further, thedevice resonator in the game controller may provide power directly tothe game controller electronics without a battery; provide power to abattery, battery pack, rechargeable battery, and the like, which thenprovides power to the game controller electronics; and the like. Thegame controller may utilize multiple battery packs, where each batterypack is equipped with a device resonator, and thus may be constantlyrecharging while in the vicinity of the source resonator, whetherplugged into the game controller or not. The source resonator may beresident in a main game controller facility for the game, where the maingame controller facility and source resonator are supplied power from AC‘house’ power; resident in an extension facility form AC power, such asin a source resonator integrated into an ‘extension cord’; resident in agame chair, which is at least one of plugged into the wall AC, pluggedinto the main game controller facility, powered by a battery pack in thegame chair; and the like. The source resonator may be placed andimplemented in any of the configurations described herein.

The systems and methods disclosed herein may integrate device resonatorsinto battery packs, such as battery packs that are interchangeable withother battery packs. For instance, some portable devices may use upelectrical energy at a high rate such that a user may need to havemultiple interchangeable battery packs on hand for use, or the user mayoperate the device out of range of a source resonator and needadditional battery packs to continue operation, such as for power tools,portable lights, remote control vehicles, and the like. The use of theprinciples disclosed herein may not only provide a way for deviceresonator enabled battery packs to be recharged while in use and inrange, but also for the recharging of battery packs not currently in useand placed in range of a source resonator. In this way, battery packsmay always be ready to use when a user runs down the charge of a batterypack being used. For example, a user may be working with a wirelesspower tool, where the current requirements may be greater than can berealized through direct powering from a source resonator. In this case,despite the fact that the systems and methods described herein may beproviding charging power to the in-use battery pack while in range, thebattery pack may still run down, as the power usage may have exceededthe recharge rate. Further, the user may simply be moving in and out ofrange, or be completely out of range while using the device. However,the user may have placed additional battery packs in the vicinity of thesource resonator, which have been recharged while not in use, and arenow charged sufficiently for use. In another example, the user may beworking with the power tool away from the vicinity of the sourceresonator, but leave the supplemental battery packs to charge in thevicinity of the source resonator, such as in a room with a portablesource resonator or extension cord source resonator, in the user'svehicle, in user's tool box, and the like. In this way, the user may nothave to worry about taking the time to, and/or remembering to plug intheir battery packs for future use. The user may only have to change outthe used battery pack for the charged battery pack and place the usedone in the vicinity of the source resonator for recharging. Deviceresonators may be built into enclosures with known battery form factorsand footprints and may replace traditional chemical batteries in knowndevices and applications. For example, device resonators may be builtinto enclosures with mechanical dimensions equivalent to AA batteries,AAA batteries, D batteries, 9V batteries, laptop batteries, cell phonebatteries, and the like. The enclosures may include a smaller “buttonbattery” in addition to the device resonator to store charge and provideextended operation, either in terms of time or distance. Other energystorage devices in addition to or instead of button batteries may beintegrated with the device resonators and any associated powerconversion circuitry. These new energy packs may provide similar voltageand current levels as provided by traditional batteries, but may becomposed of device resonators, power conversion electronics, a smallbattery, and the like. These new energy packs may last longer thantraditional batteries because they may be more easily recharged and maybe recharging constantly when they are located in a wireless power zone.In addition, such energy packs may be lighter than traditionalbatteries, may be safer to use and store, may operate over widertemperature and humidity ranges, may be less harmful to the environmentwhen thrown away, and the like. As described herein, these energy packsmay last beyond the life of the product when used in wireless powerzones as described herein.

The systems and methods described herein may be used to power visualdisplays, such as in the case of the laptop screen, but more generallyto include the great variety and diversity of displays utilized intoday's electrical and electronics components, such as in televisions,computer monitors, desktop monitors, laptop displays, digital photoframes, electronic books, mobile device displays (e.g. on phones, PDAs,games, navigation devices, DVD players), and the like. Displays that maybe powered through one or more of the wireless power transmissionsystems described herein may also include embedded displays, such asembedded in electronic components (e.g. audio equipment, homeappliances, automotive displays, entertainment devices, cash registers,remote controls), in furniture, in building infrastructure, in avehicle, on the surface of an object (e.g. on the surface of a vehicle,building, clothing, signs, transportation), and the like. Displays maybe very small with tiny resonant devices, such as in a smart card asdescribed herein, or very large, such as in an advertisement sign.Displays powered using the principles disclosed herein may also be anyone of a plurality of imaging technologies, such as liquid crystaldisplay (LCD), thin film transistor LCD, passive LCD, cathode ray tube(CRT), plasma display, projector display (e.g. LCD, DLP, LCOS),surface-conduction electron-emitter display (SED), organiclight-emitting diode (OLED), and the like. Source coil configurationsmay include attaching to a primary power source, such as building power,vehicle power, from a wireless extension cord as described herein, andthe like; attached to component power, such as the base of an electricalcomponent (e.g. the base of a computer, a cable box for a TV); anintermediate relay source coil; and the like. For example, hanging adigital display on the wall may be very appealing, such as in the caseof a digital photo frame that receives its information signalswirelessly or through a portable memory device, but the need for anunsightly power cord may make it aesthetically unpleasant. However, witha device coil embedded in the digital photo frame, such as wrappedwithin the frame portion, may allow the digital photo frame to be hungwith no wires at all. The source resonator may then be placed in thevicinity of the digital photo frame, such as in the next room on theother side of the wall, plugged directly into a traditional poweroutlet, from a wireless extension cord as described herein, from acentral source resonator for the room, and the like.

The systems and methods described herein may provide wireless powertransmission between different portions of an electronics facility.Continuing with the example of the laptop computer, and withoutlimitation, the screen of the laptop computer may require power from thebase of the laptop. In this instance, the electrical power has beentraditionally routed via direct electrical connection from the base ofthe laptop to the screen over a hinged portion of the laptop between thescreen and the base. When a wired connection is utilized, the wiredconnection may tend to wear out and break, the design functionality ofthe laptop computer may be limited by the required direct electricalconnection, the design aesthetics of the laptop computer may be limitedby the required direct electrical connection, and the like. However, awireless connection may be made between the base and the screen. In thisinstance, the device resonator may be placed in the screen portion topower the display, and the base may be either powered by a second deviceresonator, by traditional wired connections, by a hybrid ofresonator-battery-direct electrical connection, and the like. This maynot only improve the reliability of the power connection due to theremoval of the physical wired connection, but may also allow designersto improve the functional and/or aesthetic design of the hinge portionof the laptop in light of the absence of physical wires associated withthe hinge. Again, the laptop computer has been used here to illustratehow the principles disclosed herein may improve the design of anelectric or electronic device, and should not be taken as limiting inany way. For instance, many other electrical devices with separatedphysical portions could benefit from the systems and methods describedherein, such as a refrigerator with electrical functions on the door,including an ice maker, a sensor system, a light, and the like; a robotwith movable portions, separated by joints; a car's power system and acomponent in the car's door; and the like. The ability to provide powerto a device via a device resonator from an external source resonator, orto a portion of the device via a device resonator from either externalor internal source resonators, will be recognized by someone skilled inthe art to be widely applicable across the range of electric andelectronic devices.

The systems and methods disclosed herein may provide for a sharing ofelectrical power between devices, such as between charged devices anduncharged devices. For instance a charged up device or appliance may actlike a source and send a predetermined amount of energy, dialed inamount of energy, requested and approved amount of energy, and the like,to a nearby device or appliance. For example, a user may have a cellphone and a digital camera that are both capable of transmitting andreceiving power through embedded source and device resonators, and oneof the devices, say the cell phone, is found to be low on charge. Theuser may then transfer charge from the digital camera to the cell phone.The source and device resonators in these devices may utilize the samephysical resonator for both transmission and reception, utilize separatesource and device resonators, one device may be designed to receive andtransmit while the other is designed to receive only, one device may bedesigned to transmit only and the other to receive only, and the like.

To prevent complete draining the battery of a device it may have asetting allowing a user to specify how much of the power resource thereceiving device is entitled to. It may be useful, for example, to put alimit on the amount of power available to external devices and to havethe ability to shut down power transmission when battery power fallsbelow a threshold.

The systems and methods described herein may provide wireless powertransfer to a nearby electrical or electronics component in associationwith an electrical facility, where the source resonator is in theelectrical facility and the device resonator is in the electronicscomponent. The source resonator may also be connected to, plugged into,attached to the electrical facility, such as through a universalinterface (e.g. a USB interface, PC card interface), supplementalelectrical outlet, universal attachment point, and the like, of theelectrical facility. For example, the source resonator may be inside thestructure of a computer on a desk, or be integrated into some object,pad, and the like, that is connected to the computer, such as into oneof the computer's USB interfaces. In the example of the source resonatorembedded in the object, pad, and the like, and powered through a USBinterface, the source resonator may then be easily added to a user'sdesktop without the need for being integrated into any other electronicsdevice, thus conveniently providing a wireless energy zone around whicha plurality of electric and/or electronics devices may be powered. Theelectrical facility may be a computer, a light fixture, a dedicatedsource resonator electrical facility, and the like, and the nearbycomponents may be computer peripherals, surrounding electronicscomponents, infrastructure devices, and the like, such as computerkeyboards, computer mouse, fax machine, printer, speaker system, cellphone, audio device, intercom, music player, PDA, lights, electricpencil sharpener, fan, digital picture frame, calculator, electronicgames, and the like. For example, a computer system may be theelectrical facility with an integrated source resonator that utilizes a‘wireless keyboard’ and ‘wireless mouse’, where the use of the termwireless here is meant to indicate that there is wireless communicationfacility between each device and the computer, and where each devicemust still contain a separate battery power source. As a result,batteries would need to be replaced periodically, and in a largecompany, may result in a substantial burden for support personnel forreplacement of batteries, cost of batteries, and proper disposal ofbatteries. Alternatively, the systems and methods described herein mayprovide wireless power transmission from the main body of the computerto each of these peripheral devices, including not only power to thekeyboard and mouse, but to other peripheral components such as a fax,printer, speaker system, and the like, as described herein. A sourceresonator integrated into the electrical facility may provide wirelesspower transmission to a plurality of peripheral devices, user devices,and the like, such that there is a significant reduction in the need tocharge and/or replace batteries for devices in the near vicinity of thesource resonator integrated electrical facility. The electrical facilitymay also provide tuning or auto-tuning software, algorithms, facilities,and the like, for adjusting the power transfer parameters between theelectrical facility and the wirelessly powered device. For example, theelectrical facility may be a computer on a user's desktop, and thesource resonator may be either integrated into the computer or pluggedinto the computer (e.g. through a USB connection), where the computerprovides a facility for providing the tuning algorithm (e.g. through asoftware program running on the computer).

The systems and methods disclosed herein may provide wireless powertransfer to a nearby electrical or electronics component in associationwith a facility infrastructure component, where the source resonator isin, or mounted on, the facility infrastructure component and the deviceresonator is in the electronics component. For instance, the facilityinfrastructure component may be a piece of furniture, a fixed wall, amovable wall or partition, the ceiling, the floor, and the sourceresonator attached or integrated into a table or desk (e.g. justbelow/above the surface, on the side, integrated into a table top ortable leg), a mat placed on the floor (e.g. below a desk, placed on adesk), a mat on the garage floor (e.g. to charge the car and/or devicesin the car), in a parking lot/garage (e.g. on a post near where the caris parked), a television (e.g. for charging a remote control), acomputer monitor (e.g. to power/charge a wireless keyboard, wirelessmouse, cell phone), a chair (e.g. for powering electric blankets,medical devices, personal health monitors), a painting, officefurniture, common household appliances, and the like. For example, thefacility infrastructure component may be a lighting fixture in an officecubical, where the source resonator and light within the lightingfixture are both directly connected to the facility's wired electricalpower. However, with the source resonator now provided in the lightingfixture, there would be no need to have any additional wired connectionsfor those nearby electrical or electronics components that are connectedto, or integrated with, a device resonator. In addition, there may be areduced need for the replacement of batteries for devices with deviceresonators, as described herein.

The use of the systems and methods described herein to supply power toelectrical and electronic devices from a central location, such as froma source resonator in an electrical facility, from a facilityinfrastructure component and the like, may minimize the electricalwiring infrastructure of the surrounding work area. For example, in anenterprise office space there are typically a great number of electricaland electronic devices that need to be powered by wired connections.With utilization of the systems and methods described herein, much ofthis wiring may be eliminated, saving the enterprise the cost ofinstallation, decreasing the physical limitations associated with officewalls having electrical wiring, minimizing the need for power outletsand power strips, and the like. The systems and methods described hereinmay save money for the enterprise through a reduction in electricalinfrastructure associated with installation, re-installation (e.g.,reconfiguring office space), maintenance, and the like. In anotherexample, the principles disclosed herein may allow the wirelessplacement of an electrical outlet in the middle of a room. Here, thesource could be placed on the ceiling of a basement below the locationon the floor above where one desires to put an outlet. The deviceresonator could be placed on the floor of the room right above it.Installing a new lighting fixture (or any other electric device for thatmatter, e.g. camera, sensor, etc., in the center of the ceiling may nowbe substantially easier for the same reason).

In another example, the systems and methods described herein may providepower “through” walls. For instance, suppose one has an electric outletin one room (e.g. on a wall), but one would like to have an outlet inthe next room, but without the need to call an electrician, or drillthrough a wall, or drag a wire around the wall, or the like. Then onemight put a source resonator on the wall in one room, and a deviceresonator outlet/pickup on the other side of the wall. This may power aflat-screen TV or stereo system or the like (e.g. one may not want tohave an ugly wire climbing up the wall in the living room, but doesn'tmind having a similar wire going up the wall in the next room, e.g.storage room or closet, or a room with furniture that blocks view ofwires running along the wall). The systems and methods described hereinmay be used to transfer power from an indoor source to various electricdevices outside of homes or buildings without requiring holes to bedrilled through, or conduits installed in, these outside walls. In thiscase, devices could be wirelessly powered outside the building withoutthe aesthetic or structural damage or risks associated with drillingholes through walls and siding. In addition, the systems and methodsdescribed herein may provide for a placement sensor to assist in placingan interior source resonator for an exterior device resonator equippedelectrical component. For example, a home owner may place a securitylight on the outside of their home which includes a wireless deviceresonator, and now needs to adequately or optimally position the sourceresonator inside the home. A placement sensor acting between the sourceand device resonators may better enable that placement by indicatingwhen placement is good, or to a degree of good, such as in a visualindication, an audio indication, a display indication, and the like. Inanother example, and in a similar way, the systems and methods describedherein may provide for the installation of equipment on the roof of ahome or building, such as radio transmitters and receivers, solar panelsand the like. In the case of the solar panel, the source resonator maybe associated with the panel, and power may be wirelessly transferred toa distribution panel inside the building without the need for drillingthrough the roof. The systems and methods described herein may allow forthe mounting of electric or electrical components across the walls ofvehicles (such as through the roof) without the need to drill holes,such as for automobiles, water craft, planes, trains, and the like. Inthis way, the vehicle's walls may be left intact without holes beingdrilled, thus maintaining the value of the vehicle, maintainingwatertightness, eliminating the need to route wires, and the like. Forexample, mounting a siren or light to the roof of a police car decreasesthe future resale of the car, but with the systems and methods describedherein, any light, horn, siren, and the like, may be attached to theroof without the need to drill a hole.

The systems and methods described herein may be used for wirelesstransfer of power from solar photovoltaic (PV) panels. PV panels withwireless power transfer capability may have several benefits includingsimpler installation, more flexible, reliable, and weatherproof design.Wireless power transfer may be used to transfer power from the PV panelsto a device, house, vehicle, and the like. Solar PV panels may have awireless source resonator allowing the PV panel to directly power adevice that is enabled to receive the wireless power. For example, asolar PV panel may be mounted directly onto the roof of a vehicle,building, and the like. The energy captured by the PV panel may bewirelessly transferred directly to devices inside the vehicle or underthe roof of a building. Devices that have resonators can wirelesslyreceive power from the PV panel. Wireless power transfer from PV panelsmay be used to transfer energy to a resonator that is coupled to thewired electrical system of a house, vehicle, and the like allowingtraditional power distribution and powering of conventional deviceswithout requiring any direct contact between the exterior PV panels andthe internal electrical system.

With wireless power transfer significantly simpler installation ofrooftop PV panels is possible because power may be transmittedwirelessly from the panel to a capture resonator in the house,eliminating all outside wiring, connectors, and conduits, and any holesthrough the roof or walls of the structure. Wireless power transfer usedwith solar cells may have a benefit in that it can reduced roof dangersince it eliminates the need for electricians to work on the roof tointerconnect panels, strings, and junction boxes. Installation of solarpanels integrated with wireless power transfer may require less skilledlabor since fewer electrical contacts need to be made. Less sitespecific design may be required with wireless power transfer since thetechnology gives the installer the ability to individually optimize andposition each solar PV panel, significantly reducing the need forexpensive engineering and panel layout services. There may not be needto carefully balance the solar load on every panel and no need forspecialized DC wiring layout and interconnections.

For rooftop or on-wall installations of PV panels, the capture resonatormay be mounted on the underside of the roof, inside the wall, or in anyother easily accessible inside space within a foot or two of the solarPV panel. A diagram showing a possible general rooftop PV panelinstallation is shown in FIG. 51. Various PV solar collectors may bemounted in top of a roof with wireless power capture coils mountedinside the building under the roof. The resonator coils in the PV panelscan transfer their energy wirelessly through the roof to the wirelesscapture coils. The captured energy from the PV cells may be collectedand coupled to the electrical system of the house to power electric andelectronic devices or coupled to the power grid when more power thanneeded is generated. Energy is captured from the PV cells withoutrequiring holes or wires that penetrate the roof or the walls of thebuilding. Each PV panel may have a resonator that is coupled to acorresponding resonator on the interior of the vehicle or building.Multiple panels may utilize wireless power transfer between each otherto transfer or collect power to one or a couple of designated panelsthat are coupled to resonators on the interior of the vehicle of house.Panels may have wireless power resonators on their sides or in theirperimeter that can couple to resonators located in other like panelsallowing transfer of power from panel to panel. An additional bus orconnection structure may be provided that wirelessly couples the powerfrom multiple panels on the exterior of a building or vehicle andtransfers power to one or a more resonators on the interior of buildingor vehicle.

For example, as shown in FIG. 51, a source resonator 5102 may be coupledto a PV cell 5100 mounted on top of roof 5104 of a building. Acorresponding capture resonator 5106 is placed inside the building. Thesolar energy captured by the PV cells can then be transferred betweenthe source resonators 5102 outside to the device resonators 5106 insidethe building without having direct holes and connections through thebuilding.

Each solar PV panel with wireless power transfer may have its owninverter, significantly improving the economics of these solar systemsby individually optimizing the power production efficiency of eachpanel, supporting a mix of panel sizes and types in a singleinstallation, including single panel “pay-as-you-grow” systemexpansions. Reduction of installation costs may make a single paneleconomical for installation. Eliminating the need for panel stringdesigns and careful positioning and orienting of multiple panels, andeliminating a single point of failure for the system.

Wireless power transfer in PV solar panels may enable more solardeployment scenarios because the weather-sealed solar PV panelseliminate the need to drill holes for wiring through sealed surfacessuch as car roofs and ship decks, and eliminate the requirement that thepanels be installed in fixed locations. With wireless power transfer, PVpanels may be deployed temporarily, and then moved or removed, withoutleaving behind permanent alterations to the surrounding structures. Theymay be placed out in a yard on sunny days, and moved around to followthe sun, or brought inside for cleaning or storage, for example. Forbackyard or mobile solar PV applications, an extension cord with awireless energy capture device may be thrown on the ground or placednear the solar unit. The capture extension cord can be completely sealedfrom the elements and electrically isolated, so that it may be used inany indoor or outdoor environment.

With wireless power transfer no wires or external connections may benecessary and the PV solar panels can be completely weather sealed.Significantly improved reliability and lifetime of electrical componentsin the solar PV power generation and transmission circuitry can beexpected since the weather-sealed enclosures can protect components fromUV radiation, humidity, weather, and the like. With wireless powertransfer and weather-sealed enclosures it may be possible to use lessexpensive components since they will no longer be directly exposed toexternal factors and weather elements and it may reduce the cost of PVpanels.

Power transfer between the PV panels and the capture resonators inside abuilding or a vehicle may be bidirectional. Energy may be transmittedfrom the house grid to the PV panels to provide power when the panels donot have enough energy to perform certain tasks such. Reverse power flowcan be used to melt snow from the panels, or power motors that willposition the panels in a more favorable positions with respect to thesun energy. Once the snow is melted or the panels are repositioned andthe PV panels can generate their own energy the direction of powertransfer can be returned to normal delivering power from the PV panelsto buildings, vehicles, or devices.

PV panels with wireless power transfer may include auto-tuning oninstallation to ensure maximum and efficient power transfer to thewireless collector. Variations in roofing materials or variations indistances between the PV panels and the wireless power collector indifferent installations may affect the performance or perturb theproperties of the resonators of the wireless power transfer. To reducethe installation complexity the wireless power transfer components mayinclude a tuning capability to automatically adjust their operatingpoint to compensate for any effects due to materials or distance.Frequency, impedance, capacitance, inductance, duty cycle, voltagelevels and the like may be adjusted to ensure efficient and safe powertransfer

The systems and methods described herein may be used to provide awireless power zone on a temporary basis or in extension of traditionalelectrical outlets to wireless power zones, such as through the use of awireless power extension cord. For example, a wireless power extensioncord may be configured as a plug for connecting into a traditional poweroutlet, a long wire such as in a traditional power extension cord, and aresonant source coil on the other end (e.g. in place of, or in additionto, the traditional socket end of the extension The wireless extensioncord may also be configured where there are source resonators at aplurality of locations along the wireless extension cord. Thisconfiguration may then replace any traditional extension cord wherethere are wireless power configured devices, such as providing wirelesspower to a location where there is no convenient power outlet (e.g. alocation in the living room where there's no outlet), for temporarywireless power where there is no wired power infrastructure (e.g. aconstruction site), out into the yard where there are no outlets (e.g.for parties or for yard grooming equipment that is wirelessly powered todecrease the chances of cutting the traditional electrical cord), andthe like. The wireless extension cord may also be used as a drop withina wall or structure to provide wireless power zones within the vicinityof the drop. For example, a wireless extension cord could be run withina wall of a new or renovated room to provide wireless power zoneswithout the need for the installation of traditional electrical wiringand outlets.

The systems and methods described herein may be utilized to providepower between moving parts or rotating assemblies of a vehicle, a robot,a mechanical device, a wind turbine, or any other type of rotatingdevice or structure with moving parts such as robot arms, constructionvehicles, movable platforms and the like. Traditionally, power in suchsystems may have been provided by slip rings or by rotary joints forexample. Using wireless power transfer as described herein, the designsimplicity, reliability and longevity of these devices may besignificantly improved because power can be transferred over a range ofdistances without any physical connections or contact points that maywear down or out with time. In particular, the preferred coaxial andparallel alignment of the source and device coils may provide wirelesspower transmission that is not severely modulated by the relativerotational motion of the two coils.

The systems and methods described herein may be utilized to extend powerneeds beyond the reach of a single source resonator by providing aseries of source-device-source-device resonators. For instance, supposean existing detached garage has no electrical power and the owner nowwants to install a new power service. However, the owner may not want torun wires all over the garage, or have to break into the walls to wireelectrical outlets throughout the structure. In this instance, the ownermay elect to connect a source resonator to the new power service,enabling wireless power to be supplied to device resonator outletsthroughout the back of the garage. The owner may then install adevice-source ‘relay’ to supply wireless power to device resonatoroutlets in the front of the garage. That is, the power relay may nowreceive wireless power from the primary source resonator, and thensupply available power to a second source resonator to supply power to asecond set of device resonators in the front of the garage. Thisconfiguration may be repeated again and again to extend the effectiverange of the supplied wireless power.

Multiple resonators may be used to extend power needs around an energyblocking material. For instance, it may be desirable to integrate asource resonator into a computer or computer monitor such that theresonator may power devices placed around and especially in front of themonitor or computer such as keyboards, computer mice, telephones, andthe like. Due to aesthetics, space constraints, and the like an energysource that may be used for the source resonator may only be located orconnected to in the back of the monitor or computer. In many designs ofcomputer or monitors metal components and metal containing circuits areused in the design and packaging which may limit and prevent powertransfer from source resonator in the back of the monitor or computer tothe front of the monitor or computer. An additional repeater resonatormay be integrated into the base or pedestal of the monitor or computerthat couples to the source resonator in the back of the monitor orcomputer and allows power transfer to the space in front of the monitoror computer. The intermediate resonator integrated into the base orpedestal of the monitor or computer does not require an additional powersource, it captures power from the source resonator and transfers powerto the front around the blocking or power shielding metal components ofthe monitor or computer.

The systems and methods described herein may be built-into, placed on,hung from, embedded into, integrated into, and the like, the structuralportions of a space, such as a vehicle, office, home, room, building,outdoor structure, road infrastructure, and the like. For instance, oneor more sources may be built into, placed on, hung from, embedded orintegrated into a wall, a ceiling or ceiling panel, a floor, a divider,a doorway, a stairwell, a compartment, a road surface, a sidewalk, aramp, a fence, an exterior structure, and the like. One or more sourcesmay be built into an entity within or around a structure, for instance abed, a desk, a chair, a rug, a mirror, a clock, a display, a television,an electronic device, a counter, a table, a piece of furniture, a pieceof artwork, an enclosure, a compartment, a ceiling panel, a floor ordoor panel, a dashboard, a trunk, a wheel well, a post, a beam, asupport or any like entity. For example, a source resonator may beintegrated into the dashboard of a user's car so that any device that isequipped with or connected to a device resonator may be supplied withpower from the dashboard source resonator. In this way, devices broughtinto or integrated into the car may be constantly charged or poweredwhile in the car.

The systems and methods described herein may provide power through thewalls of vehicles, such as boats, cars, trucks, busses, trains, planes,satellites and the like. For instance, a user may not want to drillthrough the wall of the vehicle in order to provide power to an electricdevice on the outside of the vehicle. A source resonator may be placedinside the vehicle and a device resonator may be placed outside thevehicle (e.g. on the opposite side of a window, wall or structure). Inthis way the user may achieve greater flexibility in optimizing theplacement, positioning and attachment of the external device to thevehicle, (such as without regard to supplying or routing electricalconnections to the device). In addition, with the electrical powersupplied wirelessly, the external device may be sealed such that it iswater tight, making it safe if the electric device is exposed to weather(e.g. rain), or even submerged under water. Similar techniques may beemployed in a variety of applications, such as in charging or poweringhybrid vehicles, navigation and communications equipment, constructionequipment, remote controlled or robotic equipment and the like, whereelectrical risks exist because of exposed conductors. The systems andmethods described herein may provide power through the walls of vacuumchambers or other enclosed spaces such as those used in semiconductorgrowth and processing, material coating systems, aquariums, hazardousmaterials handling systems and the like. Power may be provided totranslation stages, robotic arms, rotating stages, manipulation andcollection devices, cleaning devices and the like.

The systems and methods described herein may provide wireless power to akitchen environment, such as to counter-top appliances, includingmixers, coffee makers, toasters, toaster ovens, grills, griddles,electric skillets, electric pots, electric woks, waffle makers,blenders, food processors, crock pots, warming trays, inductioncooktops, lights, computers, displays, and the like. This technology mayimprove the mobility and/or positioning flexibility of devices, reducethe number of power cords stored on and strewn across the counter-top,improve the washability of the devices, and the like. For example, anelectric skillet may traditionally have separate portions, such as onethat is submersible for washing and one that is not submersible becauseit includes an external electrical connection (e.g. a cord or a socketfor a removable cord). However, with a device resonator integrated intothe unit, all electrical connections may be sealed, and so the entiredevice may now be submersed for cleaning. In addition, the absence of anexternal cord may eliminate the need for an available electrical walloutlet, and there is no longer a need for a power cord to be placedacross the counter or for the location of the electric griddle to belimited to the location of an available electrical wall outlet.

The systems and methods described herein may provide continuouspower/charging to devices equipped with a device resonator because thedevice doesn't leave the proximity of a source resonator, such as fixedelectrical devices, personal computers, intercom systems, securitysystems, household robots, lighting, remote control units, televisions,cordless phones, and the like. For example, a household robot (e.g.ROOMBA) could be powered/charged via wireless power, and thus workarbitrarily long without recharging. In this way, the power supplydesign for the household robot may be changed to take advantage of thiscontinuous source of wireless power, such as to design the robot to onlyuse power from the source resonator without the need for batteries, usepower from the source resonator to recharge the robot's batteries, usethe power from the source resonator to trickle charge the robot'sbatteries, use the power from the source resonator to charge acapacitive energy storage unit, and the like. Similar optimizations ofthe power supplies and power circuits may be enabled, designed, andrealized, for any and all of the devices disclosed herein.

The systems and methods described herein may be able to provide wirelesspower to electrically heated blankets, heating pads/patches, and thelike. These electrically heated devices may find a variety of indoor andoutdoor uses. For example, hand and foot warmers supplied to outdoorworkers such as guards, policemen, construction workers and the likemight be remotely powered from a source resonator associated with orbuilt into a nearby vehicle, building, utility pole, traffic light,portable power unit, and the like.

The systems and methods described herein may be used to power a portableinformation device that contains a device resonator and that may bepowered up when the information device is near an information sourcecontaining a source resonator. For instance, the information device maybe a card (e.g. credit card, smart card, electronic card, and the like)carried in a user's pocket, wallet, purse, vehicle, bike, and the like.The portable information device may be powered up when it is in thevicinity of an information source that then transmits information to theportable information device that may contain electronic logic,electronic processors, memory, a display, an LCD display, LEDs, RFIDtags, and the like. For example, the portable information device may bea credit card with a display that “turns on” when it is near aninformation source, and provide the user with some information such as,“You just received a coupon for 50% off your next Coca Cola purchase”.The information device may store information such as coupon or discountinformation that could be used on subsequent purchases. The portableinformation device may be programmed by the user to contain tasks,calendar appointments, to-do lists, alarms and reminders, and the like.The information device may receive up-to-date price information andinform the user of the location and price of previously selected oridentified items.

The systems and methods described herein may provide wireless powertransmission to directly power or recharge the batteries in sensors,such as environmental sensors, security sensors, agriculture sensors,appliance sensors, food spoilage sensors, power sensors, and the like,which may be mounted internal to a structure, external to a structure,buried underground, installed in walls, and the like. For example, thiscapability may replace the need to dig out old sensors to physicallyreplace the battery, or to bury a new sensor because the old sensor isout of power and no longer operational. These sensors may be charged upperiodically through the use of a portable sensor source resonatorcharging unit. For instance, a truck carrying a source resonatorequipped power source, say providing ˜kW of power, may provide enoughpower to a ˜mW sensor in a few minutes to extend the duration ofoperation of the sensor for more than a year. Sensors may also bedirectly powered, such as powering sensors that are in places where itis difficult to connect to them with a wire but they are still withinthe vicinity of a source resonator, such as devices outside of a house(security camera), on the other side of a wall, on an electric lock on adoor, and the like. In another example, sensors that may need to beotherwise supplied with a wired power connection may be powered throughthe systems and methods described herein. For example, a ground faultinterrupter breaker combines residual current and over-currentprotection in one device for installation into a service panel. However,the sensor traditionally has to be independently wired for power, andthis may complicate the installation. However, with the systems andmethods described herein the sensor may be powered with a deviceresonator, where a single source resonator is provided within theservice panel, thus simplifying the installation and wiringconfiguration within the service panel. In addition, the single sourceresonator may power device resonators mounted on either side of thesource resonator mounted within the service panel, throughout theservice panel, to additional nearby service panels, and the like. Thesystems and methods described herein may be employed to provide wirelesspower to any electrical component associated with electrical panels,electrical rooms, power distribution and the like, such as in electricswitchboards, distribution boards, circuit breakers, transformers,backup batteries, fire alarm control panels, and the like. Through theuse of the systems and methods described herein, it may be easier toinstall, maintain, and modify electrical distribution and protectioncomponents and system installations.

In another example, sensors that are powered by batteries may runcontinuously, without the need to change the batteries, because wirelesspower may be supplied to periodically or continuously recharge ortrickle charge the battery. In such applications, even low levels ofpower may adequately recharge or maintain the charge in batteries,significantly extending their lifetime and usefulness. In some cases,the battery life may be extended to be longer than the lifetime of thedevice it is powering, making it essentially a battery that “lastsforever”.

The systems and methods described herein may be used for chargingimplanted medical device batteries, such as in an artificial heart,pacemaker, heart pump, insulin pump, implanted coils for nerve oracupressure/acupuncture point stimulation, and the like. For instance,it may not be convenient or safe to have wires sticking out of a patientbecause the wires may be a constant source of possible infection and maygenerally be very unpleasant for the patient. The systems and methodsdescribed herein may also be used to charge or power medical devices inor on a patient from an external source, such as from a bed or ahospital wall or ceiling with a source resonator. Such medical devicesmay be easier to attach, read, use and monitor the patient. The systemsand methods described herein may ease the need for attaching wires tothe patient and the patient's bed or bedside, making it more convenientfor the patient to move around and get up out of bed without the risk ofinadvertently disconnecting a medical device. This may, for example, beusefully employed with patients that have multiple sensors monitoringthem, such as for measuring pulse, blood pressure, glucose, and thelike. For medical and monitoring devices that utilize batteries, thebatteries may need to be replaced quite often, perhaps multiple times aweek. This may present risks associated with people forgetting toreplace batteries, not noticing that the devices or monitors are notworking because the batteries have died, infection associated withimproper cleaning of the battery covers and compartments, and the like.

The systems and methods described herein may reduce the risk andcomplexity of medical device implantation procedures. Today manyimplantable medical devices such as ventricular assist devices,pacemakers, defibrillators and the like, require surgical implantationdue to their device form factor, which is heavily influenced by thevolume and shape of the long-life battery that is integrated in thedevice. In one aspect, there is described herein a non-invasive methodof recharging the batteries so that the battery size may be dramaticallyreduced, and the entire device may be implanted, such as via a catheter.A catheter implantable device may include an integrated capture ordevice coil. A catheter implantable capture or device coil may bedesigned so that it may be wired internally, such as after implantation.The capture or device coil may be deployed via a catheter as a rolled upflexible coil (e.g. rolled up like two scrolls, easily unrolledinternally with a simple spreader mechanism). The power source coil maybe worn in a vest or article of clothing that is tailored to fit in sucha way that places the source in proper position, may be placed in achair cushion or bed cushion, may be integrated into a bed or piece offurniture, and the like.

The systems and methods described herein may enable patients to have a‘sensor vest’, sensor patch, and the like, that may include at least oneof a plurality of medical sensors and a device resonator that may bepowered or charged when it is in the vicinity of a source resonator.Traditionally, this type of medical monitoring facility may haverequired batteries, thus making the vest, patch, and the like, heavy,and potentially impractical. But using the principles disclosed herein,no batteries (or a lighter rechargeable battery) may be required, thusmaking such a device more convenient and practical, especially in thecase where such a medical device could be held in place without straps,such as by adhesive, in the absence of batteries or with substantiallylighter batteries. A medical facility may be able to read the sensordata remotely with the aim of anticipating (e.g. a few minutes ahead of)a stroke, a heart-attack, or the like. When the vest is used by a personin a location remote from the medical facility, such as in their home,the vest may then be integrated with a cell-phone or communicationsdevice to call an ambulance in case of an accident or a medical event.The systems and methods described herein may be of particular value inthe instance when the vest is to be used by an elderly person, wheretraditional non-wireless recharging practices (e.g. replacing batteries,plugging in at night, and the like) may not be followed as required. Thesystems and methods described herein may also be used for chargingdevices that are used by or that aid handicapped or disabled people whomay have difficulty replacing or recharging batteries, or reliablysupplying power to devices they enjoy or rely on.

The systems and methods described herein may be used for the chargingand powering of artificial limbs. Artificial limbs have become verycapable in terms of replacing the functionality of original limbs, suchas arms, legs, hands and feet. However, an electrically poweredartificial limb may require substantial power, (such as 10-20 W) whichmay translate into a substantial battery. In that case, the amputee maybe left with a choice between a light battery that doesn't last verylong, and a heavy battery that lasts much longer, but is more difficultto ‘carry’ around. The systems and methods described herein may enablethe artificial limb to be powered with a device resonator, where thesource resonator is either carried by the user and attached to a part ofthe body that may more easily support the weight (such as on a beltaround the waist, for example) or located in an external location wherethe user will spend an adequate amount of time to keep the devicecharged or powered, such as at their desk, in their car, in their bed,and the like.

The systems and methods described herein may be used for charging andpowering of electrically powered exo-skeletons, such as those used inindustrial and military applications, and for elderly/weak/sick people.An electrically powered exo-skeleton may provide up to a 10-to-20 timesincrease in “strength” to a person, enabling the person to performphysically strenuous tasks repeatedly without much fatigue. However,exo-skeletons may require more than 100 W of power under certain usescenarios, so battery powered operation may be limited to 30 minutes orless. The delivery of wireless power as described herein may provide auser of an exo-skeleton with a continuous supply of power both forpowering the structural movements of the exo-skeleton and for poweringvarious monitors and sensors distributed throughout the structure. Forinstance, an exo-skeleton with an embedded device resonator(s) may besupplied with power from a local source resonator. For an industrialexo-skeleton, the source resonator may be placed in the walls of thefacility. For a military exo-skeleton, the source resonator may becarried by an armored vehicle. For an exo-skeleton employed to assist acaretaker of the elderly, the source resonator(s) may be installed orplaced in or the room(s) of a person's home.

The systems and methods described herein may be used for thepowering/charging of portable medical equipment, such as oxygen systems,ventilators, defibrillators, medication pumps, monitors, and equipmentin ambulances or mobile medical units, and the like. Being able totransport a patient from an accident scene to the hospital, or to movepatients in their beds to other rooms or areas, and bring all theequipment that is attached with them and have it powered the whole timeoffers great benefits to the patients' health and eventual well-being.Certainly one can understand the risks and problems caused by medicaldevices that stop working because their battery dies or because theymust be unplugged while a patient is transported or moved in any way.For example, an emergency medical team on the scene of an automotiveaccident might need to utilize portable medical equipment in theemergency care of patients in the field. Such portable medical equipmentmust be properly maintained so that there is sufficient battery life topower the equipment for the duration of the emergency. However, it istoo often the case that the equipment is not properly maintained so thatbatteries are not fully charged and in some cases, necessary equipmentis not available to the first responders. The systems and methodsdescribed herein may provide for wireless power to portable medicalequipment (and associated sensor inputs on the patient) in such a waythat the charging and maintaining of batteries and power packs isprovided automatically and without human intervention. Such a systemalso benefits from the improved mobility of a patient unencumbered by avariety of power cords attached to the many medical monitors and devicesused in their treatment.

The systems and methods described herein may be used to for thepowering/charging of personal hearing aids. Personal hearing aids needto be small and light to fit into or around the ear of a person. Thesize and weight restrictions limit the size of batteries that can beused. Likewise, the size and weight restrictions of the device makebattery replacement difficult due to the delicacy of the components. Thedimensions of the devices and hygiene concerns make it difficult tointegrate additional charging ports to allow recharging of thebatteries. The systems and methods described herein may be integratedinto the hearing aid and may reduce the size of the necessary batterieswhich may allow even smaller hearing aids. Using the principlesdisclosed herein, the batteries of the hearing aid may be rechargedwithout requiring external connections or charging ports. Charging anddevice circuitry and a small rechargeable battery may be integrated intoa form factor of a conventional hearing aid battery allowing retrofitinto existing hearing aids. The hearing aid may be recharged while it isused and worn by a person. The energy source may be integrated into apad or a cup allowing recharging when the hearing is placed on such astructure. The charging source may be integrated into a hearing aiddryer box allowing wireless recharging while the hearing aid is dryingor being sterilized. The source and device resonator may be used to alsoheat the device reducing or eliminating the need for an additionalheating element. Portable charging cases powered by batteries or ACadaptors may be used as storage and charging stations.

The source resonator for the medical systems described above may be inthe main body of some or all of the medical equipment, with deviceresonators on the patient's sensors and devices; the source resonatormay be in the ambulance with device resonators on the patient's sensorsand the main body of some or all of the equipment; a primary sourceresonator may be in the ambulance for transferring wireless power to adevice resonator on the medical equipment while the medical equipment isin the ambulance and a second source resonator is in the main body ofthe medical equipment and a second device resonator on the patientsensors when the equipment is away from the ambulance; and the like. Thesystems and methods described herein may significantly improve the easewith which medical personnel are able to transport patients from onelocation to another, where power wires and the need to replace ormanually charge associated batteries may now be reduced.

The systems and methods described herein may be used for the charging ofdevices inside a military vehicle or facility, such as a tank, armoredcarrier, mobile shelter, and the like. For instance, when soldiers comeback into a vehicle after “action” or a mission, they may typicallystart charging their electronic devices. If their electronic deviceswere equipped with device resonators, and there was a source resonatorinside the vehicle, (e.g. integrated in the seats or on the ceiling ofthe vehicle), their devices would start charging immediately. In fact,the same vehicle could provide power to soldiers/robots (e.g. packbotfrom iRobot) standing outside or walking beside the vehicle. Thiscapability may be useful in minimizing accidental battery-swapping withsomeone else (this may be a significant issue, as soldiers tend to trustonly their own batteries); in enabling quicker exits from a vehicleunder attack; in powering or charging laptops or other electronicdevices inside a tank, as too many wires inside the tank may present ahazard in terms of reduced ability to move around fast in case of“trouble” and/or decreased visibility; and the like. The systems andmethods described herein may provide a significant improvement inassociation with powering portable power equipment in a militaryenvironment.

The systems and methods described herein may provide wireless poweringor charging capabilities to mobile vehicles such as golf carts or othertypes of carts, all-terrain vehicles, electric bikes, scooters, cars,mowers, bobcats and other vehicles typically used for construction andlandscaping and the like. The systems and methods described herein mayprovide wireless powering or charging capabilities to miniature mobilevehicles, such as mini-helicopters, airborne drones, remote controlplanes, remote control boats, remote controlled or robotic rovers,remote controlled or robotic lawn mowers or equipment, bomb detectionrobots, and the like. For instance, mini-helicopter flying above amilitary vehicle to increase its field of view can fly for a few minuteson standard batteries. If these mini-helicopters were fitted with adevice resonator, and the control vehicle had a source resonator, themini-helicopter might be able to fly indefinitely. The systems andmethods described herein may provide an effective alternative torecharging or replacing the batteries for use in miniature mobilevehicles. In addition, the systems and methods described herein mayprovide power/charging to even smaller devices, such asmicroelectromechanical systems (MEMS), nano-robots, nano devices, andthe like. In addition, the systems and methods described herein may beimplemented by installing a source device in a mobile vehicle or flyingdevice to enable it to serve as an in-field or in-flight re-charger,that may position itself autonomously in proximity to a mobile vehiclethat is equipped with a device resonator.

The systems and methods described herein may be used to provide powernetworks for temporary facilities, such as military camps, oil drillingsetups, remote filming locations, and the like, where electrical poweris required, such as for power generators, and where power cables aretypically run around the temporary facility. There are many instanceswhen it is necessary to set up temporary facilities that require power.The systems and methods described herein may enable a more efficient wayto rapidly set up and tear down these facilities, and may reduce thenumber of wires that must be run throughout the faculties to supplypower. For instance, when Special Forces move into an area, they mayerect tents and drag many wires around the camp to provide the requiredelectricity. Instead, the systems and methods described herein mayenable an army vehicle, outfitted with a power supply and a sourceresonator, to park in the center of the camp, and provide all the powerto nearby tents where the device resonator may be integrated into thetents, or some other piece of equipment associated with each tent orarea. A series of source-device-source-device resonators may be used toextend the power to tents that are farther away. That is, the tentsclosest to the vehicle could then provide power to tents behind them.The systems and methods described herein may provide a significantimprovement to the efficiency with which temporary installations may beset up and torn down, thus improving the mobility of the associatedfacility.

The systems and methods described herein may be used in vehicles, suchas for replacing wires, installing new equipment, powering devicesbrought into the vehicle, charging the battery of a vehicle (e.g. for atraditional gas powered engine, for a hybrid car, for an electric car,and the like), powering devices mounted to the interior or exterior ofthe vehicle, powering devices in the vicinity of the vehicle, and thelike. For example, the systems and methods described herein may be usedto replace wires such as those are used to power lights, fans andsensors distributed throughout a vehicle. As an example, a typical carmay have 50 kg of wires associated with it, and the use of the systemsand methods described herein may enable the elimination of a substantialamount of this wiring. The performance of larger and more weightsensitive vehicles such as airplanes or satellites could benefit greatlyfrom having the number of cables that must be run throughout the vehiclereduced. The systems and methods described herein may allow theaccommodation of removable or supplemental portions of a vehicle withelectric and electrical devices without the need for electricalharnessing. For example, a motorcycle may have removable side boxes thatact as a temporary trunk space for when the cyclist is going on a longtrip. These side boxes may have exterior lights, interior lights,sensors, auto equipment, and the like, and if not for being equippedwith the systems and methods described herein might require electricalconnections and harnessing.

An in-vehicle wireless power transmission system may charge or power oneor more mobile devices used in a car: mobile phone handset, Bluetoothheadset, blue tooth hands free speaker phone, GPS, MP3 player, wirelessaudio transceiver for streaming MP3 audio through car stereo via FM,Bluetooth, and the like. The in vehicle wireless power source mayutilize source resonators that are arranged in any of several possibleconfigurations including charging pad on dash, charging pad otherwisemounted on floor, or between seat and center console, charging “cup” orreceptacle that fits in cup holder or on dash, and the like.

The wireless power transmission source may utilize a rechargeablebattery system such that said supply battery gets charged whenever thevehicle power is on such that when the vehicle is turned off thewireless supply can draw power from the supply battery and can continueto wirelessly charge or power mobile devices that are still in the car.

The plug-in electric cars, hybrid cars, and the like, of the future needto be charged, and the user may need to plug in to an electrical supplywhen they get home or to a charging station. Based on a singleover-night recharging, the user may be able to drive up to 50 miles thenext day. Therefore, in the instance of a hybrid car, if a person drivesless than 50 miles on most days, they will be driving mostly onelectricity. However, it would be beneficial if they didn't have toremember to plug in the car at night. That is, it would be nice tosimply drive into a garage, and have the car take care of its owncharging. To this end, a source resonator may be built into the garagefloor and/or garage side-wall, and the device resonator may be builtinto the bottom (or side) of the car. Even a few kW transfer may besufficient to recharge the car over-night. The in-vehicle deviceresonator may measure magnetic field properties to provide feedback toassist in vehicle (or any similar device) alignment to a stationaryresonating source. The vehicle may use this positional feedback toautomatically position itself to achieve optimum alignment, thus optimumpower transmission efficiency. Another method may be to use thepositional feedback to help the human operator to properly position thevehicle or device, such as by making LED's light up, providing noises,and the like when it is well positioned. In such cases where the amountof power being transmitted could present a safety hazard to a person oranimal that intrudes into the active field volume, the source orreceiver device may be equipped with an active light curtain or someother external device capable of sensing intrusion into the active fieldvolume, and capable of shutting off the source device and alert a humanoperator. In addition, the source device may be equipped withself-sensing capability such that it may detect that its expected powertransmission rate has been interrupted by an intruding element, and insuch case shut off the source device and alert a human operator.Physical or mechanical structures such as hinged doors or inflatablebladder shields may be incorporated as a physical barrier to preventunwanted intrusions. Sensors such as optical, magnetic, capacitive,inductive, and the like may also be used to detect foreign structures orinterference between the source and device resonators. The shape of thesource resonator may be shaped such to prevent water or debrisaccumulation. The source resonator may be placed in a cone shapedenclosure or may have an enclosure with an angled top to allow water anddebris to roll off. The source of the system may use battery power ofthe vehicle or its own battery power to transmit its presence to thesource to initiate power transmission.

The source resonator may be mounted on an embedded or hanging post, on awall, on a stand, and the like for coupling to a device resonatormounted on the bumper, hood, body panel, and the like, of an electricvehicle. The source resonator may be enclosed or embedded into aflexible enclosure such as a pillow, a pad, a bellows, a spring loadedenclosure and the like so that the electric vehicle may make contactwith the structure containing the source coil without damaging the carin any way. The structure containing the source may prevent objects fromgetting between the source and device resonators. Because the wirelesspower transfer may be relatively insensitive to misalignments betweenthe source and device coils, a variety of flexible source structures andparking procedures may be appropriate for this application.

The systems and methods described herein may be used to trickle chargebatteries of electric, hybrid or combustion engine vehicles. Vehiclesmay require small amounts of power to maintain or replenish batterypower. The power may be transferred wirelessly from a source to a deviceresonator that may be incorporated into the front grill, roof, bottom,or other parts of the vehicle. The device resonator may be designed tofit into a shape of a logo on the front of a vehicle or around the grillas not to obstruct air flow through the radiator. The device or sourceresonator may have additional modes of operation that allow theresonator to be used as a heating element which can be used to melt ofsnow or ice from the vehicle.

An electric vehicle or hybrid vehicle may require multiple deviceresonators, such as to increase the ease with which the vehicle may comein proximity with a source resonator for charging (i.e. the greater thenumber and varied position of device resonators are, the greater thechances that the vehicle can pull in and interface with a diversity ofcharging stations), to increase the amount of power that can bedelivered in a period of time (e.g. additional device resonators may berequired to keep the local heating due to charging currents toacceptable levels), to aid in automatic parking/docking the vehicle withthe charging station, and the like. For example, the vehicle may havemultiple resonators (or a single resonator) with a feedback system thatprovides guidance to either the driver or an automated parking/dockingfacility in the parking of the vehicle for optimized charging conditions(i.e., the optimum positioning of the vehicle's device resonator to thecharging station's source resonator may provide greater power transferefficiency). An automated parking/docking facility may allow for theautomatic parking of the vehicle based on how well the vehicle iscoupled.

The power transmission system may be used to power devices andperipherals of a vehicle. Power to peripherals may be provided while avehicle is charging, or while not charging, or power may be delivered toconventional vehicles that do not need charging. For example, power maybe transferred wirelessly to conventional non-electric cars to power airconditioning, refrigeration units, heaters, lights, and the like whileparked to avoid running the engine which may be important to avoidexhaust build up in garage parking lots or loading docks. Power may forexample be wirelessly transferred to a bus while it is parked to allowpowering of lights, peripherals, passenger devices, and the likeavoiding the use of onboard engines or power sources. Power may bewirelessly transferred to an airplane while parked on the tarmac or in ahanger to power instrumentation, climate control, de-icing equipment,and the like without having to use onboard engines or power sources.

Wireless power transmission on vehicles may be used to enable theconcept of Vehicle to Grid (V2G). Vehicle to grid is based on utilizingelectric vehicles and plug-in hybrid electric vehicles (PHEV) asdistributed energy storage devices, charged at night when the electricgrid is underutilized, and available to discharge back into the gridduring episodes of peak demand that occur during the day. The wirelesspower transmission system on a vehicle and the respective infrastructuremay be implemented in such a way as to enable bidirectional energyflow—so that energy can flow back into the grid from the vehicle—withoutrequiring a plug in connection. Vast fleets of vehicles, parked atfactories, offices, parking lots, can be viewed as “peaking powercapacity” by the smart grid. Wireless power transmission on vehicles canmake such a V2G vision a reality. By simplifying the process ofconnecting a vehicle to the grid, (i.e. by simply parking it in awireless charging enabled parking spot), it becomes much more likelythat a certain number of vehicles will be “dispatchable” when the gridneeds to tap their power. Without wireless charging, electric and PHEVowners will likely charge their vehicles at home, and park them at workin conventional parking spots. Who will want to plug their vehicle in atwork, if they do not need charging? With wireless charging systemscapable of handling 3 kW, 100,000 vehicles can provide 300 Megawattsback to the grid—using energy generated the night before by costeffective base load generating capacity. It is the streamlinedergonomics of the cordless self charging PHEV and electric vehicles thatmake it a viable V2G energy source.

The systems and methods described herein may be used to power sensors onthe vehicle, such as sensors in tires to measure air-pressure, or to runperipheral devices in the vehicle, such as cell phones, GPS devices,navigation devices, game players, audio or video players, DVD players,wireless routers, communications equipment, anti-theft devices, radardevices, and the like. For example, source resonators described hereinmay be built into the main compartment of the car in order to supplypower to a variety of devices located both inside and outside of themain compartment of the car. Where the vehicle is a motorcycle or thelike, devices described herein may be integrated into the body of themotorcycle, such as under the seat, and device resonators may beprovided in a user's helmet, such as for communications, entertainment,signaling, and the like, or device resonators may be provided in theuser's jacket, such as for displaying signals to other drivers forsafety, and the like.

The systems and methods described herein may be used in conjunction withtransportation infrastructure, such as roads, trains, planes, shipping,and the like. For example, source resonators may be built into roads,parking lots, rail-lines, and the like. Source resonators may be builtinto traffic lights, signs, and the like. For example, with sourceresonators embedded into a road, and device resonators built intovehicles, the vehicles may be provided power as they drive along theroad or as they are parked in lots or on the side of the road. Thesystems and methods described herein may provide an effective way forelectrical systems in vehicles to be powered and/or charged while thevehicle traverses a road network, or a portion of a road network. Inthis way, the systems and methods described herein may contribute to thepowering/charging of autonomous vehicles, automatic guided vehicles, andthe like. The systems and methods described herein may provide power tovehicles in places where they typically idle or stop, such as in thevicinity of traffic lights or signs, on highway ramps, or in parkinglots.

The systems and methods described herein may be used in an industrialenvironment, such as inside a factory for powering machinery,powering/charging robots, powering and/or charging wireless sensors onrobot arms, powering/charging tools and the like. For example, using thesystems and methods described herein to supply power to devices on thearms of robots may help eliminate direct wire connections across thejoints of the robot arm. In this way, the wearing out of such directwire connections may be reduced, and the reliability of the robotincreased. In this case, the device resonator may be out on the arm ofthe robot, and the source resonator may be at the base of the robot, ina central location near the robot, integrated into the industrialfacility in which the robot is providing service, and the like. The useof the systems and methods described herein may help eliminate wiringotherwise associated with power distribution within the industrialfacility, and thus benefit the overall reliability of the facility.

The systems and methods described herein may be used for undergroundapplications, such as drilling, mining, digging, and the like. Forexample, electrical components and sensors associated with drilling orexcavation may utilize the systems and methods described herein toeliminate cabling associated with a digging mechanism, a drilling bit,and the like, thus eliminating or minimizing cabling near the excavationpoint. In another example, the systems and methods described herein maybe used to provide power to excavation equipment in a mining applicationwhere the power requirements for the equipment may be high and thedistances large, but where there are no people to be subjected to theassociated required fields. For instance, the excavation area may havedevice resonator powered digging equipment that has high powerrequirements and may be digging relatively far from the sourceresonator. As a result the source resonator may need to provide highfield intensities to satisfy these requirements, but personnel are farenough away to be outside these high intensity fields. This high power,no personnel, scenario may be applicable to a plurality of industrialapplications.

The systems and methods described herein may also use the near-fieldnon-radiative resonant scheme for information transfer rather than, orin addition to, power transfer. For instance, information beingtransferred by near-field non-radiative resonance techniques may not besusceptible to eavesdropping and so may provide an increased level ofsecurity compared to traditional wireless communication schemes. Inaddition, information being transferred by near-field non-radiativeresonance techniques may not interfere with the EM radiative spectrumand so may not be a source of EM interference, thereby allowingcommunications in an extended frequency range and well within the limitsset by any regulatory bodies. Communication services may be providedbetween remote, inaccessible or hard-to-reach places such as betweenremote sensors, between sections of a device or vehicle, in tunnels,caves and wells (e.g. oil wells, other drill sites) and betweenunderwater or underground devices, and the like. Communications servicesmay be provided in places where magnetic fields experience less lossthan electric fields.

The systems and methods described herein may enable the simultaneoustransmission of power and communication signals between sources anddevices in wireless power transmission systems, or it may enable thetransmission of power and communication signals during different timeperiods or at different frequencies. The performance characteristics ofthe resonator may be controllably varied to preferentially support orlimit the efficiency or range of either energy or information transfer.The performance characteristics of the resonators may be controlled toimprove the security by reducing the range of information transfer, forexample. The performance characteristics of the resonators may be variedcontinuously, periodically, or according to a predetermined, computed orautomatically adjusted algorithm. For example, the power and informationtransfer enabled by the systems and methods described herein may beprovided in a time multiplexed or frequency multiplexed manner. A sourceand device may signal each other by tuning, changing, varying,dithering, and the like, the resonator impedance which may affect thereflected impedance of other resonators that can be detected. Theinformation transferred as described herein may include informationregarding device identification, device power requirements, handshakingprotocols, and the like.

The source and device may sense, transmit, process and utilize positionand location information on any other sources and/or devices in a powernetwork. The source and device may capture or use information such aselevation, tilt, latitude and longitude, and the like from a variety ofsensors and sources that may be built into the source and device or maybe part of a component the source or device connect. The positioning andorientation information may include sources such as global positioningsensors (GPS), compasses, accelerometers, pressure sensors, atmosphericbarometric sensors, positioning systems which use Wi-Fi or cellularnetwork signals, and the like. The source and device may use theposition and location information to find nearby wireless powertransmission sources. A source may broadcast or communicate with acentral station or database identifying its location. A device mayobtain the source location information from the central station ordatabase or from the local broadcast and guide a user or an operator tothe source with the aid of visual, vibrational, or auditory signals.Sources and devices may be nodes in a power network, in a communicationsnetwork, in a sensor network, in a navigational network, and the like orin kind of combined functionality network.

The position and location information may also be used to optimize orcoordinate power delivery. Additional information about the relativeposition of a source and a device may be used to optimize magnetic fielddirection and resonator alignment. The orientation of a device and asource which may be obtained from accelerometers and magnetic sensors,and the like, for example, may be used to identify the orientation ofresonators and the most favorable direction of a magnetic field suchthat the magnetic flux is not blocked by the device circuitry. With suchinformation a source with the most favorable orientation, or acombination of sources, may be used. Likewise, position and orientationinformation may be used to move or provide feedback to a user oroperator of a device to place a device in a favorable orientation orlocation to maximize power transmission efficiency, minimize losses, andthe like.

The source and device may include power metering and measuring circuitryand capability. The power metering may be used to track how much powerwas delivered to a device or how much power was transferred by a source.The power metering and power usage information may be used in fee basedpower delivery arrangements for billing purposes. Power metering may bealso be used to enable power delivery policies to ensure power isdistributed to multiple devices according to specific criteria. Forexample, the power metering may be used to categorize devices based onthe amount of power they received and priority in power delivery may begiven to those having received the least power. Power metering may beused to provide tiered delivery services such as “guaranteed power” and“best effort power” which may be billed at separate rates. Powermetering may be used to institute and enforce hierarchical powerdelivery structures and may enable priority devices to demand andreceive-more power under certain circumstances or use scenarios.

Power metering may be used to optimize power delivery efficiency andminimize absorption and radiation losses. Information related to thepower received by devices may be used by a source in conjunction withinformation about the power output of the source to identify unfavorableoperating environments or frequencies. For example, a source may comparethe amount of power which was received by the devices and the amount ofpower which it transmitted to determine if the transmission losses maybe unusually or unacceptably large. Large transmission losses may be dueto an unauthorized device receiving power from the source and the sourceand other devices may initiate frequency hopping of the resonancefrequency or other defensive measures to prevent or deter unauthorizeduse. Large transmission losses may be due to absorption losses forexample, and the device and source may tune to alternate resonancefrequencies to minimize such losses. Large transmission losses may alsoindicate the presence of unwanted or unknown objects or materials andthe source may turn down or off its power level until the unwanted orunknown object is removed or identified, at which point the source mayresume powering remote devices.

The source and device may include authentication capability.Authentication may be used to ensure that only compatible sources anddevices are able to transmit and receive power. Authentication may beused to ensure that only authentic devices that are of a specificmanufacturer and not clones or devices and sources from othermanufacturers, or only devices that are part of a specific subscriptionor plan, are able to receive power from a source. Authentication may bebased on cryptographic request and respond protocols or it may be basedon the unique signatures of perturbations of specific devices allowingthem to be used and authenticated based on properties similar tophysically unclonable functions. Authentication may be performed locallybetween each source and device with local communication or it may beused with third person authentication methods where the source anddevice authenticate with communications to a central authority.Authentication protocols may use position information to alert a localsource or sources of a genuine device.

The source and device may use frequency hopping techniques to preventunauthorized use of a wireless power source. The source may continuouslyadjust or change the resonant frequency of power delivery. The changesin frequency may be performed in a pseudorandom or predetermined mannerthat is known, reproducible, or communicated to authorized device butdifficult to predict. The rate of frequency hopping and the number ofvarious frequencies used may be large and frequent enough to ensure thatunauthorized use is difficult or impractical. Frequency hopping may beimplemented by tuning the impedance network, tuning any of the drivingcircuits, using a plurality of resonators tuned or tunable to multipleresonant frequencies, and the like.

The source may have a user notification capability to show the status ofthe source as to whether it is coupled to a device resonator andtransmitting power, if it is in standby mode, or if the source resonatoris detuned or perturbed by an external object. The notificationcapability may include visual, auditory, and vibrational methods. Thenotification may be as simple as three color lights, one for each state,and optionally a speaker to provide notification in case of an error inoperation. Alternatively, the notification capability may involve aninteractive display that shows the status of the source and optionallyprovides instructions on how to fix or solve any errors or problemsidentified.

As another example, wireless power transfer may be used to improve thesafety of electronic explosive detonators. Explosive devices aredetonated with an electronic detonator, electric detonator, or shocktube detonator. The electronic detonator utilizes stored electricalenergy (usually in a capacitor) to activate the igniter charge, with alow energy trigger signal transmitted conductively or by radio. Theelectric detonator utilizes a high energy conductive trigger signal toprovide both the signal and the energy required to activate the ignitercharge. A shock tube sends a controlled explosion through a hollow tubecoated with explosive from the generator to the igniter charge. Thereare safety issues associated with the electric and electronicdetonators, as there are cases of stray electromagnetic energy causingunintended activation. Wireless power transfer via sharply resonantmagnetic coupling can improve the safety of such systems.

Using the wireless power transfer methods disclosed herein, one canbuild an electronic detonation system that has no locally stored energy,thus reducing the risk of unintended activation. A wireless power sourcecan be placed in proximity (within a few meters) of the detonator. Thedetonator can be equipped with a resonant capture coil. The activationenergy can be transferred when the wireless power source has beentriggered. The triggering of the wireless power source can be initiatedby any number of mechanisms: radio, magnetic near field radio,conductive signaling, ultrasonics, laser light. Wireless power transferbased on resonant magnetic coupling also has the benefit of being ableto transfer power through materials such as rock, soil, concrete, water,and other dense materials. The use of very high Q coils as receivers andsources, having very narrow band response and sharply tuned toproprietary frequencies, further ensure that the detonator circuitscannot capture stray EMI and activate unintentionally.

The resonator of a wirelessly powered device may be external, or outsideof the device, and wired to the battery of the device. The battery ofthe device may be modified to include appropriate rectification andcontrol circuitry to receive the alternating currents of the deviceresonator. This can enable configurations with larger external coils,such as might be built into a battery door of a keyboard or mouse, ordigital still camera, or even larger coils that are attached to thedevice but wired back to the battery/converter with ribbon cable. Thebattery door can be modified to provide interconnection from theexternal coil to the battery/converter (which will need an exposedcontact that can touch the battery door contacts.

Stranded Printed Circuit Board Traces

As described in previous sections, high-Q inductive elements in magneticresonators may be formed from litz wire conductors. Litz wires arebundles of thinner, insulated wires woven together in specially designedpatterns so that the thinner individual wires do not occupy the sameradial position within the larger bundle over any significant length.The weave pattern and the use of multiple smaller diameter wireseffectively increases the skin depth and decreases the AC resistance ofthe wire over a range of frequencies.

High-Q inductive elements in magnetic resonators may also be formed fromprinted circuit board (PCB) traces. Printed circuit board traces mayhave a variety of attractive features including accuratereproducibility, easy integration, and cost effective mass-production.In this section, we disclose low AC resistance stranded PCB traces,comprising multiple narrower insulated traces, potentially distributedover multiple board layers, that do not maintain fixed positions withinthe weave pattern, and that may be fabricated using standard fabricationtechniques. The AC resistance of these stranded traces may be determinedby the number, the size, and the relative spacing of the narrowerindividual traces in the designed weave pattern, as well as by thenumber of board layers on which the weave patterns are printed andinterconnected. Individual trace insulation may be provided by air, bycircuit board materials, by coatings, by flexible sheets, by curedmaterials, and the like.

In embodiments, stranded trace weave patterns for PCB fabrication may bedesigned to be easily reproducible and scalable, as well as to achievehigh individual trace densities. The achievable trace density may bedetermined by the narrowness of the individual traces, by the geometryof the weave pattern, and by the need to incorporate other, potentiallylarger structures or features, such as “vias” for example, in the weavepattern. In embodiments, methods and designs that place all the vias orthrough-holes used to connect individual traces between multiple layersof a PCB may be preferably placed on the outer perimeters of themulti-trace weave pattern. The outer location of the vias enables easyscaling and replication of the pattern as well as tight and uniformindividual trace placement and density since the normally larger featuresized vias are not used within the weave pattern itself, potentiallydisrupting the uniformity of the pattern and the density of the weave.

As used in the description of this section, the term ‘stranded trace’means a conductor formed from a group of multiple smaller or narrowerindividual traces, trace segments, or wires. In this section we describetechniques for routing individual traces on a multilayer PCB to formstranded traces that have a lower AC resistance than a solid conductortrace of equivalent size would have.

The braiding of the individual traces on the layered PCB board may beaccomplished by routing each individual trace of a stranded trace in aspecific pattern such that it undulates across and through the variouslayers of the PCB. The weave pattern of the individual traces may bedesigned so that all the individual traces in a stranded trace havesubstantially the same impedance. That is, an alternating currentapplied to the stranded trace will flow in substantially equal amountsin each of the individual traces. Because the current may be distributeduniformly across the strands, the AC resistance may be reduced. Notethat the stranded conductor may be optimally designed for minimizedresistance for specific AC frequencies. In embodiments, systemtrade-offs such as number and size of individual traces, numbers oflayers of the PCB, connection complexities, board space, and the like,may be considered to determine the optimum weave pattern and design.

In this section we may discuss examples which utilize a layered PCBboard with a specific number of layers. The specific number of layers inan example is used to clarify the methods and designs and should not beconsidered as limiting. The methods and designs can be extended andscaled to PCBs with more or fewer layers.

In this section we may discuss and describe examples which refer tospecific layered PCB technologies or implementations. All of thetechniques, methods, algorithms, and implementations described hereinmay be generic and may be applicable to a wide range of layered printedcircuit board technologies and implementations including flex circuitboards and the like.

The method of routing individual traces to form a stranded tracecomprises routing individual traces or segments of traces on differentlayers of a PCB and varying the relative location of each individualtrace or segment within the resulting stranded trace. Each individualtrace of a stranded trace may alter its position on each PCB layer, orthe individual trace may alternate between two or more positions withina pattern on different PCB layers. It may be preferable that eachindividual trace of a stranded trace undulate through all the variouslayers of the layered PCB.

In layered PCB technologies, traces may be routed through to differentconductor or PCB layers with vias or through-holes. The dimensions ofthe vias may be larger than the possible minimum dimensions of theindividual traces, the minimum spacing between individual traces, or theskin depth of AC currents at the frequencies of interest. Inembodiments, the designed weave patterns and routing methods may berealized by placing the vias on the outside edges or the exterior of thestranded traces or weave patterns. In embodiments, it may be possible topack the individual traces as closely as feasible given the fabricationconstraints on the individual traces and trace spacing and still achieveAC resistance values suitable for high-Q inductive elements.

The methods and designs for forming stranded traces on a PCB maycomprise a specific routing of individual conductor traces on each layerand specific routing between each layer of the PCB.

The routing methods and designs may be illustrated and described with anexample shown in FIG. 52 which demonstrates some of the maincharacteristics of the methods and designs. FIG. 52 depicts an exemplaryweave pattern for individual traces that may be formed on each layer ofa four layer printed circuit board. Connecting the individual tracesacross the four layers of the board may form a stranded trace comprisingseven individual traces. These seven individual traces may be arrangedin the pattern shown and may be repeated to the desired length of thestranded trace. The individual traces on each layer are depicted by theblack lines in FIG. 52( a) and the vias are represented by the blackdots on either side of the traces. FIG. 52( a) depicts the individuallayers of conductors side by side for clarity. In a PCB, the four layersare stacked, one on top of the other, and separated by the insulatorlayers of the PCB. The vias on the sides of the stranded conductor maybe shared through (or across) all of the layers. For this exemplaryembodiment, the first bottom via 5201 in FIG. 52 is the same via whenthe layers are stacked on top of one another. The two numbers next toeach via represent the layers with individual traces that are connectedby that via. For example, the first bottom via 5201, which is labeled as4-1 connects the individual trace segments on the fourth conductinglayer and the first conducting layer that are connected to that via.

FIG. 52( b) shows an isometric three dimensional view of the patternfrom FIG. 52( a). Individual traces on each layer are depicted withblack lines and the connections made by the vias between the layers aredepicted with dashed and dotted lines. The four layers of patterns inthis example are stacked on top one another. The spacing and scale ofthe layers, as well as the separation between individual traces on eachlayer have been exaggerated to improve the clarity of the figure. Thevias connect individual trace segments between two layers. In thisexample, all individual trace segments from each layer traverse thewidth of the stranded trace and are routed with the vias to an adjacentlayer.

A stranded trace may be flanked by rows of vias on both sides of theweave pattern. On each PCB layer, the individual traces may traverse thewidth of the effective stranded trace. Each individual trace segment maybe routed from a via on one side of the stranded trace to a via on theother side of the stranded trace. On each PCB layer, each routedindividual trace may be routed from a via that connects that individualtrace to an individual trace on another PCB layer. The individual tracesmay be routed in a manner such that they traverse the width of theeffective stranded trace and also traverse a distance with respect tothe axis of the stranded trace. The axis of the stranded trace is thevirtual line that runs along the length of the stranded trace and isparallel to the rows of vias that flank the stranded trace. The axis ofan exemplary stranded trace is illustrated in FIG. 52( a) with an arrow5203.

In embodiments, each individual trace may be routed in effectively asubstantially diagonal direction with respect to the axis of thestranded trace. In each conducting layer of the PCB, the individualtraces may be routed in substantially the same direction. In theexemplary embodiment of FIGS. 52( a), and 52(b), all the individualtraces of Layer 1 may be routed in a substantially diagonal directionfrom the vias on one side of the stranded trace to the vias on the otherside. At the vias, the individual traces may be routed to another layerof the PCB. All of the individual traces from a layer may be routed toanother layer, with a similar, different, translated, reversed and thelike, weave pattern at the vias. On the next layer, the individualtraces may again be routed, for example, in a substantially diagonalpattern, from the vias on one side of the stranded trace to the vias onthe other side of the stranded trace and so on to other layers. Thispattern may continue until the individual traces have traversed all orsome of the conducting layers of the PCB, whereupon the individualtraces may return to the starting conducing layer or an intermediateconducting layer. The individual traces may undulate in such a mannerfor any number of cycles, depending on the weave pattern, the number ofconducting layers in the PCB, the desired length of the stranded trace,and the like. In embodiments, the end points of the stranded traces maybe designed to reside of the top and/or bottom layers of the PCBs sothey are accessible for easy connection to other circuit elements orconductors.

In embodiments, on each sequential conductor layer, individual tracesmay be routed in a substantially diagonal direction with respect to theaxis of the stranded trace. In embodiments, on each subsequent conductorlayer, individual conductor traces may be routed in a substantiallyorthogonal direction to that of the previous conductor layer. Thispattern can be seen in FIG. 52( a) and FIG. 52( b). The individualtraces in Layer 1 are routed in a substantially diagonal directiontraversing the stranded trace from left to right in the Figure. In thesubsequent layer, Layer 2, the individual traces are routed in asubstantially diagonal direction that is substantially orthogonal to theconductor traces of Layer 1, and are routed from right to left of thestranded trace.

The routing or path of one individual conductor trace through thevarious conductor layers may be more easily distinguishable in FIG. 53(a), where the path of one of the individual traces is highlighted by adotted black line. Starting with the bottom via 5201, that connectsLayer 4 and Layer 1, the individual trace is routed from the left sideof the stranded trace to a via on the right side that connects Layer 1and Layer 2. In this exemplary embodiment, all the individual traces onLayer 1 are routed from vias that connect Layer 4 and Layer 1 and a viathat connects Layer 1 and Layer 2. The individual trace is routed toLayer 2 by the via and routed right to left in Layer 2 to a via thatconnects Layers 2 and 3. On Layer 2 the individual trace is routed to avia that connects Layers 3 and 4. On Layer 4 the individual trace isrouted to a via that connects Layers 4 and 1, bringing the individualtrace back to the first layer. The pattern can be repeated as many timesas required for a specific length of the stranded trace.

An isometric view of the routing or path of one individual conductortrace through the conductor layers of one example embodiment is depictedin FIG. 53( b). The path of one of the individual traces is highlightedby a thick black line. The individual trace traverses the width of thestranded trace on each layer from one via on one side of the strandedtrace to a via on the other side of the stranded trace. The individualtrace is routed to other layers by the vias. After traversing all of thefour layers the individual trace returns to the starting layer and thepattern continues.

While the example routing patterns shown in FIG. 52 and FIG. 53 feature90 degree angles in the individual traces that form the weave pattern,and is based on a rectilinear routing pattern for the individual traces,various other weave and routing patterns may be used. In exemplaryembodiments, other weave and routing patterns may yield individual tracepatterns that may be along substantially diagonal directions withrespect to the axis of the stranded trace. For example, the individualtraces may bend at shallower angles (such as 45 degrees) to help reducethe gap between traces. In some embodiments, it may be advantageous tomake each individual trace a slanted straight line connected directlybetween two vias. In other embodiments, various curves of the individualtraces may be used when the stranded trace does not follow a straightline path along the circuit board, but turns or loops in a direction,for example. Several alternative exemplary diagonal weave and routingpatterns for individual traces are shown in FIG. 54, but many otherpatterns can be derived. In some applications some of the diagonalrouting methods may be preferable. For example, for the routing shown inFIG. 54( a), the individual traces are straight lines which may bepreferable because it may result in the shortest overall conductorlength while maintaining consistent spacing between adjacent individualtraces. In embodiments, the weave pattern may differ between some or allof the conductor layers in a PCB. For the exemplary stranded trace shownin FIG. 52, the weave pattern on the even layers differs from the weavepattern on the odd layers. In the exemplary stranded trace shown in FIG.52 the individual traces are routed a distance of four vias in thedirection of the axis of the stranded trace in the odd layers while onlya distance of three vias in the even layers.

As exemplified in FIG. 52, the scheme of the present inventionconcentrates the vias on either side of the array or group of individualtraces. Thus, the vias (which may have larger minimum feature sizes thantraces and gaps between traces) do not take up space within or betweenthe individual traces. This arrangement of the vias may lead to a higheroverall density of traces and therefore to a lower AC resistance percross-sectional area.

The exemplary routed structures described above can be generalized forstranded traces that comprise a various number of conducting layers of alayered PCB as well as various numbers of individual traces. The generalcharacteristics of the routing method may be characterized by an integerN, representing the number of conductor layers, and an integer M,representing the number of individual conductor traces that make up thestranded trace.

For the designs and methods disclosed here, it may be preferable to havean even number of conductor layers. For some specific weave and routingpatterns vias that connect traces on two layers may be used. A strandedtrace with N conductor layers should have N types of vias connecting thedifferent layers if each via connects only two layers. Each type of viais distinguished or differentiated by the layers that it connects. Ifeach via connects only two layers, for an individual conductor totraverse all of the N layers of a PCB board, there should be N types ofvias in the stranded trace. Preferably, there may be N/2 types of viason either side of the stranded trace, arranged in a fixed repeatingorder. In the exemplary pattern shown in FIG. 52, of the four types ofvias, two types of vias, those that connect Layers 4 and 1 and Layers 2and 3 are located only on one side of the stranded trace while the othertwo types of vias, those that connect Layers 1 and 2 and Layers 3 and 4are located on the other side of the stranded trace. On each layer, anindividual trace may preferably be routed in a substantially diagonaldirection with respect to the axis of the stranded trace such that ithas a displacement of a distance equivalent to at least N/2 vias. Allindividual conducting traces on a layer may have the same displacementin the axis of the stranded trace.

The number of individual traces that make make-up a stranded trace maybe at least partially determined by the total displacement, sometimescharacterized by the number of vias that are passed by, that anindividual trace makes after traveling through all the conductor layersof a PCB. If the displacement, after all the layers have been traversed,is D vias, then the stranded trace may be comprised of up to D/(N/2)individual traces. This relationship can be seen in the example in FIG.53. The individual trace represented by the dotted line is displaced adistance equivalent to 14 vias along the axis of the stranded traceafter traversing through all of the conductor layers. Since the examplehad N=4 layers, the total number of individual conductors that make upthe stranded conductor is M=14/2=7.

A stranded trace can be optimized by considering the number ofindividual traces included in the strand. The larger the number ofindividual traces, the longer each individual trace spends on any onelayer which may reduce the effectiveness of the weaving pattern onreducing skin/proximity effects.

If the number of individual traces and the number of conductor layersare chosen appropriately, it may be possible to ensure that eachindividual trace will be displaced the same distance in each layer alongthe axis of the stranded conductor. A sufficient condition for this tooccur is to choose M(N/2) such that it is divisible by N and to choose Msuch that (M/2)mod(N/2) and N/2 are co-prime where “mod” is the modulooperation.

FIG. 55 shows another example of a partial pattern of weaved individualtraces of the proposed methods. The Figure depicts the individual tracesof the first layer of a ten layer stranded trace design. The ten layerstranded trace consists of 136 separate conductors. The parameters ofthe stranded trace may allow complete symmetry in all ten layers of thestranded conductor. Each conductor layer pattern may be a translatedmirror image of the previous layer. That is, the pattern of traces onodd-numbered layers may be the same pattern as the first layertranslated in such a way that the ends of the individual trace segmentsare connected to the correct vias. The patterns for the even-numberedlayers can be recovered by reflection symmetry and similar translationsfor this example.

FIG. 56 is a cross-sectional view representing the conducting layers ofa multi-layered PCB. The individual trace segments on each layer (notvisible), and therefore the currents they conduct, may flow primarilyinto the page but they have an additional sideways displacement alongeach layer, as indicated by the horizontal arrows in the figure. Thishorizontal displacement enables each trace to move from one side of theweave pattern on a given layer to the opposite side of the weavepattern. Once an individual trace segment reaches the edge of the weavepattern on a particular layer, it is connected by a via (indicated byvertical arrows) to another trace segment on the next layer of the boardand makes its way back across the weave pattern in the oppositedirection. This pattern repeats itself so that each individual tracespends an approximately equal amount of time at each position along thecross-section of the weave pattern. Alternatively, the individual tracesmay be routed between the layers in a non-sequential manner. Anypermutation of the order of layers may be used. It may be preferablethat each individual trace follow the same order or permutation oflayers in a strand of traces. Note that the pattern may be continued byconnecting trace segments on the bottom layer to trace segments on thetop layer, or by routing the traces up and down following the alternatepermutations described above.

Preferably, the cross-sectional dimensions of the individual traces thatmake up the stranded trace on a PCB are small enough (preferably smallerthan one skin-depth δ=√{square root over (2/ωμ_(r)μ₀σ))} that theyrender the losses induced by one individual trace or segment on itsneighbors small compared to the losses of an isolated individual traceor segment (which for an individual trace smaller than a skin-depth willbe close to the direct current (DC) losses). The braiding of the strandshelps to ensure that all the strands may have substantially the sameimpedance, so that if the same voltage is applied across the bundledstrands (i.e., the strands are driven in parallel), the strands mayindividually conduct substantially the same current. Because the ACcurrent may be distributed uniformly across the strands, the ACresistance may be minimized further.

As an illustration of the above, finite element analysis simulationswere performed on stranded traces made of individual copper traces ofsquare cross-section, driven at 250 kHz. The simulations were performedon stranded traces that have varying aspect ratios as well differentdimensions of the individual conductors. The cross sections of thestranded traces, showing the cross-section of the individual traces ingray are shown in FIG. 58. At this frequency, the skin depth of purecopper is ˜131 μm. If we arrange individual traces that are 152 μm×152μm in cross-section 5801 (a little larger than one skin depth) into asquare array of 8 layers such that the gap between nearest traces bothalong and between the layers is 76 μm as in FIG. 58( a), we find thatthe resistance per meter of a stranded trace conductor braided similarlyto the pattern in FIG. 52 may be 18.7 mΩ/m, which is 64% higher than theDC resistance per length of this structure, 11.4 mΩ/m. By contrast, theresistance per length of this structure if the traces are not braided,or all parallel to the axis of the stranded trace is 31.2 mΩ/m, nearly 3times the DC value.

If we make the individual traces of the stranded trace 76 μm×76 μm incross section 5802 and arrange them into a square array of 16 layerssuch that the gap between traces is 38 μm as in FIG. 58( b) (the overallcross-section being thus essentially unchanged from the previousexample), we find that the AC resistance of a braided structure may be13.2 mΩ/m, about 16% higher than the DC value.

In the case where the cross-sectional dimensions of the traces cannot bemade much smaller than the skin-depth (e.g., because of limitations inmanufacturing), the proximity losses may be reduced by increasing theaspect ratio of the individual traces. The aspect ratio in this contextis the effective width of the stranded conductor on a single tracedivided by the thickness of the stack of conducting and insulatinglayers that make up the stranded trace. In some cases, the thickness ofthe stranded trace is given roughly by the thickness of the PCB.Simulations show that if the aspect ratio of the strand of 152 μm×152 μmtraces described above is changed so that there are twice as many tracesegments on each layer, but half as many layers as depicted in FIG. 58(c), the AC resistance at 250 kHz may be reduced from 18.7 mΩ/m to 16.0mΩ/m. For the structure with 76 μm×76 μm traces, again keeping thenumber of individual conductors the same, but reducing the thickness ofthe structure by a factor of two as depicted in FIG. 58( d) lowers theAC resistance from 13.2 mΩ/m to 12.6 mΩ/m. The DC resistance per lengthin both cases is 11.4 mΩ/m. In embodiments, the preferable aspect ratioof the stranded trace may be application dependent. In embodiments, avariety of factors may be considered in determining the best weavepatterns for specific high-Q inductive element designs.

A benefit of the proposed approach is that the vias used in the strandedtraces may perforate the board completely. That is, there is no need forpartial vias or buried vias. Using vias that perforate the boardcompletely may simplify the manufacturing process. For example, severalboards can be stacked together and perforated at the same time. Partialvias, or vias that go through only a few consecutive layers of a PCBtypically require perforation prior to assembly of the individuallayers. Likewise, buried vias, or vias that connect or go through someinternal layers of a PCB require perforation and preparation prior toassembly of the outer layers of the PCB during manufacturing.

Another benefit of the methods and designs described herein is that thelocation of vias at the outer edges of the weave pattern may allow forsmaller separations between multi-turn or higher density stranded tracepatterns. When two stranded traces run near each other on a PCB, or whena single stranded trace is shaped, patterned, folded, turned, and/orrouted so that different sections of the stranded trace run near eachother on the PCB, the separation between these traces may be reduced byreusing or interspacing the nearby vias. For example, FIG. 57 shows thetop layer of a PCB with two stranded traces 5701, 5702 that share thesame row of vias wherein, for clarity, the vias of the right strandedtrace 5702 are depicted as white filled circles while the vias of theleft stranded trace 5701 are depicted as black circles. The vias 5703between the two stranded traces 5701, 5702, are all in the same row andthere is substantially no spacing between the two stranded traces. Withthe use of buried or blind vias, which individually do not traverse orgo through the whole thickness or all the layers of a PCB may be stackedon top of each other and the density of the routing of the individualconductor traces can be further increased since the spacing between thevias may not need to be increased to accommodate the vias of an adjacentstranded trace.

It will be clear to those skilled in the art that many changes andmodifications can be made to the examples shown within the spirit of theinvention. For example, although through vias which perforate the PCBmay be used with the methods, blind vias or buried vias may also beused. It may be possible to have more than one via stacked on top ofanother, and one via location may be used to connect more than two setsof conductor layers together which may be used to increase the densityof the conductor traces in the stranded trace. Likewise, althoughexamples use vias that connected only two board (conductor) layerstogether, the routing method may be modified such that each conductortrace is routed on multiple layers simultaneously. Other modification inthe spirit of the proposed methods may include routing individualconductor traces from one via to multiple vias, routing from multiplevias to one via on each layer, using multiple conductor traces to routefrom one via to another on each conductor layer, or any combinationthereof.

In some embodiments it may be beneficial to misalign the conductortraces between the layers to ensure that the traces all presentsubstantially the same impedance.

The stranded traces may be useful in a large diverse set of applicationsand may serve as a substitute in any application that typically usedtraditional braided litz wire. The stranded trace may be routed in aloop or loops of various shapes and dimensions to create a coil that maybe used in magnetic field power transfer systems such as traditionalinduction based power transfer systems or near-field magnetic resonancepower transfer systems. In some embodiments and applications where thestranded trace may be used as part of a resonator, the trace dimensions,aspect ratio, routing pattern, and the like may be chosen and optimizedto maximize the Q of the resonator. In embodiments, the resonantfrequency of the high-Q resonator may be chosen to take advantage ofspecific weave patterns and/or stranded trace designs.

In embodiments, the PCB stranded trace loops may be routed such that acore of magnetic material may be placed in the middle of the loop tocreate a cored loop. The PCB may have a number of cutouts, channels,pockets, mounts, or holes to accommodate a core.

In embodiments, the PCB of the stranded trace may further be used tocarry and integrate other electronics or electronic components.Electronics to power or drive a resonator formed by the stranded tracemay be located on the same PCB as the traces.

Adjustable Source Size

The efficiency of wireless power transfer methods decreases with theseparation distance between a source and a device. The efficiency ofwireless power transfer at certain separations between the source anddevice resonators may be improved with a source that has an adjustablesize. The inventors have discovered that the efficiency of wirelesspower transfer at fixed separations can be optimized by adjusting therelative size of the source and device resonators. For a fixed size andgeometry of a device resonator, a source resonator may be sized tooptimize the efficiency of wireless power transfer at a certainseparations, positions, and/or orientations. When the source and deviceresonators are close to each other, power transfer efficiency may beoptimized when the characteristic sizes or the effective sizes of theresonators are similar. At larger separations, the power transferefficiency may be optimized by increasing the effective size of thesource resonator relative to the device resonator. The source may beconfigured to change or adjust the source resonator size as a devicemoves closer or further away from the source, so as to optimize thepower transfer efficiency or to achieve a certain desired power transferefficiency.

In examples in this section we may describe wireless power transfersystems and methods for which only the source has an adjustable size. Itis to be understood that the device may also be of an adjustable sizeand achieve many of the same benefits. In some systems both the sourceand the device may be of an adjustable size, or in other systems onlythe source, or only the device may be of an adjustable size. Systemswith only the source being of an adjustable size may be more practicalin certain situations. In many practical designs the device size may befixed or constrained, such as by the physical dimensions of the deviceinto which the device resonator must be integrated, by cost, by weight,and the like, making an adjustable size device resonator impractical ormore difficult to implement. It should be apparent to those skilled inthe art, however, that the techniques described herein can be used insystems with an adjustable size device, an adjustable size source, orboth.

In this section we may refer to the “effective size” of the resonatorrather than the “physical size” of the resonator. The physical size ofthe resonator may be quantified by the characteristic size of theresonator (the radius of the smallest circle than encompasses aneffectively 2-D resonator, for example). The effective size refers tothe size or extent of the surface area circumscribed by thecurrent-carrying inductive element in the resonator structure. If theinductive element comprises a series of concentric loops with decreasingradii, connected to each other by a collection of switches, for example,the physical size of the resonator may be given by the radius of thelargest loop in the structure, while the effective size of the resonatorwill be determined by the radius of the largest loop that is “switchedinto” the inductor and is carrying current.

In some embodiments, the effective size of the resonator may be smallerthan the physical size of the resonator, for example, when a small partof the conductor comprising the resonator is energized. Likewise, theeffective size of the resonator may be larger than the physical size ofthe resonator. For example, as described below in one of the embodimentsof the invention, when multiple individual resonators with givenphysical sizes are arranged to create a resonator array, grid,multi-element pattern, and the like, the effective size of the resonatorarray may be larger than the physical size of any of the individualresonators.

The relationship between wireless power transfer efficiency andsource-device resonator separation is shown in FIG. 59( a). The plot inFIG. 59( a) shows the wireless power transfer efficiency for theconfiguration shown in FIG. 59( b) where the source 5902 and device 5901capacitively loaded conductor loop resonators are on axis 5903(centered) and parallel to each other. The plot is shown for a fixedsize 5 cm by 5 cm device resonator 5901 and three different size sourceresonators 5902, 5 cm×5 cm, 10 cm×10 cm and 20 cm×20 cm for a range ofseparation distances 5906. Note that the efficiency of wireless powertransfer at different separations may depend on the relative sizes ofthe source and device resonators. That is, the size of the sourceresonator that results in the most efficient wireless power transfer maybe different for different separations between the source and the deviceresonators. For the configuration captured by the plot in FIG. 59( a),for example, at smaller separations the efficiency is highest when thesource and device resonators are sized to be substantially equal. Forlarger separations, the efficiency of wireless power transfer is highestwhen the source resonator is substantially larger than the deviceresonator.

The inventors have discovered that for wireless power transfer systemsin which the separation between the source and device resonatorschanges, there may be a benefit to a source that can be configured tohave various effective resonator sizes. As a device is brought closer toor further away from the source, the source resonator may change itseffective resonator size to optimize the power transfer efficiency or tooperate in a range of desired transfer efficiencies. Such adjustment ofthe effective resonator size may be manual or automatic and may be partof the overall system control, tracking, operating, stabilization andoptimization architectures.

A wireless power transfer system with an adjustable source size may alsobe beneficial when all devices that are to be powered by the source donot have similarly sized device resonators. At a fixed separationbetween a source and a device, devices with two different sizes ofdevice resonators may realize maximum transfer efficiency for differentsized source resonators. Then, depending on the charging protocols andthe device power requirements and hierarchies, the source may alter itssize to preferentially charge or power one of the devices, a class ofdevices, all of the devices, and the like.

Furthermore, an additional benefit from an adjustable size source may beobtained when a single source may be required to simultaneously powermultiple devices. As more devices require power, the spatial location orthe area circumscribed by the source resonator or the active area of thesource resonator may need to change. For example, if multiple devicesare positioned in an area but are separated from each other, the sourcemay need to be enlarged in order to energize the larger area thatincludes all the multiple devices. As the number of devices requiringpower changes, or their spatial distribution and locations change withrespect to the source, an adjustable size source may change its size tochange the characteristics and the spatial distribution of the magneticfields around the source. For example, when a source is required totransfer power to a single device, a relatively smaller source size withthe appropriate spatial distribution of the magnetic field may be usedto achieve the desired wireless power transfer efficiency. When thesource is required to transfer power to multiple devices, a largersource size or a source with a different spatial distribution of themagnetic field may be beneficial since the devices may be in multiplelocations around the source. As the number of devices that require powerchanges, or their distributions or power requirements change, anadjustable size source may change its size to adjust, maximize,optimize, exceed, or meet its operating parameters and specifications.

Another possible benefit of an adjustable source size may be in reducingpower transfer inefficiencies associated with uncertainty or variabilityof the location of a device with respect to the source. For example, adevice with a certain lateral displacement relative to the source mayexperience reduced power transfer efficiencies. The plot in FIG. 60( a)shows the wireless power transfer efficiency for the configuration shownin FIG. 60( b) where the source 6002 and device 6001 capacitively loadedconductor loop resonators are parallel to each other but have a lateraloffset 6008 between their center axes 6006, 6005. The plot in FIG. 60(a) shows power transfer efficiency for a 5 cm×5 cm device resonator 6001separated from a parallel oriented 5 cm×5 cm source resonator 6002 (boldline) or a 20 cm×20 cm source resonator 6002 (dotted line) by 2 cm 6008.Note that at a lateral offset 6007 of approximately 5 cm from the 5 cm×5cm source resonator (from the center of the device resonator to thecenter of the source resonator), there is a “dead spot” in the powertransfer efficiency. That is, the transfer efficiency is minimized orapproaches zero at a particular source-device offset. The dashed line inFIG. 60( a) shows that the wireless power transfer efficiency for thesame device at the same separation and same lateral offset but with thesource size adjusted to 20 cm by 20 cm may be greater than 90%. Theadjustment of the source size from 5 cm×5 cm to 20 cm×20 cm moves thelocation of the “dead spot” from a lateral offset of approximately 5 cmto a lateral offset of greater than 10 cm. In this example, adjustingthe source size increases the wireless power transfer efficiency fromalmost zero to greater than 90%. Note that the 20 cm×20 cm source isless efficient transferring power to the 5 cm×5 cm device resonator whenthe two resonators are on axis, or centered, or are laterally offset byless than approximately 2 to 3 cm. In embodiments, a change in sourcesize may be used to move the location of a charging or powering deadspot, or transfer efficiency minimum, allowing greater positioningflexibility for and/or higher coupling efficiency to, a device.

In some embodiments, a source with an adjustable size may be implementedas a bank of resonators of various sizes that are selectively driven bya power source or by power and control circuitry. Based on predeterminedrequirements, calculated requirements, from information from amonitoring, sensing or feedback signal, communication, and the like, anappropriately sized source resonator may be driven by a power sourceand/or by power and control circuitry and that size may be adjusted asthe requirements or distances between the source and the deviceresonators change. A possible arrangement of a bank of differently sizedresonators is shown in FIG. 61 which depicts a bank of three differentlysized resonators. In the example of FIG. 61, the three resonators 6101,6102, 6103 are arranged concentrically and coupled to power and controlcircuitry 6104. The bank of resonators may have other configurations andarrangements. The different resonators may be placed side by side as inFIG. 62, arranged in an array, and the like.

Each resonator in a multi-size resonator bank may have its own power andcontrol circuitry, or they each may be switched in and selectivelyconnected to one or more power and control circuits by switches, relays,transistors, and the like. In some systems, each of the resonators maybe coupled to power and control circuitry inductively. In other systems,each of the resonators may be coupled to power and control circuitrythrough additional networks of electronic components. A three resonatorconfiguration with additional circuitry 6201, 6202, 6203 is shown inFIG. 62. In some systems, the additional circuitry 6201, 6202, 6203 maybe used for impedance matching between each of the resonators 6101,6102, 6103 and the power and control circuitry 6204. In some systems itmay be advantageous to make each of the resonators and its respectiveadditional circuitry have the same effective impedance as seen from thepower and control circuitry. It some embodiments the effective impedanceof each resonator and additional impedance matching network may bematched to the characteristic impedance of the power source or the powerand control circuitry. The same effective impedance for all of theresonators may make switching between resonators in a resonator bankeasier, more efficient, or quicker and may require less tuning ortunable components in the power and control circuitry.

In some embodiments of the system with a bank of multi-sized resonators,the additional circuitry 6201, 6202, 6203 may also include additionaltransistors, switches, relays, and the like, which disable, deactivate,or detune a resonator when not driven or powered by the power andcontrol circuitry. In some embodiments of the system, not all of theresonators in a resonator bank of a source may be powered or drivensimultaneously. It such embodiments of the system, it may be desirableto disable, or detune the non-active resonators to reduce energy lossesin power transfer due to energy absorption by the unpowered resonatorsof the source. The unpowered resonators of the source may be deactivatedor detuned from the resonant frequency of the other resonators by opencircuiting, disrupting, grounding, or cutting the conductor of theresonator. Transistors, switches, relays and the like may be used toselectively open or close electrical paths in the conductor part of aresonator. An unpowered resonator may be likewise detuned or deactivatedby removing or adding capacitance or inductance to the resonator withswitches, transistors, relays, and the like. In some embodiments, thenatural state of individual resonators may be to be detuned from thesystem operating frequency and to use signals or power from the drivesignal to appropriately tune the resonator as it is activated in thebank.

In some embodiments of a system of a source with a bank of multi-sizedresonators, multiple resonators may be driven by one or more power andcontrol circuits simultaneously. In some embodiments of the systempowered resonators may be driven out of phase to extend or direct thewireless power transfer. Constructive and destructive interferencebetween the oscillating magnetic fields of multiple resonators drivenin-phase or out of phase or at any relative phase or phases may be usedto create specific “hotspots” or areas of concentrated magnetic energy.In embodiments, the position of these hotspots may be variable and maybe moved around to achieve the desired wireless power transferefficiencies to devices that are moving around or to address devices atdifferent locations, orientations, and the like. In embodiments, themulti-sized source resonator may be adjusted to implement a powerdistribution and/or sharing algorithm and/or protocol.

In some embodiments of a bank of multi-sized resonators, the resonatorsmay all have substantially similar parameters and characteristicsdespite the differences in their size. For example, the resonators mayall have similar impedance, resonant frequency, quality factor, wiregauge, winding spacing, number of turns, power levels, and the like. Theproperties and characteristics of the resonators may be within 20% oftheir values.

In other embodiments of a bank of multi-sized resonators, the resonatorsmay have non-identical parameters and characteristics tailored oroptimized for the size of each resonator. For example, in someembodiments the number of turns of a conductor for the larger resonatormay be less than for the smallest resonator. Likewise, since the largerresonator may be intended for powering devices that are at a distancefrom the resonator, the unloaded impedance of the large resonator may bedifferent than that of the small resonator that is intended for poweringdevices that are closer to the resonator to compensate for thedifferences in effective loading on the respective resonators due to thedifferences in separation. In other embodiments, the resonators may havedifferent or variable Q's, they may have different shapes andthicknesses, they may be composed of different inductive and capacitiveelements and different conducting materials. In embodiments, thevariable source may be custom designed for a specific application.

In other embodiments, a source with an adjustable size may be realizedas an array or grid of similarly sized resonators. Power and controlcircuitry of the array may selectively drive one or more resonators tochange the effective size of the resonator. For example, a possibleconfiguration of a grid of resonators is shown in FIG. 63. A grid ofsimilarly sized resonators 6301 may be arranged in a grid and coupled toone or more power and control circuits (not shown). Each of theresonators 6301 of the array can be individually powered or any numberof the resonators may be powered simultaneously. In the array, theeffective size of the resonator may be changed by controlling thenumber, location, and driving characteristics (e.g. drive signal phase,phase offset, amplitude, and the like) of the powered resonators. Forexample, for the array of resonators in FIG. 63, the effective size ofthe resonator may be controlled by changing which individual resonatorsof the array are powered. The resonator may power only one of theresonators resulting in an effective resonator size 6304 which is equalto the size of one of the individual resonators. Alternatively, four ofthe individual resonators in the upper left portion of the array may beenergized simultaneously creating an effective resonator size 6303 thatmay be approximately twice the size of each of the individualresonators. All of the resonators may also be energized simultaneouslyresulting in an effective resonator size 6302 that may be approximatelythree (3) times larger than the physical size each of the individualresonators.

In embodiments, the size of the array of individual resonators may bescaled to any size. In larger embodiments it may be impractical to havepower and control circuitry for every individual resonator due to cost,wiring constraints, and the like. A switching bar of a cross-switch maybe used to connect any of the individual resonators to as few power andcontrol circuits as needed.

In embodiments of the array of individual resonators, the pattern of theindividual energized resonators may be modified or optimized. The shapeof the effective resonator may be rectangular, triangular, square,circular, or any arbitrary shape.

In embodiments of arrays of resonators, which resonators get energizedmay depend on the separation or distance, the lateral offset, theorientation, and the like, between the device resonator and the sourceresonator. The number of resonators that may be driven may, for example,depend on the distance and/or the orientation between the deviceresonators and the source resonators, the number of device resonators,their various power requirements, and the like. The location of theenergized resonators in the array or grid may be determined according tothe lateral position of the device with respect to the source. Forexample, in a large array of smaller individual resonators that maycover a floor of a room or a surface of a desk, the number of energizedresonators may change as the distance between the device and the flooror desk changes. Likewise, as the device is moved around a room or adesk the location of the energized resonators in the array may change.

In another embodiment, an adjustable size source resonator may berealized with an array of multi-sized resonators. Several small equallysized resonators may be arranged to make a small assembly of smallresonators. The small array may be surrounded by a larger sizedresonator to make a larger assembly. The larger assembly may itself bearranged in an array forming a yet larger array with an even largerresonator that may surround the larger array which itself may bearranged in an array, and so on. In this arrangement, the sourceresonator comprises resonators of various physical sizes distributedthroughout the array. An example diagram of an arrangement of resonatorsis shown in FIG. 64. Smaller resonators 6401 may be arranged in two bytwo arrays and surrounded by another resonator with a larger physicalsize 6402, forming an assembly of resonators. That assembly ofresonators may be arranged in a two by two array and surrounded by aresonator with an even larger physical size 6403. The pattern can berepeated to make a larger array. The number of times each resonator orassembly of resonators is repeated may be configured and optimized andmay or may not be symmetric. In the example of FIG. 64, each resonatorand assembly may be repeated in a two by two array, but any otherdimension of array may be suitable. Note that the arrays may becircular, square, rectangular, triangular, diamond shaped, and the like,or any combination of shapes and sizes. The use of multi-sizedresonators in an array may have a benefit in that it may not requirethat multiple resonators be energized to result in a larger effectiveresonator. This feature may simplify the power and control circuitry ofthe source.

In embodiments, an adjustable source size may also be realized usingplanar or cored resonator structures that have a core of magneticmaterial wrapped with a capacitively loaded conductor, examples of whichare shown in FIGS. 11, 12, and 13 and described herein. In oneembodiment, as depicted in FIG. 65( a), an adjustable source may berealized with a core of magnetic material 6501 and a plurality ofconductors 6502, 6503, and 6504 wrapped around the core such that theloops of the different conductors do not overlap. The effective size ofthe resonator may be changed or adjusted by energizing a differentnumber of the conductors. A larger effective resonator may be realizedwhen several adjacent conductors are driven or energized simultaneously.

Another embodiment of an adjustable size source with a cored resonatoris shown in FIG. 65( b) where a core of magnetic material 6505 iswrapped with a plurality of overlapping conductors 6506, 6507, 6508. Theconductors may be wrapped such that each extends a different distanceacross the magnetic core 6505. For example, for the resonator in FIG.65( b), conductor 6508 covers the shortest distance or part of the core6505 while conductors 6507 and 6506 each cover a longer distance. Theeffective size of the resonator may be adjusted by energizing adifferent conductor, with the smallest effective size occurring when theconductor that covers the smallest distance of the magnetic core isenergized and the largest effective size when the conductor covering thelargest distance of the core is energized. Each of the conductors may bewrapped to achieve similar inductances, impedances, capacitances, andthe like. The conductors may all be the same length with the coveringdistance modified by changing the density or spacing between themultiple loops of a conductor. In some embodiments, each conductor maybe wrapped with equal spacing thereby requiring conductors of differentlengths for each winding. In other embodiments the number of conductorsand the wrapping of each conductor may be further optimized with nonconstant or varying wrapping spacing, gauge, size, and the like.

Another embodiment of an adjustable size source with a cored resonatoris shown in FIG. 65( c) where multiple magnetic cores 6509, 6510, 6511are gapped, or not touching, and wrapped with a plurality of conductors6512, 6513, 6514. Each of the magnetic cores 6509, 6510, 6511 isseparated with a gap 6515, 6516 and a conductor is wrapped around eachmagnetic core, extending past the gap and around the adjacent magneticcore. Conductors that do not span a gap between two magnetic cores, suchas the conductor 6513 in FIG. 65( c), may be used in some embodiments.The effective size of the resonator may be adjusted by simultaneouslyenergizing a different number of the conductors wrapped around the core.The conductors that are wrapped around the gaps between the magneticcores may be energized guiding the magnetic field from one core toanother extending the effective size of the resonator.

As those skilled in the art will appreciate, the methods and designsdepicted in FIG. 65 may be extended to planar resonators and magneticcores having various shapes and protrusions which may enable adjustablesize resonators with a variable size in multiple dimensions. Forexample, multiple resonators may be wrapped around the extensions of thecore shaped as in FIG. 13, enabling an adjustable size resonator thathas a variable size in two or more dimensions.

In embodiments an adjustable size source resonator may comprise controland feedback systems, circuits, algorithms, and architectures fordetermining the most effective source size for a configuration ofdevices or objects in the environment. The control and feedback systemsmay use a variety of sensors, communication channels, measurements, andthe like for determining the most efficient source size. In embodimentsdata from sensors, measurement circuitry, communication channels and thelike may be processed by a variety of algorithms that select theappropriate source size.

In embodiments the source and device may comprise a wirelesscommunication channel such as Bluetooth, WiFi, near-field communication,or modulation of the magnetic field which may be used to communicateinformation allowing selection of the most appropriate or most efficientsource size. The device, for example, may communicate received power,current, or voltage to the source, which may be used by the source todetermine the efficiency of power transfer. The device may communicateits position or relative position which may be used to calculate theseparation distance between the source and device and used to determinethe appropriate size of the source.

In embodiments the source may measure parameters of the resonator or thecharacteristics of the power transfer to determine the appropriatesource size. The source may employ any number of electric or electronicsensors to determine parameters of various resonators or variousconfigurations of source resonators of the source. The source maymonitor the impedance, resistance, resonant frequency, the magnitude andphase of currents and voltages, and the like, of each configuration,resonator, or size of the source. These parameters, or changes in theseparameters, may be used by the source to determine the most effectivesource size. For example, a configuration of the source which exhibitsthe largest impedance difference between its unloaded state and presentstate may be the most appropriate or the most efficient for the state ofthe system.

The operating parameters and the size of the source may be changedcontinuously, periodically, or on demand, such as in response to arequest by the device or by an operator of the system. A device mayrequest or prompt the source to seek the most appropriate source sizeduring specific time intervals, or when the power or voltage at thedevice drops below a threshold value.

FIG. 66 depicts a possible way a wireless power transfer system may usean adjustable source size 6604 comprising two different sized resonators6601, 6605 during operation in several configurations and orientationsof the device resonator 6602 in one possible system embodiment. When adevice with a small resonator 6602 is aligned and in close proximity,the source 6604 may energize the smaller resonator 6605 as shown in FIG.66( a). When a device with a small resonator 6602 is aligned andpositioned further away, the source 6604 may energize the largerresonator 6601 as shown in FIG. 66( b). When a device with a smallresonator 6602 is misaligned, the source 6604 may energize the largerresonator 6602 as shown in FIG. 66( c). Finally, when a device with alarge resonator 6602 is present, the source 6604 may energize the largerresonator 6601 as shown in FIG. 66( d) to maximize the power transferefficiency.

In embodiments an algorithm for determining the appropriate source sizemay be executed on a processor, gate array, or ASIC that is part of thesource, connected to the source, or is in communication with the source.In embodiments, the algorithm may sequentially energize all, or a subsetof possible source configurations or sizes, measure operatingcharacteristics of the configurations and choose the source size withthe most desirable characteristics.

Wireless Power Transfer with Immersed Resonators

In embodiments, wireless power transfer systems may be designed tooperate when one, two or more resonators are immersed in liquids,slurries, mud, ice, salt solutions, and the like, embedded in materialsor surrounded by materials that may be lossy, and/or electricallyconducting. In embodiments, power may be transferred wirelessly betweenone or more resonators that are under water, underground, in streams, inpavement, in cement, in slurries, in mud, in mixtures of materials, inpools of any type of liquid or viscous materials, in wells such as waterwells, gas wells, oil wells and the like.

In embodiments, the source and/or device resonators of the wirelesspower transfer systems may be designed to reduce the magnitude of theelectric field in or at lossy or conducting materials or objects thatmay be in the regions surrounding the resonators, especially thosematerials and regions nearest to the resonator, so as to achieve adesirable perturbed Q. In embodiments, enclosures with certaindimensions and positions relative to the conducting loops and electricalcomponents of magnetic resonators may be used to improve the perturbed Qrelative to an enclosure-free implementation. Such enclosures maysupport higher perturbed Q resonators in immersed resonator applicationsby providing spacing between locations where the electric field strengthis relatively high and where the lossy or conducting materials may belocated. For example, in applications where the resonator may beimmersed in water, salt water, oil, gas, or other lossy materials, itmay be beneficial to package a magnetic resonator to ensure a minimumseparation distance between the lossy materials and the electricalcomponents of the resonator.

The packaging, structure, materials, and the like of the resonator maybe designed to provide a spacing or “keep away” zone from the conductingloops in the magnetic resonator. In some embodiments the keep away zonemay be less than a millimeter around the resonator. In other embodimentsthe keep away zone may be less than 1 cm or less than 10 cm around theresonator. In embodiments the size of the keep away zone may depend onthe levels of power transferred, the lossiness of the surroundingmaterial, operating frequency of the resonator, size of the resonator,and the like. In embodiments, the size of the keep away zone may berestricted by physical constraints of the application and the keep awayzone may be designed such that the perturbed Q of the resonator due tothe lossy material outside of the keep away zone is at least 50% of theunperturbed Q of the resonator. In embodiments, the keep away zone maybe designed such that the perturbed Q of the resonator is greater than1% of the unperturbed Q.

In embodiments the keep away zone around the resonator may be providedby packaging that surrounds the resonator and may also surround thepower and control circuitry of the resonator. Preferably the packagingmay be constructed from non-lossy materials such as certain plastics,composites, plastic composites, Teflon, Rexolite, ABS, ceramics, stone,and the like. The resonator and circuitry may be encased in suchpackaging or the packaging may provide an outer barrier with anothernon-lossy material filling the keep away zone within the packaging.Alternatively, the keep-away zone inside the packaging may comprisevacuum, air, gas, sand, and the like. In embodiments the keep away zonemay be provided by the components of the resonator or the circuitry. Inembodiments the elements of the resonators and circuitry may provide asufficient keep away zone for some applications, or the components of aresonator may be chosen to naturally provide for a large enough keepaway zone. For example, in some applications the electrical insulationon a conductor of a resonator may provide a suitable keep away zone andmay not require additional separation. Diagrams of a resonator 6704 withpackaging 6702 providing a keep away 6710 zone around the resonator areshown in FIG. 67. A resonator 6704 may be completely surrounded by anenclosure 6702 that provides separation and a keep away zone as shown inFIG. 67( a). In other embodiments the packaging 6702 may surround andfollow the shape of the resonator 6704 to provide a keep away zonearound the inside and outside edges of a resonator as shown in FIG. 67(b).

In an exemplary embodiment, depicted in FIG. 68, a 15 cm×15 cm×5 mm slabof magnetic material 6804 excited at 100 kHz by 10 6806 turns ofconductors evenly spaced by 1 cm wound along one of the longerdimensions and immersed in a medium 6808 with resistivity ρ=0.2 Ω-m wasmodeled in a finite element analysis to show the effect of adding a keepaway zone. When there was no keep away zone, the perturbing Q due to thelossy medium was 66. With the addition of a keep away zone 6802 shapedlike a parallelepiped extending 1 cm from each face of the magneticmaterial, the perturbing Q was raised to 86. When the shortest distancebetween the magnetic material 6804 and the edge of the keep away zone6802 was increased to 2.5 cm, the perturbing Q was calculated to be 119,and when this distance was increased to 10 cm, the perturbing Q improvedto 318.

In embodiments the keep away zone may not provide for a uniform keepaway zone around the resonator but may be non uniform and may be largeror thicker in areas of the resonator that may have larger externalelectrical fields which may be near the capacitors or near the conductorwindings or near the corners of the resonator, for example. This may beillustrated by extending the example above, and exploiting the fact thatthe electric field may be largest along the directions transversing themagnetic moment of the structure. As depicted in FIG. 69, if the keepaway zone along the magnetic moment of the resonator is reduced from 10cm to 1 cm while the keep away zone along all other directions is keptat 10 cm, the perturbing Q is reduced from 318 to 255, while the volumeoccupied by the resonator and the keep away zone 6802 is reduced by morethan 51% compared to the case where the keep away zone was 10 cm allaround the resonator.

In embodiments, the resonant frequencies of the wireless power transfersystem may be chosen to improve the perturbed Q of the system. Forexample, even though the intrinsic Q of an exemplary resonator mayimprove at higher frequencies, the perturbed Q may decrease at higherfrequencies. Therefore, in exemplary embodiments, it may be preferableto choose operating frequencies that are lower than the frequencycorresponding to the maximized intrinsic Q. In embodiments, theoperating frequency may be chosen to be two to ten times lower than theoptimum-Q frequency. In other embodiments, the operating frequency maybe chosen to be 10 to 100 times lower than the optimum-Q frequency. Inyet other embodiments, the operating frequency may be chosen to be onehundred to ten thousand times lower than the optimum-Q frequency. Inembodiments, the operating frequency may be between 100 kHz and 500 kHz.In other embodiments, the operating frequency may be chosen to bebetween 10 kHz and 100 kHz. In yet other embodiments, the operatingfrequency may be between 500 kHz and 30 MHz.

In an exemplary embodiment, a capacitively-loaded conducting loopresonator with a loop radius of 15 cm, a resonant frequency of 100 kHz,and surrounded by a fluid with resistivity ρ=30 Ω-m was modeled to showthe impact of resonator and enclosure design on perturbed Q. The modeledembodiment is shown in FIG. 67( a). The capacitively-loaded conductingloop 6704 is enclosed in a box 6702 filled with air 6708. The spacingbetween the outer edge of the conducting loop or coil 6704 in FIG. 67(a) and the outer edge of the enclosure 6702 is the keep away zone. Thisspacing 6708 may be filled with air, it may be filled by the enclosurematerial itself, and/or it may be filled by preferably non-lossymaterials such as plastic, composites, plastic composites, ceramics,stone, air, gas, sand, and the like. In embodiments, the loss tangentfor the enclosure material may be low enough that it does not perturbthe Q of the resonator. In embodiments, the loss tangent of the materialmay be low enough that it improves the perturbed Q of the enclosedresonator relative to the perturbed Q when the resonator is immerseddirectly in surrounding materials.

For the exemplary system shown in FIG. 67( a), the intrinsic Q of theresonators increased as the number of turns of the resonator coilincreased. However, the perturbed Q of the resonators decreased as thenumber of turns increased. The perturbed Q could be increased byincreasing the size of the keep out zone 6710 between the edges of thecoil 6704 and the edges of the enclosure 6702. In this exemplaryembodiment, the perturbed Q of the 4-turn resonator was improved by morethan a factor of two (2), for keep out zones larger than 1 cm, andapproached its intrinsic Q when the spacing exceeded approximately 2.5cm. Therefore, enclosures with keep out zones greater than 1 cm mayenable efficient wireless power transfer even when the source and deviceresonators are immersed in or may be in the vicinity of lossy materials.

Some applications for wireless power transfer where at least one of theresonators is immersed in some material other than air may be currentlyenabled using directly wired solutions. For example, electrical wiresmay run along the bottom of a pond, through building materials, down awell shaft, through the hull of a boat, and the like. However, thesewires, and the connectors that may be used to provide electricalcontinuity across different segments of the wiring may be prone tofailure and may be expensive and/or difficult to replace when they dofail. In addition, they may be difficult or impossible to installbecause of positional and rotational uncertainties in the installationprocess and because that process may compromise the integrity of thestructures that support the resonators. Wireless power transfer may beadvantageous in these applications because it may accommodate gapsbetween the energy sources and the energy consuming devices orconnections, thereby eliminating the need for wiring or electricalconnectors in places where such wiring or connectors may be stressed,dangerous, or failure prone.

FIG. 70 shows an exemplary embodiment of a wireless power transfersystem for an underwater sensor application. In this example, a wirelesspower source 7008 is housed in an annular housing 7004 that surroundstubing 7002 that may house the wiring used to supply power from a remotegenerator to the source as well as being used to guide the sourceresonator 7008 to the general vicinity of the underwater sensor 7010.This tubing 7002 may be made from a variety of materials includingsteel, plastic, rubber, metal, and the like and may contain a variety ofelectronic components, strength members, tubes, valves, conduits and thelike. The source 7008 may be used to wirelessly transfer power to adevice resonator 7012 that may be coupled to a sensor 7010. Inembodiments, multiple sensors may be arranged at different locations anddepths and the wireless power source 7008 may be flexibly positioned toaddress multiple sensors simultaneously or one at a time.

FIG. 71 shows two exemplary embodiments of capacitively-loadedconducting loop source resonators, one comprising magnetic materials(FIG. 71( b)), situated in a rotationally symmetric enclosure 7004. Inthe embodiment shown in FIG. 71( b), the resonators may have dipolemoments that are aligned either parallel to the tubing, defined here asthe z-axis (i.e. resonator 7104), or parallel to the x-axis or y-axis(i.e. resonator 7104 and 7110 respectively) depending on the orientationof the conductor loop 7106 that is wrapped around the core of magneticmaterial 7108. In this exemplary embodiment, the highest energy transferefficiency may be realized when the similarly-sized source and deviceresonators have z-directed dipole moments and the resonators arealigned. However, for this dipole orientation, the efficiency may varythrough zero at relatively small translational misalignments of theseresonators, as shown in FIG. 72, before recovering and falling off withlarger offsets. If both resonators are y-directed, the maximum couplingefficiency may not be as high as for the z-oriented dipoles, but thetransfer efficiency only goes to zero when the resonators are relativelyfar apart. A resonator that comprises orthogonally wrappedcapacitively-loaded conducting loops, and can be modeled as having bothz-directed and y-directed dipoles as shown in FIG. 12, may yield thehighest transfer efficiencies over a range of operating scenarios. Inembodiments, the orthogonal loops may be used simultaneously, or aselector or switch may be used to select between y-directed andz-directed dipole resonators to achieve the optimum performance. Notethat different system considerations may impact which type of resonatoris comprised by the source resonator and the device resonator.

When the source or device resonators are installed, positioned oractivated, there may be uncertainty in the offset and rotation of thesource resonators relative to the device resonators. Exemplarypositional and rotational uncertainties are depicted in FIGS. 73( a) and73(b). Source 7008 and device 7012 resonators may have rotationalmisalignment as shown in FIG. 73( a) or lateral or vertical misalignmentas shown in FIG. 73( b). For single resonator designs, misalignment ofresonators may decrease the efficiency of power transfer. Inembodiments, the source and device resonator sizes and materials and thealignment of their dipole moments relative to their physical dimensionsmay be chosen to maximize the range of positional and rotationalmisalignments over which sufficiently efficient energy transfer may berealized.

In other embodiments, the potential reduced efficiency associated withpositional and rotational uncertainty may be unacceptable. In thoseembodiments, a number of source resonators may be incorporated in ahousing, increasing the probability that at least one of those sourceresonators is located close enough to the device resonator to yieldadequate performance. Exemplary implementations of such a source arrayare shown in FIG. 71. Multiple resonators may be arranged in a circularfashion in an annular housing 7004 such that a resonator is locatedevery several degrees around the housing such that regardless of therotational uncertainty at least one source and device may have partialalignment. In addition multiple circular arrangements of resonators maybe combined to increase the vertical height of the resonator array. Anincrease in vertical length of a source may increase the system'sability to tolerate vertical misalignments (along the z axis). Inembodiments, the outer radius of the annular housing may be increased toincrease the system's ability to tolerate horizontal misalignments(along the y-axis). Note that a variety of source resonator designs andarray patterns may be used to implement this concept. The array patternsthat are shown here are not meant to be limiting in any way. An arraymay comprise capacitively loaded loop resonators (FIG. 71( a)). An arraymay comprise planar resonators. In some embodiments planar resonatorscomprising a conductor wrapped around a core of magnetic material may beused. In an array of planar resonators the conductors of some resonatorsmay be wrapped in orthogonal directions for different resonators asdepicted in FIG. 71( b).

In addition, the enclosure housing the resonators may be any shape andsize and may be application specific. In some applications, theenclosures may be shaped as cubes, rectangular boxes, bulbs, balls,cylinders, sheets, and the like, and may be hollow, solid, or maycomprise different materials in their centers. In embodiments, theprimary housing and array design considerations may be housing strength,size, appearance, steerability, controllability, water, wind or earthresistance, and the like.

In embodiments, the multiple source resonators may be connected viaswitches so that after the source resonator array is installed orpositioned, only one, or a few of the source resonators may be energizedto achieve wireless power transfer. The system monitoring and controlcapabilities discussed herein may be used to determine which sourceresonators may be energized and included in the wireless power transfersystem. In embodiments, the Q of the unused resonators may be spoiled orreduced to minimize interactions between these resonators and theenergized resonators. The resonator Q's may be altered by remotelycontrollable switches, fuses, connections, and the like.

Note that the designs described above for source resonators may also befor device resonators.

In embodiments, a variety of resonator designs for wireless powertransfer may be selected. In an exemplary well drilling application, thesource and device resonators may comprise capacitively-loaded conductingloops with air cores or with cores that comprise magnetic materials, asshown in FIG. 68. The resonators may include conducting surfaces toredirect and/or guide the resonator fields to reduce the impact of steelor metallic tubing, structures, instruments, casings, and the like. Theconducting surfaces and magnetic materials may be shaped to follow theform of certain well structures, such as being bowed outward to conformto the circular tubing and casings that may run up the center of thewell. In embodiments, the surface of the magnetic material closest tostructures made of metal or steel may comprise a layer of a higherconductivity material so as to reduce losses due to eddy currents onlossier structures. The shapes and sizes of the conducting materials maybe the same as for the magnetic materials, or they may be different. Inembodiments, conducting layers may conform to the surface of themagnetic materials or to the inside surfaces of an enclosure or to afeature that has been built into the enclosure. In embodiments,conducting layers may be attached to magnetic materials or separate fromthem. In embodiments, field shaping may be used to direct resonatorfields away for lossy materials or structures and/or to direct or guideresonator fields towards other resonators in the power transfer system.In embodiments, capacitively-loaded conducting loops wrapped aroundmagnetic materials such as shown in FIGS. 11-14 and FIG. 6 may beselected for transferring power from a main borehole in a well to alateral borehole.

Note that a wireless transfer system for immersed resonator applicationsmay comprise any combination of resonators, enclosures, arrays,electronics, monitoring and control methods as described herein. Inembodiments, device resonators may also be installed in arrays, with asubset of the available resonators selected for the wireless powertransfer system.

Wireless Power Repeater Resonators

A wireless power transfer system may incorporate a repeater resonatorconfigured to exchange energy with one or more source resonators, deviceresonators, or additional repeater resonators. A repeater resonator maybe used to extend the range of wireless power transfer. A repeaterresonator may be used to change, distribute, concentrate, enhance, andthe like, the magnetic field generated by a source. A repeater resonatormay be used to guide magnetic fields of a source resonator around lossyand/or metallic objects that might otherwise block the magnetic field. Arepeater resonator may be used to eliminate or reduce areas of low powertransfer, or areas of low magnetic field around a source. A repeaterresonator may be used to improve the coupling efficiency between asource and a target device resonator or resonators, and may be used toimprove the coupling between resonators with different orientations, orwhose dipole moments are not favorably aligned.

An oscillating magnetic field produced by a source magnetic resonatorcan cause electrical currents in the conductor part of the repeaterresonator. These electrical currents may create their own magnetic fieldas they oscillate in the resonator thereby extending or changing themagnetic field area or the magnetic field distribution of the source.

In embodiments, a repeater resonator may operate as a source for one ormore device resonators. In other embodiments, a device resonator maysimultaneously receive a magnetic field and repeat a magnetic field. Instill other embodiments, a resonator may alternate between operating asa source resonator, device resonator or repeater resonator. Thealternation may be achieved through time multiplexing, frequencymultiplexing, self-tuning, or through a centralized control algorithm.In embodiments, multiple repeater resonators may be positioned in anarea and tuned in and out of resonance to achieve a spatially varyingmagnetic field. In embodiments, a local area of strong magnetic fieldmay be created by an array of resonators, and the positioned of thestrong field area may be moved around by changing electrical componentsor operating characteristics of the resonators in the array.

In embodiments a repeater resonator may be a capacitively loaded loopmagnetic resonator. In embodiments a repeater resonator may be acapacitively loaded loop magnetic resonator wrapper around magneticmaterial. In embodiments the repeater resonator may be tuned to have aresonant frequency that is substantially equal to that of the frequencyof a source or device or at least one other repeater resonator withwhich the repeater resonator is designed to interact or couple. In otherembodiments the repeater resonator may be detuned to have a resonantfrequency that is substantially greater than, or substantially less thanthe frequency of a source or device or at least one other repeaterresonator with which the repeater resonator is designed to interact orcouple. Preferably, the repeater resonator may be a high-Q magneticresonator with an intrisic quality factor, Q_(r), of 100 or more. Insome embodiments the repeater resonator may have quality factor of lessthan 100. In some embodiments, √{square root over (Q_(s)Q_(r))}>100. Inother embodiments, √{square root over (Q_(d)Q_(r))}>100. In still otherembodiments, √{square root over (Q_(r1)Q_(r2))}>100.

In embodiments, the repeater resonator may include only the inductiveand capacitive components that comprise the resonator without anyadditional circuitry, for connecting to sources, loads, controllers,monitors, control circuitry and the like. In some embodiments therepeater resonator may include additional control circuitry, tuningcircuitry, measurement circuitry, or monitoring circuitry. Additionalcircuitry may be used to monitor the voltages, currents, phase,inductance, capacitance, and the like of the repeater resonator. Themeasured parameters of the repeater resonator may be used to adjust ortune the repeater resonator. A controller or a microcontroller may beused by the repeater resonator to actively adjust the capacitance,resonant frequency, inductance, resistance, and the like of the repeaterresonator. A tunable repeater resonator may be necessary to prevent therepeater resonator from exceeding its voltage, current, temperature, orpower limits. A repeater resonator may for example detune its resonantfrequency to reduce the amount of power transferred to the repeaterresonator, or to modulate or control how much power is transferred toother devices or resonators that couple to the repeater resonator.

In some embodiments the power and control circuitry of the repeaterresonators may be powered by the energy captured by the repeaterresonator. The repeater resonator may include AC to DC, AC to AC, or DCto DC converters and regulators to provide power to the control ormonitoring circuitry. In some embodiments the repeater resonator mayinclude an additional energy storage component such as a battery or asuper capacitor to supply power to the power and control circuitryduring momentary or extended periods of wireless power transferinterruptions. The battery, super capacitor, or other power storagecomponent may be periodically or continuously recharged during normaloperation when the repeater resonator is within range of any wirelesspower source.

In some embodiments the repeater resonator may include communication orsignaling capability such as WiFi, Bluetooth, near field, and the likethat may be used to coordinate power transfer from a source or multiplesources to a specific location or device or to multiple locations ordevices. Repeater resonators spread across a location may be signaled toselectively tune or detune from a specific resonant frequency to extendthe magnetic field from a source to a specific location, area, ordevice. Multiple repeater resonators may be used to selectively tune, ordetune, or relay power from a source to specific areas or devices.

The repeater resonators may include a device into which some, most, orall of the energy transferred or captured from the source to therepeater resonator may be available for use. The repeater resonator mayprovide power to one or more electric or electronic devices whilerelaying or extending the range of the source. In some embodiments lowpower consumption devices such as lights, LEDs, displays, sensors, andthe like may be part of the repeater resonator.

Several possible usage configurations are shown in FIGS. 74-76 showingexample arrangements of a wireless power transfer system that includes asource 7404 resonator coupled to a power source 7400, a device resonator7408 coupled to a device 7402, and a repeater resonator 7406. In someembodiments, a repeater resonator may be used between the source and thedevice resonator to extend the range of the source. In some embodimentsthe repeater resonator may be positioned after, and further away fromthe source than the device resonator as shown in FIG. 74( b). For theconfiguration shown in FIG. 74( b) more efficient power transfer betweenthe source and the device may be possible compared to if no repeaterresonator was used. In embodiments of the configuration shown in FIG.74( b) it may be preferable for the repeater resonator to be larger thanthe device resonator.

In some embodiments a repeater resonator may be used to improve couplingbetween non-coaxial resonators or resonators whose dipole moments arenot aligned for high coupling factors or energy transfer efficiencies.For example, a repeater resonator may be used to enhance couplingbetween a source and a device resonator that are not coaxially alignedby placing the repeater resonator between the source and device aligningit with the device resonator as shown in FIG. 75( a) or aligning withthe source resonator as shown in FIG. 75( b).

In some embodiments multiple repeater resonators may be used to extendthe wireless power transfer into multiple directions or multiplerepeater resonators may one after another to extend the power transferdistance as shown in FIG. 76( a). In some embodiments, a deviceresonator that is connected to load or electronic device may operatesimultaneously, or alternately as a repeater resonator for anotherdevice, repeater resonator, or device resonator as shown in FIG. 76( b).Note that there is no theoretical limit to the number of resonators thatmay be used in a given system or operating scenario, but there may bepractical issues that make a certain number of resonators a preferredembodiment. For example, system cost considerations may constrain thenumber of resonators that may be used in a certain application. Systemsize or integration considerations may constrain the size of resonatorsused in certain applications.

In some embodiments the repeater resonator may have dimensions, size, orconfiguration that is the same as the source or device resonators. Insome embodiments the repeater resonator may have dimensions, size, orconfiguration that is different than the source or device resonators.The repeater resonator may have a characteristic size that is largerthan the device resonator or larger than the source resonator, or largerthan both. A larger repeater resonator may improve the coupling betweenthe source and the repeater resonator at a larger separation distancebetween the source and the device.

In some embodiments two or more repeater resonators may be used in awireless power transfer system. In some embodiments two or more repeaterresonators with two or more sources or devices may be used.

Under Cabinet Lighting with Repeater Resonators

A repeater resonator may be used to enhance power transfer in lightingapplications. One example application of a wireless power transfersystem using a repeater resonator is shown in FIG. 77 for a kitchenlighting configuration. Power transfer between a source resonator 7712,7714 and a device resonator 7706 built into a light 7704 may be enhancedor improved, by an additional repeater resonator 7708 positioned aboveor next to the lights 7704 or the device resonators 7706.

The addition of a larger repeater resonator next to the lights mayincrease the coupling and power transfer efficiency between the sourceand the lights and may allow the use of smaller, less obtrusive, andmore efficient sources or source resonators, or smaller lights, ordevice resonators.

In embodiments, the repeater resonator may be a capacitively loaded loopwound in a planar, flat, rectangular coil sized to fit inside of acabinet. The repeater resonator may be integrated into a rigid orflexible pad or housing allowing placement of regular cabinet contentson top of the resonator. The repeater resonator may be incorporated inmaterials typically used to line cabinets such as contact paper, mats,non-skid placemats, and the like. In embodiments the repeater resonatormay be designed to attach to the bottom of the cabinet and may beintegrated with an attachment mechanism or attachment points for lights.In some embodiments the lights may not require additional deviceresonators but may directly connect or may be integrated into therepeater resonator.

In embodiments a device resonator may be built into the light anddesigned to couple to the repeater resonator. Each light may beintegrated with its own device resonator and power and control circuitrydescribed herein. Each light my include appropriate AC to AC, AC to DC,or DC to DC converters and drivers to power and control the lightemitting portion of the device. With a repeater resonator above thedevice resonators embedded in the lights, it may be possible to positionthe lights anywhere under the cabinet with freedom to point and move thelight at specific areas or points under the cabinet. The lights with theintegrated resonators and device power and control circuitry may beattached to the bottom of the cabinet using adhesives, or any number ofknown fasteners.

In embodiments the source resonator may be integrated in a source thatis an electrical outlet cover or any type of wall plate. One example ofa source for under cabinet lighting is depicted in FIG. 78. The sourceresonator 7804 may be integrated into a cover of an electrical outlet7802 that may cover and fit around an existing outlet 7806. The powerand control circuitry 7808 of the source may be integrated into thecover. The cover may plug-in or connect to one of the outlets allowingthe power and control circuitry to be powered directly from the outletwith 120 VAC or 230 VAC, and the like, making the source self containedand not requiring any additional wiring, plugs, electrical outlets,junction boxes, and the like. The source may be retrofitted by end usersby replacing the receptacle cover with the wireless source cover.

In embodiments the source resonator may be integrated in a source thatplugs into an electrical located under the cabinet. The source mayextend out or around the electrical outlet providing an extended volumeor box into which the resonator and the power and control circuitry maybe integrated.

In embodiments the source resonator may be designed to replace acomplete outlet, where the outlet box or outlet junction box may be usedfor the power and control circuitry of the source. The cover replacingthe outlet may have a similar shape or look as a functional outlet coverbut may have a resonator integrated into the perimeter of the cover fortransferring wireless power. In embodiments, the cover may be decorativeto match the kitchen furnishings. In embodiments, the wireless powercircuit may include fault interrupt circuits and other necessary safety,power saving, or regulatory circuits.

In embodiments the source may include manual or automatic switches orsensors for turning the source on or off and thereby allowing a centralplace for switching on or off the wirelessly powered lights. The sourcemay be integrated with a timer or light sensor to automatically turn onor off when other lights in the area or turned on or off. For example,the wireless power transfer system may include motion sensors or timersto turn lights on and off according to the detected presence of someonein the room or a certain time of day.

In one example configuration, a 15 cm by 15 cm source resonatorcomprising 10 turns of Litz wire and having a quality factor Q greaterthan 100 is attached to a wall, 23 cm below a hanging cabinet. One roundlight with an integrated 7.5 cm diameter resonator comprising eightturns of Litz wire and having a quality factor greater than 100 ismounted 23 cm above the source resonator on the bottom of the cabinet. Arectangular repeater resonator, 29 cm by 86 cm, comprising 10 turns ofLitz wire and having a quality factor greater than 100 is placed insidea cabinet 24 cm above the source. In this exemplary embodiment, therepeater resonator is used to enhance the efficiency of power transferbetween the wall-mounted source and the under-cabinet-mounted lights.Without the repeater resonator, the efficiency of power transfer wasless than 5%. With the repeater resonator positioned as described, theefficiency of power transfer was greater than 50%.

Note that while certain embodiments have been described in terms of onesource resonator and one device resonator, systems using multiplesources and/or multiple devices are encompassed by this description.Note too that the resonators may be tuned to be either sourceresonators, device resonators, or repeater resonators, simultaneously oralternately.

High Power Resonator Enclosures

In embodiments, high-Q resonators and power and control circuitry mayrequire special packaging or enclosures that confine high voltages orcurrents to within the enclosure, that protect the resonators andelectrical components from weather, moisture, sand, dust, and otherexternal elements, as well as from impacts, vibrations, scrapes,explosions, and other mechanical shocks. In embodiments, the packagingand enclosure may require special considerations for thermal dissipationto maintain an operating temperature range for the electrical componentsand the resonator in the enclosure. The packaging and enclosures mayrequire special considerations to reduce losses or energy dissipation inmaterials or components of the enclosure or surroundings during wirelesspower transfer.

An exploded view of one embodiment of a resonator enclosure designed forvehicle charging applications is shown in FIG. 79. The enclosureincludes a support plate 7906, a layer or sheet of a good conductor 7904a separator piece 7912, and an enclosure cover 7902 that encloses theresonator 7910, any or all of the power and control circuitry orelectronic components 7908, and any or all of the enclosure pieces. Thesupport plate 7906 may be made from rigid materials that may support thestructural integrity of the enclosure. For example, the support platemay be made from aluminum, steel, cast iron, brass, wood, plastic, anytype of composite material, and the like, that provides sufficientrigidity for mounting the cover and sustaining the weight of theresonator which in some embodiments may be as much as 10 kilograms or asmuch as 20 kilograms. The support plate may comprise mounting holes formounting the enclosure to a vehicle, in this exemplary embodiment.

A layer or sheet of good conductor 7904 may be included above thesupport plate 7406. In some embodiments the layer or sheet of goodconductor may be electrically and/or thermally isolated from the supportplate. In other embodiments, it may be preferable to have the layer orsheet of good conductor in electrical and/or thermal contact with thesupport plate.

A separator piece 7912 may be located on top of the conductor sheet andmay provide a certain separation distance between the layer or sheet ofgood conductor and the resonator 7910. The preferable separation betweenthe layer or sheet of good conductor and the resonator may depend on theoperating frequency of the resonators, the dimensions of the resonators,the materials comprised by the resonators, the power level that will betransferred, the materials surrounding the resonators, and the like.

An enclosure cover 7902 may attach to the support plate in a manner thatcovers or encloses and protects the internal resonator and any internalcomponents. For the enclosure design of FIG. 79, it may be preferable touse a planar resonator such as that depicted in FIG. 11( a) comprising aconductor wrapped around a rectangular form of magnetic material.

In embodiments, the layer or sheet of good conductor may comprise anyhigh conductivity materials such as copper, silver, aluminum, and thelike. In embodiments, the layer or sheet of good conductor may bethicker than the skin depth of the conductor at the resonator operatingfrequency. In embodiments, the layer or sheet of good conductor may bethicker than a few times the skin depth of the conductor at theresonator operating frequency. In embodiments, it may be beneficial forthe conductor sheet to be larger than the size of the resonator, or toextend beyond the physical extent of the resonator, to shield theresonator from lossy and/or metallic materials that may be outside theenclosure and behind or beneath the support plate 7906. In embodimentsthe conductor sheet may extend at least 1 cm past the perimeter of theresonator. In other embodiments the conductor sheet may extend at least2 cm past the perimeter of the resonator. In embodiments, the size ofthe conducting sheet may be chosen so that the perturbed Q of themounted resonator is at least 2% of the perturbed Q of the resonator inthe unmounted enclosure. In embodiments, the size of the conductingsheet may be chosen so that the perturbed Q of the mounted resonator isat least 10% of the perturbed Q of the resonator in the unmountedenclosure. In other embodiments, the size of the conducting sheet may bechosen so that the perturbed Q of the mounted resonator is at least 25%of the perturbed Q of the resonator in the unmounted enclosure. Inembodiments, the size of the conducting sheet may be chosen so that theperturbed Q of the mounted resonator is at least 50% of the perturbed Qof the resonator in the unmounted enclosure. In other embodiments theconductor sheet may be as large as possible and still fitting into theenclosure.

In embodiments the separator piece, that provides spacing between theconductor sheet and the resonator may be an electrical insulator. Inembodiments it may be advantageous for the separator piece to also be agood thermal conductor that may provide for heat dissipation from theresonator. In embodiments the separator piece may include provisions foractive cooling comprising air or coolant circulation. The separatorpiece may be approximately the same size of the resonator of theenclosure or it may be smaller than the resonator. The size of theseparator piece may depend on the rigidity of the resonator. Inembodiments the separator piece may provide for at least of 0.5 cm ofspacing between the resonator and the conductor sheet. In otherembodiments the separator piece may provide for at least of 1 cm ofspacing between the resonator and the conductor sheet. In embodiments,the separator sheet may be shaped to provide more separation for certainportions of the resonator.

In embodiments, the thickness and material of the separator piece may bechosen so that the perturbed Q of the enclosed resonator is at least 2%of the unperturbed Q. In embodiments, the thickness and material of theseparator piece may be chosen so that the perturbed Q of the enclosedresonator is at least 10% of the unperturbed Q. In embodiments, thethickness and material of the separator piece may be chosen so that theperturbed Q of the enclosed resonator is at least 25% of the unperturbedQ. In embodiments, the thickness and material of the separator piece maybe chosen so that the perturbed Q of the enclosed resonator is at least50% of the unperturbed Q.

In embodiments the enclosure cover may be made of a non-lossy material,preferably of a non-metallic material. In embodiments the enclosurecover may be made from plastic, nylon, Teflon, Rexolite, ABS(Acrylonitrile butadiene styrene), rubber, PVC (Polyvinyl chloride),acrylic, polystyrene, and the like. The material may be chosen toprovide for sufficient structural strength to protect the resonator fromimpact, vibrations, and the sustained load on the cover. The materialmay be chosen to withstand the operating environment envisioned for thevehicle.

In embodiments, the enclosure may include additional layers to giveadded support, rigidity, ruggedness, tolerance, survivability, and thelike. In embodiments, the enclosure may be mounted behind a Kevlar sheetor layer, or may be wrapped in Kevlar, in order to withstand bullets,grenades, improvised explosive devices (IEDs), and other weaponry. Inenvironments, the enclosures may comprise special thermal materials,electrical materials, weatherproof materials, optical materials, and thelike. In embodiments, the enclosures may include materials or parts toenable safety systems, control systems, monitoring systems, billingsystems, and the like.

In some embodiments the enclosure and packaging may comprise electroniccomponents and circuits. The electronic components may includecapacitors, inductors, switches, and the like, of the resonator orcapacitors, inductors, switches, and the like, used for impedancematching. In some embodiments the enclosure may enclose any and allparts of the power and control circuitry including amplifiers,rectifiers, controllers, voltage sensors, current sensors, temperaturesensors, and the like. The power and control circuitry may requireadditional cooling or temperature regulation and may require an activecooling system or a connection to an external active cooling system thatcirculates air or coolant through the enclosure or parts of theenclosure. In embodiments it may be preferable to position or locate theelectric or electronic components such that they are not in-line withthe dipole moment of the resonator. In embodiments it may be preferableto position or locate the electric or electronic components such thatthey minimize the perturbed Q of the resonator. In embodiments it may bepreferable to position or locate the electric or electronic componentsunderneath the layer or sheet of good conductor in the enclosure, sothat the components are shielded from the electromagnetic fieldsgenerated by the resonator, and so the resonator is shielded from thelossy portions of the electric and electronic enclosure.

The enclosures with device resonators may be sized and designed to mountunder a car, robot, a cart, a scooter, a motorcycle, a bike, a motorizeddolly or platform, a forklift, a piece of construction equipment, atruck, or any other vehicle. A few exemplary mounting and chargingconfigurations are as shown in FIG. 80. The device and source resonatorsand enclosures may be sized and configured for the appropriate powerlevels for each application which may be more than 3 kW for a carcharging system or may be 500 W for a robot charging system. The deviceresonator may be configured to receive energy from a source resonatorand may be used to recharge batteries, power electronics or devices, andthe like of the vehicle. One or more of the enclosures and deviceresonators 8004 may be mounted on the underside of a vehicle 8002, inthe front of the vehicle, towards the back of the vehicle, and the likeas depicted in FIG. 80( a). A vehicle may have one enclosure mounted onthe underside or it may have multiple resonators with enclosures mountedon the underside.

In embodiments the resonator and the enclosure may be mounted inside thevehicle. In some vehicles the floor panels, the wheel wells, the sparetire well, or other parts of the car may be constructed of non-lossy ornon non-metallic material, such as plastic, carbon fiber, composites,and the like, providing a window for the magnetic fields to pass throughwhile the resonator is inside the car.

In embodiments, the device resonator may include connections to thevehicle for coolant to provide active cooling or heating to theelectronics, components, and resonators inside the enclosure.

In embodiments the source resonator may be mounted in an enclosure 8008and integrated into a rubber mat 8010, or a platform as depicted in FIG.80( b). The rubber mat and enclosure may be placed on the floor of agarage or parking space and may connect to a power source allowingwireless power transfer to a vehicle when a vehicle drives over the padand the source resonator aligning the device resonator with the sourceresonator as depicted in FIG. 80( c).

An appropriately size enclosure and resonator 8012 may be designed tofit on the underside of a robot, a remotely controlled or an autonomousvehicle 8014. The robot may be designed with a docking cage or chargingarea with a source resonator that may transfer electrical power to therobot.

Passive Component Compensation

Parameters of electrical components of a wireless power transfer systemmay be impacted by environmental conditions and/or operating parametersor characteristics of the system. The electrical values and performanceof components may be impacted by the temperature, humidity, vibration,and the like of the environment and the wireless power transfer systemmodules. Changes in temperature for example, may change the capacitanceof capacitors, the inductance of the conducting loop inductor, the lossof magnetic materials, and the like. High ambient temperatures mayaffect electrical components, changing their parameters, which may inturn impact the parameters of the wireless power transfer system. Forexample, a rise in ambient temperature may increase the capacitance of acapacitor which may shift or change the resonant frequency of aresonator in a wireless power transfer system which in turn may impactefficiency of the power transfer.

In some applications the changes of parameters due to the operatingpoint or operation of the system may negatively impact wireless powertransfer. For example, operating a wireless power transfer system athigh power levels may require large electrical currents in componentscausing increased power dissipation and a temperature increase of thecomponents. The temperature increase may affect the capacitance,inductance, resistance, and the like of the components and can affectthe efficiency, resonant frequency, and the like of the wireless powertransfer system.

In some applications the changes of parameters due to the operatingpoint may create a runaway effect that may negatively impact theperformance of the wireless power transfer system. For example, powertransfer and operation may heat components of the resonator, such as thecapacitors, changing their effective capacitance. The change incapacitance may shift the resonant frequency of the resonator and maycause a drop in power transfer efficiency. The drop in power transferefficiency may in turn lead to increased heating of components causingfurther change in capacitance, causing a larger shift in resonantfrequency, and so on.

FIG. 81 shows a plot of the effect of temperature on the capacitance ofone commercially available ceramic capacitor. Over the workingtemperature range of the capacitor, the capacitance value may change by20%. For some technologies or types of capacitors the capacitance changeover the working temperature range may be as much as 50% or 200% ormore. The capacitance change as a function of temperature may be amonotonically increasing or decreasing function of temperature or it maybe a complex function with one or more maxima and minima at one or moredifferent temperatures. The shape and behavior of the capacitance curveas a function of temperature may be a design parameter for variouscapacitors technologies and the specific characteristics of a batch ofcomponents may be tailored extent during the design and manufacturingand of certain components. The design of temperature characteristics maybe a tradeoff between other parameters such as breakdown voltage, totalcapacitance, temperature range, and the like and therefore for someapplications the capacitance variations over its temperature range maynot be completely customizable or optimizable.

In embodiments of a wireless power transfer system, components such ascapacitors may be used in various parts of the system. Electricalcomponents, such as capacitors, for example, may be used as part of theresonator and may set the resonant frequency of the resonator.Electrical components, such as capacitors, may be used in an impedancematching network between the power source and the resonator and in otherparts of the circuits as described herein. Changes in parameters of thecomponents due to temperature may affect important characteristics ofthe wireless power transfer system such as the quality factor of theresonance, resonator frequency and impedance, system efficiency andpower delivery and the like.

In some embodiments the changes in parameter values of components may becompensated with active tuning circuits comprising tunable components.Circuits which monitor the operating environment and operating point ofcomponents and system may be integrated in the design. The monitoringcircuits may include tunable components that actively compensate for thechanges in parameters. For example, a temperature reading may be used tocalculate expected changes in capacitance of the system allowingcompensation by switching in extra capacitors or tuning capacitors tomaintain the desired capacitance.

In some embodiments the changes in parameters of components may becompensated with active cooling, heating, active environmentconditioning, and the like.

In some embodiments changes in parameters of components may be mitigatedby selecting components with characteristics that change in acomplimentary or opposite way or direction when subjected to differencesin operating environment or operating point. A system may be designedwith components, such as capacitors, that have opposite dependence orparameter fluctuations due to temperature, power levels, frequency, andthe like. For example, some capacitors or other components of the systemmay be selected or designed such that they have positive temperaturecoefficient over a specific temperature range, i.e. the capacitance ofthe component increases as the temperature increases as shown in FIG.82( a). Some capacitors or other components in the system may beselected or designed such that they have a negative temperaturecoefficient over a specific temperature range, i.e. the capacitance ofthe component decreases as the temperature decreases as shown in thesecond plot of FIG. 82( a). By selecting the coefficients appropriatelya parallel placement of the two capacitor components with the oppositetemperature coefficients may cancel out capacitance variations due to atemperature change. That is, as the capacitance of one component risesdue a rise in temperature, the capacitance of the other component willdecreases thereby causing a net zero change in the overall capacitance.

The passive parameter variation compensation may be advantageous formany applications. A passive compensation method may be less expensiveand simpler than an active tuning method since no active sensors and nocontrol or controller may be needed. A passive compensation method maybe advantageous for applications where traditional controllers andsensors may not function or may be difficult to deploy. Hightemperatures, high radiation environments may make digital or analogactive monitoring and control circuitry impractical or impossible todeploy. A passive compensation method may have higher reliability, maybe smaller and less expensive, because it requires fewer net componentsto achieve system performance stabilization.

In embodiments the passive compensation method may be combined withactive tuning and control methods or systems. Passive compensation mayreduce the range over which an active tuning and control method andsystem may need to operate or compensate. In some embodiments thecompensation due to passive components may not be adequate. Variationsin thermal coefficients or component values may result in imperfectpassive compensation and require additional active tuning. An additionof passive compensation to active tuning method may reduce the requiredtuning range requirement for the active tuning method. The active tuningmay only be required to compensate for small changes and imperfectionsdue to incomplete or partial passive tuning compensation, which may be asmall fraction of the total change in parameters that would haverequired compensation if passive compensation was not included in thesystem.

In some embodiments the passive compensation may be implemented over acomplete temperature range or operation range of the system. In someembodiments passive compensation may be implemented over a partialtemperature or operation range of the system and may require extratuning from an active tuning system or method.

Passive compensation may be achieved by various arrangements ofcomponents with various thermal parameters using components placed inseries, parallel, or in any combination thereof. Passive compensationmay be achieved with at least two components having different parametervariations that result from the same environmental or component changes.In some embodiments it may be necessary to use three or more componentsplaced in series, parallel, or any combination thereof to obtain thenecessary compensation over a desired range. For example, threecomponents with capacitance curves shown in FIG. 82( b) may be placed inparallel to achieve passive compensation due to capacitance variationsover their complete temperature range. In some embodiments one componentmay be used to offset the variation of several components.

In some system embodiments, specific parts of a resonator or system maybe exposed to larger parameter fluctuations than other parts. Forexample, some parts of the circuits may heat more than others, due tolocalized exposure to sun, a heat source, higher loss components, anenclosure or ventilation block, and the like. It some systems it may beadvantageous to distribute the components throughout an enclosure,resonator, circuit, or design to prevent temperature differences oftemperature gradients that may affect components in a non-symmetric way.

In some embodiments the variation of component parameters may be used asa safety mechanism or they may be used to adjust or enhance parametersof power transfer. Components may be chosen or designed to have aspecific or predetermined parameter deviation. For example, components,such as capacitors, may be chosen to have a sharp increase or decreasein capacitance beyond, below, or in between a certain temperature value.Capacitors with capacitance curves that have a sharp increase after aspecific temperature may used in a device or power capture resonator toautomatically detune the device resonator when a threshold temperatureis reached. Such a characteristic may be used as a passive safetyfeature since excessive heat may mean that a device is exceeding itspower rating. With proper component selection, the components may detunea device resonator from the resonant frequency of the source reducingthe power captured by the device resonator preventing overheating orexceeding power ratings of the devices.

It is to be understood that the methods and designs outlined in thissection are applicable to many different types of electrical componentsand many types of parameter variations. Although the methods and designswere outlined primarily using capacitors, capacitance, and temperatureas the cause of capacitance variations it should be clear to thoseskilled in the art that the methods and designs may be used in a varietyof other components of a wireless power transfer system. Similarbehavior may be exploited to compensate for changes of inductance ofinductors, capacitance of resonators, reluctance and loss of magneticmaterials, and the like due to temperature variations, voltage levels,current levels, humidity, vibration, barometric pressure, magnetic fieldstrength, electric field strength, exposure to the elements, and thelike.

In some embodiments the variations of parameters of one type ofcomponent may be compensated with a variation of another type ofcomponent. For example, variations in inductance of the resonator coilmay be compensated by temperature variations of other components such ascapacitors.

Electrical elements with the passive compensation may be placed inseries, or in parallel, or may be distributed across the inductors of aresonator, a wireless power source, or a wireless power device.

Exemplary Resonator Optimizations

Properties or performance of resonators and the parameters of wirelesspower transfer may be affected by changes in the structure,configuration, or operation of the resonators. Changes to the resonatorconfigurations, structures, or operation may be used to optimize thequality factor of the resonator, change the distribution of magneticfields, reduce losses, or reduce or change the interactions of theresonator with other objects.

In embodiments, the span of the conductor loops wrapped around magneticmaterial may affect the magnetic field distribution around theresonator. For a planar resonator structure, or a resonator comprising aconductor wrapped around magnetic material such as depicted in FIG. 83(a), the distribution of the magnetic field around the structure may bealtered or affected by the span of the conductor winding. A conductor8304 wrapped around a core of magnetic material 8302 that comprises theresonator structure may be wrapped to have a specific span that coversthe magnetic material (the span is depicted by the dimension B in FIG.83( a)). This span or dimension may be chosen or modified, for example,by winding the conductor with larger or smaller spacing betweenindividual conductor loops, by varying the number of loops of theconductor around the magnetic material, and the like. The span of theconductor loops, compared to the span or dimension of the magneticmaterial around which the conductor is wrapped (defined as dimension Ain FIG. 83( a)), may affect the maximum magnetic fields generated orlocalized around the resonator. For example, when the span of theconductor (dimension B in FIG. 83( a)) is substantially equal to thelength of the magnetic material around which the conductor is wrapped(dimension A in FIG. 83( a)), the magnetic fields generated or inducedin the resonator may be guided and concentrated by the conductor loopsto the ends of the magnetic material resulting in relatively highmagnetic fields at the endpoints of the magnetic material of theresonator 8310. If the span of the conductor is much smaller than thelength of the magnetic material around which the conductor is wrapped,the magnetic fields generated by the resonator may be concentrated closeto the conductor loops resulting in a high magnetic field at thoselocations. For some systems or applications, the maximum magnetic fieldstrength around the resonator may be a critical parameter and it may bepreferable ensure that the magnetic fields are, as much as possible,substantially evenly distributed around the resonator as to eliminate orreduce “magnetic field hot spots” or areas with a relatively highmagnetic field compared to other areas around the resonator. For a moreuniform field distribution it may be preferable to have the conductorloops span substantially 50% of the total length of the core materialand be centered such that equal amounts of the magnetic material extendpast the conductor loops in the direction of the dipole moment of theresonator. For systems or applications for which the maximum magneticfield strength around a resonator may be a critical parameter it may bepreferable to have the span of the magnetic material to be substantiallytwice the span of the conductor wrapped around the magnetic material8304.

The differences in distribution of the magnetic fields were observedwhen finite element method simulations were performed comparing themaximum magnetic field strengths for three different spans of conductorwinding on the same magnetic material structure. The simulations modeledwireless power transfer between resonators comprising a block ofmagnetic material 45 cm wide by 45 cm long by 1 cm thick. The maximummagnetic field strengths were calculated for a configurationtransferring 3.3 kW of power at a 21 cm separation between the tworesonators operating and resonant at 175 kHz. The fields were calculatedfor resonators with ten loops of conductor wrapped around the magneticmaterial with a span of 10 cm, 20 cm, and 30 cm. For the configurationhaving a conductor span of 20 cm, that is roughly half the span of themagnetic material, the maximum magnetic field at a distance of 3 cm fromthe device resonator was 0.75×10⁻³ T RMS. For the conductor spans of 10cm and 30 cm the maximum magnetic field strengths were both 0.95×10⁻³ TRMS and concentrated at the conductor or at the ends of the magneticmaterial respectively.

In systems and applications for which the maximum magnetic fieldstrength may be a critical parameter it may also be preferable to reducesharp edges or corners of the magnetic material that is wrapped with theconductor loops. It may be preferable to chamfer or radius the cornersof the magnetic material.

In embodiments, positioning power and control circuitry of a resonatorin an enclosure comprising magnetic material may be used to optimize theperturbed quality factor of a resonator. External circuit boards orelectronics which may be part of the power and control circuitry and areoften required to be located near a resonator may affect the parametersof the resonator and the wireless power transfer system. A circuit boardor electronic components may load the resonator, induce losses, andaffect the capacitance, quality factor, inductance, and the like of theresonator. In embodiments the power and control circuitry, which mayinclude amplifiers, power converters, microprocessors, switches, circuitboards, and other lossy objects may be completely or partially enclosedinside the magnetic material of a resonator which may eliminate orreduce the perturbing effects of the circuitry on the resonatorparameters.

A drawing of one embodiment that uses the magnetic material of theresonator to house electronic components in shown in FIG. 83( b). Thefigure shows the cross section of a magnetic resonator that comprisesconductor loops 8304 wrapped around magnetic material 8302. The magneticmaterial 8302 may be a hollow shell such that some or all of the powerand control circuitry 8308 or other electrical or electronic circuitryand devices may be inside the magnetic material 8302. Positioning andenclosing circuitry inside the magnetic material of the resonator mayeliminate or substantially reduce the perturbing Q of the electronics onthe resonator intrinsic Q and the resulting wireless power transferefficiency compared to the circuitry being placed outside, or close tothe resonator but not enclosed in the magnetic material. The magneticmaterial enclosure may guide the oscillating magnetic fields generatedby the conductor of the resonator or by an external source around andaway from the circuitry and objects inside the magnetic material therebypreventing the magnetic fields from interacting with the lossyelectronic components and/or other objects.

An exemplary 11 cm×5 cm×20 cm magnetic resonator comprising a hollow boxof magnetic material with a 0.5 cm wall thickness and twenty loops ofLitz wire conductor wrapped around the middle of the magnetic materialmay be used to demonstrate the impact of lossy materials on the qualityfactor of a resonator, and the ability of a hollow shell of magneticmaterial to reduce the perturbing Q of these lossy materials. Theintrinsic Q of the exemplary resonator described above had a qualityfactor, Q=360. A circuit board, which in some embodiments may be acircuit board containing power and control circuitry, placed directly ontop of the resonator conductor on the outside of the magnetic materialperturbed the resonator and reduced the perturbed quality factor of thestructure to 130. However, placing the same circuit board inside thehollow box of magnetic material that comprised the resonator had noeffect on the quality factor of the resonator, yielding a perturbedquality factor substantially equal to the intrinsic quality factor.

In embodiments the magnetic material of a resonator may include holes,notches, gaps, and the like that may be used for ventilation,communication, wiring, connections, mounting holes, cooling, and thelike. When the power and control circuitry is configured to be mountedinside the magnetic material holes may be required for connection to theconductor or Litz wire on the outside of the resonator. In embodimentsthe magnetic material may have additional holes, gaps, spaces, voids,and the like on some or all faces or areas of the magnetic material thatmay have a minimal impact the quality factor of the resonator. Forexample, for the design depicted in FIG. 83( b) the walls of magneticmaterial 8312 on the opposite ends of the dipole moment of the resonatorare less critical than the magnetic material on other sides and in someembodiments where minimizing the weight or cost of the resonator is apriority.

In embodiments the enclosure of magnetic material may comprise one ormore sections, parts, tiles, blocks, or layers of similar or differentmagnetic materials. In some embodiments the magnetic material mayrequire a substrate or supporting structure on to which the magneticmaterial is fastened, glued, or attached. In some embodiments, thesurface of the magnetic material on the inside of the enclosure may belined with one or more layers of a good electrical conductor, such ascopper, silver, and the like. The inside of the magnetic materialenclosure may further be lined with electrical insulator to preventshort circuits between the enclosure and any internal electricalcomponents or devices. In some embodiments it may be preferable for themagnetic material enclosure to be designed from multiple parts such thatit may be disassembled or assembled providing access to the internalelectronics and components. In embodiments the magnetic materialenclosure may be part of, or integrated into, device packagingsurrounding the electronics of the device and the power and controlcircuitry of the resonator. The conductor loops of the resonator maywrap around the whole of the device and magnetic material enclosure.

It should be clear to those skilled in the art that the shape of themagnetic material may include any number of extensions, protrusions, orvarious geometries while providing an enclosed structure in at least onepart of the structure that can be used to completely or partiallyenclose objects such as circuit boards or electrical components. Thedesigns and configurations may be further extended or modified toinclude features and designs described herein for resonators usingmagnetic materials or planar resonators such as using multipleconductors wrapped in orthogonal directions or combining the resonatorwith a capacitively loaded loop resonator without magnetic material.

In embodiments, shaping a conductor sheet used for shielding a resonatorfrom loss inducing objects may increase the effective size of theconductor shield or increase the coupling of the resonator withoutincreasing the physical dimensions of the shield. Shaping a conductorshield may also reduce losses or energy dissipation into externalobjects during wireless power transfer and may increase the qualityfactor of the resonator in the presence of perturbing objects. Asdescribed herein, a sheet of high conductivity material positionedbetween a high-Q resonator and its surrounding environment may reducelosses due to energy dissipation in objects in the surroundingenvironment but on the opposite side of the conductor sheet, as shown inFIG. 21. The dimensions of the conductor sheet may be reduced, or theeffectiveness of the conductor shield may be improved by shaping theedges of the conductor sheet so they deflect magnetic fields away fromobjects around the sheet. FIG. 84( a) depicts a shaped conductor sheet8402 above a resonator comprising a conductor 8304 wrapped around ablock of magnetic material 8302. In this configuration the conductorsheet 8402 shields any lossy objects above the sheet 8406 from themagnetic fields that may be induced or generated by the resonator below.In embodiments it may be preferable for the conductor sheet to havedimensions larger than the resonator or to extend past the resonator. Inapplications where the lossy objects are substantially larger than theresonator it may be beneficial to increase the dimensions or the size ofthe conductor sheet. However, in many applications the dimensions of theconductor sheet may be limited by practical considerations such asweight, available space, cost, and the like. The effectiveness or theeffective size of the conductor sheet may be increased withoutincreasing the physical area of the conductor sheet by shaping the edgesof the conductor towards the resonator.

An exemplary embodiment of a conductor shield for the resonatorcomprising a conductor sheet with shaped edges is shown in FIG. 84( a)and FIG. 84( b). In this exemplary embodiment, the ends the conductorshield 8402 are shaped or bent down, towards the resonator, producingtwo flaps 8404. The shaped flaps 8404 of the conductor shield do not addto the overall length of the conductor shield (dimension C in FIG. 84),but may improve the effective shielding of the conductor from lossyobjects above 8406 the conductor shield. The conductor flaps may deflectand guide the magnetic field downwards reducing the field strength onthe sides of the resonator and reducing the field interactions withlossy objects that may be above, or near the edge of the conductorshield. This configuration and shape of the conductor shield mayincrease the effectiveness of the conductor shield without increasingthe length (dimension C in FIG. 84).

In embodiments the shape, separation, and length of the conductor sheetflaps may be specifically configured for each application, environment,power level, positioning of other resonators, power transfer efficiencyrequirement, and the like. The length of the conductor shield flaps(dimension A in FIG. 84( b)) and the separation of the flaps from theresonator (dimension B in FIG. 84( b)) may be configured and changed toachieve desired power transfer parameters for each application

In an exemplary embodiment, the effectiveness of the conductor sheetshaping in resonator shielding applications may be demonstrated by fineelement method simulations for exemplary shapes and sizes of conductorshield over a resonator comprising a 32 cm×30 cm×1 cm block of magneticmaterial wrapped with 10 loops of a conductor, spanning 20 cm of themagnetic material and wrapped such that the axis of the loops isparallel to the longest edge of the magnetic material. The resonator hasa resonant frequency of 175 kHz and is positioned approximately 2 cmfrom an infinite sheet of steel, with the largest face of the magneticmaterial of the resonator parallel to the steel sheet. The perturbedquality factor of the resonator in the presence of the infinite sheet ofsteel may be calculated for various sizes and shapes of the conductorshield positioned between the resonator and the steel sheet. Without anyshielding the perturbed quality factor of the resonator is calculated tobe approximately 24. Placing a flat (unshaped) 42 cm by 47 cm coppershield between the resonator and the steel sheet improved the perturbedQ of the resonator to 227. Placing a flat (unshaped) 50 cm by 50 cmcopper shield between the resonator and the steel sheet improved theperturbed Q of the resonator to 372. Shaping the conductor shields sothat they had the same 42 cm by 47 cm, and 50 cm by 50 cm footprints,but now included 2.5 cm flaps on all edges improved the perturbedquality factors to 422 and 574 respectively. This exemplary embodimentshows just one way a conducting sheet may be shaped to improve theperturbed quality factor of a shielded resonator without increasing thefootprint of the conductor shield.

It should be clear to those skilled in the art that the shape, size, andgeometry of the conductor flaps may be varied and configured from theexemplary embodiments. In some embodiments the conductor shield may onlybe shaped on the edges that are perpendicular to the dipole moment ofthe resonator as depicted in FIG. 84. In some embodiments the conductorshield may be shaped on all sides. In some embodiments the length, size,thickness and the like of the flaps may not be uniform around theresonator. The size of the flap may be smaller for the side of theresonator with fewer loss inducing objects and larger on the side wherethere may be more loss inducing objects. In some embodiments the flapsmay have one or more bends or curves. The flaps may be angled at 90degrees or less with respect to the plane of the conductor.

Repeater Resonator Modes of Operation

A repeater resonator may be used to enhance or improve wireless powertransfer from a source to one or more resonators built into electronicsthat may be powered or charged on top of, next to, or inside of tables,desks, shelves, cabinets, beds, television stands, and other furniture,structures, and/or containers. A repeater resonator may be used togenerate an energized surface, volume, or area on or next to furniture,structures, and/or containers, without requiring any wired electricalconnections to a power source. A repeater resonator may be used toimprove the coupling and wireless power transfer between a source thatmay be outside of the furniture, structures, and/or containers, and oneor more devices in the vicinity of the furniture, structures, and/orcontainers.

In one exemplary embodiment depicted in FIG. 85, a repeater resonator8504 may be used with a table surface 8502 to energize the top of thetable for powering or recharging of electronic devices 8510, 8516, 8514that have integrated or attached device resonators 8512. The repeaterresonator 8504 may be used to improve the wireless power transfer fromthe source 8506 to the device resonators 8512.

In some embodiments the power source and source resonator may be builtinto walls, floors, dividers, ceilings, partitions, wall coverings,floor coverings, and the like. A piece of furniture comprising arepeater resonator may be energized by positioning the furniture and therepeater resonator close to the wall, floor, ceiling, partition, wallcovering, floor covering, and the like that includes the power sourceand source resonator. When close to the source resonator, and configuredto have substantially the same resonant frequency as the sourceresonator, the repeater resonator may couple to the source resonator viaoscillating magnetic fields generated by the source. The oscillatingmagnetic fields produce oscillating currents in the conductor loops ofthe repeater resonator generating an oscillating magnetic field, therebyextending, expanding, reorienting, concentrating, or changing the rangeor direction of the magnetic field generated by the power source andsource resonator alone. The furniture including the repeater resonatormay be effectively “plugged in” or energized and capable of providingwireless power to devices on top, below, or next to the furniture byplacing the furniture next to the wall, floor, ceiling, etc. housing thepower source and source resonator without requiring any physical wiresor wired electrical connections between the furniture and the powersource and source resonator. Wireless power from the repeater resonatormay be supplied to device resonators and electronic devices in thevicinity of the repeater resonator. Power sources may include, but arenot limited to, electrical outlets, the electric grid, generators, solarpanels, fuel cells, wind turbines, batteries, super-capacitors and thelike.

In embodiments, a repeater resonator may enhance the coupling and theefficiency of wireless power transfer to device resonators of smallcharacteristic size, non-optimal orientation, and/or large separationfrom a source resonator. As described above in this document, and asshown in FIGS. 59, 60 and 72, the efficiency of wireless power transfermay be inversely proportional to the separation distance between asource and device resonator, and may be described relative to thecharacteristic size of the smaller of the source or device resonators.For example, a device resonator designed to be integrated into a mobiledevice such as a smart phone 8512, with a characteristic size ofapproximately 5 cm, may be much smaller than a source resonator 8506,designed to be mounted on a wall, with a characteristic size of 50 cm,and the separation between these two resonators may be 60 cm or more, orapproximately twelve or more characteristic sizes of the deviceresonator, resulting in low power transfer efficiency. However, if a 50cm×100 cm repeater resonator is integrated into a table, as shown inFIG. 85, the separation between the source and the repeater may beapproximately one characteristic size of the source resonator, so thatthe efficiency of power transfer from the source to the repeater may behigh. Likewise, the smart phone device resonator placed on top of thetable or the repeater resonator, may have a separation distance of lessthan one characteristic size of the device resonator resulting in highefficiency of power transfer between the repeater resonator and thedevice resonator. While the total transfer efficiency between the sourceand device must take into account both of these coupling mechanisms,from the source to the repeater and from the repeater to the device, theuse of a repeater resonator may provide for improved overall efficiencybetween the source and device resonators.

In embodiments, the repeater resonator may enhance the coupling and theefficiency of wireless power transfer between a source and a device ifthe dipole moments of the source and device resonators are not alignedor are positioned in non-favorable or non-optimal orientations. In theexemplary system configuration depicted in FIG. 85, a capacitivelyloaded loop source resonator integrated into the wall may have a dipolemoment that is normal to the plane of the wall. Flat devices, such asmobile handsets, computers, and the like, that normally rest on a flatsurface may comprise device resonators with dipole moments that arenormal to the plane of the table, such as when the capacitively loadedloop resonators are integrated into one or more of the larger faces ofthe devices such as the back of a mobile handset or the bottom of alaptop. Such relative orientations may yield coupling and the powertransfer efficiencies that are lower than if the dipole moments of thesource and device resonators were in the same plane, for example. Arepeater resonator that has its dipole moment aligned with that of thedipole moment of the device resonators, as shown in FIG. 85, mayincrease the overall efficiency of wireless power transfer between thesource and device because the large size of the repeater resonator mayprovide for strong coupling between the source resonator even though thedipole moments of the two resonators are orthogonal, while theorientation of the repeater resonator is favorable for coupling to thedevice resonator.

In the exemplary embodiment shown in FIG. 85, the direct power transferefficiency between a 50 cm×50 cm source resonator 8506 mounted on thewall and a smart-phone sized device resonator 8512 lying on top of thetable, and approximately 60 cm away from the center of the sourceresonator, with no repeater resonator present, was calculated to beapproximately 19%. Adding a 50 cm×100 cm repeater resonator as shown,and maintaining the relative position and orientation of the source anddevice resonators improved the coupling efficiency from the sourceresonator to the device resonator to approximately 60%. In this oneexample, the coupling efficiency from the source resonator to therepeater resonator was approximately 85% and the coupling efficiencyfrom the repeater resonator to the device resonator was approximately70%. Note that in this exemplary embodiment, the improvement is due bothto the size and the orientation of the repeater resonator.

In embodiments of systems that use a repeater resonator such as theexemplary system depicted in FIG. 85, the repeater resonator may beintegrated into the top surface of the table or furniture. In otherembodiments the repeater resonator may be attached or configured toattach below the table surface. In other embodiments, the repeaterresonator may be integrated in the table legs, panels, or structuralsupports. Repeater resonators may be integrated in table shelves,drawers, leaves, supports, and the like. In yet other embodiments therepeater resonator may be integrated into a mat, pad, cloth, potholder,and the like, that can be placed on top of a table surface. Repeaterresonators may be integrated into items such as bowls, lamps, dishes,picture frames, books, tchotchkes, candle sticks, hot plates, flowerarrangements, baskets, and the like.

In embodiments the repeater resonator may use a core of magneticmaterial or use a form of magnetic material and may use conductingsurfaces to shape the field of the repeater resonator to improvecoupling between the device and source resonators or to shield therepeater resonators from lossy objects that may be part of thefurniture, structures, or containers.

In embodiments, in addition to the exemplary table described above,repeater resonators may be built into chairs, couches, bookshelves,carts, lamps, rugs, carpets, mats, throws, picture frames, desks,counters, closets, doors, windows, stands, islands, cabinets, hutches,fans, shades, shutters, curtains, footstools, and the like.

In embodiments, the repeater resonator may have power and controlcircuitry that may tune the resonator or may control and monitor anynumber of voltages, currents, phases, temperature, fields, and the likewithin the resonator and outside the resonator. The repeater resonatorand the power and control circuitry may be configured to provide one ormore modes of operation. The mode of operation of the repeater resonatormay be configured to act only as repeater resonator. In otherembodiments the mode of operation of the repeater resonator may beconfigured to act as a repeater resonator and/or as a source resonator.The repeater resonator may have an optional power cable or connectorallowing connection to a power source such as an electrical outletproviding an energy source for the amplifiers of the power and controlcircuits for driving the repeater resonator turning it into a source if,for example, a source resonator is not functioning or is not in thevicinity of the furniture. In other embodiments the repeater resonatormay have a third mode of operation in which it may also act as a deviceresonator providing a connection or a plug for connecting electrical orelectronic devices to receive DC or AC power captured by the repeaterresonator. In embodiments these modes be selected by the user or may beautomatically selected by the power and control circuitry of therepeater resonator based on the availability of a source magnetic field,electrical power connection, or a device connection.

In embodiments the repeater resonator may be designed to operate withany number of source resonators that are integrated into walls, floors,other objects or structures. The repeater resonators may be configuredto operate with sources that are retrofitted, hung, or suspendedpermanently or temporarily from walls, furniture, ceilings and the like.

Although the use of a repeater resonator with furniture has beendescribed with the an exemplary embodiment depicting a table and tabletop devices it should be clear to those skilled in the art that the sameconfigurations and designs may be used and deployed in a number ofsimilar configurations, furniture articles, and devices. For example, arepeater resonator may be integrated into a television or a media standor a cabinet such that when the cabinet or stand is placed close to asource the repeater resonator is able to transfer enough energy to poweror recharge electronic devices on the stand or cabinet such as atelevision, movie players, remote controls, speakers, and the like.

In embodiments the repeater resonator may be integrated into a bucket orchest that can be used to store electronics, electronic toys, remotecontrols, game controllers, and the like. When the chest or bucket ispositioned close to a source the repeater resonator may enhance powertransfer from the source to the devices inside the chest or bucket withbuilt in device resonators to allow recharging of the batteries.

Another exemplary embodiment showing the use of a repeater resonator isdepicted in FIG. 86. In this embodiment the repeater resonator may beused in three different modes of operation depending on the usage andstate of the power sources and consumers in the arrangement. The figureshows a handbag 8602 that is depicted as transparent to show internalcomponents. In this exemplary embodiment, there may be a separate bag,satchel, pocket, or compartment 8606 inside the bag 8602 that may beused for storage or carrying of electronic devices 8610 such ascell-phones, MP3 players, cameras, computers, e-readers, iPads,netbooks, and the like. The compartment may be fitted with a resonator8608 that may be operated in at least three modes of operation. In onemode, the resonator 8608 may be coupled to power and control circuitrythat may include rechargeable or replaceable batteries or battery packsor other types of portable power supplies 8604 and may operate as awireless power source for wirelessly recharging or powering theelectronic devices located in the handbag 8602 or the handbagcompartment 8606. In this configuration and setting, the bag and thecompartment may be used as a portable, wireless recharging or powerstation for electronics.

The resonator 8608 may also be used as a repeater resonator extendingthe wireless power transfer from an external source to improve couplingand wireless power transfer efficiency between the external source andsource resonator (not shown) and the device resonators 8612 of thedevice 8610 inside the bag or the compartment. The repeater resonatormay be larger than the device resonators inside the bag or thecompartment and may have improved coupling to the source.

In another mode, the resonator may be used as a repeater resonator thatboth supplies power to electronic devices and to a portable power supplyused in a wireless power source. When positioned close to an externalsource or source resonator the captured wireless energy may be used by arepeater resonator to charge the battery 8604 or to recharge theportable energy source of the compartment 8606 allowing its future useas a source resonator. The whole bag with the devices may be placed neara source resonator allowing both recharging of the compartment battery8604 and the batteries of the devices 8610 inside the compartment 8606or the bag 8602.

In embodiments the compartment may be built into a bag or container ormay be an additional or independent compartment that may be placed intoany bag or storage enclosure such as a backpack, purse, shopping bag,luggage, device cases, and the like.

In embodiments, the resonator may comprise switches that couple thepower and control circuitry into and out of the resonator circuit sothat the resonator may be configured only as a source resonator, only asa repeater resonator, or simultaneously or intermittently as anycombination of a source, device and repeater resonator. An exemplaryblock diagram of a circuit configuration capable of controlling andswitching a resonator between the three modes of operation is shown inFIG. 87. In this configuration a capacitively loaded conducting loop8608 is coupled to a tuning network 8728 to form a resonator. The tuningnetwork 8728 may be used to set, configure, or modify the resonantfrequency, impedance, resistance, and the like of the resonator. Theresonator may be coupled to a switching element 8702, comprising anynumber of solid state switches, relays, and the like, that may couple orconnect the resonator to either one of at least two circuitry branches,a device circuit branch 8704 or a source circuit branch 8706, or may beused to disconnect from any of the at least two circuit branches duringan inactive state or for certain repeater modes of operation. A devicecircuit branch 8704 may be used when the resonator is operating in arepeater or device mode. A device circuit branch 8704 may convertelectrical energy of the resonator to specific DC or AC voltagesrequired by a device, load, battery, and the like and may comprise animpedance matching network 8708, a rectifier 8710, DC to DC or DC to ACconverters 8710, and any devices, loads, or batteries requiring power8714. A device circuit branch may be active during a device mode ofoperation and/or during a repeater mode of operation. During a repeatermode of operation, a device circuit branch may be configured to drainsome power from the resonator to power or charge a load while theresonator is simultaneously repeating the oscillating magnetic fieldsfrom an external source to another resonator.

A source circuit branch 8706 may be used during repeater and/or sourcemode of operation of the resonator. A source circuit branch 8706 mayprovide oscillating electrical energy to drive the resonator to generateoscillating magnetic fields that may be used to wirelessly transferpower to other resonators. A source circuit branch may comprise a powersource 8722, which may be the same energy storage device such as abattery that is charged during a device mode operation of the resonator.A source circuit branch may comprise DC to AC or AC to AC converters8720 to convert the voltages of a power source to produce oscillatingvoltages that may be used to drive the resonator through an impedancematching network 8716. A source circuit branch may be active during asource mode of operation and/or during a repeater mode of operation ofthe resonator allowing wireless power transfer from the power source8722 to other resonators. During a repeater mode of operation, a sourcecircuit branch may be used to amplify or supplement power to theresonator. During a repeater mode of operation, the external magneticfield may be too weak to allow the repeater resonator to transfer orrepeat a strong enough field to power or charge a device. The power fromthe power source 8722 may be used to supplement the oscillating voltagesinduced in the resonator 8608 from the external magnetic field togenerate a stronger oscillating magnetic field that may be sufficient topower or charge other devices.

In some instances, both the device and source circuit branches may bedisconnected from the resonator. During a repeater mode of operation theresonator may be tuned to an appropriate fixed frequency and impedanceand may operate in a passive manner. That is, in a manner where thecomponent values in the capacitively loaded conducting loop and tuningnetwork are not actively controlled. In some embodiments, a devicecircuit branch may require activation and connection during a repeatermode of operation to power control and measurement circuitry used tomonitor, configure, and tune the resonator.

In embodiments, the power and control circuitry of a resonator enabledto operate in multiple modes may include a processor 8726 andmeasurement circuitry, such as analog to digital converters and thelike, in any of the components or sub-blocks of the circuitry, tomonitor the operating characteristics of the resonator and circuitry.The operating characteristics of the resonator may be interpreted andprocessed by the processor to tune or control parameters of the circuitsor to switch between modes of operation. Voltage, current, and powersensors in the resonator, for example, may be used to determine if theresonator is within a range of an external magnetic field, or if adevice is present, to determine which mode of operation and whichcircuit branch to activate.

It is to be understood that the exemplary embodiments described andshown having a repeater resonator were limited to a single repeaterresonator in the discussions to simplify the descriptions. All theexamples may be extended to having multiple devices or repeaterresonators with different active modes of operation.

Wireless Power Converter

In some wireless energy transfer systems and configurations a wirelessenergy converter may be used to convert the parameters or configurationsof wireless power transfer. In some embodiments a system may have one ormore sources or one or more devices that are capable or configured tooperate and transfer wireless energy with one or more different andpossibly incompatible parameters. A wireless energy converter may beused to translate or convert the parameters or characteristics ofwireless power transfer allowing energy transfer between sources anddevices that may be configured to receive or capture wireless energywith incompatible or different parameters. Note that throughout thisdisclosure we may use the terms wireless power converter, wirelessenergy converter, wireless converter, and wireless power conversion,wireless energy conversion, and wireless conversion interchangeably.

In embodiments a wireless power converter may be used to convert thecharacteristics of wireless power transfer and allow power transferbetween a source and a device that may be designed or configured forwireless energy transfer with different parameters or characteristics.For example, a source resonator may be configured or designed to operateat a specific resonant frequency and may transfer energy via oscillatingmagnetic fields at that frequency. A device resonator may be configuredor designed to operate at a different resonant frequency and may bedesigned or configured to receive energy wirelessly only if theoscillating magnetic fields are at, or close to, the device resonantfrequency. If the resonant frequencies of the source and device aresubstantially different, very little or no energy may be transferred. Awireless power converter may be used to convert the wireless energytransferred by the source to have characteristics or parameters suchthat the wireless energy may be utilized by the device. A wireless powerconverter may, for example, may receive energy via oscillating magneticfields at one frequency and use the captured energy to generateoscillating magnetic fields at a different frequency that may beutilized and received by the device with a different resonant frequencythan the source.

FIG. 88 shows exemplary functionality and uses of a wireless powerconverter. In wireless energy transfer systems one or more sources 8810may generate oscillating magnetic fields 8814 at one or morefrequencies. A wireless power converter 8808 may couple to the source8810 and capture the energy from the oscillating magnetic field 8814 andtransfer some or all of the captured energy by generating an oscillatingmagnetic field 8816 at one or more frequencies that may be differentfrom the source resonator frequencies and that may be utilized by thedevice 8812. It is important to note that the wireless power converter8808 may not need to be located between the source 8810 and the device8812, but only in the general vicinity of both the source and device.Note that if a device is configured to operate or receive energy withdifferent parameters or characteristics than what is generated by asource, the device may not receive significant amounts of power from thesource, even if the source and device are close together. Inembodiments, a wireless power converter may be used to adapt theparameters of the source to parameters that may be received by thedevice and may increase the efficiency of the wireless power transferbetween what would be an incompatible source and device, in the absenceof the converter. In some embodiments the wireless power converter mayalso serve as a repeater resonator and may extend, enhance, or modifythe range of the wireless power transfer when it is placed between asource and a device or in the vicinity of the device.

A wireless power converter may be beneficial for many wireless powersystems and applications. In some embodiments the wireless powerconverter may be used to convert the characteristics of wireless powertransfer between normally incompatible resonators or wireless powertransfer systems.

In some embodiments the wireless power converters may be utilized by thewireless power transfer system to manage, separate, or enhance thewireless power distribution between sources and devices of differentpower demands, power outputs, and the like. In embodiments, somewireless power transfer systems and configurations may employ deviceswith different power demands. Some devices in a system may have powerdemands for several hundred watts of power while other devices mayrequire only a few watts of power or less. In systems without a wirelesspower converter, such differences in power demands and device powerrequirements may impose additional design constraints and limitations onthe hardware and operation of the devices. For example, in a systemwhere all devices are configured to operate at the same frequency, thedevices with lower power demands of a few watts may need to be designedto withstand the voltages, currents, and magnetic field strengths equalto those of a device requiring several hundreds of watts of power. Inembodiments, circuit components comprised by lower power deviceresonators may be required to dissipate large amounts of power as heat.One way to reduce the high voltage, current, power, and the like,requirements on lower power devices may be to detune the lower powerdevice resonant frequency from the high power source resonant frequency,or to use frequency hopping or time multiplexing techniques toperiodically, or at adjustable intervals, decouple the device from thesource. These schemes may reduce the average power received by thedevice, and may expand the range of components that may be used in thedevice because components capable of withstanding high voltages,currents, powers, and the like, for short periods of time, may besmaller, less expensive, and more capable than components that mustsustain such voltages, currents and powers, for extended periods oftime, or for continuous operation.

In embodiments, such as when the resonant frequency of a device is nottunable, or when the resonant frequency can be tuned to an operatingpoint that supports wireless power transmission between a high powersource and a lower power device, a wireless power converter may be usedto support wireless power transfer.

In an exemplary embodiment, a wireless power configuration maywirelessly transfer two hundred watts or more of power from a source ina wall to a television. In such an embodiment, it may be useful to alsosupply wireless power to television remote controllers, gamecontrollers, additional displays, DVD players, music players, cableboxes, and the like, that may be placed in the vicinity of thetelevision. Each of these devices may require different power levels andmay require power levels much lower than is available from the source.In such an embodiment, it may not be possible to adjust the poweravailable at the source without disrupting the operation of thetelevision, for example. In addition, the television remote controllers,game controllers, additional displays, DVD players, music players, cableboxes, and the like, may also be able to receive power from otherwireless power sources, such as a lower power energized surface source,situated on a shelf or a table, as shown in FIG. 15 for example. Withouta wireless power converter, it may be necessary to design the wirelesspower transfer hardware of the lower power devices to withstand thevoltages, currents, and magnetic fields generated by a source capable ofsupplying hundreds of watts to a television, as well as to be efficientwhen the lower power devices receive power from a lower power energizedsurface source, for example. Circuits may be designed for the lowerpower devices that enable this type of operation, but in someembodiments, it may be preferable to optimize the lower power devicecircuits for operation with lower power sources, and to use a powerconverter to convert the high power levels available from a high powersource to lower power levels, in some region of operation. A wirelesspower converter may capture some of the wireless energy generated by ahigh power source, may condition that power according to a variety ofsystem requirements, and may resupply the conditioned power at differentfrequencies, power levels, magnetic field strengths, intervals, and thelike, suitable for reception by the lower power devices referred to inthis exemplary embodiment.

In some embodiments, for example, it may be preferable to operate highpower devices requiring 50 watts of power or more at the lowerfrequencies such as in the range of 100 kHz to 500 kHz. Allowablemagnetic field limits for safety considerations are relatively higher,and radiated power levels may be lower at lower operating frequencies.In some embodiments it may be preferable to operate smaller, lower powerdevices requiring 50 watts of power or less at higher frequencies of 500kHz or more, to realize higher Q resonators and/or to utilize electricand electronic components such as capacitors, inductors, AC to DCconverters, and the like, that may be smaller or more efficient allowingfor smaller and/or tighter resonator and power and control circuitryintegration.

In embodiments a wireless power converter may be used to convertwireless power transferred from multiple sources with differentparameters to a single source and may be used to convert wireless powerparameters to be compatible with more than one device. In embodiments awireless power converter may be used to amplify a specific wirelesspower source by converting wireless power from other sources workingwith different parameters.

Exemplary embodiments of wireless power transfer system configurationsemploying wireless power converters are depicted in FIG. 89. As part ofthe configuration, a wireless power converter 8914 may capture energyfrom oscillating magnetic fields 8932, 8930 from one or more sources8922, 8924 that may be configured or designed to operate with differentparameters. The wireless power converter 8914 may capture the energy andgenerate a magnetic field 8934, 8936, 8938 with one or more differentparameters than the sources 8922, 8924 from which the energy wasreceived and transfer the energy to one or more devices 8916, 8918,8920. In another aspect of the configuration, a wireless power converter8914 may be used to capture energy from one or more sources 8922, 8924that may be designed to operate with different parameters and generate amagnetic field 8934 with parameters that match the field 8928 of anothersource 8926 providing “amplification” or a boost to a field from sources8922, 8924 and fields 8930, 8932 with different parameters.

In embodiments a wireless power converter may comprise one or moremagnetic resonators configured or configurable to capture wirelessenergy with one or more parameters and one or more resonators configuredor configurable to transfer wireless energy with one or more parameters.For example, a wireless power converter designed to convert thefrequency parameter of a oscillating magnetic field is depicted in FIG.90( a). The wireless power converter 9012 may have one or more magneticresonators 9014, 9016 that are tuned or tunable to one or morefrequencies. The oscillating voltages generated in the resonator 9014 bythe oscillating magnetic fields 9002 may be rectified and used by a DCto AC converter 9008 to drive another resonator 9016 with oscillatingcurrents generating an oscillating magnetic field 9004 with one or moredifferent frequencies. In embodiments the DC to AC converter of thewireless power converter may be tuned or tunable using a controller 9010to generate a range of frequencies and output power levels.

In embodiments the oscillating voltages of the receiving resonators 9014may be converted to oscillating voltages at a different frequency usingan AC to AC converter 9018 and used to energize a resonator 9016 of awireless power converter without first converting the received voltagesand currents to DC as depicted in FIG. 90( b). In embodiments it may bepreferable to configure and design a wireless power converter to convertthe frequency of magnetic fields such that the captured and transferredmagnetic fields are multiples of one another such that a diode, anonlinear element, a frequency multiplier, a frequency divider, and thelike, may be used to convert the frequency of the captured energy to adifferent frequency without first converting to a DC voltage.

In embodiments a wireless power converter may include one or moreresonators that are time multiplexed between capturing energy at onefrequency and transferring energy at a different frequency. The blockdiagram of time multiplexed power converter is depicted in FIG. 91. Atime multiplexed wireless power converter 9102 may be tuned to captureoscillating magnetic fields 9104, convert the generated AC energy to DCenergy using an AC to DC converter 9114, and charge an energy storageelement 9108 such as a super capacitor, battery, and the like. After aperiod of time, the resonator 9116 may be tuned to a different frequencyand the energy stored in the energy storage element 9108 may be used topower an amplifier or an DC to AC converter 9112 to drive the tunedresonator 9116 with an oscillating voltage at the new resonant frequencythereby generating an oscillating magnetic field. In embodiments theresonator 9116 may change from capturing to transferring power every fewmilliseconds, seconds, or minutes. The resonator may be configured tochange from capturing to transferring of power as soon as energy in thestorage element reaches a predetermined level and may switch back tocapturing when the energy in the storage element drops below apredetermined level. In embodiments a wireless power converter thatconverts power from a high power source to a device with low powerrequirements may only need to capture power for a small fraction of thetime multiplexed cycle and slowly transmit power at the required devicepower level for the remainder of the cycle.

In an embodiment system utilizing wireless power converters, an area,room, or region may be flooded or energized with low power magneticfields by multiple sources that may be integrated into walls, ceilings,partitions and the like. Different wireless power converters may bedistributed or strategically located at different locations to captureand convert the low power magnetic fields to different frequencies,parameters, and power levels to transfer power to different classes ortypes of devices within the area. In system embodiments utilizingwireless power converters, sources may be configured or extended tofunction and operate with a large number of various devices withspecialized power demands or configurations without requiring changes orreconfiguration of the sources.

In embodiments a wireless power converter may not require any additionalenergy input and may simply convert the parameters and characteristicsof wireless power transfer. In embodiments the wireless power convertersmay have additional energy inputs from batteries, solar panels, and thelike that may be used to supplement the energy transferred.

In embodiments the wireless power converter may be tunable andconfigurable such that it may be tuned or configured to convert from anynumber of frequencies or power levels or energy multiplexing schemes toany number of frequencies or power levels or energy multiplexingschemes. It may be adjusted automatically by sensing power levels orfrequencies of a source, or the source with the strongest or appropriatemagnetic field, for example. The converter may include communication orsignaling capability to allow configuration by a source or sources,device or devices, repeater or repeaters, master controller orcontrollers or other converters, as to parameters of the conversion thatmay be desired or required. The converter may communicate or signal to asource or sources to turn on or off, or to increase or decrease powerlevels, depending on the power requirements of the device or devices,repeater or repeaters, to which the converter is transferring energy orfor which the converter is adapting, converting, or translating, thecharacteristics of the wireless power transfer.

Although many of the specific embodiments of a wireless power converterhave been described in terms of a converter that changes the frequencyof an oscillating magnetic field it is to be understood that frequencyis an exemplary parameter and other parameters may be converted withoutdeparting from the spirit of the invention. In embodiments a powerconverter may change any number of parameters including phase,amplitude, and the like. In some embodiments a wireless power convertermay change the sequence or timing of frequency hopping, or allow asingle frequency source to power devices that employ or expect aconstant or periodic frequency hopping mode of operation. In someembodiments, the converter may use time multiplexing techniques toadjust power levels, power distribution algorithms and sequences, and toimplement preferential or hierarchical charging or powering services.

In embodiments a wireless power converter may convert the parameters ofwireless power transfer and may also, or instead, change thedistribution of the fields generated by a source field. A wireless powerconverter may include multi-sized or variable size resonators that maybe configured to redistribute the magnetic field of a source to allow orenhance operation with a device of a different size or at differentseparations. In embodiments a small source resonator may not be the mostefficient at transferring power to a large device resonator. Likewise, alarge source resonator may not be the most efficient at transferringpower to a small device resonator. A wireless power converter mayinclude two or more differently sized resonators that capture andredistribute the magnetic field for improved efficiency of wirelesspower transfer to device resonators without requiring changes orreconfiguration of the source or device resonators.

For example, as depicted in FIG. 92( a), a wireless power converter 9214with a large capture resonator 9216 and a small transmitting resonator9218 may be placed close to a small device resonator 9212 and mayimprove the wireless power transfer efficiency between a large distantsource resonator 9208 and a small device resonator 9212. Likewise, asdepicted in FIG. 92( b), a wireless power converter 9214 with a smallcapture resonator 9218 and a large transmitting resonator 9216 mayplaced close to a small source resonator 9208 and may improve thewireless power transfer efficiency between a large distant deviceresonator 9212 and the small source resonator 9208. The converterresonator may include one or more capture resonators that are sized tomaximize the efficiency of wireless power transfer from the sourceresonator to the converter resonator and one or more transfer resonatorsthat are sized to maximize the efficiency of wireless power transferfrom the converter resonator to the device resonator. In someembodiments energy captured by the capture resonator may be used todirectly power the transmitting resonator. In embodiments the energycaptured by the capture resonator may be converted, modified, metered oramplified before being used to energize the transmitter resonator. Awireless power converter with differently sized resonators may result inimproved system efficiency.

Vehicle Charging Configurations

Wireless power transfer may be used for powering, charging, ordelivering electrical energy to a vehicle. As described above, power maybe delivered to a vehicle from one or more source resonators generatingmagnetic fields outside of a vehicle to one or more device resonatorson, under, alongside, attached to, and the like, a vehicle, for charginga vehicle battery or for charging or powering electronic systems anddevices in or on a vehicle.

In embodiments the source and device resonators of the vehicle chargingsystem may require specific alignment or may have limits on operatingparameters such as separation distance, lateral offset, axialmisalignment, and the like. In embodiments the wireless power transfersystem may include designs which ensure, enable, monitor, or facilitatethat the distance, offset, alignment, and the like are within thespecified operating parameters of the system. In embodiments thewireless power transfer system may include designs and systems whichenable, monitor, or facilitate that the distance, offset, alignment, andthe like are the best feasible or optimum operating characteristics withrespect to safety, efficiency, magnitude of power transfer, and thelike, for a specific configuration.

In car embodiments, for example, a device resonator mounted underneaththe car may receive power from a source positioned under the car. A carmay receive power, charge batteries, power peripherals, and the likefrom the energy captured by the device resonator by driving or parkingover the source. Depending on the size, type, design, orientation, powerlevels, surroundings, and the like, the car source and the car may needto be positioned within a specific boundary or location with respect tothe source. The wireless power transfer system may include features thatenable, facilitate, guide, promote, or ensure proper orientation,position, or alignment of the source and device resonators or thevehicle.

In embodiments a digital camera coupled to a machine vision system maybe used to aid or automate source and device resonator alignment. Avideo camera image of the source and device resonator may be displayedto the user in the vehicle providing guidance as to the location of thesource. In some embodiments the camera and machine vision may be coupledwith a processing unit and appropriate machine vision algorithms andpreprocess alignment and positioning of the car to alert a user withpositional information using auditory, vibrational, or visualindicators. The processing and alignment algorithms may includepositioning and location information from other systems of the vehiclesuch that the positioning and location indicators take into accountobstructions or position limitations of the car. For example, theprocessing and alignment algorithms may be coupled to infrared oracoustic sensors in the bumpers of the car to aid in the positioningwithin the confines of a parking space, garage, and the like.

In embodiments the camera system or machine vision system may be coupledwith a processing unit and appropriate machine vision algorithms used toautomate the process or parts of the process of resonator alignment. Insome embodiments the source or device may be mounted on robotic, orautomated tracks, arms, platforms that move into alignment using thecamera for positioning and orientation information. In some embodimentsthe camera, machine vision algorithms, and processing unit may becoupled to a vehicle's sensors and controls allowing the car to positionand park itself in proper alignment with the source.

In embodiments a camera system or machine vision system may detect, orhelp to detect obstructions and foreign objects and/or materials betweenthe source and device resonators. In embodiments the camera and machinevision system may constantly monitor the gap and/or vicinity around thesource and device for movement, extraneous objects, or any type ofundefined or abnormal operating environments or configurations. Thesystem may be designed to stop power or limit power transfer and may bedesigned to alert the driver, user, or operator when any undefined orabnormal operating environments or configurations are detected by thecamera and/or algorithms. In embodiments the camera and machine visionsystem may be coupled or controlled with self learning or trainablealgorithms that can be designed to function in or with a wide variety ofenvironments, vehicles, sources, and systems and may learn or be trainedto operate in many environments after periods of supervised operation.

In embodiments the camera may be mounted in or around the source and maytransmit video or processed information wirelessly to electronics orusers inside or outside the vehicle. In embodiments the camera may bemounted on the car and may be mounted under the car. In embodiments thecamera may be fitted with an automated door or housing that opens onlywhen the alignment procedure is initiated or when the device or sourceare in close proximity. The mechanical door or housing may open andclose only as needed protecting the camera lens and electronics fromroad debris, water, dirt, and the like.

In embodiments, transmitted and/or reflected acoustic, microwave, RF,optical, and the like signals may be used to automatically, or with thehelp of a user, align source and device resonators to within a specifiedaccuracy. The specified accuracy may be a user settable parameter or itmay be a parameter that is set by a control system. The settableparameter may be adjusted depending on the time of day, the demand onthe electric grid, the cost of electricity (quoted in kW hours forexample), the availability of green energy and the like. The settableparameter may be controlled by a utility provider, by a local agency, bythe car company, by a services company, by an individual user, and thelike.

In embodiments various sensor systems may be used to aid or automatesource and device resonator alignment. Acoustic, pressure, contact,inductive, capacitive, and the like sensors may be located in or aroundthe vehicle to determine the vehicles position and guide the user ofoperator of the vehicle to establish the best alignment. Variousbumpers, lasers, balls, whistles, scrapers, strings, bells, speakers,and the like may also be used as indicators to the users or operatorsfor proper alignment positioning. In embodiments any number of parkingguides, or parking assistant devices may be incorporated into the systemto help guide or position the vehicle in proper or within the acceptablelimits of the source.

In embodiments one or more pressure, temperature, capacitive, inductive,acoustic, infrared, ultraviolet, and the like sensors may be integratedinto the source, device, source housing, vehicle, or surrounding areaand may detect, or help to detect obstructions and foreign objectsand/or materials between the source and device resonators. Inembodiments the sensors and safety system may constantly monitor the gapand/or vicinity around the source and device for movement, extraneousobjects, or any type of undefined or abnormal operating environments orconfigurations. In embodiments, for example, the housing covering thesource resonator may include or may be mounted on top of a pressuresensor that monitors the weight or forces pushing on the enclosure ofthe source resonator. Extra pressure or additional detected weight, forexample, may indicate a foreign or unwanted object that is left on topof the source indicating that it may be unsafe or undesirable to operatethe wireless power transfer system. The output of the sensor may becoupled to the processing elements of the wireless power transfer systemand may be used to stop or prevent wireless power transfer or preventwhen the sensor is tripped or detects abnormalities. In embodiments thesystem and sensor may be coupled to auditory, visual, or vibrationalindicator to alert the user or operator of the wireless power transferinterruption. In some embodiments multiple sensors, sensing multipleparameters may be used simultaneously to determine if an obstruction ora foreign object is present. In some embodiments the system may beconfigured such that at least two sensors must be tripped, such as apressure and a temperature sensor, for example, to turn off or preventthe wireless power transfer.

In embodiments a theft deterrent or detection system may be incorporatedinto the source and device that utilizes the various sensors and camerasof the wireless power transmission system to detect unauthorized use ofthe vehicle.

In embodiments the source and device resonators may be of non-identicaldimensions and geometries to reduce the dependence on alignment of theefficiency of power transfer between source and device coils. In someembodiments it may be beneficial to make the source resonator largerthan the device resonator which may increase the positional tolerancefor a desired energy transfer efficiency between the source and deviceresonators.

In embodiments various geometries of source and device resonators may beused to reduce the effects of source and device misalignments, such asthose that may be associated with parking variations. Parking variationsmay include forward and back variations, side-to-side variations,angular offsets (when the vehicle is parked at an angle), and the like.For example, in some embodiments the source and device resonators may beprone to variations in alignment in the forward and backward directionof the vehicle. In such embodiments, the use of rectangular sourceinductive loop, oriented with the long axis of the inductive loopparallel to the direction of vehicle positional uncertainty—paired witha square device resonator having the same short axis length as thesource resonator may yield a better average efficiency as a function ofsource-to-device resonator displacement than would be achieved by asquare source resonator with the same dimensions as the deviceresonator. Note that the long axis of a rectangular source inductiveloop may be aligned with the length of the vehicle, if the positionaluncertainty is in that direction and may be aligned with the width ofthe vehicle if side-to-side positional uncertainty is expected. Anexemplary embodiment, showing the relative geometries of a source and adevice inductive loop for reducing lateral or side-to-side offsetdependency on the vehicle is shown in FIG. 93. The figure showsexemplary relative geometries from the top perspective looking down atthe car when the source resonator is located below the car and thedevice resonator is mounted to the underside of the car. To increase theside to side offset capability of the car 9302 the capacitively loadedloop resonators comprising the source and the device may be of differentdimensions. The dimensions of the source 9304 may be larger in the inthe side to side dimension or axis of the car than the dimensions of thedevice 9306.

In embodiments the effects of misalignment between a source and a devicemay be mitigated or limited with resonator designs that do not requireprecise alignment. In embodiments the source and device resonator mayinclude planar resonators or resonators comprising a conductor wrappedaround a core of magnetic material. In embodiments the dipole moment ofthe planar resonators may be oriented perpendicular to the dimension ofvehicle position uncertainty. The design of the resonators may allowmisalignments perpendicular to the dipole moments of the resonators withminimal effects of power transfer efficiency.

In embodiments, device resonators and their respective power and controlcircuitry may have various levels of integration with other electronicand control systems and subsystems of a vehicle. In some embodiments thepower and control circuitry and the device resonators may be completelyseparate modules or enclosures with minimal integration to existingsystems of the vehicle, providing a power output and a control anddiagnostics interface to the vehicle. In other embodiments the deviceresonator or parts of the resonator housing may be integrated into thebody, structure, undercarriage, panels of the vehicle. In someembodiments the vehicle may be configured to house a resonator andcircuit assembly in a recess area underneath the vehicle making thebottom face of the coil enclosure flush with the underbody. In someembodiments the recessed area may be further lined with a highlyconductive material such as aluminum, copper, silver and the like whichmay electroplated, laminated, sprayed, applied, and the like to therecessed area.

In embodiments the device and source may include active cooling orheating. The device resonator and circuitry may be integrated into avehicle's cooling system to prevent high temperatures in high powerapplications. In embodiments the device resonator and circuitry mayinclude its own active cooling or heating system with radiators, fans,liquid coolant, and the like. In embodiments the resonators and powerand control circuitry may include various shapes, profiles, protrusions,heat sinks, and the like to aid in temperature control.

In wireless power systems the vehicle power control system may include apower station reservation system that allows users to reserve chargingstations for specific times of the day preventing others users fromcharging from the source. Central information may be used to let userschoose specific power sources or sources which use more environmentallyfriendly sources of energy such as wind or solar power.

In embodiments the device resonator of a vehicle may also be used as apower source. In embodiments vehicle power may be used to power abuilding during a blackout or a cabin without power. In embodiments thevehicle may be used to transmit power to construction vehicles or toolsat a job site.

Resonator Arrays

In embodiments two or more smaller resonators or two or more blocks ofmagnetic material wrapped with conductor may be arranged to form alarger resonator with an effective size that is larger than the physicalsize of the smaller resonators or larger than the size of the blocks ofmagnetic material. A resonator with a larger effective size may haveimproved coupling over a larger distance, may have a higher efficiency,improved invariance with respect to positional uncertainty, may be ableto transfer higher power levels, and the like. An arrangement of smallerresonators or smaller blocks of magnetic material may offer advantagesover a single large resonator with respect to manufacturability, cost,scalability, variability, and the like.

For example, in embodiments as shown in FIG. 94( a) a planar resonatorcomprising a conductor 9406 wrapped around a block of magnetic material9404 may be implemented using one single resonator or one block ofmagnetic material. The resonator may comprise a substantially continuousblock of magnetic material 9404 with a conductor 9406 wrapped around thecomplete width of the magnetic material forming loops with an enclosedarea that are substantially equal to the cross section of the block ofmagnetic material. The resonator may have an effective size 9402 that issubstantially equal to the physical dimensions of the resonator.

In other embodiments, a planar resonator may be implemented using anarrangement of two or more smaller resonators or blocks of magneticmaterial. Each of these smaller resonators may comprise smaller blocksof magnetic material wrapped by conductors forming loops with enclosedareas that are substantially equal to the cross sectional area of theblocks of magnetic material. As depicted in an example embodiment inFIG. 94( b), two smaller blocks of magnetic material 9408, each wrappedwith a conductor 9410 may be arranged side by side to create a resonatorwith an effective size 9402 that is substantially equal to the physicaldimensions of the arrangement of the two blocks of magnetic material. Inembodiments, more than two blocks of magnetic material, each comprisinga conductor 9414 wrapped around the blocks 9412, may be arranged in twoor three dimensional arrays as depicted in FIGS. 94( c-d) to create alarger effective composite resonator that has an effective size 9402that is substantially equal to the physical dimensions of thearrangement of the blocks of magnetic material. The arrays of smallerresonators may be sized and arranged to create an array with the desiredeffective size and shape and the array may be used instead of aresonator comprising a single substantially continuous block of magneticmaterial.

In embodiments each block of magnetic material wrapped with a conductormay be treated as a separate resonator and may be coupled to additionalelectrical elements such as capacitors or inductors for parameteradjustment of each individual block. In other embodiments some or all ofthe conductors wrapped around the blocks of magnetic material may beconnected together and coupled to additional electrical elements such ascapacitors, inductors, and the like to make the complete arrangement ofblocks of magnetic material and conductors a single resonator. Inembodiments, the multiple smaller inductive or resonator structures maybe connected in series, or in parallel, or in a network of serial andparallel connections.

In some embodiments, an arrangement of smaller resonators orarrangements of smaller blocks of magnetic material wrapped with aconductor may offer advantages over a single large resonator withrespect to manufacturability, cost, scalability, variability, and thelike. Magnetic materials are often brittle and a large continuous pieceof magnetic material of the resonator, especially for a large resonator,may be susceptible to damage and cracking Smaller arrays of resonatorsmay be more resistant to vibrations and damage as it may be easier toisolate, reinforce, package, and the like the smaller separate blocks ofmagnetic material. Likewise, composite resonators comprising arrays ofseparate blocks of magnetic material wrapped with a conductor may bemore scalable or expandable. A composite resonator array may be madelarger or smaller by adding or removing individual resonator elements oradding or removing individual blocks of magnetic material from the arrayto increase or decrease the effective size of the resonator depending onthe application or deployment configuration. Such arrangements may haveadvantages in that a large range of resonator effective sizes and shapesmay be realized by assembling multiple smaller resonators. Then, asingle or a few standard resonators may be stocked, tested, manufacturedin volume, and the like, and used to support a wide variety of resonatorsizes and shapes supplied for wireless power transfer systems.

In embodiments, composite resonators comprising arrangements of smallerresonators or arrangements of blocks of magnetic material may havesubstantially the same or similar system parameters and wireless powertransfer characteristics as a resonator with a larger, substantiallycontinuous piece of magnetic material and may be used to replace orsubstitute resonators with a larger, substantially continuous piece ofmagnetic material without a significant impact on the performance orcharacteristics of wireless power transfer. In one embodiment of awireless power transfer configuration, the parameters of wireless powertransfer between a source and a device were calculated and comparedusing finite element method models for arrangements for which the deviceresonator 9504 was implemented as a conductor wrapped around a singlesubstantially continuous blocks of magnetic material (FIG. 95( a)), forwhich the device resonator 9504 was implemented as two conductorswrapped around two equally sized blocks of magnetic material (FIG. 95(b)), and for which the device resonator 9504 was implemented as fourconductors wrapped around four equally sized blocks of magnetic material(FIG. 95( c)). In each configuration of the device, the effective sizeof the resonator was maintained at 30 cm by 32 cm and was aligneddirectly 20 cm above a 30 cm by 32 cm source resonator 9502 comprising aconductor wrapped around a substantially continuous block of magneticmaterial. In the configuration where the device resonator comprises asingle block of magnetic material as shown by 9504 in FIG. 95( a), thequality factor of the effective device resonator was calculated to be450, and the coupling factor k between the source and the device wascalculated to be 0.124, resulting in a predicted wireless power transferefficiency of 96.4% between the source and the device. In theconfiguration where the device resonator comprises two smaller blocks ofmagnetic material wrapped with a conductor and separated by a 0.1 cm gapof air, as shown by 9504 in FIG. 95( b), the quality factor of theeffective device resonator was calculated to be 437, and the couplingfactor k between the source and the device was calculated to be 0.115resulting in a predicted wireless power transfer efficiency of 96.2%between the source and the device. In the configuration where the deviceresonator comprises four smaller blocks of magnetic material wrappedwith conductors separated by a 0.2 cm air gap, as shown in FIG. 95( c),the quality factor of the effective device resonator was calculated tobe xxx, the coupling factor k between the source and the device wascalculated to be 0.109 resulting in a predicted wireless power transferefficiency of 96% between the source and the device.

In embodiments, the parameters of the arrangement of compositeresonators comprising smaller blocks of magnetic material may beaffected by the orientation, positioning, arrangement, and configurationof the blocks of magnetic material, the conductor, and the like. Onefactor found to be of importance is the separation distance between theresonators and the smaller blocks of magnetic material that may comprisea resonator with a larger effective area. For example, consider acomposite resonator with a large effective area comprising four separatesmaller resonators with separate blocks of magnetic material is depictedin FIG. 96. The size of the separation distances, labeled as A and B inthe figure, may affect the parameters of the resonator and theefficiency of wireless power transfer. For example, for theconfiguration and orientation depicted in FIG. 95( c) and describedabove, changing both dimension A and dimension B from 0.2 cm to 2 cmreduced the efficiency of wireless power transfer from the source to thedevice from 96% to 94.8%.

In embodiments it may be preferable to minimize the gaps between theblocks of magnetic material, and may be especially preferable for gapsthat are not parallel to the axis of the dipole moments 9602 of theresonators. In embodiments the size of an acceptable or preferable airgap may be dependent on the overall or effective size of the largerresonator, the size of the individual small resonators, power levels,and the like. In embodiments it may be preferable to ensure that thegaps between the blocks of magnetic material be smaller than 10% of thelargest dimension of the effective size of the resonator arrangement. Inembodiments it may be preferable to ensure that the gaps between theblocks of magnetic material be smaller than 10% of the smallestdimension of the effective size of the resonator.

In embodiments, the individual smaller resonators or individual blocksof magnetic material wrapped with a conductor and comprising theeffective larger composite resonator may include features, shapes,designs, notches, and the like to enable smaller separation gaps betweenthe smaller blocks of magnetic material or the smaller resonators. Insome embodiments, the gap 9706, as shown in FIG. 97, between adjacentresonators may be reduced reduced by staggering the conductor windings9704 of the adjacent resonators and allowing a conductor of aneighboring resonator to fit between adjacent windings of the conductorof an another resonator as shown in FIG. 97( a). In some embodiments theblocks of magnetic material 9702 may be shaped and may haveindentations, notches, holes, and the like 9708 to generate anindentation for the conductor 9704 allowing neighboring blocks ofmagnetic material to come close together and have a separation 9706 thatmay be smaller than the thickness of the conductor 9704 as shown in FIG.97( b).

In embodiments the gaps between the resonators may be filled completelyor partially with magnetic material blocks, powder, epoxy, and the like.In some embodiments the magnetic material may be different from theblocks of magnetic material that comprise the smaller resonators. Insome embodiments it may be preferable to use a flexible form of magneticmaterial which may prevent or reduce vibration or shock transfer betweenresonators.

In embodiments each of the smaller blocks of magnetic materialcomprising a larger effective composite resonator may be wrapped withseparate pieces of conductors and coupled to separate tuning andmatching networks. Each block of magnetic material with a wrappedconductor may be an individual resonator and may be tuned or adjustedindependently from the other resonators. In embodiments each resonatoror groups of resonators may be coupled to separate power and controlcircuitry which may be synchronized with an oscillator or clock toensure all resonators and power and control circuitry are operating atthe same frequency and phase or at predetermined frequencies and phaseoffsets. In embodiments a single power and control circuitry may be usedfor all of the resonators and, in the case of a source, may drive allthe resonators in parallel with an oscillating voltage, or in the caseof a device, one power and control circuitry may capture and convert theoscillating voltage on each resonator conductor.

In embodiments a single conductor may be used to sequentially wrap allor groups of blocks of magnetic material of the resonator. A conductormay be wrapped around one block of magnetic material and then wrappedaround a second and so on providing a series connection between theconductors around multiple blocks of magnetic material. In suchembodiments a single power and control circuitry may be used to energizethe conductor with oscillating current.

In embodiments the individual smaller resonators and blocks of magneticmaterial that comprise the composite resonator arrangement may all havesubstantially equal dimensions. In other embodiments the blocks ofmagnetic material may be non-uniform and may have varying thickness orirregular shapes.

In embodiments, the individual smaller resonators or individual blocksof magnetic material wrapped with a conductor comprising the effectivelarger composite resonator may all be wrapped such that all the loopsformed by the conductor are coaxial or such that the axis of all theloops formed by the conductors are all parallel. In other embodiments,the conductors may be wrapped such that not all the axes of the loopsformed by the conductors are parallel. Some blocks of magnetic materialmay be wrapped or arranged such the conductor forms loops with an axisthat is perpendicular to other loops of other conductors and may be usedto form a larger effective composite resonator that has, or has thecapability of having a magnetic dipole moment in more than onedirection.

In embodiments a composite resonator comprising an arrangement ofsmaller blocks of magnetic material may include blocks of magneticmaterial without a wrapped conductor.

In embodiments of a composite resonator comprising an arrangement ofsmaller blocks of magnetic material or smaller resonators the conductorsmay be selectively energized or activated depending on the power levels,distances, magnetic field limits, and the like during wireless powertransfer. In embodiments, for example, a source resonator comprising anarrangement that includes multiple conductors may energize one or only aportion of the conductors when low levels of wireless power transfer arerequired and may energize most or all of the conductors when high levelsof wireless power transfer are required.

In some embodiments different conductors or different numbers ofconductors may be energized depending on the relative location of asource and a device including distance or lateral offset. For example,in embodiments for a vehicle charging application, where the sourceresonator may be of a larger dimension than the device resonator asshown in FIG. 93, the source resonator may comprise smaller blocks ofmagnetic material or smaller resonators for which only the blocks andconductors that are directly below the device resonator may beenergized. In such an embodiment the source and device resonators maytolerate greater lateral offset while ensuring that the strongestmagnetic fields are always confined to the area below the deviceresonator.

It is to be understood that any description of blocks of magneticmaterial, small or large, may refer to blocks that comprise a singlemonolithic block, tile, structure, crystal, sheet, square, shape, form,and the like, of magnetic material or may comprise any combination ofseparate smaller blocks, tiles, structures, crystals, sheets, squares,shapes, forms, and the like, of similar or different types of magneticmaterial that are attached, packed, assembled or secured together toform a substantially continuous form.

Integrated Resonator-Shield Structures

In some embodiments and applications of wireless power transfer it maybe necessary or desirable to place the resonator structure in closeproximity to another object such as electronic devices, circuit boards,metallic objects, lossy objects, and the like. In some embodiments closeproximity to some types of objects, such as batteries, circuit boards,lossy objects, and/or metals, may adversely affect or perturb theperformance of the power transfer system. Close proximity to someobjects may reduce the quality factor of one or more of the resonatorsinvolved in the power transfer or may impact the coupling between two ormore of the resonators. In some embodiments the electromagnetic fieldsgenerated by the resonators may also affect objects around the resonatorby, for example, affecting the operation of electronic devices orcircuits, or causing heating of the object.

In embodiments, the effects of the electromagnetic fields on objects aswell as the effects of objects on the parameters of wireless powertransfer or parameters of the resonators may be at least partiallymitigated by introducing a shielding structure between the resonator andthe object, as described above and shown in FIGS. 21, 25-27, 79, and 84.In some embodiments, the shielding structure and the resonator may beintegrated into one structure allowing the resonator structure to beplaced or located near an object with minimal effects on quality factorQ of the resonator and likewise minimal effects on the external object.In some embodiments, an integrated resonator and shield structure may besmaller in at least one dimension, than a structure comprising aresonator and a shield assembled from each of its parts separately.

As described above, one method of shielding against perturbations fromexternal objects for planar resonators, or resonators comprising a blockof magnetic material, is to place a sheet of a good conductive materialbetween the resonator and the object. For example, as shown in FIG. 98(a) for a planar resonator 9818 comprising a block of magnetic material9814 and a conductor wire 9816 wrapped all the way around the block9814, a shield comprising a sheet of a good electrical conductor 9812can be positioned next to the resonator 9818 at least partiallyshielding the resonator from the effects of objects located below 9820the conductor shield 9812, and likewise at least partially shielding theobjects positioned below 9820 the shield from the effects of theelectromagnetic fields that may be generated by the resonator. Note thatwhile the Figures may not show the resonator capacitors explicitly, itshould be clear the magnetic resonators described here compriseinductive elements comprised of conductive wire loops, either in air orwrapped around a block of magnetic material and capacitive elements, asdescribed above.

One physical effect of the addition of a conductive shield such as shownin FIG. 98( a) is the generation of an “image” resonator, on the otherside of the conductive shield. One of ordinary skill in the art willrecognize that the “image” described here is similar to the imagecharges and the method of images used to replicate electromagneticboundary conditions along a perfect conductor. The “image” resonatorwill have “image” currents that mirror the electromagnetic currents inthe resonator itself. In the limit where the size of the shield isinfinitely larger than that of the resonator, the electromagnetic fieldsin the region of the actual resonator can be expressed as asuperposition of the fields generated by the actual resonator and thosegenerated by the image resonator. In some embodiments, an additionalbenefit of including a shield in the resonator structure is that theshield doubles the effective thickness of the magnetic material in theresonator structure.

In the limit where the shield is flat, large, close to the resonator,and highly conductive, the image currents and the actual currentsflowing on the inner conductor segments (between the actual resonatorand its image) of the real and image structures will be substantiallyequal and opposite and the electromagnetic fields they generate aresubstantially cancelled out. Therefore the wire segments that traversethe bottom of the magnetic material contribute very little to theoverall field of the resonator. However, their resistive losses reducethe resonator Q and their thickness increases the overall thickness ofthe structure.

In some embodiments, a conductive shield may be placed in proximity to aplanar resonator so that a thinner resonator may be used to achievesimilar performance to one that is twice as thick. In other embodiments,the thin resonator may be made thinner by moving or removing thesegments of the conducting wire that traverse the “bottom” of themagnetic material as shown in FIG. 98 (a). As described above, thesewire segments contribute very little to the overall field, but theirresistive losses reduce the resonator Q and their thickness increasesthe overall thickness of the structure. If these conducting wiresegments are to be moved or removed from the resonator structure, analternate electrical path for the current must be provided so thatcurrent can flow through the inductive element and around the magneticmaterial of the resonator.

One structure that removes the wire segments from below the block ofmagnetic material while preserving the shielding is shown in FIG. 98(b). In embodiments, current may be returned to the remaining segmentsof the winding by connecting the remaining winding segments directly tothe conductor shield. Such a resonator and shield combination may have ahigher-Q than an equivalent resonator not electrically connected to ashield but using a continuous wire wrapping, provided that the currentdistribution in the newly integrated shield and remaining windings issubstantially the same as in the configuration for which the conductorshield is separate. In some embodiments the same current distribution inthe integrated resonator-shield structure may be achieved by driving orcontrolling the current in each conductor wire segment individually. Inother embodiments the current distribution may be achieved by separatingthe shield into optimized individual conductor segments as will be shownbelow.

In embodiments it may be advantageous to explicitly incorporate theshield as part of the resonator, and use the conductor shield to carrycurrents that are directly connected to other parts of the resonatorthat do not have a shielding function. The integrated resonator-shieldstructure may eliminate the resistive losses of the image currentsgenerated in the shield and may have an increased quality factorcompared to a structure using a separate shield and resonator.

An example embodiment of the inductive portion of an integratedresonator-shield structure is shown in FIG. 98( b) and comprises a sheetof conductor 9822, a block of magnetic material 9804, and conductor wiresegments 9810. The block of magnetic material 9804 is positioned on topof the sheet of conductor 9822 and the core is partially wrapped by theconductor wire segments 9810. The ends of the conductor wire segments9810 are connected to opposite sides of the conductor shield not coveredby the block of magnetic material. In other words, the conductor wiresegments only partially wrap the block of magnetic material. That is,the conductor wire segments do not wrap completely around the core ofmagnetic material, but rather connect to the shield or segments of theshield to complete the electrical circuit. In FIG. 98 (b), the conductorwire segments wrap the top and both sides of the block of magneticmaterial. The conductor wire segments connect to the conductor shieldwhich is used to complete the electrical connection between the two endsof the conductor wire segment. In embodiments, the conductor shieldfunctions in part as the current path for the conductor wire segments.

In some embodiments, the overall current distribution in the windingsegments and shield of an integrated resonator may differ substantiallyfrom that of the separate resonator and shield, even after accountingfor the redundant currents. This difference may occur if, for example,the remaining segments of winding are simply electrically connected tothe shield (e.g., by soldering), in which case the separate windingswould all be connected in parallel with the shield and unless additionalpower control is added for each conductor wire segment the electricalcurrent would flow preferentially in those portions of windingexhibiting the lowest impedance. Such a current distribution may not besuitable for all applications. For example, such a current distributionmay not be the one that minimizes losses and/or optimizes performance.

One alternative embodiment of the integrated resonator-shield structureis to split the continuous conductor shield into distinct, electricallyisolated conductor segments. In FIG. 98( c) the integratedresonator-shield structure comprises a conductor shield 9808 that issplit or divided into distinct isolated conductor segments 9802, 9812,etc that connect the ends of different conductor wire segments 9810,9814 forming an electrical connection between the conductor wiresegments and creating one continuous conducting path. The net result isa series connection of conductor wire segments alternated withelectrically isolated segments of the conductor shield.

The top, side, front, and exploded views of one embodiment of theintegrated resonator-shield structure are shown in FIGS. 99( a), 99(b),99(c), and FIG. 100 respectively. The integrated resonator-shieldstructure has a conductor shield 9808 that is split into multipleisolated conductor segments or paths, 9802, 9812, that are connected tothe ends of the conductor wire segments 9810, 9814, the conductor wiresegments then partially wrap the block of magnetic material 9804, orrather the conductor wire segments are routed so as to cover part of themagnetic material. As can be seen from the front view of the resonatorin FIG. 99( c), the conductor wire segment 9810 does not wrap completelyaround the core of magnetic material 9804, but only wraps partially withthe ends of the conductor wire segment 9810 connected to differentsegments of the conductor shield 9808.

In embodiments the conductor shield may be split into multiple segmentsand shaped such that the shield segments connect to the ends of the wireconductor segments in a manner that results in each or some of the wireconductors segments being connected in series. An exemplary conductorshield with segments shaped and configured to connect the conductor wiresegments in series is shown in FIG. 99( a). Each segment 9802, 9812 ofthe conductor shield 9808 is shaped to connect two ends of differentconductor wire segments 9810. In this configuration for example, theindividual shield segments and the conductor wire segments are connectedin series to produce one continuous conductor that partially wrapsaround the core of magnetic material 9804 top to bottom, and partiallywraps around the block of magnetic material in the plane of the shield.For the embodiment shown in FIG. 99( a) for example, the effectiveconductor starts at the end of one conductor wire segment 9906 andalternates between the conductor wire segments above the block ofmagnetic material 9804 and the segments of the conductor shield 9808that are routed around the block of magnetic material 9804. The firstconductor wire segment 9906 is routed over the block of magneticmaterial 9804 and connects to a conductor shield segment 9910 which inturn connects to another conductor wire segment 9912 that is routed overthe magnetic material and connects to another conductor segment 9914 andthe pattern of alternating conductor wire segments and conducting shieldsegments is repeated until the last conductor segment of the conductorshield 9908. The combination of the segments on the conductor shield andthe conductor wire segments above the core of magnetic material createan effective continuous conductor and thus a magnetic resonator with anintegrated shield that may be used to transfer or capture wireless powervia oscillating magnetic fields. In embodiments, the conductor wiresegments may comprise any type of wire such as solid wire, Litz wire,stranded wire and the like. In other embodiments, the conductor wiresegments may comprise PCB or flex circuit traces, conductor strapping,strips, tubing, tape, ink, gels, paint, and the like.

The structure shown in FIG. 99( a), for example, may be used as a sourcemagnetic resonator by coupling the two ends of the effective conductor9906, 9908 to at least one capacitor and to an oscillating voltage powersource. The oscillating currents in the effective conductor willgenerate oscillating magnetic fields that are substantially parallel tothe conductor shield 9808 while providing shielding against lossyobjects that may be positioned below 9904 the resonator-shieldstructure. In addition, the fields that are generated may appear as ifthey have been generated by a resonator with a block of magneticmaterial that is twice as thick as the actual dimension of the magneticmaterial block, t, under certain coupling scenarios.

In embodiments it may preferable to connect the conductor wire segmentsand the segments of the conductor shield such that when the effectiveconductor is energized by an external power source or by externaloscillating magnetic field, the currents in the conductor wire segmentsflow substantially in the same direction. For example, for theembodiments shown in FIG. 99( a), the conductor wire segments areconnected such that when the effective conductor is energized throughthe conductor ends or leads 9908, 9906, all the currents in allindividual conductor wire segments 9810, etc. flow in the samedirection, wherein the direction depends on the polarity of the inducedvoltages on the effective conductor. Current flowing in the samedirection in the conductor wire segments may generate the strongestmagnetic field.

In embodiments it may be preferable to connect and arrange the segmentsof the conductor shield such that the currents in the shield segmentsflow in opposite directions for shield segments above or below thecenter line 9910 of the resonator. For example, for the embodiment shownin FIG. 99( a), the conductor segments of the conductor shield areconnected such that when the effective conductor is energized at theends 9908, 9906, the electric currents above the center line of theresonator 9910 flow in the opposite rotation than the currents below ofthe center line of the resonator 9910 in the conductor segments 9802,9812 of the conductor shield 9808. That is, if the currents in conductorsegments above the center line flow in substantially a clockwisedirection, the currents below the center line should flow substantiallyin the counterclockwise direction. The counter flowing current of thetop and bottom portions of the segments of the conducting shield maydirect the magnetic fields generated by the respective portions of theresonator to enhance one another or point toward the same directionstrengthening the dipole moment of the resonator towards a planeparallel with the conductor shield.

In embodiments the splitting of the integrated shield that generates theconductor shield segments could be done self-consistently so that theresulting current distribution for the integrated structure wouldperform at least as well (as defined by the resulting quality factor,effectiveness in shielding, coupling to other resonators, and the like)as the original system comprising a separate resonator and shield.

In embodiments the shape and distribution of the segments on theconductor shield may be designed to equalize currents in each segment ofthe shield, in each conductor winding segment, or in sections ofcombined segments. It may be preferable to shape and divide theconductor shield and shape the shield segments such that each shieldsegment carries substantially equal electric current. Such a currentdistribution may reduce proximity losses for example. The shaping of theshield segments is often done so they are narrower or thinner when theyare closest to the magnetic material and thicker or wider when they arefarther away may be preferable in some embodiments because thedistribution arising from driving all of the conductor segments inparallel with equal current best approximates the current distributionin a solid shield located close to a resonator in a non integratedresonator-shield structure.

The general characteristics of the pattern may be seen in the shieldsegment shapes in the embodiments shown in FIG. 99( a) for example. Inthe Figure, the conductor segments 9812, 9802 span or cover a largerarea of the conductor shield 9808 the further the segments are from theblock of magnetic material 9804. In the non-integrated resonator-shieldstructure, the effective currents induced in the conductor shieldincrease in areas closer to the block of magnetic material 9804. Shapingthe shield segments as shown in FIG. 99 (a) forces a substantiallysimilar current distribution in the integrated structure with thesegmented shield.

In embodiments, the conductor shield may not need to extend all the waybelow the block of magnetic material. In embodiments the area under theblock of magnetic material may be substantially void of magnetic fieldsduring operation of the resonator. In embodiments the conductor shieldmay have a hole or cut-out below the block of magnetic material (in thearea where the block of magnetic material and the conductor shield wouldotherwise overlap). In embodiments, removing this shielding material maymake the resonator structure lighter or less expensive to make. Forexample, FIG. 100 depicts an exploded view of an embodiment of aintegrated resonator-shield structure which comprises a conductor shield9808 with a cutout or hole 10002 in the area of the conductor shieldwhich would otherwise overlap with the block of magnetic material 9804in the assembled structure.

In embodiments, the effective size of the shield may be larger than thedimensions of the block of magnetic material or the inductive portion ofthe resonator. The exact dimension of the conductor shield may differfor different applications. For example, in resonators designed forsmall devices such as cell phones or other hand held electronics, it maybe preferable to ensure that the conductor shield extends out at least15-20% of the length of the block of magnetic material in eachdirection. This shield extension may provide additional shielding fromlossy materials in the cell phones or other hand held electronics. Thesize of the shield with respect to the magnetic material may depend onthe types and sizes of objects the shield is meant to be effectiveagainst. The size of the conductor shield may be reduced if, forexample, objects or materials behind the shield are not very lossy. Inembodiments where the resonator may placed on a plane of very lossysteel, however, it may be desirable to make the shield larger tominimize the losses in the steel and the shield may have dimensionslarger than 30% larger or more than the dimensions of the block ofmagnetic material.

In embodiments the segmented shield may be manufactured by any number offabrication techniques, including machining, electroplating,electro-deposition, etching, painting, patterning, and the like and byrigid and flexible printed, deposited, etched, and the like, circuitboard techniques. The individual segments on the conductor shield may beformed by machining a single piece of conductor. In embodiments theseparation between the shield segments may comprise an additionalseparation or insulation space, layer or material. Such additionalseparation may provide improved electrical isolation between thesegments and may prevent electrical arcing between two adjacentconductor traces.

In embodiments, the conductor shield may be further divided intomultiple layers of conductors separated by insulators. A layered shieldmay be used to increase the cross section of conductor over whichelectrical current flows beyond the limits set by the skin depth effectat the frequency of operation, as described in previous sections. Inembodiments, a layered shield may reduce the AC resistance of theconductor segments and increase the quality factor of the structure. Alayered shield may also be used to achieve an integratedresonator-shield structure having dipole moments with substantiallymutually orthogonal orientations in a thin and compact structure. Such astructure might comprise conductor wire segments that are orthogonal toeach other on top of the block of magnetic material. Each layer ofshield segment may itself be further divided into narrower tracks ofconductor that would provide additional control over the current densityprofile in the shield and may further increase the performance of thestructure.

In embodiments the segments of the conductor shield may be shaped andarranged to provide a serial connection of the conductor wire segmentsthat are partially wrapped around the block of magnetic material. Forexample, in the embodiment depicted in FIG. 99( a), the shield segments9812, 9802 are non symmetric with respect to the center line 9910 of theresonator. Each shield trace is shaped to connect the ends of twodifferent conductor wire segments 9810 allowing the conductor wiresegments to be arranged in a symmetric pattern with respect to thecenterline 9910. Such an arrangement may be advantageous for someconfigurations since it may allow simpler conductor wire design. Theconductor wires that partially wrap around the block of magneticmaterial are all parallel and at right angles to the resonatorstructure. In other embodiments the shield segments may be completely orpartially symmetric with respect to the center line of the conductorshield requiring the conductor wire segments that wrap partially abovethe magnetic core to be arranged such that they connect two ends ofdifferent shield segments. For example, in the embodiment depicted inFIG. 101( a) the shield segments 10106, 10110 of the conductor shield10102 are symmetric with respect to the center line 10104 of theresonator. A serial connection of the conductor segments is provided bya non symmetric alignment, or diagonal alignment of the conductor wiresegments 10108 that partially wrap the block of magnetic material 9804.In some embodiments a combination of non-symmetrical or symmetric shieldsegments and non-symmetrical or symmetrical conductor wire segmentrouting may be used to connect some or all of the conductors in seriesor parallel depending on the desired properties of the resonator. Forexample, for some higher power configurations wherein large currents maybe present in the resonator it may be advantageous to use an arrangementin which at least some of the conductor wire segments are connected inparallel to reduce losses in the conductors.

In embodiments the conductor wire segments that partially wrap the blockof magnetic material may be comprised of individual wires or braidedwires such as Litz wire. In embodiments the conductor wires may becomprised of flex circuits or traces or printed circuits or traces andmay be shaped to fold over the block of magnetic material and may haveappropriate contacts or attachments to make electrical connections withthe conductor segments of the conductor shield. For example, FIG. 101(b) depicts an exemplary embodiment in which the conductor wire segmentis integrated into a single piece 10114 that may be a printed circuitboard, a flex circuit, and the like, and is formed to fold over theblock of magnetic material 9804 and make appropriate electrical contactswith the conductor segments of the conductor shield 10102.

In embodiments, the shield and conductor wire segments may be fabricatedin the same process, potentially improving reproducibility andperformance while reducing manufacturing costs. In embodiments, anintegrated shield and conductor wire segments structure may befabricated as a flexible PCB, and the resonator structure may becompleted by simply inserting the block of magnetic material within theintegrated shield and winding, and then connecting the resultingstructure to the appropriate circuitry. In the exemplary embodimentdepicted in FIG. 102( b), the complete structure of the conductor shield10214 with the conductor segments (not shown) and the conductor wirepart 10212 comprising individual conductor segments (not shown) may beone printed circuit board wherein the conductor wire part 10212 is bentor shaped to facilitate or support the placement of a block of magneticmaterial.

In embodiments, some or all of the supporting circuitry of the resonatormay be fabricated on the same printed circuit board as the conductorshield of the integrated resonator-shield structure. For example, oneside of the printed circuit board may have the printed conductor tracesof the conductor shield while the other side may have electroniccomponents and printed traces and may be used to contain the power andcontrol circuitry for the resonators.

In embodiments, the block of magnetic material may be hollow or may havea cavity on the side facing the conductor shield where the effectivemagnetic fields or the resonator are minimal. The cavity in the magneticmaterial may be used to house electric or electronic components such asamplifiers or rectifiers used to power and control the resonator. Theelectronic components may be located in the cavity without significantlyaffecting the properties and parameters of the resonators and likewisenot being significantly affected by the magnetic fields of theresonator. For example, FIG. 102( a) depicts an exemplary integratedresonator-shield structure wherein the bottom side 10208, or the sidethat faces the conductor shield 10102 of the magnetic material 10202 isshaped to have a cavity 10204 into which components or electronicdevices may be located. Placing the components in the cavity 10204 mayprovide for an integrated resonator-shield structure with the power andcontrol circuitry designed under the magnetic material and shield withminimal or no impact on the height or thickness of the resonatorstructure. In some embodiments, an antenna or the like may be placed inthe cavity and may be operated at a frequency where the magneticmaterial is substantially transparent or at least not an effectiveshield. In such embodiments, the antenna may suffer little attenuationfrom the presence of the resonator.

In embodiments, the conductor shield of the integrated resonator-shieldstructure may have additional bends, curves, flaps, and the like toenhance, improve, or alter the magnetic fields generated or affectingthe resonator. The conductor shield of the integrated resonator-shieldstructure may have any of the bends, curves, flaps and the like thatwere described herein for the designs comprising a separate resonatorand conductor shield. For example, similarly to the conductor shielddepicted in FIG. 84( a) in which the conductor shield 8402 is shaped tohave flaps 8404, the conductor shield of the integrated resonator-shieldstructure may be shaped to include flaps that extend towards the blockof magnetic material which may increase the effective size of theintegrated shield without requiring a larger size conductor shield.

In embodiments, the design of the integrated resonator-shield structuremay be sized, modified, configured, and the like to operate at specificconfigurations, power levels, frequencies, orientations, environments,and the like which may be required for specific applications. The numberof conductor wire segments, the number of separate conductor segments onthe conductor shield, the wire gauge, the thickness of the conductorshield, the thickness of the magnetic material, the dimensions of theshield, and the like may all be modified and manipulated to meetspecific design requirements.

In embodiments, the integrated resonator-shield structure may bemodified and extended to structures that have more than one magneticdipole moment. The block of magnetic material may be partially wrappedwith conductor wire segments in orthogonal directions or in non-paralleldirections with the segments of the conductor shield arranged to connectthe conductor wire segments in a serial or parallel or switchedconfiguration. For example, an exemplary embodiment of an integratedresonator-shield structure having two orthogonal dipole moments is shownin FIG. 103. In the embodiment a block of magnetic material 10304 withfour protrusions 10308 is partially wrapped with conductor wire segments10306 that extend around the block of magnetic material 10304 andconnect to the conductor segments 10310 of the conductor shield 10302 ofthe structure. The shield segments 10310 may be shaped to connect theconductor wire segments 10306 in series, in parallel, or may compriseswitches so that different dipole moments can be individually excited.The structure has conductor wire segments wrapping the block of magneticmaterial in orthogonal directions and is capable of producing twoorthogonal magnetic dipole moments that are each parallel to the surfaceof the conductor shield. The segments of the conductor shield providefor a continuous current path while eliminating losses associated withnon-integrated shields used to shield a resonator from perturbatingobjects that may be located below 10312 the structure.

Example Resonator Circuitry

FIGS. 104 and 105 show high level block diagrams depicting powergeneration, monitoring, and control components for exemplary sources ofa wireless energy transfer system. FIG. 104 is a block diagram of asource comprising a half-bridge switching power amplifier and some ofthe associated measurement, tuning, and control circuitry. FIG. 105 is ablock diagram of a source comprising a full-bridge switching amplifierand some of the associated measurement, tuning, and control circuitry.

The half bridge system topology depicted in FIG. 104 may comprise aprocessing unit that executes a control algorithm 10428. The processingunit executing a control algorithm 10428 may be a microcontroller, anapplication specific circuit, a field programmable gate array, aprocessor, a digital signal processor, and the like. The processing unitmay be a single device or it may be a network of devices. The controlalgorithm may run on any portion of the processing unit. The algorithmmay be customized for certain applications and may comprise acombination of analog and digital circuits and signals. The masteralgorithm may measure and adjust voltage signals and levels, currentsignals and levels, signal phases, digital count settings, and the like.

The system may comprise an optional source/device and/or source/otherresonator communication controller 10432 coupled to wirelesscommunication circuitry 10412. The optional source/device and/orsource/other resonator communication controller 10432 may be part of thesame processing unit that executes the master control algorithm, it maya part or a circuit within a microcontroller 10402, it may be externalto the wireless power transmission modules, it may be substantiallysimilar to communication controllers used in wire powered or batterypowered applications but adapted to include some new or differentfunctionality to enhance or support wireless power transmission.

The system may comprise a PWM generator 10406 coupled to at least twotransistor gate drivers 10434 and may be controlled by the controlalgorithm. The two transistor gate drivers 10434 may be coupled directlyor via gate drive transformers to two power transistors 10436 that drivethe source resonator coil 10444 through impedance matching networkcomponents 10442. The power transistors 10436 may be coupled and poweredwith an adjustable DC supply 10404 and the adjustable DC supply 10404may be controlled by a variable bus voltage, Vbus. The Vbus controllermay be controlled by the control algorithm 10428 and may be part of, orintegrated into, a microcontroller 10402 or other integrated circuits.The Vbus controller 10426 may control the voltage output of anadjustable DC supply 10404 which may be used to control power output ofthe amplifier and power delivered to the resonator coil 10444.

The system may comprise sensing and measurement circuitry includingsignal filtering and buffering circuits 10418, 10420 that may shape,modify, filter, process, buffer, and the like, signals prior to theirinput to processors and/or converters such as analog to digitalconverters (ADC) 10414, 10416, for example. The processors andconverters such as ADCs 10414, 10416 may be integrated into amicrocontroller 10402 or may be separate circuits that may be coupled toa processing core 10430. Based on measured signals, the controlalgorithm 10428 may generate, limit, initiate, extinguish, control,adjust, or modify the operation of any of the PWM generator 10406, thecommunication controller 10432, the Vbus control 10426, the sourceimpedance matching controller 10438, the filter/buffering elements,10418, 10420, the converters, 10414, 10416, the resonator coil 10444,and may be part of, or integrated into, a microcontroller 10402 or aseparate circuit. The impedance matching networks 10442 and resonatorcoils 10444 may include electrically controllable, variable, or tunablecomponents such as capacitors, switches, inductors, and the like, asdescribed herein, and these components may have their component valuesor operating points adjusted according to signals received from thesource impedance matching controller 10438. Components may be tuned toadjust the operation and characteristics of the resonator including thepower delivered to and by the resonator, the resonant frequency of theresonator, the impedance of the resonator, the Q of the resonator, andany other coupled systems, and the like. The resonator may be any typeor structure resonator described herein including a capacitively loadedloop resonator, a planer resonator comprising a magnetic material or anycombination thereof.

The full bridge system topology depicted in FIG. 105 may comprise aprocessing unit that executes a master control algorithm 10428. Theprocessing unit executing the control algorithm 10428 may be amicrocontroller, an application specific circuit, a field programmablegate array, a processor, a digital signal processor, and the like. Thesystem may comprise a source/device and/or source/other resonatorcommunication controller 10432 coupled to wireless communicationcircuitry 10412. The source/device and/or source/other resonatorcommunication controller 10432 may be part of the same processing unitthat executes that master control algorithm, it may a part or a circuitwithin a microcontroller 10402, it may be external to the wireless powertransmission modules, it may be substantially similar to communicationcontrollers used in wire powered or battery powered applications butadapted to include some new or different functionality to enhance orsupport wireless power transmission.

The system may comprise a PWM generator 10510 with at least two outputscoupled to at least four transistor gate drivers 10434 that may becontrolled by signals generated in a master control algorithm. The fourtransistor gate drivers 10434 may be coupled to four power transistors10436 directly or via gate drive transformers that may drive the sourceresonator coil 10444 through impedance matching networks 10442. Thepower transistors 10436 may be coupled and powered with an adjustable DCsupply 10404 and the adjustable DC supply 10404 may be controlled by aVbus controller 10426 which may be controlled by a master controlalgorithm. The Vbus controller 10426 may control the voltage output ofthe adjustable DC supply 10404 which may be used to control power outputof the amplifier and power delivered to the resonator coil 10444.

The system may comprise sensing and measurement circuitry includingsignal filtering and buffering circuits 10418, 10420 anddifferential/single ended conversion circuitry 10502, 10504 that mayshape, modify, filter, process, buffer, and the like, signals prior tobeing input to processors and/or converters such as analog to digitalconverters (ADC) 10414, 10416. The processors and/or converters such asADC 10414, 10416 may be integrated into a microcontroller 10402 or maybe separate circuits that may be coupled to a processing core 10430.Based on measured signals, the master control algorithm may generate,limit, initiate, extinguish, control, adjust, or modify the operation ofany of the PWM generator 1510, the communication controller 10432, theVbus controller 10426, the source impedance matching controller 1438,the filter/buffering elements, 10418, 10420, differential/single endedconversion circuitry 10502, 10504, the converters, 10414, 10416, theresonator coil 10444, and may be part of or integrated into amicrocontroller 10402 or a separate circuit.

Impedance matching networks 10442 and resonator coils 10444 may compriseelectrically controllable, variable, or tunable components such ascapacitors, switches, inductors, and the like, as described herein, andthese components may have their component values or operating pointsadjusted according to signals received from the source impedancematching controller 10438. Components may be tuned to enable tuning ofthe operation and characteristics of the resonator including the powerdelivered to and by the resonator, the resonant frequency of theresonator, the impedance of the resonator, the Q of the resonator, andany other coupled systems, and the like. The resonator may be any typeor structure resonator described herein including a capacitively loadedloop resonator, a planar resonator comprising a magnetic material or anycombination thereof.

Impedance matching networks may comprise fixed value components such ascapacitors, inductors, and networks of components as described herein.Parts of the impedance matching networks, A, B and C, may compriseinductors, capacitors, transformers, and series and parallelcombinations of such components, as described herein. In someembodiments, parts of the impedance matching networks A, B, and C, maybe empty (short-circuited). In some embodiments, part B comprises aseries combination of an inductor and a capacitor, and part C is empty.

The full bridge topology may allow operation at higher output powerlevels using the same DC bus voltage as an equivalent half bridgeamplifier. The half bridge exemplary topology of FIG. 104 may provide asingle-ended drive signal, while the exemplary full bridge topology ofFIG. 105 may provide a differential drive to the source resonator 10408.The impedance matching topologies and components and the resonatorstructure may be different for the two systems, as discussed herein.

The exemplary systems depicted in FIGS. 104 and 105 may further includefault detection circuitry 10440 that may be used to trigger the shutdownof the microcontroller in the source amplifier or to change or interruptthe operation of the amplifier. This protection circuitry may comprise ahigh speed comparator or comparators to monitor the amplifier returncurrent, the amplifier bus voltage (Vbus) from the DC supply 10404, thevoltage across the source resonator 10408 and/or the optional tuningboard, or any other voltage or current signals that may cause damage tocomponents in the system or may yield undesirable operating conditions.Preferred embodiments may depend on the potentially undesirableoperating modes associated with different applications. In someembodiments, protection circuitry may not be implemented or circuits maynot be populated. In some embodiments, system and component protectionmay be implemented as part of a master control algorithm and othersystem monitoring and control circuits. In embodiments, dedicated faultcircuitry 10440 may include an output (not shown) coupled to a mastercontrol algorithm 10428 that may trigger a system shutdown, a reductionof the output power (e.g. reduction of Vbus), a change to the PWMgenerator, a change in the operating frequency, a change to a tuningelement, or any other reasonable action that may be implemented by thecontrol algorithm 10428 to adjust the operating point mode, improvesystem performance, and/or provide protection.

As described herein, sources in wireless power transfer systems may usea measurement of the input impedance of the impedance matching network10442 driving source resonator coil 10444 as an error or control signalfor a system control loop that may be part of the master controlalgorithm. In exemplary embodiments, variations in any combination ofthree parameters may be used to tune the wireless power source tocompensate for changes in environmental conditions, for changes incoupling, for changes in device power demand, for changes in module,circuit, component or subsystem performance, for an increase or decreasein the number or sources, devices, or repeaters in the system, for userinitiated changes, and the like. In exemplary embodiments, changes tothe amplifier duty cycle, to the component values of the variableelectrical components such as variable capacitors and inductors, and tothe DC bus voltage may be used to change the operating point oroperating range of the wireless source and improve some system operatingvalue. The specifics of the control algorithms employed for differentapplications may vary depending on the desired system performance andbehavior.

Impedance measurement circuitry such as described herein, and shown inFIGS. 104 and 105, may be implemented using two-channel simultaneoussampling ADCs and these ADCs may be integrated into a microcontrollerchip or may be part of a separate circuit. Simultaneously sampling ofthe voltage and current signals at the input to a source resonator'simpedance matching network and/or the source resonator, may yield thephase and magnitude information of the current and voltage signals andmay be processed using known signal processing techniques to yieldcomplex impedance parameters. In some embodiments, monitoring only thevoltage signals or only the current signals may be sufficient.

The impedance measurements described herein may use direct samplingmethods which may be relatively simpler than some other known samplingmethods. In embodiments, measured voltage and current signals may beconditioned, filtered and scaled by filtering/buffering circuitry beforebeing input to ADCs. In embodiments, the filter/buffering circuitry maybe adjustable to work at a variety of signal levels and frequencies, andcircuit parameters such as filter shapes and widths may be adjustedmanually, electronically, automatically, in response to a controlsignal, by the master control algorithm, and the like. Exemplaryembodiments of filter/buffering circuits are shown in FIGS. 104, 105,and 106.

FIG. 106 shows more detailed views of exemplary circuit components thatmay be used in filter/buffering circuitry. In embodiments, and dependingon the types of ADCs used in the system designs, single-ended amplifiertopologies may reduce the complexity of the analog signal measurementpaths used to characterize system, subsystem, module and/or componentperformance by eliminating the need for hardware to convert fromdifferential to single-ended signal formats. In other implementations,differential signal formats may be preferable. The implementations shownin FIG. 106 are exemplary, and should not be construed to be the onlypossible way to implement the functionality described herein. Rather itshould be understood that the analog signal path may employ componentswith different input requirements and hence may have different signalpath architectures.

In both the single ended and differential amplifier topologies, theinput current to the impedance matching networks 10442 driving theresonator coils 10444 may be obtained by measuring the voltage across acapacitor 10424, or via a current sensor of some type. For the exemplarysingle-ended amplifier topology in FIG. 104, the current may be sensedon the ground return path from the impedance matching network 10442. Forthe exemplary differential power amplifier depicted in FIG. 105, theinput current to the impedance matching networks 10442 driving theresonator coils 10444 may be measured using a differential amplifieracross the terminals of a capacitor 10424 or via a current sensor ofsome type. In the differential topology of FIG. 105, the capacitor 10424may be duplicated at the negative output terminal of the source poweramplifier.

In both topologies, after single ended signals representing the inputvoltage and current to the source resonator and impedance matchingnetwork are obtained, the signals may be filtered 10602 to obtain thedesired portions of the signal waveforms. In embodiments, the signalsmay be filtered to obtain the fundamental component of the signals. Inembodiments, the type of filtering performed, such as low pass,bandpass, notch, and the like, as well as the filter topology used, suchas elliptical, Chebyshev, Butterworth, and the like, may depend on thespecific requirements of the system. In some embodiments, no filteringwill be required.

The voltage and current signals may be amplified by an optionalamplifier 10604. The gain of the optional amplifier 10604 may be fixedor variable. The gain of the amplifier may be controlled manually,electronically, automatically, in response to a control signal, and thelike. The gain of the amplifier may be adjusted in a feedback loop, inresponse to a control algorithm, by the master control algorithm, andthe like. In embodiments, required performance specifications for theamplifier may depend on signal strength and desired measurementaccuracy, and may be different for different application scenarios andcontrol algorithms.

The measured analog signals may have a DC offset added to them, 10606,which may be required to bring the signals into the input voltage rangeof the ADC which for some systems may be 0 to 3.3V. In some systems thisstage may not be required, depending on the specifications of theparticular ADC used.

As described above, the efficiency of power transmission between a powergenerator and a power load may be impacted by how closely matched theoutput impedance of the generator is to the input impedance of the load.In an exemplary system as shown in FIG. 107( a), power may be deliveredto the load at a maximum possible efficiency, when the input impedanceof the load 10704 is equal to the complex conjugate of the internalimpedance of the power generator or the power amplifier 10702. Designingthe generator or load impedance to obtain a high and/or maximum powertransmission efficiency may be called “impedance matching”. Impedancematching may be performed by inserting appropriate networks or sets ofelements such as capacitors, resistors, inductors, transformers,switches and the like, to form an impedance matching network 10706,between a power generator 10702 and a power load 10704 as shown in FIG.107( b). In other embodiments, mechanical adjustments and changes inelement positioning may be used to achieve impedance matching. Asdescribed above for varying loads, the impedance matching network 10706may include variable components that are dynamically adjusted to ensurethat the impedance at the generator terminals looking towards the loadand the characteristic impedance of the generator remain substantiallycomplex conjugates of each other, even in dynamic environments andoperating scenarios. In embodiments, dynamic impedance matching may beaccomplished by tuning the duty cycle, and/or the phase, and/or thefrequency of the driving signal of the power generator or by tuning aphysical component within the power generator, such as a capacitor, asdepicted in FIG. 107( c). Such a tuning mechanism may be advantageousbecause it may allow impedance matching between a power generator 10708and a load without the use of a tunable impedance matching network, orwith a simplified tunable impedance matching network 10706, such as onethat has fewer tunable components for example. In embodiments, tuningthe duty cycle, and/or frequency, and/or phase of the driving signal toa power generator may yield a dynamic impedance matching system with anextended tuning range or precision, with higher power, voltage and/orcurrent capabilities, with faster electronic control, with fewerexternal components, and the like. The impedance matching methods,architectures, algorithms, protocols, circuits, measurements, controls,and the like, described below, may be useful in systems where powergenerators drive high-Q magnetic resonators and in high-Q wireless powertransmission systems as described herein. In wireless power transfersystems a power generator may be a power amplifier driving a resonator,sometimes referred to as a source resonator, which may be a load to thepower amplifier. In wireless power applications, it may be preferable tocontrol the impedance matching between a power amplifier and a resonatorload to control the efficiency of the power delivery from the poweramplifier to the resonator. The impedance matching may be accomplished,or accomplished in part, by tuning or adjusting the duty cycle, and/orthe phase, and/or the frequency of the driving signal of the poweramplifier that drives the resonator.

Efficiency of Switching Amplifiers

Switching amplifiers, such as class D, E, F amplifiers, and the like orany combinations thereof, deliver power to a load at a maximumefficiency when no power is dissipated on the switching elements of theamplifier. This operating condition may be accomplished by designing thesystem so that the switching operations which are most critical (namelythose that are most likely to lead to switching losses) are done whenboth the voltage across the switching element and the current throughthe switching element are zero. These conditions may be referred to asZero Voltage Switching (ZVS) and Zero Current Switching (ZCS) conditionsrespectively. When an amplifier operates at ZVS and ZCS either thevoltage across the switching element or the current through theswitching element is zero and thus no power can be dissipated in theswitch. Since a switching amplifier may convert DC (or very lowfrequency AC) power to AC power at a specific frequency or range offrequencies, a filter may be introduced before the load to preventunwanted harmonics that may be generated by the switching process fromreaching the load and being dissipated there. In embodiments, aswitching amplifier may be designed to operate at maximum efficiency ofpower conversion, when connected to a resonant load, with a nontrivialquality factor (say Q>5), and of a specific impedanceZ_(o)*=R_(o)+jX_(o), which leads to simultaneous ZVS and ZCS. We defineZ_(o)=R_(o)−jX_(o) as the characteristic impedance of the amplifier, sothat achieving maximum power transmission efficiency is equivalent toimpedance matching the resonant load to the characteristic impedance ofthe amplifier.

In a switching amplifier, the switching frequency of the switchingelements, f_(switch), wherein f_(switch)=ω/2π and the duty cycle, dc, ofthe ON switch-state duration of the switching elements may be the samefor all switching elements of the amplifier. In this specification, wewill use the term “class D” to denote both class D and class DEamplifiers, that is, switching amplifiers with dc<=50%.

The value of the characteristic impedance of the amplifier may depend onthe operating frequency, the amplifier topology, and the switchingsequence of the switching elements. In some embodiments, the switchingamplifier may be a half-bridge topology and, in some embodiments, afull-bridge topology. In some embodiments, the switching amplifier maybe class D and, in some embodiments, class E. In any of the aboveembodiments, assuming the elements of the bridge are symmetric, thecharacteristic impedance of the switching amplifier has the formR _(o) =F _(R)(dc)/ωC _(a) ,X _(o) =F _(X)(dc)/ωC _(a),  (1)where dc is the duty cycle of ON switch-state of the switching elements,the functions F_(R)(dc) and F_(X)(dc) are plotted in FIG. 108 (both forclass D and E), ω is the frequency at which the switching elements areswitched, and C_(a)=n_(a)C_(switch) where C_(switch) is the capacitanceacross each switch, including both the transistor output capacitance andalso possible external capacitors placed in parallel with the switch,while n_(a)=1 for a full bridge and n_(a)=2 for a half bridge. For classD, one can also write the analytical expressionsF _(R)(dc)=sin² u/π,F _(R)(dc)=(u−sin u*cos u)/π,  (2)where u=π(1−2*dc), indicating that the characteristic impedance level ofa class D amplifier decreases as the duty cycle, dc, increases towards50%. For a class D amplifier operation with dc=50%, achieving ZVS andZCS is possible only when the switching elements have practically nooutput capacitance (C_(a)=0) and the load is exactly on resonance(X_(o)=0), while R_(o) can be arbitrary.

Impedance Matching Networks

In applications, the driven load may have impedance that is verydifferent from the characteristic impedance of the external drivingcircuit, to which it is connected. Furthermore, the driven load may notbe a resonant network. An Impedance Matching Network (IMN) is a circuitnetwork that may be connected before a load as in FIG. 107( b), in orderto regulate the impedance that is seen at the input of the networkconsisting of the IMN circuit and the load. An IMN circuit may typicallyachieve this regulation by creating a resonance close to the drivingfrequency. Since such an IMN circuit accomplishes all conditions neededto maximize the power transmission efficiency from the generator to theload (resonance and impedance matching—ZVS and ZCS for a switchingamplifier), in embodiments, an IMN circuit may be used between thedriving circuit and the load.

For an arrangement shown in FIG. 107( b), let the input impedance of thenetwork consisting of the Impedance Matching Network (IMN) circuit andthe load (denoted together from now on as IMN+load) beZ_(l)=R_(l)(ω)+jX_(l)(ω). The impedance matching conditions of thisnetwork to the external circuit with characteristic impedanceZ_(o)=R_(o)−jωX, are then R_(l)(ω)=R_(o), X_(l)(ω)=X_(o).

Methods for Tunable Impedance Matching of a Variable Load

In embodiments where the load may be variable, impedance matchingbetween the load and the external driving circuit, such as a linear orswitching power amplifier, may be achieved by using adjustable/tunablecomponents in the IMN circuit that may be adjusted to match the varyingload to the fixed characteristic impedance Z_(o) of the external circuit(FIG. 107(b)). To match both the real and imaginary parts of theimpedance two tunable/variable elements in the IMN circuit may beneeded.

In embodiments, the load may be inductive (such as a resonator coil)with impedance R+jωL, so the two tunable elements in the IMN circuit maybe two tunable capacitance networks or one tunable capacitance networkand one tunable inductance network or one tunable capacitance networkand one tunable mutual inductance network.

In embodiments where the load may be variable, the impedance matchingbetween the load and the driving circuit, such as a linear or switchingpower amplifier, may be achieved by using adjustable/tunable componentsor parameters in the amplifier circuit that may be adjusted to match thecharacteristic impedance Z_(o) of the amplifier to the varying (due toload variations) input impedance of the network consisting of the IMNcircuit and the load (IMN+load), where the IMN circuit may also betunable (FIG. 107( c)). To match both the real and imaginary parts ofthe impedance, a total of two tunable/variable elements or parameters inthe amplifier and the IMN circuit may be needed. The disclosed impedancematching method can reduce the required number of tunable/variableelements in the IMN circuit or even completely eliminate the requirementfor tunable/variable elements in the IMN circuit. In some examples, onetunable element in the power amplifier and one tunable element in theIMN circuit may be used. In some examples, two tunable elements in thepower amplifier and no tunable element in the IMN circuit may be used.

In embodiments, the tunable elements or parameters in the poweramplifier may be the frequency, amplitude, phase, waveform, duty cycleand the like of the drive signals applied to transistors, switches,diodes and the like.

In embodiments, the power amplifier with tunable characteristicimpedance may be a tunable switching amplifier of class D, E, F or anycombinations thereof. Combining Equations (1) and (2), the impedancematching conditions for this network areR _(l)(ω))=F _(R)(dc)/ωC _(a) ,X _(l)(ω)=F _(X)(dc)/ωC _(a)  (3).

In some examples of a tunable switching amplifier, one tunable elementmay be the capacitance C_(a), which may be tuned by tuning the externalcapacitors placed in parallel with the switching elements.

In some examples of a tunable switching amplifier, one tunable elementmay be the duty cycle dc of the ON switch-state of the switchingelements of the amplifier. Adjusting the duty cycle, dc, via Pulse WidthModulation (PWM) has been used in switching amplifiers to achieve outputpower control. In this specification, we disclose that PWM may also beused to achieve impedance matching, namely to satisfy Eqs. (3), and thusmaximize the amplifier efficiency.

In some examples of a tunable switching amplifier one tunable elementmay be the switching frequency, which is also the driving frequency ofthe IMN+load network and may be designed to be substantially close tothe resonant frequency of the IMN+load network. Tuning the switchingfrequency may change the characteristic impedance of the amplifier andthe impedance of the IMN+load network. The switching frequency of theamplifier may be tuned appropriately together with one more tunableparameters, so that Eqs. (3) are satisfied.

A benefit of tuning the duty cycle and/or the driving frequency of theamplifier for dynamic impedance matching is that these parameters can betuned electronically, quickly, and over a broad range. In contrast, forexample, a tunable capacitor that can sustain a large voltage and has alarge enough tunable range and quality factor may be expensive, slow orunavailable for with the necessary component specifications

Examples of Methods for Tunable Impedance Matching of a Variable Load

A simplified circuit diagram showing the circuit level structure of aclass D power amplifier 10902, impedance matching network 10904 and aninductive load 10906 is shown in FIG. 109. The diagram shows the basiccomponents of the system with the switching amplifier 10904 comprising apower source 10910, switching elements 10908, and capacitors. Theimpedance matching network 10904 comprising inductors and capacitors,and the load 10906 modeled as an inductor and a resistor.

An exemplary embodiment of this inventive tuning scheme comprises ahalf-bridge class-D amplifier operating at switching frequency f anddriving a low-loss inductive element R+jωL via an IMN, as shown in FIG.109.

In some embodiments L′ may be tunable. L′ may be tuned by a variabletapping point on the inductor or by connecting a tunable capacitor inseries or in parallel to the inductor. In some embodiments C_(a) may betunable. For the half bridge topology, C_(a) may be tuned by varyingeither one or both capacitors C_(switch), as only the parallel sum ofthese capacitors matters for the amplifier operation. For the fullbridge topology, C_(a) may be tuned by varying either one, two, three orall capacitors C_(switch), as only their combination (series sum of thetwo parallel sums associated with the two halves of the bridge) mattersfor the amplifier operation.

In some embodiments of tunable impedance matching, two of the componentsof the IMN may be tunable. In some embodiments, L′ and C₂ may be tuned.Then, FIG. 110 shows the values of the two tunable components needed toachieve impedance matching as functions of the varying R and L of theinductive element, and the associated variation of the output power (atgiven DC bus voltage) of the amplifier, for f=250 kHz, dc=40%, C_(a)=640pF and C₁=10 nF. Since the IMN always adjusts to the fixedcharacteristic impedance of the amplifier, the output power is alwaysconstant as the inductive element is varying.

In some embodiments of tunable impedance matching, elements in theswitching amplifier may also be tunable. In some embodiments thecapacitance C_(a) along with the IMN capacitor C₂ may be tuned. Then,FIG. 111 shows the values of the two tunable components needed toachieve impedance matching as functions of the varying R and L of theinductive element, and the associated variation of the output power (atgiven DC bus voltage) of the amplifier for f=250 kHz, dc=40%, C₁=10 nFand ωL′=1000Ω. It can be inferred from FIG. 111 that C₂ needs to betuned mainly in response to variations in L and that the output powerdecreases as R increases.

In some embodiments of tunable impedance matching, the duty cycle dcalong with the IMN capacitor C₂ may be tuned. Then, FIG. 112 shows thevalues of the two tunable parameters needed to achieve impedancematching as functions of the varying R and L of the inductive element,and the associated variation of the output power (at given DC busvoltage) of the amplifier for f=250 kHz, C_(a)=640 pF, C₁=10 nF andωL′=1000Ω. It can be inferred from FIG. 112 that C₂ needs to be tunedmainly in response to variations in L and that the output powerdecreases as R increases.

In some embodiments of tunable impedance matching, the capacitance C_(a)along with the IMN inductor L′ may be tuned. Then, FIG. 112( a) showsthe values of the two tunable components needed to achieve impedancematching as functions of the varying R of the inductive element, and theassociated variation of the output power (at given DC bus voltage) ofthe amplifier for f=250 kHz, dc=40%, C₁=10 nF and C₂=7.5 nF. It can beinferred from FIG. 112( a) that the output power decreases as Rincreases.

In some embodiments of tunable impedance matching, the duty cycle dcalong with the IMN inductor L′ may be tuned. Then, FIG. 112( b) showsthe values of the two tunable parameters needed to achieve impedancematching as functions of the varying R of the inductive element, and theassociated variation of the output power (at given DC bus voltage) ofthe amplifier for f=250 kHz, C_(a)=640 pF, C₁=10 nF and C₂=7.5 nF asfunctions of the varying R of the inductive element. It can be inferredfrom FIG. 112( b) that the output power decreases as R increases.

In some embodiments of tunable impedance matching, only elements in theswitching amplifier may be tunable with no tunable elements in the IMN.In some embodiments the duty cycle dc along with the capacitance C_(a)may be tuned. Then, FIG. 112( c), shows the values of the two tunableparameters needed to achieve impedance matching as functions of thevarying R of the inductive element, and the associated variation of theoutput power (at given DC bus voltage) of the amplifier for f=250 kHz,C₁=10 nF, C₂=7.5 nF and ωL′=1000Ω. It can be inferred from FIG. 112( c)that the output power is a non-monotonic function of R. Theseembodiments may be able to achieve dynamic impedance matching whenvariations in L (and thus the resonant frequency) are modest.

In some embodiments, dynamic impedance matching with fixed elementsinside the IMN, also when L is varying greatly as explained earlier, maybe achieved by varying the driving frequency of the external frequency f(e.g. the switching frequency of a switching amplifier) so that itfollows the varying resonant frequency of the resonator. Using theswitching frequency f and the switch duty cycle dc as the two variableparameters, full impedance matching can be achieved as R and L arevarying without the need of any variable components. Then, FIG. 113shows the values of the two tunable parameters needed to achieveimpedance matching as functions of the varying R and L of the inductiveelement, and the associated variation of the output power (at given DCbus voltage) of the amplifier for C_(a)=640 pF, C₁=10 nF, C₂=7.5 nF andL′=637 μH. It can be inferred from FIG. 113 that the frequency f needsto be tuned mainly in response to variations in L, as explained earlier.

Tunable Impedance Matching for Systems of Wireless Power Transmission

In applications of wireless power transfer the low-loss inductiveelement may be the coil of a source resonator coupled to one or moredevice resonators or other resonators, such as repeater resonators, forexample. The impedance of the inductive element R+jωL may include thereflected impedances of the other resonators on the coil of the sourceresonator. Variations of R and L of the inductive element may occur dueto external perturbations in the vicinity of the source resonator and/orthe other resonators or thermal drift of components. Variations of R andL of the inductive element may also occur during normal use of thewireless power transmission system due to relative motion of the devicesand other resonators with respect to the source. The relative motion ofthese devices and other resonators with respect to the source, orrelative motion or position of other sources, may lead to varyingcoupling (and thus varying reflected impedances) of the devices to thesource. Furthermore, variations of R and L of the inductive element mayalso occur during normal use of the wireless power transmission systemdue to changes within the other coupled resonators, such as changes inthe power draw of their loads. All the methods and embodiments disclosedso far apply also to this case in order to achieve dynamic impedancematching of this inductive element to the external circuit driving it.

To demonstrate the presently disclosed dynamic impedance matchingmethods for a wireless power transmission system, consider a sourceresonator including a low-loss source coil, which is inductively coupledto the device coil of a device resonator driving a resistive load.

In some embodiments, dynamic impedance matching may be achieved at thesource circuit. In some embodiments, dynamic impedance matching may alsobe achieved at the device circuit. When full impedance matching isobtained (both at the source and the device), the effective resistanceof the source inductive element (namely the resistance of the sourcecoil R_(s) plus the reflected impedance from the device) isR=R_(s)√{square root over (1+U_(sd) ²)}. (Similarly the effectiveresistance of the device inductive element is R_(d)√{square root over(1+U_(sd) ²)}, where R_(d) is the resistance of the device coil.)Dynamic variation of the mutual inductance between the coils due tomotion results in a dynamic variation of U_(sd)=ωM_(sd)/√{square rootover (R_(s)R_(d))}. Therefore, when both source and device aredynamically tuned, the variation of mutual inductance is seen from thesource circuit side as a variation in the source inductive elementresistance R. Note that in this type of variation, the resonantfrequencies of the resonators may not change substantially, since L maynot be changing. Therefore, all the methods and examples presented fordynamic impedance matching may be used for the source circuit of thewireless power transmission system.

Note that, since the resistance R represents both the source coil andthe reflected impedances of the device coils to the source coil, inFIGS. 110-113, as R increases due to the increasing U, the associatedwireless power transmission efficiency increases. In some embodiments,an approximately constant power may be required at the load driven bythe device circuitry. To achieve a constant level of power transmittedto the device, the required output power of the source circuit may needto decrease as U increases. If dynamic impedance matching is achievedvia tuning some of the amplifier parameters, the output power of theamplifier may vary accordingly. In some embodiments, the automaticvariation of the output power is preferred to be monotonicallydecreasing with R, so that it matches the constant device powerrequirement. In embodiments where the output power level is accomplishedby adjusting the DC driving voltage of the power generator, using animpedance matching set of tunable parameters which leads tomonotonically decreasing output power vs. R will imply that constantpower can be kept at the power load in the device with only a moderateadjustment of the DC driving voltage. In embodiments, where the “knob”to adjust the output power level is the duty cycle dc or the phase of aswitching amplifier or a component inside an Impedance Matching Network,using an impedance matching set of tunable parameters which leads tomonotonically decreasing output power vs. R will imply that constantpower can be kept at the power load in the device with only a moderateadjustment of this power “knob”.

In the examples of FIGS. 110-113, if R_(s)=0.19Ω, then the rangeR=0.2-2Ω corresponds approximately to U_(sd)=0.3-10.5. For these values,in FIG. 115, we show with dashed lines the output power (normalized toDC voltage squared) required to keep a constant power level at the load,when both source and device are dynamically impedance matched. Thesimilar trend between the solid and dashed lines explains why a set oftunable parameters with such a variation of output power may bepreferable.

In some embodiments, dynamic impedance matching may be achieved at thesource circuit, but impedance matching may not be achieved or may onlypartially be achieved at the device circuit. As the mutual inductancebetween the source and device coils varies, the varying reflectedimpedance of the device to the source may result in a variation of boththe effective resistance R and the effective inductance L of the sourceinductive element. The methods presented so far for dynamic impedancematching are applicable and can be used for the tunable source circuitof the wireless power transmission system.

As an example, consider the circuit of FIG. 115, where f=250 kHz,C_(a)=640 pF, R_(s)=0.19Ω, L_(s)=100 μH, C_(1s)=10 nF, ωL_(s)′=1000Ω,R_(d)=0.3Ω, L_(d)=40 μH, C_(1d)=87.5 nF, C_(2d)=13 nF, ωL_(d)′=400Ω andZ₁=50Ω, where s and d denote the source and device resonatorsrespectively and the system is matched at U_(sd)=3. Tuning the dutycycle dc of the switching amplifier and the capacitor C_(2s) may be usedto dynamically impedance match the source, as the non-tunable device ismoving relatively to the source changing the mutual inductance M betweenthe source and the device. In FIG. 115, we show the required values ofthe tunable parameters along with the output power per DC voltage of theamplifier. The dashed line again indicates the output power of theamplifier that would be needed so that the power at the load is aconstant value.

In some embodiments, tuning the driving frequency f of the sourcedriving circuit may still be used to achieve dynamic impedance matchingat the source for a system of wireless power transmission between thesource and one or more devices. As explained earlier, this methodenables full dynamic impedance matching of the source, even when thereare variations in the source inductance L_(s) and thus the sourceresonant frequency. For efficient power transmission from the source tothe devices, the device resonant frequencies must be tuned to follow thevariations of the matched driving and source-resonant frequencies.Tuning a device capacitance (for example, in the embodiment of FIG. 114C_(1d) or C_(2d)) may be necessary, when there are variations in theresonant frequency of either the source or the device resonators. Infact, in a wireless power transfer system with multiple sources anddevices, tuning the driving frequency alleviates the need to tune onlyone source-object resonant frequency, however, all the rest of theobjects may need a mechanism (such as a tunable capacitance) to tunetheir resonant frequencies to match the driving frequency.

Resonator Thermal Management

In wireless energy transfer systems, some portion of the energy lostduring the wireless transfer process is dissipated as heat. Energy maybe dissipated in the resonator components themselves. For example, evenhigh-Q conductors and components have some loss or resistance, and theseconductors and components may heat up when electric currents and/orelectromagnetic fields flow through them. Energy may be dissipated inmaterials and objects around a resonator. For example, eddy currentsdissipated in imperfect conductors or dielectrics surrounding or near-bythe resonator may heat up those objects. In addition to affecting thematerial properties of those objects, this heat may be transferredthrough conductive, radiative, or convective processes to the resonatorcomponents. Any of these heating effects may affect the resonator Q,impedance, frequency, etc., and therefore the performance of thewireless energy transfer system.

In a resonator comprising a block or core of magnetic material, heat maybe generated in the magnetic material due to hysteresis losses and toresistive losses resulting from induced eddy currents. Both effectsdepend on the magnetic flux density in the material, and both can createsignificant amounts of heat, especially in regions where the fluxdensity or eddy currents may be concentrated or localized. In additionto the flux density, the frequency of the oscillating magnetic field,the magnetic material composition and losses, and the ambient oroperating temperature of the magnetic material may all impact howhysteresis and resistive losses heat the material.

In embodiments, the properties of the magnetic material such as the typeof material, the dimensions of the block, and the like, and the magneticfield parameters may be chosen for specific operating power levels andenvironments to minimize heating of the magnetic material. In someembodiments, changes, cracks, or imperfections in a block of magneticmaterial may increase the losses and heating of the magnetic material inwireless power transmission applications.

For magnetic blocks with imperfections, or that are comprised of smallersize tiles or pieces of magnetic material arranged into a larger unit,the losses in the block may be uneven and may be concentrated in regionswhere there are inhomogeneities or relatively narrow gaps betweenadjacent tiles or pieces of magnetic material. For example, if anirregular gap exists in a magnetic block of material, then the effectivereluctance of various magnetic flux paths through the material may besubstantially irregular and the magnetic field may be more concentratedin portions of the block where the magnetic reluctance is lowest. Insome cases, the effective reluctance may be lowest where the gap betweentiles or pieces is narrowest or where the density of imperfections islowest. Because the magnetic material guides the magnetic field, themagnetic flux density may not be substantially uniform across the block,but may be concentrated in regions offering relatively lower reluctance.Irregular concentrations of the magnetic field within a block ofmagnetic material may not be desirable because they may result in unevenlosses and heat dissipation in the material.

For example, consider a magnetic resonator comprising a conductor 11606wrapped around a block of magnetic material composed of two individualtiles 11602, 11604 of magnetic material joined such that they form aseam 11608 that is perpendicular to the axis of the conductor 11606loops as depicted in FIG. 116. An irregular gap in the seam 11608between the tiles of magnetic material 11602, 11604 may force themagnetic field 11612 (represented schematically by the dashed magneticfield lines) in the resonator to concentrate in a sub region 11610 ofthe cross section of the magnetic material. Since the magnetic fieldwill follow the path of least reluctance, a path including an air gapbetween two pieces of magnetic material may create an effectively higherreluctance path than one that traverses the width of the magneticmaterial at a point where the pieces of magnetic materials touch or havea smaller air gap. The magnetic flux density may thereforepreferentially flow through a relatively small cross area of themagnetic material resulting in a high concentration of magnetic flux inthat small area 11610.

In many magnetic materials of interest, more inhomogeneous flux densitydistributions lead to higher overall losses. Moreover, the moreinhomogeneous flux distribution may result in material saturation andcause localized heating of the area in which the magnetic flux isconcentrated. The localized heating may alter the properties of themagnetic material, in some cases exacerbating the losses. For example,in the relevant regimes of operation of some materials, hysteresis andresistive losses increase with temperature. If heating the materialincreases material losses, resulting in more heating, the temperature ofthe material may continue to increase and even runaway if no correctiveaction is taken. In some instances, the temperature may reach 100 C ormore and may degrade the properties of the magnetic material and theperformance of wireless power transfer. In some instances, the magneticmaterials may be damaged, or the surrounding electronic components,packaging and/or enclosures may be damaged by the excessive heat.

In embodiments, variations or irregularities between tiles or pieces ofthe block of magnetic material may be minimized by machining, polishing,grinding, and the like, the edges of the tiles or pieces to ensure atight fit between tiles of magnetic materials providing a substantiallymore uniform reluctance through the whole cross section of the block ofmagnetic material. In embodiments, a block of magnetic material mayrequire a means for providing a compression force between the tiles toensure the tiles are pressed tight together without gaps. Inembodiments, an adhesive may be used between the tiles to ensure theyremain in tight contact.

In embodiments the irregular spacing of adjacent tiles of magneticmaterial may be reduced by adding a deliberate gap between adjacenttiles of magnetic material. In embodiments a deliberate gap may be usedas a spacer to ensure even or regular separations between magneticmaterial tiles or pieces. Deliberate gaps of flexible materials may alsoreduce irregularities in the spacings due to tile movement orvibrations. In embodiments, the edges of adjacent tiles of magneticmaterial may be taped, dipped, coated, and the like with an electricalinsulator, to prevent eddy currents from flowing through reducedcross-sectional areas of the block, thus lowering the eddy currentlosses in the material. In embodiments a separator may be integratedinto the resonator packaging. The spacer may provide a spacing of 1 mmor less.

In embodiments, the mechanical properties of the spacer between tilesmay be chosen so as to improve the tolerance of the overall structure tomechanical effects such as changes in the dimensions and/or shape of thetiles due to intrinsic effects (e.g, magnetostriction, thermalexpansion, and the like) as well as external shocks and vibrations. Forexample, the spacer may have a desired amount of mechanical give toaccommodate the expansion and/or contraction of individual tiles, andmay help reduce the stress on the tiles when they are subjected tomechanical vibrations, thus helping to reduce the appearance of cracksand other defects in the magnetic material.

In embodiments, it may be preferable to arrange the individual tilesthat comprise the block of magnetic material to minimize the number ofseams or gaps between tiles that are perpendicular to the dipole momentof the resonator. In embodiments it may be preferable to arrange andorient the tiles of magnetic material to minimize the gaps between tilesthat are perpendicular to the axis formed by the loops of a conductorcomprising the resonator.

For example, consider the resonator structure depicted in FIG. 117. Theresonator comprises a conductor 11704 wrapped around a block of magneticmaterial comprising six separate individual tiles 11702 arranged in athree by two array. The arrangement of tiles results in two tile seams11706, 11708 when traversing the block of magnetic material in onedirection, and only one tile seam 11710 when traversing the block ofmagnetic material in the orthogonal direction. In embodiments, it may bepreferable to wrap the conductor wire 11704 around the block of magneticmaterial such that the dipole moment of the resonator is perpendicularto the fewest number of tile seams. The inventors have observed thatthere is relatively less heating induced around seams and gaps 11706,11708 that are parallel to the dipole moment of the resonator. Seams andgaps that run perpendicular to the dipole moment of the resonator mayalso be referred to as critical seams or critical seam areas. It maystill be desirable, however, to electrically insulate gaps that runparallel to the dipole moment of the resonator (such as 11706 and 11708)so as to reduce eddy current losses. Uneven contact between tilesseparated by such parallel gaps may cause eddy currents to flow throughnarrow contact points, leading to large losses at such points.

In embodiments, irregularities in spacing may be tolerated with adequatecooling of the critical seam areas to prevent the localized degradationof material properties when the magnetic material heats up. Maintainingthe temperature of the magnetic material below a critical temperaturemay prevent a runaway effect caused by a sufficiently high temperature.With proper cooling of the critical seam area, the wireless energytransfer performance may be satisfactory despite the additional loss andheating effects due to irregular spacing, cracks, or gaps between tiles.

Effective heatsinking of the resonator structure to prevent excessivelocalized heating of the magnetic material poses several challenges.Metallic materials that are typically used for heatsinks and thermalconduction can interact with the magnetic fields used for wirelessenergy transfer by the resonators and affect the performance of thesystem. Their location, size, orientation, and use should be designed soas to not excessively lower the perturbed Q of the resonators in thepresence of these heatsinking materials. In addition, owing to therelatively poor thermal conductivity of magnetic materials such asferrites, a relatively large contact area between the heatsink and themagnetic material may be required to provide adequate cooling which mayrequire placement of substantial amount of lossy materials close to themagnetic resonator.

In embodiments, adequate cooling of the resonator may be achieved withminimal effect on the wireless energy transfer performance withstrategic placement of thermally conductive materials. In embodiments,strips of thermally conductive material may be placed in between loopsof conductor wire and in thermal contact with the block of magneticmaterial.

One exemplary embodiment of a resonator with strips of thermallyconductive material is depicted in FIG. 118. FIG. 118( a) shows theresonator structure without the conducting strips and with the block ofmagnetic material comprising smaller tiles of magnetic material forminggaps or seams. Strips of thermally conductive 11808 material may beplaced in between the loops of the conductor 11802 and in thermalcontact with the block of magnetic material 11804 as depicted in FIGS.118( b) and 118(c). To minimize the effects of the strips on theparameters of the resonator, in some embodiments it may be preferable toarrange the strips parallel to the loops of conductor or perpendicularto the dipole moment of the resonator. The strips of conductor may beplaced to cover as much or as many of the seams or gaps between thetiles as possible especially the seams between tiles that areperpendicular to the dipole moment of the resonator.

In embodiments the thermally conductive material may comprise copper,aluminum, brass, thermal epoxy, paste, pads, and the like, and may beany material that has a thermal conductivity that is at least that ofthe magnetic material in the resonator (˜5 W/(K-m) for some commercialferrite materials). In embodiments where the thermally conductivematerial is also electrically conducting, the material may require alayer or coating of an electrical insulator to prevent shorting anddirect electrical contact with the magnetic material or the loops ofconductor of the resonator.

In embodiments the strips of thermally conductive material may be usedto conduct heat from the resonator structure to a structure or mediumthat can safely dissipate the thermal energy. In embodiments thethermally conductive strips may be connected to a heat sink such as alarge plate located above the strips of conductor that can dissipate thethermal energy using passive or forced convection, radiation, orconduction to the environment. In embodiments the system may include anynumber of active cooling systems that may be external or internal to theresonator structure that can dissipate the thermal energy from thethermally conducting strips and may include liquid cooling systems,forced air systems, and the like. For example, the thermally conductingstrips may be hollow or comprise channels for coolant that may be pumpedor forced through to cool the magnetic material. In embodiments, a fielddeflector made of a good electrical conductor (such as copper, silver,aluminum, and the like) may double as part of the heatsinking apparatus.The addition of thermally and electrically conducting strips to thespace between the magnetic material and the field deflector may have amarginal effect on the perturbed Q, as the electromagnetic fields inthat space are typically suppressed by the presence of the fielddeflector. Such conducting strips may be thermally connected to both themagnetic material and the field deflector to make the temperaturedistribution among different strips more homogeneous.

In embodiments the thermally conducting strips are spaced to allow atleast one loop of conductor to wrap around the magnetic material. Inembodiments the strips of thermally conductive material may bepositioned only at the gaps or seams of the magnetic material. In otherembodiments, the strips may be positioned to contact the magneticmaterial at substantially throughout its complete length. In otherembodiments, the strips may be distributed to match the flux densitywithin the magnetic material. Areas of the magnetic material which undernormal operation of the resonator may have higher magnetic fluxdensities may have a higher density of contact with the thermallyconductive strips. In embodiments depicted in FIG. 118( a) for example,the highest magnetic flux density in the magnetic material may beobserved toward the center of the block of magnetic material and thelower density may be toward the ends of the block in the direction ofthe dipole moment of the resonator.

To show how the use of thermally conducting strips helps to reduce theoverall temperature in the magnetic material as well as the temperatureat potential hot spots, the inventors have performed a finite elementsimulation of a resonator structure similar to that depicted in FIG.118( c). The structure was simulated operating at a frequency of 235 kHzand comprising a block of EPCOS N95 magnetic material measuring 30 cm×30cm×5 mm excited by 10 turns of litz wire (symmetrically placed at 25 mm,40 mm, 55 mm, 90 mm and 105 mm from the plane of symmetry of thestructure) carrying 40 A of peak current each, and thermally connectedto a 50 cm×50 cm×4 mm field deflector by means of three 3×¾×1′ hollowsquare tubes (⅛″ wall thickness) of aluminum (alloy 6063) whose centralaxes are placed at −75 mm, 0 mm, and +75 from the symmetry plane of thestructure. The perturbed Q due to the field deflector and hollow tubeswas found to be 1400 (compared to 1710 for the same structure withoutthe hollow tubes). The power dissipated in the shield and tubes wascalculated to be 35.6 W, while that dissipated in the magnetic materialwas 58.3 W. Assuming the structure is cooled by air convection andradiation and an ambient temperature of 24° C., the maximum temperaturein the structure was 85° C. (at points in the magnetic materialapproximately halfway between the hollow tubes) while the temperature inparts of the magnetic material in contact with the hollow tubes wasapproximately 68° C. By comparison, the same resonator without thethermally conducting hollow tubes dissipated 62.0 W in the magneticmaterial for the same excitation current of 40 W peak and the maximumtemperature in the magnetic material was found to be 111° C.

The advantage of the conducting strips is more apparent still if weintroduce a defect in a portion of the magnetic material that is in goodthermal contact with the tubes. An air gap 10 cm long and 0.5 mm placedat the center of the magnetic material and oriented perpendicular to thedipole moment increases the power dissipated in the magnetic material to69.9 W (the additional 11.6 W relative to the previously discussedno-defect example being highly concentrated in the vicinity of the gap),but the conducting tube ensures that the maximum temperature in themagnetic material has only a relative modest increase of 11° C. to 96°C. In contrast, the same defect without the conducting tubes leads to amaximum temperature of 161° C. near the defect. Cooling solutions otherthan convection and radiation, such as thermally connecting theconducting tubes body with large thermal mass or actively cooling them,may lead to even lower operational temperatures for this resonator atthe same current level.

In embodiments thermally conductive strips of material may be positionedat areas that may have the highest probability of developing cracks thatmay cause irregular gaps in the magnetic material. Such areas may beareas of high stress or strain on the material, or areas with poorsupport or backing from the packaging of the resonator. Strategicallypositioned thermally conductive strips may ensure that as cracks orirregular gaps develop in the magnetic material, the temperature of themagnetic material will be maintained below its critical temperature. Thecritical temperature may be defined as the Curie temperature of themagnetic material, or any temperature at which the characteristics ofthe resonator have been degraded beyond the desired performanceparameters.

In embodiments the heastsinking structure may provide mechanical supportto the magnetic material. In embodiments the heatsinking structure maybe designed to have a desired amount of mechanical give (e.g., by usingepoxy, thermal pads, and the like having suitable mechanical propertiesto thermally connect different elements of the structure) so as toprovide the resonator with a greater amount of tolerance to changes inthe intrinsic dimensions of its elements (due to thermal expansion,magnetostriction, and the like) as well as external shocks andvibrations, and prevent the formation of cracks and other defects.

In embodiments where the resonator comprises orthogonal windings wrappedaround the magnetic material, the strips of conducting material may betailored to make thermal contact with the magnetic material within areasdelimited by two orthogonal sets of adjacent loops. In embodiments astrip may contain appropriate indentations to fit around the conductorof at least one orthogonal winding while making thermal contact with themagnetic material at least one point. In embodiments the magneticmaterial may be in thermal contact with a number of thermally conductingblocks placed between adjacent loops. The thermally conducting blocksmay be in turn thermally connected to one another by means of a goodthermal conductor and/or heatsinked.

Throughout this description although the term thermally conductivestrips of material was used as an exemplary specimen of a shape of amaterial it should be understood by those skilled in the art that anyshapes and contours may be substituted without departing from the spiritof the inventions. Squared, ovals, strips, dots, elongated shapes, andthe like would all be within the spirit of the present invention.

Communication in a Wireless Energy Transfer System

A wireless energy transfer system may require a verification step toensure that energy is being transferred between designated resonators.For example, in wireless energy transfer systems, source resonators,device resonators, and repeater resonators, do not require physicalcontact with each other in order to exchange energy, and theseresonators may be separated from each other by distances of centimetersor meters, depending on the size and number of resonators in the system.In some configurations, multiple resonators may be in a position togenerate or receive power, but only two or some of those resonators aredesignated resonators.

Communication of information between resonators in a wireless energytransfer system may be utilized to designate resonators. Communicationof information between resonators may be implemented using in-band orout-of-band communications or communications channels. If at least somepart of a magnetic resonator used to exchange power is also used toexchange information, and the carrier frequency of the informationexchange is close to the resonant frequency used in the power exchange,we refer to that communication as in-band. Any other type ofcommunication between magnetic resonators is referred to as out-of-band.An out-of-band communication channel may use an antenna and a signalingprotocol that is separated from the energy transfer resonator andmagnetic fields. An out-of-band communication channel may use or bebased on Bluetooth, WiFi, Zigbee, NFC technology and the like.

Communication between resonators may be used to coordinate the wirelessenergy transfer or to adjust the parameters of a wireless energytransfer system, to identify and authenticate available power sourcesand devices, to optimize efficiency, power delivery, and the like, totrack and bill energy preferences, usage, and the like, and to monitorsystem performance, battery condition, vehicle health, extraneousobjects, also referred to as foreign objects, and the like. Methods fordesignating and verifying resonators for energy transfer may bedifferent when in-band and out-of-band communication channels are usedbecause the distance over which communication signals may be exchangedusing out-of-band techniques may greatly exceed the distance over whichthe power signals may be exchanged. Also, the bandwidth of out-of-bandcommunication signals may be larger than in-band communication signals.This difference in communication range and capability may affect thecoordination of the wireless energy transfer system. For example, thenumber of resonators that may be addressed using out-of-bandcommunication may be very large and communicating resonators may befarther apart than the distance over which they may efficiently exchangeenergy.

In some embodiments all of the signaling and communication may beperformed using an in-band communication channel and the signals may bemodulated on the fields used for energy transfer. In other embodiments,in-band communication may use substantially the same frequency spectrumas is used for energy transfer, but communication may occur while usefulamounts of energy are not being transmitted. Using only the in-bandcommunication channel may be preferable if separate or multipleverification steps are problematic, because the range of thecommunication may be limited to the same range as the power exchange orbecause the information arrives as a modulation on the power signalitself. In some embodiments however, a separate out-of-bandcommunication channel may be more desirable. For example, an out-of-bandcommunication channel may be less expensive to implement and may supporthigher data rates. An out-of-band communication channel may supportlonger distance communication, allowing resonator discovery and powersystem mapping. An out-of-band communication channel may operateregardless of whether or not power transfer is taking place and mayoccur without disruption of the power transfer.

An exemplary embodiment of a wireless energy system is shown in FIG.119. This exemplary embodiment comprises two device resonators 11902,11916 each with an out-of-band communication module 11904, 11918respectively and two source resonators 11906, 11910 each with their ownout-of-band communication modules 11908, 11912 respectively. The systemmay use the out-of-band communication channel to adjust and coordinatethe energy transfer. The communication channel may be used to discoveror find resonators in the proximity, to initiate power transfer, and tocommunicate adjustment of operating parameters such as power output,impedance, frequency, and the like of the individual resonators.

In some situations a device resonator may incorrectly communicate withone source but receive energy from another source resonator. Forexample, imagine that device 11902 sends an out-of-band communicationsignal requesting power from a source. Source 11910 may respond andbegin to supply power to device 11902. Imagine that device 11916 alsosends an out-of-band communication signal requesting power from a sourceand that source 11906 responds and begins to supply power to device11916. Because of the proximity of device 11902 to source 11906, it ispossible that device 11902 receives some or most of its power fromsource 11906. If the power level received by device 11902 becomes toohigh, device 11902 may send an out-of-band communication signal tosource 11910 to reduce the power it is transmitting to device 11902.However, device 11902 may still be receiving too much power, because itis receiving power from source 11906 but is not communicating controlsignals to that source 11906.

Therefore, the separation of the energy transfer channel and thecommunication channel may create performance, control, safety, security,reliability, and the like issues in wireless energy transfer systems. Inembodiments, it may be necessary for resonators in a wireless energytransfer system to identify/designate and verify any and all resonatorswith which it is exchanging power. As those skilled in the art willrecognize, the example shown in FIG. 119 is just one example and thereexist many configurations and arrangements of wireless powertransmission systems that may benefit from explicit or implicit energytransfer verification steps.

In embodiments, the potential performance, control, safety, security,reliability and the like, issues may be avoided by providing at leastone verification step that insures that the energy transfer channel andthe communication channel used by a pair of resonators are associatedwith the same pair of resonators.

In embodiments the verification step may comprise some additionalinformation exchange or signaling through the wireless energy transferchannel. A verification step comprising communication or informationexchange using the energy transfer channel, or fields of the energytransfer channel may be used to verify that the out-of-bandcommunication channel is exchanging information between the same tworesonators that are or will be exchanging energy.

In embodiments with an out-of-band communication channel theverification step may be implicit or explicit. In some embodimentsverification may be implicit. In embodiments an energy transfer channelmay be implicitly verified by monitoring and comparing the behavior ofthe energy transfer channel to expected behavior or parameters inresponse to the out-of-band information exchange. For example, afterestablishing out-of-band communications, a device may request that awireless source increase the amount of power it is transmitting. At thesame time, parameters of the wireless energy transfer channel andresonators may be monitored. An observed increase of delivered power atthe device may be used to infer that the out-of-band communicationchannel and the energy transfer channel are correctly linked to thedesignated resonators.

In embodiments an implicit verification step may involve monitoring anynumber of the parameters of the wireless energy transfer or parametersof the resonators and components used in the wireless energy transfer.In embodiments the currents, voltages, impedances, frequency,efficiency, temperatures, of the resonators and their drive circuits andthe like may be monitored and compared to expected values, trends,changes and the like as a result of an out-of-band communicationexchange.

In embodiments a resonator may store tables of measured parameters andexpected values, trends, and/or changes to these parameters as aconsequence of a communication exchange. A resonator may store a historyof communications and observed parameter changes that may be used toverify the energy transfer channel. In some cases a single unexpectedparameter change due to a communication exchange may be not beconclusive enough to determine the out-of-band channel is incorrectlypaired. In some embodiments the history of parameter changes may bescanned or monitored over several or many communication exchanges toperform verification.

An example algorithm showing the series of steps which may be used toimplicitly verify an energy transfer channel in a wireless energytransfer system using out-of-band communication is shown in FIG. 120(a). In the first step 12002 an out-of-band communication channel betweena source and a device is established. In the next step 12004 the sourceand device may exchange information regarding adjusting the parametersof the wireless energy transfer or parameters of the components used forwireless energy transfer. The information exchange on the out-of-bandcommunication channel may be a normal exchange used in normal operationof the system to control and adjust the energy transfer. In some systemsthe out-of-band communication channel may be encrypted preventingeavesdropping, impersonation, and the like. In the next step 12006 thesource and the device or just a source or just a device may monitor andkeep track of any changes to the parameters of the wireless energytransfer or any changes in parameters in the components used in theenergy transfer. The tracked changes may be compared against expectedchanges to the parameters as a consequence of any out-of-bandcommunication exchanges. Validation may be considered failed when one ormany observed changes in parameters do not correspond to expectedchanges in parameters.

In some embodiments of wireless energy transfer systems verification maybe explicit. In embodiments a source or a device may alter, dither,modulate, and the like the parameters of the wireless energy transfer orthe parameters of the resonators used in the wireless energy transfer tocommunicate or provide a verifiable signal to a source or device throughthe energy transfer channel. The explicit verification may involvechanging, altering, modulating, and the like some parameters of thewireless energy transfer or the parameters of the resonators andcomponents used in the energy transfer for the explicit purpose ofverification and may not be associated with optimizing, tuning, oradjusting the energy transfer.

The changing, altering, modulating, and the like some parameters of thewireless energy transfer or the parameters of the resonators andcomponents used in the energy transfer for the purpose of signaling orcommunicating with another wireless energy resonator or component mayalso be referred to as in-band communication. In embodiments, thein-band communication channel may be implemented as part of the wirelessenergy transfer resonators and components. Information may betransmitted from one resonator to another by changing the parameters ofthe resonators. Parameters such as inductance, impedance, resistance,and the like may be dithered or changed by one resonator. These changesmay affect the impedance, resistance, or inductance of other resonatorsaround the signaling resonator. The changes may manifest themselves ascorresponding dithers of voltage, current, and the like on theresonators which may be detected and decoded into messages. Inembodiments, in-band communication may comprise altering, changing,modulating, and the like the power level, amplitude, phase, orientation,frequency, and the like of the magnetic fields used for energy transfer.

In one embodiment the explicit in-band verification may be performedafter an out-of-band communication channel has been established. Usingthe out-of-band communication channel a source and a device may exchangeinformation as to the power transfer capabilities and in-band signalingcapabilities. Wireless energy transfer between a source and a device maythen be initiated. The source or device may request or challenge theother source or device to signal using the in-band communication channelto verify the connection between the out-of-band and communicationchannel and the energy transfer channel. The channel is verified whenthe agreed signaling established in the out-of-band communicationchannel is observed at the in-band communication channel.

In embodiments verification may be performed only during specific orpre-determined times of an energy exchange protocol such as duringenergy transfer startup. In other embodiments explicit verificationsteps may be performed periodically during the normal operation of thewireless energy transfer system. The verification steps may be triggeredwhen the efficiency or characteristics of the wireless power transferchange which may signal that the physical orientations have changed. Inembodiments the communication controller may maintain a history of theenergy transfer characteristics and initiate a verification of thetransfer that includes signaling using the resonators when a change inthe characteristics is observed. A change in the energy transfercharacteristics may be observed as a change in the efficiency of theenergy transfer, the impedance, voltage, current, and the like of theresonators, or components of the resonators and power and controlcircuitry.

Those skilled in the art will appreciate a signaling and communicationchannel capable of transmitting messages may be secured with any numberof encryption, authentication, and security algorithms. In embodimentsthe out-of-band communication may be encrypted and the securedcommunication channel may be used to transmit random sequences forverification using the in-band channel. In embodiments the in-bandcommunication channel may be encrypted, randomized, or secured by anyknown security and cryptography protocols and algorithms. The securityand cryptography algorithms may be used to authenticate and verifycompatibility between resonators and may use a public key infrastructure(PKI) and secondary communication channels for authorization andauthentication.

In embodiments of energy transfer systems between a source and a devicea device may verify the energy transfer channel to ensure it isreceiving energy from the desired or assumed source. A source may verifythe energy transfer channel to ensure energy is being transferred to thedesired or assumed source. In some embodiments the verification may bebidirectional and a source and device may both verify their energytransfer channels in one step or protocol operation. In embodiments,there may be more than two resonators and there may be repeaterresonators. In embodiments of multiple resonators, communication andcontrol may be centralized in one or a few resonators or communicationand control may be distributed across many, most, or all the resonatorsin a network. In embodiments, communication and/or control may beeffected by one or more semiconductor chips or microcontrollers that arecoupled to other wireless energy transfer components.

An example algorithm showing the series of steps which may be used toexplicitly verify an energy transfer channel in a wireless energytransfer system using out-of-band communication is shown in FIG. 120(b). In the first step 12008 an out-of-band communication channel betweena source and a device is established. In the next step 12010 the sourceand device may coordinate or agree on a signaling protocol, method,scheme, and the like that may be transmitted through the wireless energytransfer channel. To prevent eavesdropping and provide security theout-of-band communication channel may be encrypted and the source anddevice may follow any number of known cryptographic authenticationprotocols. In a system enabled with cryptographic protocols theverification code may comprise a challenge-response type exchange whichmay provide an additional level of security and authenticationcapability. A device, for example, may challenge the source to encrypt arandom verification code which it sends to the source via theout-of-band communication channel using a shared secret encryption keyor a private key. The verification code transmitted in the out-of-bandcommunication channel may then be signaled 12012 through the in-bandcommunication channel. In the case where the source and device areenabled with cryptographic protocols the verification code signaled inthe in-band communication channel may be encrypted or modified by thesender with a reversible cryptographic function allowing the receiver tofurther authenticate the sender and verify that the in-bandcommunication channels are linked with the same source or deviceassociated with the out-of-band communication channel.

In situations when the verification fails a wireless energy transfersystem may try to repeat the validation procedure. In some embodimentsthe system may try to re-validate the wireless energy transfer channelby exchanging another verification sequence for resignaling using thein-band communication channel. In some embodiments the system may changeor alter the sequence or type of information that is used to verify thein-band communication channel after attempts to verify the in-bandcommunication channel have failed. The system may change the type ofsignaling, protocol, length, complexity and the like of the in-bandcommunication verification code.

In some embodiments, upon failure of verification of the in-bandcommunication channel and hence the energy transfer channel, the systemmay adjust the power level, the strength of modulation, frequency ofmodulation and the like of the signaling method in the in-bandcommunication channel. For example, upon failure of verification of asource by a device, the system may attempt to perform the verificationat a higher energy transfer level. The system may increase the poweroutput of the source generating stronger magnetic fields. In anotherexample, upon failure of verification of a source by a device, thesource that communicated the verification code to the device by changingthe impedance of its source resonator may increase or even double theamount of change in the impedance of the source resonator for thesignaling.

In embodiments, upon failure of verification of the energy transferchannel, the system may try to probe, find, or discover other possiblesources or devices using the out-of-band communication channel. Inembodiments the out-of-band communication channel may be used to findother possible candidates for wireless energy transfer. In someembodiments the system may change or adjust the output power or therange of the out-of-band communication channel to help minimize falsepairings.

The out-of-band communication channel may be power modulated to haveseveral modes, long range mode to detect sources and a short range orlow power mode to ensure the communication is with another device orsource that is within a specified distance. In embodiments theout-of-band communication channel may be matched to the range of thewireless channel for each application. After failure of verification ofthe energy transfer channel the output power of the out-of-bandcommunication channel may be slowly increased to find other possiblesources or devices for wireless energy transfer. As discussed above, anout-of-band communication channel may exhibit interferences andobstructions that may be different from the interferences andobstructions of the energy transfer channel and sources and devices thatmay require higher power levels for out-of-band communication may be inclose enough proximity to allow wireless energy transfer.

In some embodiments the out-of-band communication channel may bedirected, arranged, focused, and the like, using shielding orpositioning to be only effective in a confined area (i.e., under avehicle), to insure it is only capable of establishing communicationwith another source or device that is in close enough proximity,position, and orientation for energy transfer.

In embodiments the system may use one or more supplemental sources ofinformation to establish an out-of-band communication channel or toverify an in-band energy transfer channel. For example, during initialestablishment of an out-of-band communication channel the locations ofthe sources or devices may be compared to known or mapped locations or adatabase of locations of wireless sources or devices to determine themost probable pair for successful energy transfer. Out-of-bandcommunication channel discovery may be supplemented with GPS data fromone or more GPS receivers, data from positioning sensors, inertialguidance systems and the like.

It is to be understood that although example embodiments withverification were described in systems consisting of a source and deviceverification may be performed in systems with any number of sources,devices, or repeaters. A single source may provide verification tomultiple devices. In some embodiments multiple sources may provide powerto one or more devices concurrently each may be varied. In embodimentsverification may be performed with a repeater. In some embodimentsverification may be performed through a repeater. A device receivingpower from a source via a repeater resonator may verify the source ofpower from the repeater. A device receiving power from a source via arepeater resonator may verify the source of energy through the repeater,i.e., the in-band communication may pass through the repeater to thesource for verification. It should be clear to those skilled in the artthat all of these and other configurations are within the scope of theinvention.

Low Resistance Electrical Conductors

As described above, resonator structures used for wireless energytransfer may include conducting wires that conduct high frequencyoscillating currents. In some structures the effective resistance of theconductors may affect the quality factor of the resonator structure anda conductor with a lower loss or lower resistance may be preferable. Theinventors have discovered new structures for reducing the effectiveresistance of conducting wires at high frequencies compared to solidwire conductors or even Litz wire conductors of the same equivalent wiregauge (diameter).

In embodiments, structures comprising concentric cylindrical conductingshells can be designed that have much lower electrical resistance forfrequencies in the MHz range than similarly sized solid wire conductorsor commercially available Litz wires. At such frequencies, wireresistances are dominated by skin-depth effects (also referred to asproximity effects), which prevent electrical current from beinguniformly distributed over the wire cross-section. At lower frequencies,skin-depth effects may be mitigated by breaking the wire into a braid ofmany thin insulated wire strands (e.g. Litz wire), where the diameter ofthe insulated strands are related to the conductor skin depth at theoperating frequency of interest. In the MHz frequency range, the skindepth for typical conductors such as copper are on the order of 10 μm,making traditional Litz wire implementations impractical.

The inventors have discovered that breaking the wire into multipleproperly designed concentric insulated conducting shells can mitigatethe skin depth effects for frequencies above 1 MHz. In embodiments,wires comprising fewer than 10 coaxial shells can lower AC resistance bymore than a factor of 3 compared to solid wire. In embodiments, wires orconductors comprising thin concentric shells can be fabricated by avariety of processes such as electroplating, electrodeposition, vapordeposition, sputtering, and processes that have previously been appliedto the fabrication of optical fibers.

In embodiments, conducting structures comprising nested cylindricalconductors may be analyzed using the quasistatic Maxwell equations. Ofparticular importance in the design of these conducting structures istaking account of the proximity losses induced by each conducting shellin the others via the magnetic fields. Modeling tools may be used tooptimize the number of conducting shells, the size and shape of theconducting shells, the type and thickness of insulating materials for agiven conductor diameter, operating frequency and environment, cost, andthe like.

One embodiment of the new conductor structure comprises a number, N, ofconcentric conducting shells. Such a structure can be designed to havemuch lower AC resistance at frequencies in the 10 MHz range than similargauge solid or stranded wires or commercially available Litz wires.

An embodiment of a wire or conductor comprising conducting shells maycomprise at least two concentric conducting shells separated by anelectrical insulator. An exemplary embodiment of an electrical conductorwith four concentric shells is shown in FIG. 121. Note that theconductor may have an unlimited length along the z axis. That is, thelength along the z axis is the length of the wire or the conductor.Also, the wire or conductor may have any number of bends, curves,twists, and the like (not shown) as would other conductors of equivalentgauge or thickness. Also note that in embodiments where thecross-section of the shell is annular or substantially annular, theshell will consequently be cylindrical or substantially cylindrical.There is no limitation to the shape of the cross sections and thus theshape of the resulting three-dimensional structure. For example, thecross-sectional shape may be rectangular in embodiments.

An embodiment shown in FIG. 121 comprises four concentric shells 12108,12106, 12104, 12102 of an electrical conductor that extend through thecomplete length of the conducting wire along the z axis. The conductorshells may be referred to by their location with respect to the centeror innermost conductor shell. For convention, the innermost shell may bereferred to as the first shell, and each successive shell as the secondshell, third shell, etc. The successive shells may also referred to asnested concentric shells. For example, in the embodiment shown in FIG.121 conductor shell 12102 may be referred to as the first shell or theinnermost shell and the conductor 12104 as the second shell, conductor12106 as the third shell, and conductor 2008 as the fourth shell or theoutermost shell. Each shell, except the innermost and the outermostshell, is in direct proximity to two neighboring shells, an innerneighbor and an outer neighbor shell. The innermost shell only has anouter neighbor, and the outermost shell only has an inner neighbor. Forexample, the third conductor 12106 has two shell neighbors, the innerneighbor being the second shell 12104 and the outer neighbor being thefourth shell 12108. In embodiments, the inner shell may be a solid core(in embodiments, cylindrical with an inner diameter zero).Alternatively, it may have a finite inner diameter and surround a coremade of insulating material and the like.

In embodiments each successive shell covers its inner neighbor shelllong the z axis of the conductor. Each shell wraps around its innerneighbor shell except the faces of each shell that are exposed at theends of the conductor. For example, in the embodiment shown in FIG. 121,shell 12102 is wrapped around by its outer neighbor shell 12104 andshell 12104 is wrapped by 12106 and etc.

In embodiments each successive shell may comprise one or more strips ofconductor shaped so as to conform to the cylindrical geometry of thestructure. In embodiments the strips in each shell may be mutuallyinsulated and periodically connected to strips in adjacent shells sothat the input impedances of the shells and/or strips naturally enforcethe current distribution that minimizes the resistance of the structure.In embodiments the strips in each shell may be wound at a particularpitch. The pitch in different shells may be varied so as to assist inthe impedance matching of the entire structure.

FIG. 121 shows an end section of the conductor with the conductinglayers staggered to provide a clear illustration of the layers. Thestaggering of layers in the drawing should not be considered as apreferred termination of the conductor. The conductor comprisingmultiple shells may be terminated with all shells ending in the sameplane or at different staggered planes as depicted in FIG. 121.

In embodiments, the innermost conductor shell 12102 may be solid asshown in FIG. 121. In embodiments the innermost conductor shell may behollow defining a hole or cavity along its length along the z axis ofthe conductor.

In embodiments neighboring shells may be separated from each other bylayers of an electrical insulator such that neighboring layers are notin electrical contact with one another. The thickness and material ofthe insulating layer may depend on the voltages, currents, and relativevoltage potential between each neighboring shell. In general theinsulator should be selected such that its breakdown voltage exceeds thevoltage potential between neighboring conducting shells. In embodimentsthe outside of the outermost shell 12110 may be covered by additionalelectrical insulators or protective casing for electrical safety,durability, water resistance, and the like. In embodiments differentshells and insulator layers may have different thicknesses depending onthe application, frequency, power levels and the like.

Another view of a cross section of an embodiment of the conductorcomprising four shells is shown in FIG. 122. The figure shows across-section, normal to the z-axis, of the conductor comprising theconductor shells 12202, 12204, 12206, 12208. Note that in this figure,and in FIG. 121, the insulating layers are not shown explicitly, but areunderstood to be located between the various shells. In embodiments, thethickness of the insulating layers may be extremely thin, especially incomparison to the thickness of the conducting shells.

The thickness, relative thickness, size, composition, shape, number,fraction of total current carried and the like, of concentric conducingshells may be selected or optimized for specific criteria such as thevoltage and/or current levels carried by the wire, the operatingfrequency of the resonator, size, weight and flexibility requirements ofthe resonator, required Q-values, system efficiencies, costs and thelike. The appropriate size, number, spacing, and the like of theconductors may be determined analytically, through simulation, by trialand error, and the like.

The benefits of the concentric shell design may be seen by comparing thecurrent distributions in conductors of similar diameters but withdifferent conductor arrangements. By way of example, calculations of thecurrent distributions in two concentric shell conductor structures andone solid conductor are shown in FIGS. 123-125. The figures show onequarter of the cross section of the conductor with the conductor beingsymmetric around x=0, y=0 coordinate. The figures show the currentdensity at 10 MHz for a copper conductor with an outside diameter (OD)of 1 mm and carrying a peak current of 1 A. Note that the darkershadings indicate higher current densities, as shown in the legend onthe right hand side of the figure.

FIG. 123 shows the current distribution for a wire comprising a single,1 mm diameter, solid core of copper. Note that the current isconcentrated on the outer perimeter of the solid conductor, limiting thearea over which the current is distributed, and yielding an effectiveresistance of 265.9 mΩ/m . This behavior is indicative of the knownproximity effect.

FIG. 124 shows the current distribution for an embodiment where the 1 mmdiameter wire comprises 24 mutually insulated 5.19 μm concentricconductive shells, around a solid innermost copper shell, totaling 25conductive shell elements. Note that the optimal current density (i.e.,the current distribution among the shells that minimizes the ACresistance, which may be found for any given structure usingmathematical techniques familiar to those skilled in the art) in thisstructure is more uniformly distributed, increasing the cross sectionover which the current flows, and reducing the effective resistance ofthe wire to 55.2 mΩ/m. Note that this wire comprising concentricconducting shells has an AC resistance that is approximately five timeslower than the similarly sized solid conducting wire.

FIG. 125 shows the current distribution for an embodiment where the 1 mmdiameter wire comprises 25 conductive shells (including an innermostsolid core) whose thicknesses are varied from shell to shell so as tominimize the overall resistance. Each shell is of a different thicknesswith thinner and thinner shells towards the outside of the wire. In thisembodiment, the thickness of the shells ranged from 16.3 μm to 3.6 μm(except for the solid innermost shell). The inset in FIG. 125 shows theradial locations of the interfaces between the shells. The effectiveresistance of the wire comprising the varying thickness shells as shownin FIG. 125 is 51.6 mΩ/m . Note that the resistance of the conductingstructures shown in FIGS. 123-125 was calculated analytically usingmethods described in A. Kurs, M. Kesler, and S. G. Johnson, Optimizeddesign of a low-resistance electrical conductor for the multimegahertzrange, Appl. Phys. Lett. 98, 172504 (2011), as well as U.S. ProvisionalApplication Ser. No. 61/411,490, filed Nov. 9, 2010 the contents of eachwhich are incorporated herein by reference in their entirety as if fullyset forth herein. For simplicity, the insulating gap between the shellswas taken to be negligibly small for each structure.

Note that while the embodiments modeled in FIGS. 124-125 comprised solidinnermost conductor shells, most of the current flowing in that shell isconfined to the outer layer of this innermost shell. In otherembodiments, this solid innermost shell may be replaced by a hollow orinsulator filled shell, a few skin-depths thick, without significantlyincreasing the AC resistance of the structure.

FIGS. 126-128 show plots that compare the ratio of the lowest ACresistance (as a function of the number of shells, N, and the operatingfrequency, f) achievable for a 1 mm OD wire comprising concentricconducting shells and a 1 mm OD solid core wire, of the same conductingmaterial.

FIG. 126 shows that an optimized cylindrical shell conductor cansignificantly outperform a solid conductor of the same OD. One can alsosee from FIG. 126 that much of the relative improvement of an optimizedconcentric shell conductor over a solid conductor occurs for structureswith only a small number of elements or shells. For example, a wirecomprising 10 concentric conducting shells has an AC resistance that isthree times lower than a similarly sized solid wire over the entire 2-20MHz range. Equivalently, since the resistance of a solid conductor inthe regime κD>>1 (κ being the inverse of the skin depth δ and D thediameter of the conductor) scales as 1/D, the conductor comprising tenshells would have the same resistance per unit length as a solidconductor with a diameter that is 3.33 times greater (and roughly 10times the cross area) than the wire comprising shells.

Increasing the number of shells to 20 and 30 further reduces the ACresistance to four times lower, and five times lower than the ACresistance for a similarly sized solid wire.

It should be noted that with the presented structures comprisingmultiple conductor shells it may be necessary to impedance match eachshell to ensure an optimal current distribution. However due to therelatively small number of shell conductors for most applications (<40)a brute force approach of individually matching the impedance of eachshell (e.g., with a lumped-element matching network) to achieve theoptimal current distribution could be implemented (similar impedancematching considerations arise in multi-layer high-T_(c) superconductingpower cables (see H. Noji, Supercond. Sci. Technol. 10, 552 (1997). andS. Mukoyama, K. Miyoshi, H. Tsubouti, T. Yoshida, M. Mimura, N. Uno, M.Ikeda, H. Ishii, S. Honjo, and Y. Iwata, IEEE Trans. Appl. Supercond. 9,1269 (1999). the contents of which are incorporated in their entirety asif fully set forth herein), albeit at much lower frequencies).

In embodiments, concentric conducting shells of a wire may preferably becylindrical or have circular cross-sections, however other shapes arecontemplated and may provide for substantial improvement over solidconductors. Concentric conducting shells having an elliptical,rectangular, triangular, or other irregular shapes are within the scopeof this invention. The practicality and usefulness of each cross-sectionshape may depend on the application, manufacturing costs, and the like.

In this section of the disclosure we may have referred to the structurescomprising multiple shells of conductors as a wire. It is to beunderstood that the term wire should not be limited to mean any specificor final form factor of the structures. In embodiments the structuresmay comprise free standing conductors that may be used to replacetraditional wires. In embodiments the structures comprising multipleshells may be fabricated or etched onto a multilayer printed circuitboard or substrate. The structures may be etched, deposited on wafers,boards, and the like. In embodiments thin concentric shells can befabricated by a variety of processes (such as electroplating,electro-deposition, vapor deposition, or processes utilized in opticalfiber fabrication).

The conductor structures may be utilized in many resonator or coilstructures used for wireless energy transfer. The multi-shell structuresmay be used as part of a resonator such as those shown in FIG. 98( a) or98(c). The low loss conductors may be wrapped around a core of magneticmaterial to form low loss planar resonators. The low loss conductors maybe etched or printed on a printed circuit board to form a printed coiland the like.

Wireless Energy Distribution System

Wireless energy may be distributed over an area using repeaterresonators. In embodiments a whole area such as a floor, ceiling, wall,table top, surface, shelf, body, area, and the like may be wirelesslyenergized by positioning or tiling a series of repeater resonators andsource resonators over the area. In some embodiments, a group of objectscomprising resonators may share power amongst themselves, and power maybe wireless transmitted to and/or through various objects in the group.In an exemplary embodiment, a number of vehicles may be parked in anarea and only some of the vehicles may be positioned to receive wirelesspower directly from a source resonator. In such embodiments, certainvehicles may retransmit and/or repeat some of the wireless power tovehicles that are not parked in positions to receive wireless powerdirectly from a source. In embodiments, power supplied by a vehiclecharging source may use repeaters to transmit power into the vehicles topower devices such as cell phones, computers, displays, navigationdevices, communication devices, and the like. In some embodiments, avehicle parked over a wireless power source may vary the ratio of theamount of power it receives and the amount of power it retransmits orrepeats to other nearby vehicles. In embodiments, wireless power may betransmitted from one source to device after device and so on, in a daisychained fashion. In embodiments, certain devices may be able to selfdetermine how much power that receive and how much they pass on. Inembodiments, power distribution amongst various devices and/or repeatersmay be controlled by a master node or a centralized controller.

Some repeater resonators may be positioned in proximity to one or moresource resonators. The energy from the source may be transferred fromthe sources to the repeaters, and from those repeaters to otherrepeaters, and to other repeaters, and so on. Therefore energy may bewirelessly delivered to a relatively large area with the use of smallsized sources being the only components that require physical or wiredaccess to an external energy source.

In embodiments the energy distribution over an area using a plurality ofrepeater resonators and at least one source has many potentialadvantages including in ease of installation, configurability, control,efficiency, adaptability, cost, and the like. For example, using aplurality of repeater resonators allows easier installation since anarea may be covered by the repeater resonators in small increments,without requiring connections or wiring between the repeaters or thesource and repeaters. Likewise, a plurality of smaller repeater coilsallows a greater flexibility of placement allowing the arrangement andcoverage of an area with an irregular shape. Furthermore, the repeaterresonators may be easily moved or repositioned to change the magneticfield distribution within an area. In some embodiments the repeaters andthe sources may be tunable or adjustable allowing the repeaterresonators to be tuned or detuned from the source resonators andallowing a dynamic reconfiguration of energy transfer or magnetic fielddistribution within the area covered by the repeaters without physicallymoving components of the system.

For example, in one embodiment, repeater resonators and wireless energysources may be incorporated or integrated into flooring. In embodiments,resonator may be integrated into flooring or flooring products such ascarpet tiles to provide wireless power to an area, room, specificlocation, multiple locations and the like. Repeater resonators, sourceresonators, or device resonators may be integrated into the flooring anddistribute wireless power from one or more sources to one more deviceson the floor via a series of repeater resonators that transfer theenergy from the source over an area of the floor.

It is to be understood that the techniques, system design, and methodsmay be applied to many flooring types, shapes, and materials includingcarpet, ceramic tiles, wood boards, wood panels and the like. For eachtype of material those skilled in the art will recognize that differenttechniques may be used to integrate or attach the resonators to theflooring material. For example, for carpet tiles the resonators may besown in or glued on the underside while for ceramic tiles integration oftiles may require a slurry type material, epoxy, plaster, and the like.In some embodiments the resonators may not be integrated into theflooring material but placed under the flooring or on the flooring. Theresonators may, for example, come prepackaged in padding material thatis placed under the flooring. In some embodiments a series or an arrayor pattern of resonators, which may include source, device, and repeaterresonators, may be integrated in to a large piece of material orflooring which may be cut or trimmed to size. The larger material may betrimmed in between the individual resonators without disrupting ordamaging the operation of the cut piece.

Returning now to the example of the wireless floor embodiment comprisingindividual carpet tiles, the individual flooring tiles may be wirelesspower enabled by integrating or inserting a magnetic resonator to thetile or under the tile. In embodiments resonator may comprise a loop orloops of a good conductor such as Litz wire and coupled to a capacitiveelement providing a specific resonant frequency which may be in therange of 10 KHz to 100 MHz. In embodiments the resonator may be a high-Qresonator with a quality factor greater than 100. Those skilled in theart will appreciate that the various designs, shaped, and methods forresonators such as planar resonators, capacitively loaded loopresonators, printed conductor loops, and the like described herein maybe integrated or combined within a flooring tile or other flooringmaterial.

Example embodiments of a wireless power enabled floor tile are depictedin FIG. 129( a) and FIG. 129( b). A floor tile 12902 may include loopsof an electrical conductor 12904 that are wound within the perimeter ofthe tile. In embodiments the conductor 12904 of the resonator may becoupled to additional electric or electronic components 12906 such ascapacitors, power and control circuitry, communication circuitry, andthe like. In other embodiments the tile may include more than oneresonator and more than one loop of conductors that may be arranged inan array or a deliberate pattern as described herein such as for examplea series of multisized coils, a configurable size coil and the like.

In embodiments the coils and resonators integrated into the tiles mayinclude magnetic material. Magnetic material may be used to constructplanar resonator structures such those depicted in FIG. 98( a) or 98(c).In embodiments the magnetic material may also be used for shielding ofthe coil of the resonator from lossy objects that may be under or aroundthe flooring. In some embodiments the structures may further include alayer or sheet of a good electrical conductor under the magneticmaterial to increase the shielding capability of the magnetic materialas described herein.

Tiles with a resonator may have various functionalities and capabilitiesdepending on the control circuitry, communication circuitry, sensingcircuitry, and the like that is coupled to the coil or resonatorstructure. In embodiments of a wireless power enabled flooring thesystem may include multiple types of wireless enabled tiles withdifferent capabilities. One type of floor tile may comprise only amagnetic resonator and function as a fixed tuned repeater resonator thatwirelessly transfers power from one resonator to another resonatorwithout any direct or wired power source or wired power drain.

Another type of floor tile may comprise a resonator coupled to controlelectronics that may dynamically change or adjust the resonant frequencyof the resonator by, for example, adjusting the capacitance, inductance,and the like of the resonator. The tile may further include an in-bandor out-of-band communication capability such that it can exchangeinformation with other communication enabled tiles. The tile may be thenable to adjust its operating parameters such as resonant frequency inresponse to the received signals from the communication channel.

Another type of floor tile may comprise a resonator coupled tointegrated sensors that may include temperature sensors, pressuresensors, inductive sensors, magnetic sensors, and the like. Some or allthe power captured by the resonator may be used to wirelessly power thesensors and the resonator may function as a device or partially as arepeater.

Yet another type of wireless power enabled floor tile may comprise aresonator with power and control circuitry that may include an amplifierand a wired power connection for driving the resonator and function likea wireless power source. The features, functions, capabilities of eachof the tiles may be chosen to satisfy specific design constraints andmay feature any number of different combinations of resonators, powerand control circuitry, amplifiers, sensors, communication capabilitiesand the like.

A block diagram of the components comprising a resonator tile are shownin FIG. 130. In a tile, a resonator 13002 may be optionally coupled topower and control circuitry 13006 to receive power and power devices oroptional sensors 13004. Additional optional communication circuitry13008 may be connected to the power and control circuitry and controlthe parameters of the resonator based on received signals.

Tiles and resonators with different features and capabilities may beused to construct a wireless energy transfer systems with variousfeatures and capabilities. One embodiment of a system may includesources and only fixed tuned repeater resonator tiles. Another systemmay comprise a mixture of fixed and tunable resonator tiles withcommunication capability. To illustrate some of the differences insystem capabilities that may be achieved with different types of floortiles we will describe example embodiments of a wireless floor system.

The first example embodiment of the wireless floor system may include asource and only fixed tuned repeater resonator tiles. In this firstembodiment a plurality of fixed tuned resonator tiles may be arranged ona floor to transfer power from a source to an area or location over ornext to the tiles and deliver wireless power to devices that may beplaced on top of the tiles, below the tiles, or next to the tiles. Therepeater resonators may be fixed tuned to a fixed frequency that may beclose to the frequency of the source. An arrangement of the firstexample embodiment is shown in FIG. 131. The tiles 13102 are arranged inan array with at least one source resonator that may be integrated intoa tile 13110 or attached to a wall 13106 and wired 13112 to a powersource. Some repeater tiles may be positioned next to the sourceresonator and arranged to transfer the power from the source to adesired location via one or more additional repeater resonators.

Energy may be transferred to other tiles and resonators that are furtheraway from the source resonators using tiles with repeater resonatorswhich may be used to deliver power to devices, integrated or connectedto its own device resonator and device power and control electronicsthat are placed on top or near the tiles. For example, power from thesource resonator 13106 may be transferred wirelessly from the source13106 to an interior area or interior tile 13122 via multiple repeaterresonators 13114, 13116, 13118, 13120 that are between the interior tile13122 and the source 13106. The interior tile 13122 may than transferthe power to a device such as a resonator built into the base of a lamp13108. Tiles with repeater resonators may be positioned to extend thewireless energy transfer to a whole area of the floor allowing a deviceon top of the floor to be freely moved within the area. For exampleadditional repeater resonator tiles 13124, 13126, 13128 may bepositioned around the lamp 13108 to create a defined area of power(tiles 13114, 13116, 13118, 13120, 13122, 13124, 13126, 13128) overwhich the lamp may be placed to receive energy from the source via therepeater tiles. The defined area over which power is distributed may bechanged by adding more repeater tiles in proximity to at least one otherrepeater or source tile. The tiles may be movable and configurable bythe user to change the power distribution as needed or as the roomconfiguration changes. Except a few tiles with source resonators whichmay need wired source or energy, each tile may be completely wirelessand may be configured or moved by the user or consumer to adjust thewireless power flooring system.

A second embodiment of the wireless floor system may include a sourceand one or more tunable repeater resonator tiles. In embodiments theresonators in each or some of the tiles may include control circuitryallowing dynamic or periodic adjustment of the operating parameters ofthe resonator. In embodiments the control circuitry may change theresonant frequency of the resonator by adjusting a variable capacitor ora changing a bank of capacitors.

To obtain maximum efficiency of power transfer or to obtain a specificdistribution of power transfer in the system of multiple wireless powerenabled tiles it may be necessary to adjust the operating point of eachresonator and each resonator may be tuned to a different operatingpoint. For example, in some situations or applications the requiredpower distribution in an array of tiles may be required to benon-uniform, with higher power required on one end of the array andlower power on the opposite end of the array. Such a distribution may beobtained, for example, by slightly detuning the frequency of theresonators from the resonant frequency of the system to distribute thewireless energy where it is needed.

For example, consider the array of tiles depicted in FIG. 131 comprising36 tunable repeater resonator tiles with a single source resonator13106. If only one device that requires power is placed on the floor,such as the lamp 13108, it may be inefficient to distribute the energyacross every tile when the energy is needed in only one section of thefloor tile array. In embodiments the tuning of individual tiles may beused to change the energy transfer distribution in the array. In theexample of the single lamp device 13108, the repeater tiles that are notin direct path from the source resonator 13106 to the tile closes to thedevice 13122 may be completely or partially detuned from the frequencyof the source. Detuning of the unused repeaters reduces the interactionof the resonators with the oscillating magnetic fields changing thedistribution of the magnetic fields in the floor area. With tunablerepeater tiles, a second device may be placed within the array of tilesor the lamp device 13108 is moved from its current location 13122 toanother tile, say 13130, the magnetic field distribution in the area ofthe tiles may be changed by retuning tiles that are in the path from thesource 13106 to the new location 13130.

In embodiments, to help coordinate the distribution of power and tuningof the resonators the resonator may include a communication capability.Each resonator may be capable of wirelessly communicating with one ormore of its neighboring tiles or any one of the tiles to establish anappropriate magnetic field distribution for a specific devicearrangement.

In embodiments the tuning or adjustment of the operating point of theindividual resonators to generate a desired magnetic field distributionover the area covered by the tiles may be performed in a centralizedmanner from one source or one “command tile”. In such a configurationthe central tile may gather the power requirements and the state of eachresonator and each tile via wireless communication or in bandcommunication of each tile and calculate the most appropriate operatingpoint of each resonator for the desired power distribution or operatingpoint of the system. The information may be communicated to eachindividual tile wirelessly by an additional wireless communicationchannel or by modulating the magnetic field used for power transfer. Thepower may be distributed or metered out using protocols similar to thoseused in communication systems. For example, there may be devices thatget guaranteed power, while others get best effort power. Power may bedistributed according to a greedy algorithm, or using a token system.Many protocols that have been adapted for sharing information networkresources may be adapted for sharing wireless power resources.

In other embodiments the tuning or adjustment of the operating point ofthe individual resonators may be performed in a decentralized manner.Each tile may adjust the operating point of its resonator on its ownbased on the power requirements or state of the resonators of tiles inits near proximity.

In both centralized and decentralized arrangements any number of networkbased centralized and distributed routing protocols may be used. Forexample, each tile may be considered as a node in network and shortestpath, quickest path, redundant path, and the like, algorithms may beused to determine the most appropriate tuning of resonators to achievepower delivery to one or more devices.

In embodiments various centralized and decentralized routing algorithmsmay be used to tune and detune resonators of a system to route power viarepeater resonators around lossy objects. If an object comprising lossymaterial is placed on some of the tiles it may the tiles, it mayunnecessarily draw power from the tiles or may disrupt energytransmission if the tiles are in the path between a source and thedestination tile. In embodiments the repeater tiles may be selectivelytuned to bypass lossy objects that may be on the tiles. Routingprotocols may be used to tune the repeater resonators such that power isrouted around lossy objects.

In embodiments the tiles may include sensors. The tiles may includesensors that may be power wirelessly from the magnetic energy capturedby the resonator built into the tile to detect objects, energy capturedevices, people 13134, and the like on the tiles. The tiles may includecapacitive, inductive, temperature, strain, weight sensors, and thelike. The information from the sensors may be used to calculate ordetermine the best or satisfactory magnetic field distribution todeliver power to devices and maybe used to detune appropriateresonators. In embodiments the tiles may comprise sensors to detectmetal objects. In embodiments the presence of a lossy object may bedetected by monitoring the parameters of the resonator. Lossy objectsmay affect the parameters of the resonator such as resonant frequency,inductance, and the like and may be used to detect the metal object.

In embodiments the wireless powered flooring system may have more thanone source and source resonators that are part of the tiles, that arelocated on the wall or in furniture that couple to the resonators in theflooring. In embodiments with multiple sources and source resonators thelocation of the sources may be used to adjust or change the powerdistribution within in the flooring. For example, one side of a room mayhave devices which require more power and may require more sourcescloser to the devices. In embodiments the power distribution in thefloor comprising multiple tiles may be adjusted by adjusting the outputpower (the magnitude of the magnetic field) of each source, the phase ofeach source (the relative phase of the oscillating magnetic field) ofeach source, and the like.

In embodiments the resonator tiles may be configured to transfer energyfrom more than one source via the repeater resonators to a device.Resonators may be tuned or detuned to route the energy from more thanone source resonator to more than one device or tile.

In embodiments with multiple sources it may be desirable to ensure thatthe different sources and maybe different amplifiers driving thedifferent sources are synchronized in frequency and/or phase. Sourcesthat are operating at slightly different frequencies and/or phase maygenerate magnetic fields with dynamically changing amplitudes andspatial distributions (due to beating effects between the oscillatingsources). In embodiments, multiple source resonators may be synchronizedwith a wired or wireless synchronization signal that may be generated bya source or external control unit. In some embodiments one sourceresonator may be designed as a master source resonator that dictates thefrequency and phase to other resonators. A master resonator may operateat its nominal frequency while other source resonators detect thefrequency and phase of the magnetic fields generated by the mastersource and synchronize their signals with that of the master.

In embodiments the wireless power from the floor tiles may betransferred to table surfaces, shelves, furniture and the like byintegrating additional repeater resonators into the furniture and tablesthat may extend the range of the wireless energy transfer in thevertical direction from the floor. For example, in some embodiments of awireless power enabled floor, the power delivered by the tiles may notbe enough to directly charge a phone or an electronic device that may beplaced on top of a table surface that may be two or three feet above thewireless power enabled tiles. The coupling between the small resonatorof the electronic device on the surface of the table and the resonatorof the tile may be improved by placing a large repeater resonator nearthe surface of the table such as on the underside of the table. Therelatively large repeater resonator of the table may have good couplingwith the resonator of the tiles and, due to close proximity, goodcoupling between the resonator of the electronic device on the surfaceof the table resulting in improved coupling and improved wireless powertransfer between the resonator of the tile and the resonator of thedevice on the table.

As those skilled in the art will recognize the features and capabilitiesof the different embodiments described may be rearranged or combinedinto other configurations. A system may include any number of resonatortypes, source, devices, and may be deployed on floors, ceilings, walls,desks, and the like. The system described in terms of floor tiles may bedeployed onto, for example, a wall and distribute wireless power on awall or ceiling into which enabled devices may be attached or positionedto receive power and enable various applications and configurations. Thesystem techniques may be applied to multiple resonators distributedacross table tops, surfaces, shelves, bodies, vehicles, machines,clothing, furniture, and the like. Although the example embodimentsdescribed tiles or separate repeater resonators that may be arrangedinto different configurations based on the teachings of this disclosureit should be clear to those skilled in the art that multiple repeater orsource resonator may not be attached or positioned on separate physicaltiles or sheets. Multiple repeater resonators, sources, devices, andtheir associated power and control circuitry may be attached, printed,etched, to one tile, sheet, substrate, and the like. For example, asdepicted in FIG. 132, an array of repeater resonators 13204 may beprinted, attached, or embedded onto one single sheet 13202. The singlesheet 13202 may be deployed similarly as the tiles described above. Thesheet of resonators may be placed near, on, or below a source resonatorto distribute the wireless energy through the sheet or parts of thesheet. The sheet of resonators may be used as a configurable sizedrepeater resonator in that the sheet may be cut or trimmed between thedifferent resonators such as for example along line 13206 shown in FIG.132.

In embodiments a sheet of repeater resonators may be used in a desktopenvironment. Sheet of repeater resonators may be cut to size to fit thetop of a desk or part of the desk, to fit inside drawers, and the like.A source resonator may be positioned next to or on top of the sheet ofrepeater resonators and devices such as computers, computer peripherals,portable electronics, phones, and the like may be charged or powered viathe repeaters.

In embodiments resonators embedded in floor tiles or carpets can be usedto capture energy for radiant floor heating. The resonators of each tilemay be directly connected to a highly resistive heating element viaunrectified AC, and with a local thermal sensor to maintain certainfloor temperature. Each tile may be able to dissipate a few watts ofpower in the thermal element to heat a room or to maintain the tiles ata specific temperature.

Medical and Surgical Applications

Wireless power transfer may be used in hospital and operating roomenvironments. A large number of electric and electronic equipment isused in hospitals and operating rooms to monitor patients, administermedications, perform medical procedures, maintain administrative andmedical records, and the like. The electric and electronic equipment isoften moved, repositioned, moved with a patient, or attached to apatient. The frequent movement may result in problems related to powerdelivery to the devices. Equipment and electronic devices that are oftenmoved and repositioned may create a power cable hazards and managementproblem due to cables that become tangled, strained, unplugged, thatbecome a tripping hazard, and the like. Devices with a battery backupthat are capable of operating for a period of time without a directelectrical connection require frequent recharging or plugging andunplugging from electrical outlets every time a device is used orrepositioned. Wireless power transfer may be used to eliminate theproblems and hazards of traditional wired connection in hospital andoperating room environments.

Wireless power transfer may be used to power surgical robots, equipment,sensors, and the like. Many medical procedures and surgical operationsutilize robots or robotic equipment to perform or aid in medicalprocedures or operations. Wireless power transfer may be used totransfer power to the robotic equipment, to parts of the equipment, orto instruments or tools manipulated by the equipment which may reducethe potentially hazardous and troublesome wiring of the systems.

One example configuration of a surgical robot utilizing wireless powertransfer is shown in FIG. 133. The figure depicts a surgical robot 13306and an operating bed 13304. The surgical robot may be powered wirelesslyfrom a wireless source embedded in the bed, floor, or other structure.The wireless energy transfer may allow the robot to be repositionedwithout changing the position of power cables. In some embodiments thesurgical robot may receive power wirelessly for operation or chargingits battery or energy storage system. The received power may bedistributed to systems or parts such as motors, controllers, and thelike via conventional wired methods. The surgical robot may have adevice resonator in its base 13316, neck 13302, main structure 13308,and the like for capturing oscillating magnetic energy generated by asource. In some embodiments the robot may be wirelessly powered from asource 13314 that is integrated, attached, or next to the operating bed.

In some embodiments the source resonator or the device resonator may bemounted on an articulating arm, or a moving or configurable extension asdepicted in FIG. 134. The arm or moving extension 13402 may beconfigured to respond to positional changes of the robot, power demands,or efficiency of the wireless power transfer to reposition the source orthe device to ensure that adequate levels of power are delivered to therobot. In some embodiments the movable source or device may be movedmanually by an operator or may be automatic or computerized andconfigured to align or to maintain a specific separation range ororientation between the source and the device.

In embodiments the movable arm or extension may be used in situations orconfigurations where there may be a positional offset, mismatch, lateroffset, or height offset between the source and the device. Inembodiments the movable arm that houses or is used to position thesource or device resonator may be computer controlled and mayautonomously position itself to obtain the best power transferefficiency. The arm, for example, may move in all direction scanning themost efficient configuration or position and may use learning or otheralgorithms to fine tune its position and alignment. In embodiments thecontroller may use any number of measurements from the sensor to try toalign or seek the best or most efficient position including, but limitedto, impedance, power, efficiency, voltage, current, quality factor,coupling rate, coupling coefficient measurements, and the like.

In other embodiments the surgical robot may use wireless power transferto power motors, sensors, tools, circuits, devices, or systems of therobot, that are manipulated by the robot, or that are integrated intothe robot. For example, many surgical robots may have complex appendagesthat have multiple degrees of freedom of movement. It may be difficultto provide power along or through the various joints or moving parts ofthe appendages due to bulkiness, inflexibility, or unreliability ofwires.

Likewise, powering of the various tools or instruments necessary for aprocedure may pose reliability and safety problems with powerconnections and connectors in the presence of body fluids. A surgicalrobot may utilize one or more source resonator 13302 and one or moredevice resonators 13310, 13312 located in the appendages or tools topower motors, electronics, or devices to allow movement of theappendages or powering of tools, cameras, and the like that the robotmanipulates which may be inside, or outside of a patient. The power maybe transferred wirelessly without any wires regardless of thearticulation or rotation of the appendages and may increase the degreesor articulation capability of the appendages. In some embodiments thesources may be integrated into the robot and powered by the robot thatmay receive its own power wirelessly or from a wired connection. In someembodiments the source powering the appendages and the tools may bemounted on the operating bed, under the bed, or next to the patient.

As those skilled in the art will appreciate, the systems described andshown in the figures are specific exemplary embodiments and systems mayutilize any one of many different robot devices of various shapes andcapabilities, tools, and the like. Likewise the source may be mounted onany number of objects of various dimensions depending on the applicationand use of the robot. The source may be mounted on the operating roombed or pedestal as shown in the FIG. 133. In other embodiments a sourcemay be mounted in the floor, walls, ceilings, other devices, and thelike.

Wireless power transfer may be used to power or recharge movableequipment such as an IV or drug delivery racks or computer stands. Suchstands or racks are often repositioned temporarily or moved from onelocation to another with a patient. The electronic devices attached tothese racks often have battery backup allowing them to operate for aperiod of time without a direct electrical connection such that they canbe moved or repositioned and maintain their functionality. However,every time a traditional rack is moved or repositioned it needs to beunplugged and plugged back into an outlet for recharging or powering andthe cable must be wound or untangled from other cables.

The problems with traditional movable wired drug delivery, patientmonitoring, or computer racks may be overcome by integrating a wirelesspower transfer system to the devices. For example, sample embodiments ofa drug delivery rack and a computer rack are depicted in FIG. 135( a)and FIG. 135( b). Device resonators 13508, 13506 and power and controlcircuitry may be integrated or attached to the base or the body of therack or the supporting structure allowing wireless power transfer from asource resonator mounted into the floor, wall, charging station, orother objects. To be charged or powered the rack 13502 or stand 13514may be positioned in the proximity of the source, within a meterdistance of the source, or within a foot separation of the source. Thewireless power transfer enabled rack and the electrical equipment doesnot require plugging or unplugging or cable management. The wirelesspower transfer enabled rack or electrical equipment may be powered bypositioning the rack or electrical equipment in a specific area of aroom or in proximity to the source that may be integrated into thefloor, carpet, walls, baseboard, other equipment and the like. In thisconfiguration, for example, a device or rack that may is only used forshort period of time to measure or diagnose a patient may be moved fromthe charging location and brought anywhere close to the patient to takea measurement and moved back into the charging location withoutrequiring precise positioning or plugging or unplugging of theequipment.

In some embodiments the device capturing wireless energy may requireadditional electric and electronic components in addition to aresonator. As described herein, additional AC to DC converters, AC to ACconverters, matching networks, active components may be necessary tocondition, control, and convert the voltages and currents from theresonator to voltages and currents that may be usable by the device tobe powered. In some devices and embodiments, the voltages and currentsof the resonator may be used directly without an additional conditioningor conversion step. Surgical tools such as cauterizers, electricscalpels, and the like use oscillating high voltages to effectively cut,stimulate, or cauterize tissue. The oscillating voltages on the deviceresonator may be directly used to power such devices reducing theirsize, cost, and complexity.

For example, in some embodiments a surgical tools such as a cauterizer13604 may be fitted with a device resonator 13606 capable of capturingmagnetic energy from one or more source resonators 13602 as depicted inFIG. 136. Depending on the inductance, quality factor, resistance,relative distance to the source resonators, power output of the sourceresonators, frequency, and the like the parameters of the voltages andcurrents on the device resonator may be enough to directly cauterize orcut tissue. Voltages of 30 or more volts with frequencies of 1 KHz toover 5 MHz may be generated on the device resonator 13606 and may beused directly as the output 13612 of the surgical tool 13614. In someembodiments monitoring circuitry, such as voltage or current sensingcircuitry 13610 may integrated into the device resonator along with awireless communication capability to relay the measured values to asource. The source may monitor the received current and voltage valuesand adjust its operating parameters to maintain a specific voltage,frequency, or current at the device or to adjust the current or voltageis response to the operator input.

Wireless Power Transfer for Implantable Devices

In embodiments, wireless power transfer may be used to deliver power toelectronic, mechanical, and the like devices that may be implanted in aperson or animal. Implantable devices such as mechanical circulatorysupport (MCS) devices, ventricular assist devices (VAD), implantablecardioverter defibrillators (ICD), and the like may require an externalenergy source for operation for extended periods of time. In somepatients and situations the implanted device requires constant or nearconstant operation and has considerable power demands that requireconnection to an external power source requiring percutaneous cables orcables that go through the skin of the patient to an external powersource increasing the possibility of infection and decreasing patientcomfort.

Some implanted devices may require 1 watt of power or more or 10 wattsof power or more for periodic or continuous operation making aself-contained system that operates only from the battery energyimplanted in a patient impractical as the battery would require frequentreplacement or replacement after the implanted device is activated.

In embodiments, wireless power transfer described herein may be used todeliver power to the implanted device without requiring through the skinwiring. In embodiments wireless power transfer may be used toperiodically or continuously power or recharge an implanted rechargeablebattery, super capacitor, or other energy storage component.

For example, as depicted in FIG. 137( a), an implanted device 13708requiring electrical energy may be wired 13706 to a high-Q deviceresonator 13704 implanted in the patient 13702 or animal. The deviceresonator may be configured to wirelessly receive energy from one ormore external high-Q resonators 13712 via oscillating magnetic fields.In embodiments additional battery or energy storage components may beimplanted in the patient and coupled to the device resonator and theimplanted device. The internal battery may be recharged using thecaptured energy from the device resonator allowing the implanted deviceto operate for some time, even when wireless power is not transferred oris temporarily interrupted to the patient. The block componentscomprising an embodiment of a wireless power system are depicted in FIG.137( b). A device resonator 13704 implanted inside a patient and coupledto power and control circuitry (not shown) that controls and tunes theoperation of the resonator may be coupled to a rechargeable battery orother energy storage element 13710 that is also implanted in thepatient. The energy captured by the device resonator may be used tocharge the battery or power the implanted device 13708 directly usingthe captured energy that is generated by an external resonator 13712.

The wireless energy transfer system based on the high-Q resonatorsources and devices described herein may tolerate larger separationdistance and larger lateral offsets than traditional induction basedsystems. A device resonator implanted in a patient may be energizedthrough multiple sides and angles of the patient. For example, a deviceresonator implanted in the abdomen of a patient may be energized with asource from the back of the patient. The same device resonator may alsobe energized from a source positioned in the front abdomen side of thepatient providing for a more flexible positioning and orientationconfiguration options for the source.

In embodiments the resonator and the battery may be integrated with theimplanted device into one substantially continuous unit. In otherembodiments the device resonator and the battery may be separate fromthe implanted device and may be electrically wired to the device. Theresonator may be implanted in a different part of the body than thedevice, a part of the body that may be more accessible for an externalsource resonator, less obtrusive to the patient, and the like. Inembodiments the device resonator may be implanted in or close to thebuttock of the patient, or the lower back of the patient, and the like.In embodiments the size of the resonator and placement may depend on theamount of power required by the implanted device, distance of wirelesspower transfer, frequency of power delivery or recharging, and the like.In some embodiments, for example, it may be preferable to use a deviceresonator that is smaller than 7 cm by 7 cm such that it may be easierto implant in a person while capable of delivering 5 watts or more orpower at a separation of at least 2 cm.

In embodiments the implanted device resonators may comprise a round orrectangular planar capacitively loaded conductor loop comprising fiveloops of a Litz conductor coupled to a capacitor network as describedherein. In embodiments it may be preferable to enclose the implanteddevice resonator in an enclosure comprising mostly nonmetallic materialsto minimize losses, or an enclosure which has at last one side thatcomprises non-metallic material.

In embodiments, an implanted medical device may comprise an inductiveelement comprised of any number of turns of Litz wire, magnetic wire,standard wire, conducting ribbon such as a trace on a printed circuitboard, and the like. In embodiments, implanted medical devices maycomprise magnetic materials, ferrites, and the like and may be optimizedfor specific frequencies or frequency ranges such as 13.56 MHz or 100 ormore kHz.

In embodiments, a patient may have more than one implanted device thatis wirelessly powered or recharged. In embodiments, multiple devices maybe powered or charged by a single source or by multiple sources. Inembodiments, multiple devices may operate at the same resonant frequencyor at different resonant frequencies. Either the source, repeater ordevice resonators may tune their frequency to receive or share power.

In embodiments, the magnetic resonators may comprise means forcommunication with other magnetic resonators. Such communication may beused to coordinate operation of wirelessly powered medical devices withother wireless systems. In an exemplary environment, an implanted deviceresonator may adjust its operating parameters in the vicinity of ahigh-power source of another wireless power system. In an embodiment, amedical device source may communicate with another wireless power sourcein a region and communicate with a patient to avoid or exercise cautionin such a region.

Embodiments comprising high-Q device resonators and optionally high-Qsource resonators allow for more efficient wireless power transfer andcan tolerate larger separation distances and lateral offsets of thesource and device resonators than traditional induction based systems.The high efficiency of the wireless power transfer systems describedherein reduces heating and heat buildup in resonators which may be ofcritical importance for resonators implanted in a patient. The describedresonators may transfer 5 watts or more or power while withoutsignificant heating of the elements such that the temperature of thecomponents does not exceed 50 C.

Tolerance to separation distance and lateral offset between an externalsource resonator and an implanted device resonator allows greaterfreedom of placement of the source resonator. The use of wireless powertransfer systems as described herein may also provide greater safety tothe patient since movements or displacements of the source resonatorwill not disrupt the power transfer to the implanted device.

In embodiments power may be transferred to the implanted deviceresonator from a source resonator that is worn by the patient in abackpack, hip pack, article of clothing and the like. For example, asdepicted in FIG. 138( a), source resonators 13804 may be embedded inclothing and worn by a person 13802, the source resonators 13804 may bewired to power and control circuitry and a battery (not shown) todeliver the power to the implanted device resonator (not shown). Inother embodiments the source resonators and power source may becontained in a backpack, or a bag as depicted in FIGS. 138( b), 138(c),and 138(d). A backpack 13806 or other bag 13812 may be integrated with asource resonator 13808, 13814 in a location such that when worn by thepatient the source resonator will be in substantial alignment with theimplanted device resonator in the patient. For example, for a deviceresonator implanted in the buttock or lower back, a backpack with asource resonator integrated into the lower back portion provides forsubstantial alignment of the source and device resonators when thebackpack is worn by the patient as shown in FIG. 138( d). In embodimentsthe backpack or bag may further comprise additional device resonators13810 for wireless charging of the internal energy storage or batterythat is inside the bag. The backpack may be placed near an externalsource resonator or charging station and charged wirelessly. In someembodiments the source and device resonators of the backpack or bag maybe the same physical resonator that alternates function between a sourceand a device depending on the use.

In embodiments external source resonator may be integrated intofurniture such as chairs, beds, couches, car seats, and the like. Due tothe tolerance to misalignment of the high-Q wireless power transfersystem described herein, device resonators may be integrated into thefurniture in areas of relative proximity to the implanted deviceresonators (i.e. within 25 cm) and transfer power to the implanteddevice resonator and implanted device while a patient is working at adesk and sitting in a chair, sitting in couch, driving, sleeping, andthe like.

In embodiments the wireless power transfer system for implantabledevices may include repeater resonators. Repeater resonators may be usedto improve the energy transfer between the source and device resonatorsand may be used to increase the overall coupling and power transferefficiency. As described herein a repeater resonator positioned inproximity to a device resonator may increase the wireless power transferefficiency to the device resonator from a distal source resonator.

In embodiments the repeater resonators are positioned to improve theenergy transfer between the source and the device. The position of therepeater resonators that provides the highest improvement in efficiencyor coupling may depend on the application, size of the resonators,distance, orientation of resonators, location of lossy objects and thelike. In some embodiments an improvement in wireless energy transferefficiency may be obtained by positioning the repeater resonators inbetween the source and device resonators. In other embodiments it may bebeneficial to position the repeater resonators angled or further awayfrom the source than the device. The exact placement of repeaterresonators may be determined experimentally with trial or error, withsimulation, or calculations for specific configurations, power demands,implanted devices and the like.

In embodiments of a system, repeater resonators may be positioned orlocated internal to the patient, or they may be located external to thepatient, or a system may have both internal and external resonators. Arepeater resonator may be internal or implanted into a patient. Arepeater resonator may be implanted under the skin of a patient toimprove the coupling to a device resonator. Since a repeater resonatordoes not need to be connected to a device it may be easier to positionor implant a larger repeater resonator than a device resonator that isconnected to an implanted medical device. The device resonator may haveto be implanted deeper inside a patient due to distance limitations orsize limitations between the resonator and the medical device. Therepeater resonators may comprise loops of a conductor like Litz wireconnected to a network of capacitors. The repeater resonator may beencased in flexible material or packaging such as silicon, or otherimplantable plastics. The whole structure may be implanted inside thebody under the skin to provide fine tuning of the wireless energytransfer between the external source and the implanted device.

In embodiments repeater resonators may be positioned outside, externalto a patient into articles of clothing, packs, furniture and the like.For example, larger repeater resonators with a diameter of 20 cm or moremay be integrated into an article of clothing such as a vest, robe, andthe like or an attachable pad and worn by the patient such that therepeater resonator overlaps or is in close proximity of the implanteddevice resonator. The repeater resonator may be completely passive or itmay have additional circuitry for power and control. Locating therepeater resonator in close proximity of the implanted device resonatoreffectively increases the size of the implanted resonator to a size thatis substantially or close to the size of the repeater resonator and mayallow more efficient wireless power transfer to the implanted deviceresonator and device over a larger distance. The repeater resonator maybe much larger than the resonator that is practical for implant in aperson.

In embodiments multiple repeater resonators, internal or external to thepatient, may be arranged in an array or a pattern around the body toallow wireless energy transfer from a source to an implanted device overa large range of offsets. Each repeater resonator may be specificallytuned or configured to provide adequate coupling to an implanted deviceresonator based on its relative location from the device resonator.

In embodiments a room, a bathroom, a vehicle, and the like may be fittedwith large source resonators to transfer sufficient power to the patientvia the repeater resonator allowing continuous power transfer andrestrictions on mobility while showering, sleeping, cooking, working,and the like.

In embodiments the repeater resonator may include wireless powerconverter functionality for translating wireless energy withincompatible parameters to oscillating magnetic fields with parameterscompatible with the implanted device resonator. A wireless powerconverter resonator integrated into a vest, bag, and the like may beworn by the patient and capture wireless power from a variety of sourcesand transfer the captured wireless power to the implanted deviceresonator with parameters compatible with the implanted deviceresonator. In embodiments the wireless power converter may be configuredto capture wireless power from solar energy, an RF source, movement,motion, and the like. In embodiments the repeater resonator may act as apower converter that limits the power delivered to the implanted deviceresonator preventing too much power from being delivered to the patient.

In embodiments, a repeater resonator or wireless power converter mayhave auditory visual or vibrational alerts when it no longer receivespower. A repeater resonator may detect when it is not coupled to theimplanted device or may detect that it is not receiving enough powerfrom an external source and may be configured to alert the patient.

In embodiments a fully integrated external source resonator, may beencased in a waterproof enclosure, including a rechargeable battery, RFamplifier, and a source resonator. The integrated source and circuitrymay be of a form factor that may be attached with a belt or a strapallowing the patient to go swimming or take a shower with the integratedsource intact. The integrated source and circuitry may also have aninternal battery charging circuit & rectifier, so it can be wirelesslycharged by switching the resonator and electronics to capture mode.

In embodiments of the system, the device and source and repeaterresonators may include a tuning capability to control heat dissipationin implanted resonators. During wireless energy transfer electriccurrents and voltages induced in the device resonator by the magneticfields of the source resonator may cause heating of the resonatorelements due to ohmic losses, internal losses, and the like. Animplanted resonator may have restrictions on the amount of heat it cansafely dissipate before raising the temperature of the surroundingtissue to an undesirable level. The amount of power that may be safelydissipated may depends on the size of the resonator, location of theresonator and the like. In some systems one or more watts of power maybe safely dissipated in a patient.

A source or repeater resonator, which is external to a patient, may bedesigned to tolerate higher levels of heat dissipation. The externalsource or repeater resonator may have higher limits of safe powerdissipation or heating. A source or repeater resonator that is externalto a patient may be designed to safely dissipate 5 watts of more of heatand may include active cooling means such as fans, or water cooling andmay be able to safely dissipate 15 watts or more of power. Inembodiments a wireless energy transfer system may control the amount ofheat dissipated in the device resonator. Since a source or repeaterresonator may be able to tolerate more heat dissipation than a deviceresonator, a wireless energy transfer system may be tuned to reduce theheat dissipation at the device resonator. A system tuned to reduce heatdissipation at the device may have higher overall heat dissipation withthe increased heat dissipation occurring in the source or repeaterresonator.

The heat dissipation in a device resonator may be controlled by reducingthe electric currents oscillating in the implanted device resonator. Thecurrents in the device resonator may be controlled by tuning theresonant frequency of the resonator. The currents in the deviceresonator may be controlled by tuning the impedance of the resonator.

In embodiments the device resonator may comprise one or more temperaturesensors along with monitoring circuitry and control logic. Upon thedetection of a temperature threshold the monitoring and controlcircuitry may detune the resonant frequency away from the resonantfrequency of the source or repeater resonator. The monitoring andcontrol circuitry may detune the resonant frequency above the resonantfrequency of the source or repeater resonator. The monitoring andcontrol circuitry may detune the resonant frequency below the resonantfrequency of the source or repeater resonator. The device may be detunedincrementally until the temperature of the device resonator stabilizes.In embodiments the frequency may be detuned by 1% or more or inincrements of 1 kHz or more.

As those skilled in the art will appreciate, the resonant frequency maybe changed with a variable component in the device resonator such as avariable capacitor, inductor, a bank of capacitors, and the like.

In embodiments the detuning of the resonant frequency of the deviceresonator may decrease the efficiency of energy transfer between thesource or repeater and device. To maintain the same level of powerdelivered to the device the source may be required to increase the poweroutput to compensate for the reduction in efficiency. In embodiments thedevice resonator may signal the source resonator of a temperaturecondition that may require an adjustment of its resonant frequency andalso the power output of the source resonator.

Similarly to controlling the resonant frequency, the effective impedanceof the device resonator which may affect the currents and voltages inthe resonator may be controlled by adjusting components of the resonatorsuch as inductance and the capacitance. In embodiments the impedance maybe tuned by changing the power requirements of the device, or bycontrolling the switching frequency, phase, and the like of therectifier or the switching dc to dc converter of the device.

A device resonator may continuously monitor the temperature of thecomponents and monitor and trends of the temperatures and adjust thefrequency and values of components to stabilize the temperature.

In embodiments the wireless energy transfer system may be tuned toreduce the heat dissipation in device resonators and distribute the heatdissipation to repeater resonators. Implanted repeater resonators may belarger than the device resonators and may be able to dissipate more heatthan a smaller device resonator. Likewise a repeater resonator may beimplanted closer to the skin of a patient thus allowing the repeaterresonator to be cooled through the skin with external cooling packs orpads worn by the patient.

Wireless Energy Transfer and Vehicle Safety Systems

Wireless power transfer may be used for powering, charging, ordelivering electrical energy to a vehicle. Power may be delivered to avehicle from one or more source resonators generating magnetic fieldsoutside of a vehicle to one or more device resonators on, under,alongside, attached to, and the like, a vehicle, for charging a vehiclebattery or for charging or powering electronic systems and devices in oron a vehicle.

Referring now to FIG. 139, a charging source resonator 13901 isintegrated with a garage floor 13907 so as to provide wireless chargingto an automobile 13902. In one embodiment, source resonator 13901 isembedded in floor 13907. In a second embodiment, resonator 13901 isfixed on top of floor 13907, such as by a plate bolted to floor 13907.In a third embodiment, resonator 13901 is implemented as a mat laid ontop of floor 13907. Resonator 13901 is part of a wireless vehiclecharging system, the other components of which are not explicitlyillustrated here. For clarity in this disclosure, other components ofthe wireless charging system can be considered to be represented byresonator 13901, even though such other components may actually belocated remotely from resonator 13901. A vehicle resonator 13911(sometimes referred to as a device, capture, drain or sink resonator)attached to automobile 13902 captures the energy transferred viaoscillating magnetic fields from source resonator 13901. In oneembodiment, device resonator 13911 is attached to the underside ofautomobile 13902 toward its midsection; in variations resonator 13911 islocated substantially toward the front or rear of automobile 13902. Instill other embodiments, resonator 13911 is integrated into part of thestructure, body or panels of automobile 13902. As a specific example,resonator 13911 may be shaped to fit into a vehicle's bumper section,allowing almost invisible design while being positioned withinreasonably close proximity to either a wall- or floor-mounted sourceresonator 13901. It should also be noted that where terms such as“charging” or “charger” are used herein they should be construed broadlyto include generalized power transfer, as opposed to just batterycharging.

In practice, it is found that in certain instances, extraneous objects(e.g., object 13910) disposed between source resonator 13901 and acorresponding vehicle resonator 13911 can alter the operatingcharacteristics of a vehicle charging system. Depending on the nature ofobject 13910 and its location, object 13910 can absorb some of theenergy being transferred by the system, resulting in heating of theobject 13910 and its surroundings.

For systems capable of wirelessly recharging vehicles such asautomobiles, the absorbed energy in object 13910 can cause it and thesurrounding area to become too hot to touch. For example, if automobile13902 leaves the charging area after hours of recharging, someonepicking up object 13910 could find it too hot to touch. Likewise, evenif the object is moved, a person or animal standing on the heated areacould be affected.

Accordingly, in one embodiment a sensor 13903 detects thermal conditionssignificant enough to result in a safety concern. As shown in FIG. 139,sensor 13903 is mounted on wall 13906 in front of the automobile. Invarious implementations for such wall-mounted configurations, aconventional thermal sensor 13903 such as an infrared camera orsolid-state sensor is aimed from wall 13906 to the area around resonator13901 and detects high temperatures anywhere in that area. In otherimplementations, a conventional heat sensor such as a thermistor-basedsensor is integrated directly in resonator 13901. In alternateimplementations, an array of such sensors is used to provide coveragefor a larger area of interest. In some embodiments, one or more thermalsensors 13912 comprising IR cameras, temperature gauges, and the likeare positioned around source resonator 13901, integrated into sourceresonator 13901, integrated into device resonator 13911, or attached toautomobile 13902. In some applications mounting sensors 13912 on theunderside of automobile 13902 may be preferable, as that locationtypically provides a clear view of the source resonator 13901 below.

Some inexpensive implementations of sensor 13903 such as unfocusedinfrared detectors may read vastly differently if their field of viewincludes areas that are being warmed due to other reasons, for instancesun beating down on floor 13907 or engine/exhaust system heat. To allowcontinued use of very inexpensive devices for sensor 13903, in suchsituations additional sensors are used to provide a level ofcalibration. In one embodiment, a sensor (not shown) is located abovethe automobile, for instance in the location of annunciator 13904, andis aimed to obtain a reference ambient temperature not indicative of aresonator-related heat issue. The difference in temperatures is thenused to determine whether there is an over-temperature situation relatedto charging of automobile 13902. In other embodiments a light indicatorrather than a heat indicator is used to determine whether sunlightfalling on floor 13907 is resulting in higher than expected temperatureindications from sensor 13903.

In some embodiments it may be possible to determine the source of atemperature increase by turning on and off the power transfer andexamining temperature readings to see whether they correlate or followthe modulation of power transfer. For example, if the safety systemsuspects (e.g., due to a high sensor reading) there might be an objectthat is being heated due to the wireless power transfer, the safetysystem may temporarily modulate the level of wireless power transfer ina prescribed or random temporal fashion. If heating or a temperatureincrease detected by a sensor follows the modulation of the power sourcethere may be a high likelyhood that the wireless power transfer iscausing a heating effect of a foreign object.

In some embodiments, sensor(s) 13912 calibrate the area around resonator13901 once a vehicle has parked but before charging is initiated. Thiscalibration procedure provides a baseline value for subsequent sensingso that temperature changes attributable to charging are more easilyidentified for mitigation or notification, as detailed herein.

Depending on the nature of the safety concern, an appropriate responseto a high temperature condition may vary. If a charging system is knownto be prone to overheating only in one particular location (a known hotspot), it may be most appropriate to actively cool that location if heatabove an acceptable threshold is detected. If the safety risk is one ofonly discomfort or minor injury, a warning to those nearby may be mostappropriate. In certain embodiments, upon determining an unacceptableamount of heating the charging power level is reduced so that thevehicle is still charged, albeit at a slower rate. In such a situation,it may be appropriate for the system to notify the vehicle owner with anindicator (e.g., via a wireless communication protocol, email message,text message, cell phone message) of this reduced charging rate. Thevehicle owner can then decide whether to return to the vehicle to clearthe object 110 causing the reduction in charge rate.

Accordingly, in one embodiment an annunciator 13904 is operativelycoupled to the sensor(s) 13903, 13912 such that it activates uponsensor(s) 13903, 13912 detecting high temperatures. In one embodiment,annunciator 13904 provides an auditory warning, such as a synthesizedvoice cautioning those nearby to be careful of high temperaturesunderneath the automobile. Alternatively, simpler notifications such aschirps, beeps and the like are used to warn those nearby. If moreinformation should be conveyed, a sign near the annunciator is providedto explain that when it is activated, there are high temperatures in thearea. In various environments, indicators other than such an annunciator13904 are more appropriate.

In some environments, the likelihood of high temperatures in thevicinity of resonator 13911 causing a safety issue may be minimal whenautomobile 13902 is still present, but increase markedly once automobile13902 departs, thereby leaving an open space into which pedestrians, orfor instance a dog on a leash, might venture. In such environments,sensor(s) 13903, 13912 include an integrated proximity sensor thatdetermines the presence or absence of automobile 13902, and onlyactivates annunciator 13904 when both (i) a high temperature situationis detected and (ii) automobile 13902 is no longer present.

As described above, annunciator 13904 provides an aural warning. Inother embodiments, visual warnings are provided. In simpleimplementations, the visual warnings are via solid or blinking lights,e.g., LED devices. In more complex implementations, electronic signsincluding text messages are provided. Depending on the environment andextent of the concern, pulsating, blinking or strobed lighting effectsare used to provide the appropriate amount of attention to the risk. Insome embodiments, a message is sent to the owner or other specified uservia phone, text, tweet, email instant message or the like.

Referring now to FIG. 142( a), in various embodiments arrays orarrangements of temperature sensors are integrated into the enclosure ofthe source or device resonators. In one embodiment depicted in FIG. 142(a), temperature sensors 14201 are deployed as an array on the top ofresonator 14201. The array of temperature sensors 14201 may be mountedon the inside of the resonator enclosure close enough to the top surfaceof the resonator to detect temperature differences due to hot objects ontop of the resonator. In other embodiments the temperature sensors 14204are integrated with the enclosure itself as encased within, or integralto, the packaging of the enclosure. In yet another embodiment thesensors 14202 are in a separate module substantially covering the top ofresonator 14201. The array of temperature sensors 14204 may be used andcalibrated to distinguish between localized heating due to a lossyobject placed on top of resonator 14201 or due to overall rise inambient temperature. For example, a higher temperature reading in one ortwo sensors may signify that a foreign object may be on top of theresonator and absorbing energy, whereas an overall rise in temperaturereadings of all the temperature sensors may signify changes in theambient temperature due to the sun, environment, and the like. Anability to make such a differential reading can eliminate any need forcalibration of the sensors, as only the relative difference betweentheir readings may be needed to detect a hot object. In someapplications, the output of the sensors 14204 is coupled to the powerand control circuitry of the source allowing the source control tochange its operating parameters to limit or reduce the heating of theforeign object. Lights 14202 on or near resonator 14201 such as LEDs,photoluminescent strips, or other light emitting sources are optionallyprovided to alert a user of a potentially hot object, based on theoutput of sensors 14201.

In an another embodiment, as depicted in FIG. 142( b), strips, wires,strings, and the like of heat sensitive material 14203 are arrangedacross the face of the source resonator 14201. The strips 14203 arecoupled to appropriate sensing circuitry to detect the changes inproperties of the strips 14203 due to heating from objects on top of theresonator and are used to control the power output or other operatingcharacteristics of the resonator or notify the user of possible hotitems on top of the resonator as described above.

In certain environments, a safety risk may be sufficiently large that awarning alone is inadequate. For instance, children might wander througha parking facility at a playground or school and try to pick up anobject 13910 that is hot. In such environments, active management of theoverheating is appropriate. Accordingly, in the embodiment of FIG. 139,a coolant dispenser 13905 is disposed on wall 13906 near floor 13907 andactivates upon detection of overheating. In a simple embodiment, coolantdispenser 13905 is merely a water nozzle with a solenoid-controlledvalve that opens when overheating is detected. In a related embodiment,the water spray is used for additional purposes as well, includingcleaning the underbody of the automobile (in one particular embodimentin combination with other car washing nozzles), cleaning oil, grease andother automotive fluids from floor 13907, and sweeping debris from floor13907. Other environments may call for more complex approaches. In oneembodiment, cooling tubes are integrated with resonator 13901.

In certain environments, the safety concerns related to overheating callfor reducing or turning off vehicle charging rather than, or in additionto, notification of an overheating condition or activation of a coolingmechanism. In one implementation for such environments, sensor 13903 iscoupled to the vehicle charger and an over-temperature indicationresults in fully or partially depowering the charger. In one embodiment,conventional interlock circuitry is used to implement such control sothat charging cannot take place if object 13910 is detected. Somevehicle charger designs make use of multiple source and deviceresonators; in such implementations one embodiment applies differentcombinations of resonator elements to permit some charging to continue,but in a manner that does not result in overheating. In someembodiments, the charging system includes a variable size source and thesize of the source may be varied to permit at least some charging tocontinue, but in a manner that does not result in overheating. In otherembodiments a wireless charging system includes multiple source anddevice resonators or an array of source and device resonators which maybe energized or powered in a manner that minimizes heating of theforeign objects. For example, in one embodiment a wireless chargingsystem may include one source and device resonator positioned toward thefront of the automobile and a second source and device resonatorpositioned towards the rear of the automobile. Temperature sensors maymonitor any abnormal conditions in between or around the source anddevice resonators and use the pair that produces the least amount ofheating, allowing the automobile to receive power despite a possibleobstruction.

Preventing overheating rather than reacting to overheating is preferablein certain environments. In such circumstances, sensor 13903 detects thepresence of an object 13910 that may result in overheating and takes theappropriate action (notification, clearing the object, shutting down ofthe charger) before any overheating occurs. In such environments, sensor13903 is implemented not to detect overheating itself, but the merepresence of an object likely to lead to overheating. In a simpleembodiment, light beams are used in a manner similar to garage doormechanisms to ensure the absence of humans or objects before closing thedoor. Conventional light curtains may provide a slightly morecomprehensive detection area. In certain implementations, digitalcameras and conventional machine vision systems are cost-effectivecomponents for sensor 13903, particularly if other systems relating tothe automobile or the vehicle charging system already employ suchcomponents for other purposes (e.g., assistance to a driver in parkingso that resonators are aligned). Some vehicles already have systems thatuse transmitted and/or reflected acoustic, microwave, RF, optical, andother signals for positioning, parking assist, collision avoidance andthe like; in appropriate environments minor modifications andenhancements to these systems may provide cost-effective supplements andalternatives to sensor 13903. For example, an automobile withlow-mounted LIDAR curb detection for parking assist is readily modifiedfor the LIDAR to face toward the resonator area, rather than toward acurb, while in a charging mode. Sensor(s) 13912 are also usable in someembodiments to detect presence of object 13910 in the same manner asdescribed above.

In various embodiments one or more pressure, temperature, capacitive,inductive, acoustic, infrared, ultraviolet, and the like sensors areintegrated into the source, device, source housing, vehicle, orsurrounding area to detect obstructions and foreign objects and/ormaterials between the source and device resonators. In criticalenvironments the sensors and safety system constantly monitor theresonator area for movement, extraneous objects, and any type ofundefined or abnormal operating condition. For example, a housingcovering resonator 13901 may include or may be mounted on top of apressure sensor that monitors the weight or forces pushing on theenclosure of source resonator 13901. Extra pressure or additionaldetected weight, for example, may indicate a foreign or unwanted objectthat is left on top of the source making it unsafe or undesirable tooperate the charging system. Much like operation of sensor 13903, outputfrom such a pressure sensor is coupled to processing elements of thecharging system and is used to stop or reduce wireless power transferwhen the sensor is tripped or detects abnormalities. As appropriate forthe particular environment the sensor is coupled to an auditory, visual,vibrational, communication link or other indicator to providenotification of charger interruption. In some embodiments multiplesensors, sensing multiple parameters, are used simultaneously todetermine if an obstruction or a foreign object is present. To preventfalse triggering, in some embodiments at least two sensors must betripped, such as a pressure and a temperature sensor, for example, toturn off the vehicle charger.

In a resonator implementation in which metal is the most likelysubstance to lead to overheating, one embodiment integrates sensor 13903via a metal detector. An advantage of such an implementation is thatconventional metal detector circuitry is based on inductive loops, whichcan be easily integrated with typical designs of resonators (e.g.,13901). Given the large mass of metal in automobile 13902, preferablysuch detector has an effective range shorter than the distance toautomobile 13902. A variety of conventional magnetometer architecturesare usable to sense presence of an object 13910. The frequency ofoperation and type of magnetometer are preferably chosen for reliableoperation in the presence of a large charging field; alternatively, suchmagnetometer is used before the charger is turned on, when it is atreduced power, or when it has been turned off, such as during temporaryinterruptions in charging to allow a magnetometer check.

In some resonator implementations, presence of an object 13910 likely tocause overheating may result in an operating parameter of the resonatorto vary from what would be expected. For example, the power transferfrom the charger may be noticeably reduced, the amplitude of an expectedvoltage or current may change, a magnetic field may be altered, areactance value of the resonator may change, and a phase relationship invehicle charger may change from what would be expected. Depending on theparticular implementation of resonators and other circuitry in thevehicle charger, an appropriate electrical parameter or set ofparameters is compared with a nominal value and such comparison is usedrather than, or in combination with, sensor 13903 to detect presence ofobject 13910. In some resonator implementations the system may monitorthe power input at the source as well as received power at the deviceresonator and compare that value to an expected or nominal value.Significant differences from a nominal value may mean that the energy isbeing dissipated in other objects or there may be an error in thesystem. In some resonator implementation the coupling factor k, thequality factor Q, the resonant frequency, inductance, impedence,resistance, and the like may be measured by the system and compared tonominal or expected values. A change of 5% or more of the parametersfrom their nominal values may signify an error in the system, or aforeign object and may be used as a signal to shutdown, lower the powertransfer, run diagnostics, and the like. For example, high-conductivitymaterials may shift the resonant frequency of a resonator and detune itfrom other resonant objects. In some embodiments, a resonator feedbackmechanism is employed that corrects its frequency by changing a reactiveelement (e.g., an inductive element or capacitive element). To theextent that such mechanisms are already present in a vehicle chargersystem, in certain embodiments they are employed to supplement and incertain environments replace sensor 13903.

Discussion above has primarily focused on detection and response basedon components that are part of the vehicle charger. In certainembodiments, portions of such circuitry are instead deployed at least inpart on automobile 13902 itself. For instance, line of sight from sensor13903 mounted on wall 13906 may be inferior to that achievable by asensor or array of sensors mounted on the underside of automobile 1102.Other advantages flow from such automobile-mounted implementations aswell. Sensors can easily be aimed directly below the automobile's deviceresonator and can be positioned so as to avoid sensingartifact-producing locations such as near exhaust system components,engine components, brake components and the like. In one suchembodiment, annunciator 13904 is also implemented in automobile 13902.In one specific example, the existing voice synthesis module used forthe automobile's GPS system is used to announce to the driver thatcharging will not occur because an object 13910 is detected beneath thevehicle, and that it should be cleared so that charging can commence.

Referring now to FIG. 140( a), an alternate embodiment that does notrequire any circuitry is based on the use of thermally sensitivematerials. In one specific embodiment, resonator 13901 is deployed withheat sensitive paint applied in an area 14001 overlapping resonator13901 and in an adjacent area 14003 such that if an object becomessufficiently warm, a portion of the area affected by the heated objectwill change color to warn of high temperatures. Preferably, adistinctive color change that provides a clear warning is used, such asfrom white to neon red/orange. In one embodiment, the paint is appliedthrough stencils such that a warning message 14002 (e.g., “HOT” of“Caution”) appears when the paint changes color.

By using heat sensitive paint, the functions of both sensor 13903 andannunciator 13904 are achieved together. Management functions can alsobe achieved in a “passive” manner that does not call for components suchas solenoid-controlled water valve/nozzle arrangements (e.g., 13905). Inone such embodiment, depicted in FIG. 140( b), a portion of resonator13901 is not merely flat, but is implemented in a pyramidal, crowned orconical shape 14005 such that an object 13910 is not likely to stay onresonator 13901. In a first implementation, such shape is achieved byusing a conventional form for the poured concrete, epoxy, Fiberglas orother material that makes up the remainder of the surface of floor13907. In certain environments, low loss materials such as Teflon,REXOLITE, styrene, ABS, delryn, and the like are preferable forimplementing area 14001 over resonator 13901 to provide both strengthand minimal interaction with the charging fields. In a secondimplementation, a mat including resonator 13901 and having a pyramidalshape is used to implement area 14001. In this implementation, thematerial of the mat itself rather than heat sensitive paint may changecolor with heat. In a related embodiment a thermotropic material is usedfor the mat such that heated areas of the mat rise to form a slopewherever a hot object is, gradually causing it to migrate off of theenergized area. Numerous thermotropic materials are known that change inappearance with temperature and can thus provide visual indication ofoverheating as well. An alternate embodiment achieves deformation byincluding a bladder in the mat such that by filling the bladder withair, water or another substance the shape of the mat changes to dislodgeforeign objects (e.g., 13910). In yet another implementation, area 14001is implemented as a wobbly surface, such as a pyramidal surfacesuspended at its apex from the floor by a short cylinder. By suchsuspension, the perimeter of such surface is nominally maintained ashort height (in one embodiment approximately 1 cm) above floor 13907such that when a vehicle or pedestrian walks over the surface, it movessufficiently that an object 13910 is likely to eventually roll or slideoff. Optionally, a drain area is integrated around the periphery of area14001 or 14003 so that melting snow and other debris readily migrateinto the drain. In environments where greater certainty of objectclearance is required, the supporting cylinder mentioned above is partof a piston subsystem that controllably provides vibration to thesurface to move objects off of resonator 13901. In some chargerimplementations, resonator 13901 is designed to be movable so as tooptimally align with a corresponding resonator in automobile 13902. Inthose implementations, the same mechanism used to achieve resonatoralignment is used to move/vibrate the surface so as to relocate object13910 from area 14001.

An alternative for clearing area 14001 of extraneous objects is aconventional sweeper/wiper mechanism (not shown) deployed from wall13906 or another convenient location. In one embodiment, the clearingmechanism operates immediately as a vehicle approaches area 14001 tominimize the likelihood that tools, trash or other materials get placedin area 14001 between the time of clearing and the time that chargingbegins. In some embodiments, this mechanism is engaged by operation ofan automatic garage door opener; in other embodiments a conventionalremote control is used. In an alternate embodiment, the clearingmechanism is capable of operation even when automobile 13902 is parkedover area 14001 so that materials such as melting ice from automobile13902 can be cleared while vehicle charging is taking place. This isimportant because it is found that winter slush sometimes includesextraneous materials such as metal debris (e.g., from broken snowplowbolts, salt spreading apparatus and the like). Once the slush melts, theresulting debris can cause the same high temperature conditions asdescribed above. As ferrous objects are found to be particularlysusceptible to heating, in one embodiment a magnetized wiper mechanismis used to more readily clear metal objects.

In environments in which slush is considered particularly problematic,water jets aimed at the underbody of the automobile dislodge slushquickly before charging commences. A particular advantage of such jetsis that if sufficient water is used, the water dripping from theunderbody onto area 14001 will eventually cause not only slush, but atleast small objects as well, to be dislodged from area 14001.

A related embodiment using water jets is well suited for warmerenvironments. This embodiment provides a relatively strong blast ofwater from above area 14001 just before the automobile arrives, thusclearing area 14001 of foreign material. An advantage of such anapproach is that it is readily integrable with other features ofinterest, such as a car rinse or car wash.

Not all vehicle charger resonators are deployed underneath anautomobile. In some applications, resonators are implemented in otherstructures. In one alternative implementation, source resonators areimplemented as horizontal barriers suspended from wall 13906 at a heightset to match a corresponding resonator in the front or rear bumper ofautomobile 13902. In another implementation, vertical posts set in floor13907, such as those commonly provided for protection of a wall orsupport column in a parking garage, serve as enclosures for sourceresonator 13901. Such varied implementations result in possible safetyissues that differ somewhat from the examples discussed herein. However,those skilled in the art will recognize that the principles disclosedherein can readily be applied to other implementations as well.

Referring now to FIG. 141, a wireless vehicle charger safety system14100 includes a detection subsystem 14101, a notification subsystem14102, and a management subsystem 14103. In certain environments, thenotification and management subsystems are not required. In otherembodiments, the various subsystems are implemented in an integratedmanner; the use of heat-sensitive paint as discussed in connection withFIG. 140( a) is an example in which the detection subsystem and thenotification subsystem are implemented in a unitary manner. Not shown inFIG. 141 are various interconnections that exist in certain embodimentswith other components of a wireless vehicle charger, such as interlockcircuitry that is controllable by the management subsystem. As shown inthis disclosure, the various subsystems are implemented in differentembodiments by electronic circuitry, electro-mechanical systems,chemical/materials-based approaches, fluid control systems,computer-implemented control systems, and the like. In practice it isfound that one particular application environment may be ill-suited foran approach that is optimal in a different application environment.Large trucks kept in a company loading facility call for differentsafety measures than passenger cars in a residential garage. In someembodiments, subsystems 14101-14103 operate with self-learning ortrainable algorithms designed to function in or with a wide variety ofenvironments, vehicles, sources, and systems and may learn or be trainedto operate in many environments after periods of supervised operation.In some embodiments, any or any combination of the detection subsystem14101, a notification subsystem 14102, and a management subsystem 14103,may be a stand alone module or subsystem. In other embodiments, any orany combination of the detection subsystem 14101, a notificationsubsystem 14102, and a management subsystem 14103, may be implemented atleast partially using resources already available on the vehicle.

Wireless Outdoor Light

Wireless power transfer may be incorporated into outdoor lightingapplications. A wireless power transfer system may be used to transferpower from a source resonator, through materials and/or structuresand/or over a distance, to a device resonator in lighting fixtures thatmay be located a distance from the source, that may be sealed,encapsulated, weatherproofed, and the like and that may be installedwithout requiring the connection of any electrical wires to the lightfixtures.

With wireless power transfer, a wireless power transfer enabled lightingfixture may be placed, mounted, secured, attached, and the like, in thevicinity of a wireless power source and receive power to providesecurity lighting, decorative lighting, utility lighting, safetylighting, signaling lighting, insect repellent lighting, and the like. Alighting fixture with wireless power capture capability may be placed,mounted, secured, attached, and the like where it may be difficult,impossible, impractical, inconvenient, or too expensive to placetraditional lighting fixtures which receive power from a wired powersource or from a portable power source such as a battery,super-capacitor or energy storage unit.

A lighting fixture with wireless power transfer capability may bemounted in locations where wired electricity, a junction box, a wiredoutlet, and the like, are unwanted or unavailable. With wireless powertransfer, a wireless power source may be located near or connected to atraditional wired power source such as a power outlet, a battery, anenergy storage unit, a generator, an engine, and the like, and thesource may wirelessly transfer power to a light fixture location. Inembodiments, the light fixtures may be located in a place wheretraditional wired power is not available. In embodiments, the lightfixtures may be located in a place where traditional wired power isdifficult to supply. In embodiments, the light fixtures may be locatedin a place where traditional wired power is available, but a wirelessapproach is preferred.

Outdoor wireless lighting fixtures may comprise lighting fixtures thatare used or located on the exterior of homes, buildings, sheds, tents,barns, and the like. Outdoor wireless lighting fixtures may compriselighting fixtures that are used or located on the exterior of vehiclessuch as cars, boats, ships, planes, trains, motorcycles, scooters,all-terrain vehicles, snow mobiles, carts, and the like. Outdoorwireless lighting fixtures may comprise multiple lighting fixtures thatmay exchange power with each other as well as with a wireless powertransmission source unit. Such strings or networks of light may extendthe distance, operating range, or performance of wireless lightingfixtures. Wireless lighting fixtures may be affixed to walls, roofs,doors, windows, hulls, decks, panels, clothing, racks, mounts,accessories, bumpers, handlebars, hoods, trunks, platforms, wheels,plants, posts, supports, and the like.

The position of traditional outdoor lighting fixtures for buildings orvehicles may be limited or restricted to prewired positions. Changingthe positions of those wired fixtures, or adding additional wiredfixtures may be difficult or undesirable and may require modification(s)of the exterior or structure of the building or vehicle and may affectthe integrity of the building, vehicle, lighting fixture, or theelectrical systems. Changes to the integrity of the building, vehicle,lighting fixture or electrical systems may included changes to theweather proofing, fire proofing, sound proofing, insulation, strength,and the like. Users or customers wishing to add traditional wiredexterior lights may be forced to pay for electrician services or skilledlabor to install or move wired lighting fixtures. In addition, it may bedifficult to make small adjustments to the wired fixture's position ororientation once it has been installed.

With a wireless power transfer system for lighting devices, a wirelesspower transfer source may be located near or connected to a wired poweroutlet, battery, energy storage unit, junction box, generator, engine,and the like, and wirelessly transfer power to a device resonatorattached to a lighting fixture which may be at a distance of severalmillimeters, several centimeters, or several meters away from thesource, at the desired light fixture location. A wireless power sourcemay be located inside or within a building, vehicle, wall, panel, roof,window, board, seat cushion, bumper, trunk, and the like, and the powermay be wirelessly transferred to a lighting fixture on the outside orother side of the building, vehicle, wall, panel, roof, window, board,seat cushion, bumper, trunk, and the like.

In the interiors of buildings, wired power outlets may be locatedthroughout the building, and may be positioned at regular intervals.These wired power outlets may drive wireless power sources that supplypower to wireless lighting fixtures that have been flexibly positionedon the inside or the outside of the building. In embodiments, a wirelesssource may be placed on the inside of the building in the vicinity ofthe desired location of the wireless lighting fixture. The indoor sourcemay be connected to a traditional household outlet or may be wired tothe interior household electrical system. If the source is placed insidethe building it may not need to be weather proofed or ruggedized foroutdoor use. Since the outdoor lighting fixture may not be hardwired, itmay be completely sealed with no exposed electrical wires or connectors.

A diagram of the components of an exemplary embodiment of a wirelesslighting system with a wireless lighting fixture is shown in FIG. 143.FIG. 143 shows a lighting fixture 14303 that may be mounted on theoutside of a building. In this figure, the region outside the building14301, is separated from the region inside the building, 14302, by awall, 14308. The lighting fixture, 14303, comprises at least onemagnetic resonator 14306, which may be integrated in the lightingfixture 14303 or the mounting hardware or may be connected to thelighting fixture 14303 in some other way. Inside the building 14302, thewireless power source 14310 comprises at least one source magneticresonator 14309 and power and control circuitry 14312 which is coupledto a power source such as a power outlet 14311 on the inside of thehouse. The source may be coupled to the power outlet 14311 with anelectrical cord 14313 allowing the source resonator to be placed invarious locations on the inside of the building, including locationsaway from the power outlet. The lighting fixture 14303 on the outside ofthe building may be positioned in a variety of locations including awayfrom the building, or attached to the building using any known fasteningmethods. Oscillating magnetic fields generated by the oscillatingelectrical currents of the source magnetic resonator 14309, penetratethe wall 14308 and induce currents in the magnetic resonator 14306 ofthe light fixture 14303.

The source and device resonators may be any type of the resonatorsdescribed herein such as a capacitively-loaded conducting wire loops orplanar resonators comprising capacitively-loaded conducting wire loopswrapped around magnetic materials. The resonators may be arranged inarrays or composed of multiple sized resonators or conductors asdescribed herein. The power and control circuitry may include impedancematching, and tuning circuits. The resonators may comprise printedcircuit traces or loops of printed circuit traces woven to reduce ACresistance as described herein.

A clear advantage of such a wireless lighting system is that it may beinstalled by unskilled labor and may not require electrician services orskilled labor for installation. A user may install a wireless lightingfixture by placing or fastening the wireless lighting fixture at theoutside of a building and connecting the wireless source to a powersource such as an traditional power outlet inside the building that isnear the location of the outdoor wireless lighting fixture.

In some embodiments it may be desirable that the source resonator insidethe building or vehicle and the device resonator attached to thelighting fixture be aligned, facing each other, or within apredetermined maximum separation distance to maintain proper operation,efficiency, and the like. To aid alignment the source or the devicemodules of the wireless power transfer system may comprise sensors,monitors, system controls, user feedback mechanisms, and the like, foraiding the user in attaining proper alignment or distance between thesource and device resonators. Sensors which measure or monitor, powertransfer efficiency, voltage, current, or phase of current of voltage onthe resonators may be used to determine alignment or distance betweenthe source and device resonators. The measured data may be translatedinto any number of visual, auditory, or vibration feedback signals tothe user.

In embodiments the wireless power transfer system for the light fixturemay comprise hardware and/or software for controlling the intensity ofthe light emitted from the lighting fixture including putting thelighting fixture into a power saving mode, turning the light on or off,turning the light on partially, intermittently, periodically, or inresponse to a change in a sensor output, and the like. In embodiments,the sensor may be a light sensor, a motion sensor, a thermal sensor, anacoustic sensor, and the like.

In embodiments, the amount of light generated by the outdoor lightfixture may be completely controlled by the power delivered by thesource resonator. For example, the outdoor lighting fixture may beturned on or off by turning on or off to power supplied to the sourceresonator inside the building. In some embodiments, the wirelesslighting fixture may be controlled by a switch that controls powerdelivery to the source. In another embodiment, the light fixture maycomprise a manual or automatic switch, or a sensor with appropriatedrive circuitry to control the intensity of the light emitted from thelighting fixture. In such embodiments it may be possible to maintainwireless power transfer from the source resonator to the deviceresonator and to modulate the intensity of the light emitted by thelighting fixture using components within the lighting fixture itself.

In some embodiments the device and source modules may have a signalingcapability that transfers information about the operating states of thevarious resonators to each other. In embodiments, the signalingcapability may be realized using a wireless communications channel ofthe types described herein. In other embodiments, the signalingcapability may be realized by changing the electrical properties of thesource and/or device resonators. A device module may monitor motionsensors, light sensors, acoustic sensors, thermal sensors, switchsettings, buttons, and the like of the lighting fixture to determine thedesired operating point for the light and may signal the source moduleto turn on or off as necessary.

In some embodiments the source module may have multiple power modes. Onepower mode may be used during normal operation when the outdoor light ison and drawing power. Another power mode may be used when the outdoorlight is off. The source may transfer a fraction of the available powerin lower power modes to minimize the energy consumption of the lightingfixture when less light is required or when only sensors, controlcircuitry and the like are consuming power. The source may switchbetween power modes as signaled by the device using wireless signaling,a wireless communication link, or by the device changing its electricalproperties as sensed by the source.

In embodiments the device module of the lighting fixture may comprise arechargeable battery, super-capacitor, power storage unit and the like,which may be used to power outdoor light sensors and control circuitrywhile the source module is turned off or in a quiescent state. In suchembodiments, the source may be configured to turn on periodically or asrequested by the device module to recharge the batteries of the devicemodule and lighting fixture or to power the lighting fixture.

In embodiments the device module and lighting fixture may include powerand control circuitry tailored specifically to the type of light orlight emitting part of the light fixture. In some embodiments, the powerand control circuitry in the device module 14307 may not includerectification circuits or AC to DC converters. In embodiments, thedevice resonator may be directly connected to a light emitting part. Inother embodiments, the device resonator may be connected to the lightemitting part after the resonator signal has been conditioned by avoltage clamp, a transformer, a switch, a converter, and the like.

In some embodiments the light emitting part of the light fixture mayrequire DC voltage, or voltage and currents at a specific frequency. Thepower and control circuitry may comprise AC to DC converters or AC to ACconverters that change or control the voltage frequency at theiroutputs.

In embodiments the source may include power and control circuitrytailored specifically to the type of light emitting part of the lightfixture. In some embodiments the source may drive the source resonatorat a specific frequency such that the voltages and currents at thedevice resonator may be directly coupled to the light emitting part ofthe light fixture. The power and control circuitry of the source mayinclude AC to DC and DC to AC converters to change the input voltage toan appropriate frequency and power level.

In some embodiments the power and control circuit may include a ballastcircuit which is powered by standard AC household current and outputs ahigh frequency oscillating voltage in the range of 1 kHz to 500 kHzwhich may be used to directly drive the source resonator. In someembodiments, the frequency of the oscillating voltage used to drive thesource resonator may be within the range of frequencies acceptable bythe light element of the light fixture and the light fixture or deviceresonator may not require additional AC to DC or AC to AC converters inthe light fixture. In some embodiments the light fixture or the lightelement may be connected directly to the resonator and be powereddirectly from the oscillating voltage of the device resonator notrequiring further voltage conditioning of conversion.

In some embodiments, the lighting fixtures may comprise different kindsof lamps and lights which may include, but may not be limited to,compact fluorescent lamps (CFLs), fluorescent tube and circline lamps,mercury vapor lamps, metal halide lamps, high-pressure sodium lamps,standard incandescent lamps, tungsten halogen lamps, reflector lamps,light emitting diodes (LEDs), and the like. In embodiments, the lightfixture may comprise housings, circuits, sockets, plugs, connectors,wires, and the like. The light fixtures may be smaller than the lightingelements or larger than the lighting elements. The light fixtures may beintegrated into clothing, bags, posts, bumpers, helmets, eyewear,pouches, racks, decks, vehicle accessories, building accessories, andthe like.

Appliances with Wireless Power Transfer

Wireless power transfer may be incorporated into household appliancessuch as refrigerators, washing machines, dishwashers, stoves, and thelike. A wireless power transfer system may be used to transfer power toor from household appliances or parts of household appliances, allowingportable electronics or sensors that are placed on, near, or inside theappliances to be powered or charged wirelessly from the appliances.

For example, in many homes the refrigerator is in a central locationand, in addition to food storage and preparation, may be used to displaymessages, photographs, drawings, reminders, lists, and the like. Inembodiments, items may be attached to a refrigerator using tape, hooks,permanent magnets, and the like. A refrigerator enabled with wirelesspower transfer may power or charge electric or electronic devices thatare placed on, near, or inside the refrigerator. Electric or electronicdevices may be placed on the refrigerator using permanent tape, hooks,magnets and the like. Devices such as televisions, monitors, displays,digital picture frames, lights, electronic writing pads, tablets, mobiledevices, cell phones, music players, cooking timers, electroniccookbooks, clocks, and the like may be attached to the fridge andwirelessly receive power from the fridge. In embodiments, mobile devicesmay be recharged while magnetically “stuck”, hooked, attached, or placedin any way onto the refrigerator door.

For example, a small television, or a monitor may be integrated with adevice resonator and power and control circuitry. Such a television ormonitor may then be attached to the refrigerator using hooks, magnets,clasps, and the like and receive power from a source resonatorintegrated in or attached to the refrigerator. Without power cables, thetelevision or monitor may be freely removed or repositioned as needed.Simple devices, such as small lights, or small speakers, may beintegrated with a device resonator and programmed to flash or sound ondemand, to serve as a reminder or to alert a person to a note or messageleft on the refrigerator or another message location in the home. Thesesmall lights or speakers may never require batteries and may be placedor removed from the refrigerator as needed.

In another example, the refrigerator may be used as charging locationfor electronics or electric devices. Devices such as cell-phones, mobiledevices, mobile handsets, remotes, and the like, may be attached to therefrigerator and receive power to recharge their batteries. The devicesmay have a magnetic back or any number of hooks, cables, clasps, and thelike to attach to the refrigerator.

Wireless power transfer may be used to power devices inside therefrigerator. Devices and sensors enabled with wireless power transfermay be completely sealed and resistant to the cold and moisture of therefrigerator and the food products inside. Smart internal appliances,such as ice trays that sense when the ice is out, may be powered by thesource and device resonators. Temperature sensors, sensors for checkingif food is spoiling by monitoring gasses, smart containers which monitorfood expiration dates and relay their data to an external display may bekept and powered inside the refrigerator. Items inside the refrigeratormay be catalogued and tracked using wirelessly powered sensors,transmitters, and readers, and the contents of the refrigerator may bedisplayed on a monitor on the front of the refrigerator. Smart trackingand organizing algorithms may be used to alert a consumer that certainitems need to be replenished or removed and may suggested items for theweekly shopping list.

As depicted in FIG. 144, source resonators for transferring powerwirelessly may be integrated into the doors 14403, 14404, the sides14401, or the top of the refrigerator 14402 and coupled to source powerand control circuitry (not shown). Source resonators may be integratedinto internal shelves inside the refrigerator.

Wirelessly powered or charged devices or sensors may be attached to theoutside, the outside door, the side or the top of the refrigerator orthey may be placed on the inside of the refrigerator, on the shelves orinside containers, and the like. Each device or sensor may be integratedwith its own device resonator and device power and control circuitry toreceive power transferred by the source, or multiple devices and/orsensors may share device resonators and power and control circuitry.

The source and device resonators may be any type of the resonatorsdescribed herein such as a capacitively-loaded conducting wire loops orplanar resonators comprising capacitively-loaded conducting wire loopswrapped around magnetic materials. The resonators may be arranged inarrays or composed of multiple sized resonators or conductors asdescribed herein. The power and control circuitry may include impedancematching, and tuning circuits. The resonators may comprise printedcircuit traces or loops of printed circuit traces woven to reduce ACresistance as described herein.

To accommodate wireless power transfer from sources inside therefrigerator or refrigerator panels to devices on the exterior of therefrigerator, some portion of the surface of the refrigerator may beconstructed using non-metallic and/or non-ferrous materials. Theseportions of the refrigerator may be covered using cover sheets made ofdifferent materials and the material choices may depend on whether ornot the wireless power transmission system is operating. In embodiments,the cover sheets may appear metallic, to match the texture and veneer ofthe rest of the appliance. In embodiments, the cover sheets may bedecorative or personalized, and sets of cover sheets may be used toprovide a variety of appearances for the exterior of the refrigerator.The cover sheets may be solid sheets, or they may contain cutouts, orthey may be shaped to only partially cover the wireless power transferarea so that wirelessly powered devices may be mounted next to the coversheets. The cover sheets may be made of materials that do notsignificantly perturb the wireless power transfer system so thatwirelessly powered devices may be mounted on top of cover sheets.

A diagram of one possible configuration is shown in FIG. 145. Acapacitively loaded conductor coil resonator 14502 may be integratedinto a door of a refrigerator 14501. This source resonator may bepowered using a wired connection to a wall outlet or a power connectorin the refrigerator or it may receive its power wirelessly, from anothersource resonator integrated in the body of the refrigerator. Inembodiments, power to devices in a refrigerator door, such as icedispensers, or the other devices described herein, may be preferentiallydelivered wirelessly because the wireless power system eliminates theneed failure-prone wires that cross moving joints such as a door hinge.The outer door 14503 may include magnetic materials to shape themagnetic fields toward the front of the door and/or toward any mounteddevices 14504 and their respective resonators 14505. The cover andcasing of the door 14503 covering the source resonator 14502 may includeareas of magnetic or metallic materials allowing devices 14504 to beattached to the door with magnets.

Wireless power transfer may be achieved using power sources attached tothe exterior of the refrigerator. These sources may comprise resonatorsof any of the varieties discussed herein. These sources may be attachedto the refrigerator using hooks, magnets, clasps, and the like. Thesesources may comprise field shaping elements to enable efficient powertransfer when the sources are mounted on metallic and/or ferrousmaterials. A diagram of an exemplary embodiment is shown in FIG. 146. Asource 14602 with a source resonator 14604 and power and controlcircuitry (not shown) may be attached to the outside of therefrigerator. The source 14602 may be attached permanently and wired tothe refrigerator and receive power from the refrigerator. In someembodiments the source may be placed temporarily or attached by a user.In some embodiments the source may have a power cord that may attach toa house hold power outlet (not shown) allowing retrofitting to anyrefrigerator. The source may be attached by magnets, glue, tape, screws,fasteners, and the like, to the refrigerator. In some embodiments it maybe preferable for the source to use so called planar resonatorsdescribed herein comprising a conductor wrapped around magnetic materialresulting in a magnetic field lines that are substantially in the planeof the refrigerator surface to which the source is attached, making thesurface an energized surface such that devices 14606 attached to thesurface may be wirelessly powered. Devices 14606 may be attached to,placed on, or placed near the energized surface and receive powerwirelessly from the source 14602. The devices 14606 may be placedanywhere on the energized surface. In embodiments with an externalresonator comprising a planar resonator source it may be beneficial forthe devices to use a planar device resonator. In embodiments, the source14602 and devices 14606 may include additional shielding to reducelosses due to metallic or ferrous material that may be part of thestructure of the refrigerator. Layers of magnetic material or sheets ortiles of good conductors or a combination thereof as described hereinmay be used to shield or guide magnetic fields away from the lossymaterials of the refrigerator or guide them towards, or in a paralleldirection the plane of the surface to which they are attached.

Wireless power transfer may be incorporated into a washing machine. Awireless power transfer system may be used to transfer power to devicesinside the washing machine, when the machine is idle, when the machineis running and washing clothes, when the machine is in a self cleancycle, and the like. A wireless power transfer may be used to transferpower to devices outside, on top, or on the side of the washing machine.Wireless power transfer may be used to charge or power devices on theexterior of the washing machine.

A wireless power transfer system may be retrofitted into existingwashing machines. Wireless power transfer source may be retrofitted intothe lid of a washing machine. A lid with a power connection and anintegrated wireless power transfer source may be used as a replacementfor existing washing machines to enable wireless power transfer.Wireless power transfer sources may be attached to the lid of a washingmachine, the side of the machine, the top of the machine as an add-on ora module installed by a technician or a consumer.

A wireless power transfer system may be integrated into the washingcompartment of the washing machine. A wireless power transfer source maybe integrated into central agitator of a washing machine allowing powertransfer to devices in the washing compartment of the machine. Awireless power transfer source may be integrated around the washingmachine compartment. The conductor of a source resonator may be shapedto fit around the outer diameter of the washing compartment transferringwireless power to devices inside the washing compartment. The conductorof a source resonator may be shaped to fit around the inner diameter ofthe washing compartment transferring wireless power to devices insidethe washing compartment. A wireless power transfer source may beintegrated into the side, top, or bottom panels of the washing machineand may transfer power to devices on the side, on top, or inside thewashing machine. In some embodiments it may be preferable to constructparts of the washing machine from non-metallic materials to reducewireless power transfer losses. In some embodiments the washingcompartment or the washing machine enclosure may be constructedcompletely or partially from non-metallic materials.

In embodiments the wireless power transfer source integrated orretrofitted into a washing machine may be used to transfer power todevices inside the washing compartment of the machine. The devices maybe integrated with device magnetic resonators and power and controlcircuitry described herein for capturing power from the source. In someembodiments the devices may be powered directly by the powered capturedby the device resonator. In other embodiments the devices may alsoinclude a rechargeable battery, super cap, energy storage, and the liketo recharge the battery, super cap, and the like allowing the device tooperate even when not directly receiving power from the source.

The devices in the washing machine may be powered or recharged duringthe machine's normal operation or when idle. In embodiments thewirelessly powered devices may include wirelessly powered agitators.Devices that vibrate, move, rotate, have rotating parts, may be placed,attached, mounted, screwed, and the like to the inside of the washingcompartment and provide additional or primary agitation or movement tothe washing compartment. Since the agitators may not require anyexternal power connections they may be easily upgraded or replaced. Theagitators may be devices that are dropped into the washing compartment.The ease of replacement may allow for specialized agitators for eachdifferent wash cycle, fabric type, and the like. A wirelessly poweredagitator device may be attached or placed inside the washing compartmentas needed for different wash cycles, temperatures, clothes, and thelike.

In embodiments the wirelessly powered devices may include wirelesslypowered sensors. Devices may include dirt, soil, cleanliness sensors. Asensor which tests the hardness of the water, the minerals in the water,particulates in the water, and the like may be used to adjust the washcycles to a necessary length and type or to continue a cycle untilclothes are clean or sensors do not detect more dirt or particles beingwashed from the articles in the machine. In embodiments the sensors mayinclude temperature sensors, detergent sensors, water sensors and thelike. The sensors may be used to adjust the wash cycles, or increasedetergent levels and the like.

In embodiments the wirelessly powered devices may include otherwirelessly powered devices such as smart detergent, fabric softener, andthe like containers. The containers may be fitted with electromechanicalvalves or release methods allowing controlled release of detergent intothe wash. The wirelessly powered devices such as agitators, sensors,other devices, and the like may include a wireless signaling capabilityto receive configuration and operation information from the washingmachine with regards to the agitation settings, times to power on oroff, release detergent, and the like.

In embodiments wireless power sources may be configured to provide powerto the outside of the washing machine such that devices placed on ornext to the washing machine can receive power for operation orrecharging. Power outside of washing machine may be used to rechargeagitators, sensors, and other devices for use inside the washing machinesuch that the devices may not require wireless power inside the washingchamber during operation of the washing machine and may be powered usingthe devices stored power. In embodiments wireless power may be used topower or recharge washing devices such as scrubbers or rotating brushesthat may be used for pretreating stains prior to washing. Wireless powermay be transferred to other appliances or devices placed next to thewashing machine, accessories like a clothes warmer installed on the sideof a washer may obtain power from the washing machine and not require aseparate plug and may be designed to be more modular or movable.

Wirelessly powered or recharged devices may be made completelywaterproof and chemical resistant since so external connections, cables,power ports are necessary. The whole device may be completely sealed towithstand detergents, water, heat, chemicals, and the like used in awashing machine. Likewise, the wirelessly powered devices may notrequire any electrical connections to the washing machine. Features,devices, sensors, and the like in a washing machine may be made modularand designed to be easily removable, upgradable, replaceable,reconfigurable, and the like. Consumers may be able to easily replacesensor modules as newer sensor technology is available, replace amalfunctioning device, or upgrade to new features by dropping a newdevice module into the washing compartment.

Although a washing machine was used as an example appliance above, itwill be clear to those skilled in the art that the same, or similardesigns may also be incorporated into dryers and dishwashing machines.Wireless power sources may be mounted or integrated into a dryer ordishwasher. The sources may be permanently integrated into theappliances or they may be installed by the consumers. The sources maywirelessly power devices inside the appliances such as sensors oragitators. For example, the dryer may have devices that vibrate or fluffthe clothes for extra softness. Dryer devices may release chemical,fluids, powders, or fragrances. The dryer may have devices to measurethe temperature or the moisture content of the clothes and adjust thedrying cycle or heat until the desired moisture content of the articlesin the dryer are obtained. A dishwasher may include wirelessly powerdevices that rotate, vibrate, or move to provide additional scrubbingaction for dishes. A dishwasher may include wirelessly powered sensorsfor sensing temperature, cleanliness of water, moisture content, and thelike which may be used to adjust control or indicate to the user thesuccess or length of washing, drying, or rinsing cycles.

In embodiments, a wireless power source may be integrated into the topof a dish washing machine such that when it is installed under a counterit creates an energized surface at the counter above the dishwashermachine. The energized surface may be used to power kitchen electronicsor appliances.

Wireless power may be incorporated into an oven transferring power todevices inside the oven. A wireless power source placed in the oven maybe used to wirelessly power a portable heating element. A device thatincludes a device resonator, power and control circuitry, and a heatingelement that uses converts the electric energy from the resonator intoheat may be used to accelerate cooking or baking inside the oven. Thewireless heating device may be placed inside baked goods, meat, andother food to allow heating from the inside which may accelerate thebaking, cooking, or heating process. In embodiments wirelessly poweredoven devices may include temperature sensors, some which may be placedinside of food to measure cooking temperature which may wirelesslysignal the control system of the oven or the user when a predeterminedtemperature or temperature for a predetermined threshold has beenreached.

Application Specific Charging/Boost Charging

Wireless power transfer may be used to provide full or supplementalpower for powering or charging specific electronic modules or circuits.Wireless power transfer may be used to provide power or supplement powerto specific circuits of a device or during specific operations of adevice. Supplemental power delivery may be used in portable or batterypowered devices to power specific operations or circuitry that may havesignificant power demands or whose operation may be controlled by anexternal source of power.

Wirelessly powered electronic modules incorporated into devices, such asbattery powered portable devices, may allow operations and applicationswhich may normally not be practical using battery power alone.

An electronic module may be integrated with wireless power transfercapability. Power for the electronic module may be provided by anintegrated wireless power device resonator. The electronic module may bepowered solely by the wireless power transfer system, or the wirelesspower transfer system may provide a portion of the power delivered tothe module with the rest being delivered from a battery source, asuper-capacitor, a power storage unit, and the like.

For example, a mobile device may be integrated with a high speedwireless data transfer module for transferring or broadcasting video toa television or sending or receiving large amounts of data. The highspeed wireless data transfer module may require considerable power forpowering the transceiver radios or the computing and processing circuitson the module. In some situations, the power requirements of the datatransfer module may be impractical for a battery powered device,requiring a large heavy battery, or severely limiting the operationaltimes of the battery-powered devices. Improved performancecharacteristics may be enabled by integrating in the electronic module adevice resonator and circuitry for capturing wireless power in awireless power transferred by a wireless power source. The electronicmodule may be at least partially powered by the power received by thedevice resonator, reducing the battery-power requirements of theelectronic module. In some systems the electronic module may usewireless power transfer to operate completely independently of thebattery. In some embodiments the electronic module may be configured tooperate only when wireless power transfer is active.

In one embodiment, the electronic module may be a high speedcommunication module operating at 60 GHz and capable of streaming dataat 1 Gbps or more and may stream video or send data wirelessly toenabled devices. The electronic module, as well as the devices withwhich the module communicates, may be integrated with resonators andcircuitry described herein for transferring power wirelessly in additionto the data. The electronic module may be integrated into a batterypowered mobile device that transmits streaming video signals tomonitors, televisions, computers, and the like. The display devices maycomprise source resonators that transfer power wirelessly to the videotransmitting module as the module operates, allowing transfer of videoand data signals without draining the batteries of the mobile device.Supplemental power transfer may be integrated into any number of moduleswith various functionalities including communication modules such asthose that employ close proximity near-field data transfer such asTransfer Jet, or other wireless data transfer standards such as wirelessUSB and the like.

Wirelessly Powered Computer Peripherals

Cordless computer peripherals and other electronic devices may require aportable energy source such as a battery or batteries to operate.Devices such as wireless keyboards, computer mice, cameras, microphones,mobile handsets, and the like are often powered by batteries. As theenergy of the batteries is drained, the batteries need to be replaced orthe devices plugged into a power source for charging. This mode ofoperation can be problematic since the electronic devices cannot be usedif replacement batteries are unavailable. Likewise, when a device isconnected to a wired cord for charging it may not be used freely sincethe charging cord may restrict the movement of the device.

The aforementioned problems are overcome in with a wireless energytransfer system that may power or charge a plurality of computerperipherals and other devices at the same time. The system may use oneor more sources comprising magnetic resonators that may transfer energywirelessly to other magnetic resonators integrated or coupled to thecomputer peripherals or electronic devices. Using appropriate magneticresonator design, a small magnetic resonator may be attached, coupled,integrated, or located near a computer or monitor (also referred to as adisplay, computer screen, LCD display, LED display and the like), andtransfer energy over a distance, via an oscillating magnetic field, tomultiple magnetic resonators attached to or integrated in theperipherals and other electronic devices. The power transferred may besufficient to directly power or recharge batteries inside theperipherals.

Power may be transferred from the source or sources to the device ordevices over a distance allowing the peripherals to be charged orpowered while in their natural position in front of a computer ormonitor.

In some systems, the distance, distribution, number of peripherals thatcan be powered or charged may be enhanced by the use of passive,intermediate, magnetic resonator repeaters.

In some systems, the power transfer system may use wirelesscommunication channels to transfer status and tuning information betweenthe source, peripherals, other devices, computer, and the like, toexchange status information, control the power transfer, or optimize thepower transfer. In some systems, the power transfer system may use theoscillating magnetic field mediating the power transfer to transfer orsense status and tuning information between the source, peripherals,other devices, computer, and the like to exchange status information,control the power transfer, or optimize the power transfer.

In this section describing an application of wireless power transfer wemay refer to computer peripherals and give examples of peripherals suchas computer mice or keyboards. It is to be understood that computerperipherals may refer to a wide range of electric and electronic devicesand is not limited to those listed. In the scope of this disclosure anyportable electronic device, such as a cell phone, keyboard, camera,mobile handset, and the like, and any usual workspace electronic devicessuch as printers, clocks, lamps, headphones, external drives,projectors, additional displays, and the like, may be considered acomputer peripheral and is applicable to the methods and designsdescribed.

In this section describing an application of wireless power transfer wemay refer to a source coupled to or integrated into a computer. It is tobe understood that a computer is used as a generic term encompassingmany various display and computing electronic devices including computermonitors, all-in-one computers, laptops, desktops, notebook computers,televisions, and the like.

A diagram illustrating features of one example system is shown in FIG.147. FIG. 147 depicts a computer 14714 with a source 14711 coupled to apower source (not shown) which transfers energy wirelessly and over adistance to magnetic resonators 14716, 14717 integrated into twoperipherals 14712, 14713. The source may be coupled to a power sourcevia a connection internal to the computer or a connection external tothe computer such as a USB port, or a power plug, for example. Thesource may be coupled directly to a power source and it may share powerwith a variety of other components in the system. The power source maybe turned up and down or on and off in response to commands, algorithms,programs, operational parameters, and the like, running in the computer.The power supplied by the power source may be adjusted in response tothe power requirements of the peripherals and/or in response to usersettable operational modes such as power saving modes, hibernationmodes, stand-by modes, screen-saver modes, enhanced performance modes,and the like.

Preferably, the source comprises at least one high-Q magnetic resonatorthat is coupled to power and control circuitry 2302 which may beintegrated into the source 14711 or integrated into the computer 14714.The magnetic resonators of the source may be planar magnetic resonatorscomprising a conductor or conductors wrapped around a core or cores ofmagnetic material. Alternatively, the magnetic resonators of the sourcemay be capacitively-loaded magnetic resonator loops or any combinationof magnetic resonator structures described herein.

Although FIG. 147 depicts the source 14711 attached to the computer14714 at the bottom location of the computer screen, it should be clearto those skilled in the art that many alternative locations andpositions may also be satisfactory. For example, the source may beattached to the base of the computer 14715, the side, the back, and thelike depending on the exact materials and configuration comprising thecomputer. In notebook computers for example, a source may be located inthe lip or lid of the notebook computer.

Preferably, the computer peripherals that require power may be coupledor are integrated with at least one magnetic resonator and may becoupled to power and control circuitry 2304 that may control the powertransfer between the source and the peripheral as well as any power orvoltage regulation that the computer peripheral circuitry or batteriesmay require. The magnetic resonator of the peripheral may be a planarmagnetic resonator or resonators which comprise a conductor orconductors wrapped around a core or cores of magnetic material.Alternatively, the magnetic resonators may be a capacitively loadedconductor formed in a loop or loops. The magnetic resonators of thecomputer peripherals may be high-Q magnetic resonators and may have aquality factor of at least 100.

In the system, the source generates an oscillating magnetic field. Theoscillating magnetic field causes current flow in the conductors of themagnetic resonators of the computer peripherals thereby transferringenergy to the peripherals.

In some systems, the source magnetic resonators and the device magneticresonators of the computer peripherals may include shielding. Theshielding may be placed in between the magnetic resonator and any lossycomponents or materials near the resonator. For example, a sourcemagnetic resonator 14711 attached to the bottom of a computer 14714 mayhave a layer or a sheet of a good conductor like copper placed betweenit and the casing of the computer. In some systems, the shielding mayinclude a layer of magnetic material between the resonator and theconductor sheet or layer to improve the power transfer efficiency and/orto shape the fields used in the wireless power transfer system asdescribed herein.

In an experimental system, the source 14711, comprising one magneticresonator is attached to the bottom of the computer as shown in FIG.147. In this system, the computer is an “iMac” computer, also referredto as an “all-in-one desktop” computer. A more detailed, exploded viewof the source assembly is shown in FIG. 152. In the experimental system,a planar magnetic resonator 15203 is attached to the bottom of thecomputer 14714 with a cover 15201 that is made from ABS plastic.Low-loss tangent materials are typically chosen for the source anddevice resonator housings. The source magnetic resonator 15203 is aplanar resonator comprising a 160 mm×20 mm×3 mm core of magneticmaterial with a single piece of litz wire conductor wrapped around thecore such that it forms 30 loops that are coaxial with the largestdimension of the core. The resonator has a quality factor, Q, ofapproximately 500 and a perturbed quality factor, Q_((integrated)) of135, when mounted to the bottom of the computer as shown in FIG. 147.The magnetic resonator is positioned such that its dipole moment isparallel with the bottom edge of the computer. A thin sheet of a goodconductor 15202, in this case copper, is placed between the magneticresonator and the computer casing to reduce losses due to the materialof the casing of the computer and/or losses due to the materials insidethe computer. The source power and control circuitry (not shown) isintegrated inside the computer housing and directly coupled to the endsof the litz wire conductor of the source resonator that are routedthrough the case of the computer to the power and control circuitry. Thesource power and control circuitry comprises the components describedearlier as shown, for example, in FIG. 40 and includes the impedancematching network between the source resonator and the power amplifier.The impedance matching network uses the network shown in FIG. 30 h,where an inductor L₂ is in series with the resonator. The source powerand control circuitry is connected to an internal 5V power source in thecomputer.

In the experimental system two peripherals, a computer keyboard and acomputer mouse, are each integrated with a device magnetic resonator. Inthis demonstration system, the keyboard is an “Apple Wireless Keyboard”.The wireless keyboard is fully functional even as it is wirelesslypowered, as described herein.

A more detailed, exploded view of the experimental computer keyboardwith the wireless power transfer system is shown in FIG. 151. In theexample system the computer keyboard 14713 is integrated with planarmagnetic resonator 15102 and optionally a rechargeable battery 15105.The energy transferred to the device resonator may be used to rechargethe battery allowing the keyboard to operate even when removed from thecharging zone or active area of the system.

In the computer keyboard a planar magnetic resonator 15102 comprising a90 mm×10 mm×6 mm core of magnetic material 15103 with a single piece oflitz wire conductor 15104 wrapped around the core such that it forms 35loops coaxial with the largest dimension of the core is used. The deviceresonator has a Q of approximately 500, and a perturbed Q,Q_((integrated)) of approximately 113, when integrated in the keyboardas shown in FIG. 151.

The magnetic resonator is integrated into the keyboard in the at leastpartially vacated battery compartment situated along the front edge ofthe keyboard and oriented such that the dipole moment of the resonatoris parallel to the longest dimension of the keyboard. In some computerkeyboards, the main body or housing of the keyboard may include metallicmaterials or sections that may block the magnetic field of the source.In such at least partially metallic keyboards, the device resonator maybe situated in a portion of keyboard that does not include metallicmaterials, or may be situated in a position where the keyboard housingmay be altered to remove the metallic section. The removed metallicmaterials or sections may be replaced with a cover or housing made fromlow loss materials such as have been described herein. In the examplesystem, the resonator 15102 is integrated into the housing of thekeyboard behind a cover 15101 made from ABS plastic, and designed tomaintain the original size and form of the “Apple Wireless Keyboard”.This section of the keyboard may have originally housed the batterycompartment for the wireless keyboard. In computer keyboards where thehousing or body comprises a non-lossy material, the device resonator maynot require a cover or window of a different material. Optionally, athin sheet of copper shielding (not shown) may be placed between themagnetic resonator and the lossy materials of the keyboard.

The device power and control circuitry may also be integrated within thekeyboard next to, along the side, at the end of the device resonator andoptional rechargeable battery. Alternatively, the device power andcontrol circuitry may be mounted on the bottom of the keyboard or behindthe keyboard and directly coupled to the two ends of the conductor ofthe device resonator integrated into the keyboard. One of ordinary skillin the art will recognize that the placement of the resonator orresonators, power and control circuitry, and optional battery orbatteries, may be determined by industrial or artistic designconsiderations, as well as by performance specifications.

A more detailed exploded view diagram of the experimental computer mouseis shown in FIG. 153. In the experimental system, the computer mouse15303, 15301 (14712 shown in FIG. 150) includes a planar magneticresonator 15302 comprising a 50 mm×35 mm×3 mm core of magnetic materialwrapped with a single piece of litz wire conductor to form 35 loops thatare coaxial with the largest dimension of the core. The magneticresonator is integrated into the inside of the mouse and oriented suchthat the dipole moment of the resonator is parallel to the longestdimension of the mouse and has a quality factor of approximately 500,and a perturbed quality factor of approximately 411 when integrated inthe mouse. The resonator is mounted above the circuitry and electronics(not shown) of the mouse and the device power and control circuitry (notshown).

In the experimental system, the source is able to transfer energy toboth of the computer peripherals to power or to charge the batteries ofthe device peripherals even when the peripherals are placedapproximately 20 cm away from the source. The effective active area ofthe experimental system in front of the computer may be approximatelyrepresented by the area 14931 outlined in FIG. 149. The shape and extentof the active area 14931, is determined by the shape, size, orientation,and structure, of the source and device resonators, by the poweravailable to the source and by the power required by each peripheraldevice. In this experimental system, the source and device resonatoractive areas may be approximated by single-axis dipole patterns, and maycontain so-called “dead spots” where power transfer efficiency isreduced in a sub-region of the effective active area. Such dead spotsmay be minimized or eliminated using other resonator designs discussedherein, and by using source and/or device power adjustment algorithmsand techniques described herein. Note that the effective active area inthis experimental system extends behind the computer as well, but may beimpacted by the stand used to hold the “all-in-one” computer anddisplay.

As those skilled in the art will appreciate, the parameters of theresonators may be changed or optimized based on design criteria such assize and power requirements and the exemplary values given for thesystem should not be viewed as limiting. For example, in each instance asingle planar resonator was described multiple resonators may be usedand oriented at orthogonal angles, or a single planar resonator withmultiple conductors at orthogonal angles may be used to improve theomni-directionality and uniformity of the active area of the system.

In the experimental system the computer peripherals may include one ormore rechargeable batteries that may be used to power the peripheral.These batteries may allow the devices to operate even when they aremoved outside of the active area. Whenever the peripherals are placedinside the active area, the batteries may be recharged. As a consequenceof the large active area in front of the computer the peripherals may berecharged while in their normal operating positions in front of thecomputer and may require only a small and lightweight rechargeablebattery for the times when the devices are occasionally removed from theactive area. The use of rechargeable batteries in these computerperipheral applications may greatly reduce the demand for disposablebatteries. Such reduced demand for disposable batteries may have apositive environmental, economic, and/or health impact.

For some computer peripherals the device resonator, shielding, power andcontrol circuitry, and possibly a small rechargeable battery may becombined into a module that fits into the battery compartment, replacingnormal batteries, of a traditional battery power peripheral. Somedevices can be retrofitted with this wireless power transfer technologyby inserting the module into the existing battery compartment to enablewireless power transfer.

In some power transfer systems the source may be configured to turn onduring specific times or during predetermined operating conditions. Forexample, the source may be configured to turn on or be active when thecomputer or peripherals are not in use. In some systems the source maybe configured to turn on at specific times of the day when the user isknown to be less active such as at night. In other systems the sourcemay be configurable by the user to turn on or off at specific times oron demand.

In some systems, the source, or the source and device resonators mayrequire active tuning to maximize, optimize, or control the powertransfer. The active tuning of the power transfer may involvecommunication between the peripherals and the source or the peripheralsand the computer to which the source is attached. Likewise tuning andcontrol communication may also be between peripherals. The communicationmay be channeled through the communication channels of the peripherals.For example, many peripherals contain communication capability such asBluetooth, Wifi, and the like. Alternatively, the power transfer systemmay have its own separate communication subsystem utilizing any numberof wireless data transfer methods and technologies.

In some systems, the communication can be used to allow user control andmonitoring of the power transfer system. Communication between theperipheral devices and the computer and, the computer and the source maybe used by the computer to display and control the power transfer. Auser interface on the computer may be created to allow a user to turnthe power transfer on or off, or to monitor the charging of theperipherals, or adjust any of the operating parameters of the system. Insome systems, the oscillating magnetic field used for power transfer maybe used to transfer or sense status and tuning information between thesource, peripherals, other devices, computer, and the like to exchangestatus information, control the power transfer, optimize the powertransfer, or adjust the power transfer in any way.

In some systems the source may be permanently integrated into thecomputer and the control and power circuitry may be integrated with thecircuitry of the computer. In other systems the source may be movable tocustomize the active area or the charging zone of the system. Forexample, for a right handed person an active area or charging zone thatis more to the right of the computer may be more desirable since that isthe typical location of the computer mouse while a left handed personmay require that the active area or charging zone be to the left of thecomputer. The source may be mounted such that it can swivel, slide,extend, retract, or move in any direction of orientation, to allowmodification of the active area. In other systems, the source may be acompletely separate unit from the computer and may be powered from anexternal source or a port, such as a USB port, on the computer and maybe attached to a computer or monitor using any number of variousfasteners, adhesives, magnets, and the like. In other systems, thesource may be a completely separate unit from the computer and may bepowered from a battery pack, a solar cell, a fuel cell, a wall plug, apower supply, or any type of power source.

In some embodiments of the system, passive repeater resonators may beused to extend and enhance the active area or the charging area of thesystem, or used to eliminate regions of weaker charging. A passiveresonator, which is a resonator that is not connected to a power source,may be placed near the source to capture and transfer the energy. Thepassive repeater may comprise any number of resonators of variousconfigurations such as planar resonators or capacitively loaded loopsand may be tuned to the frequency of the source. The passive repeatermay be a separate module or may be integrated into another computerperipheral. FIG. 148 shows an exemplary system with an exemplary passiverepeater 14821. The repeater may be moved freely to optimize the activearea. For example, to extend the active area of the computer mouse14712, the passive repeater 14821 may be placed substantially betweenthe source 14711 and the mouse 14712. Alternatively, a passive repeatermay be placed on the bottom edge of a computer 14822 to extend or modifythe active charging area.

In some embodiments a repeater or intermediate resonator may beintegrated into a computer peripheral. For example, the computerkeyboard may have an additional repeater resonator oriented to extendthe active area of the source to the side of the keyboard to power orcharge a mouse that is typically placed on the side of the keyboard forexample.

In some embodiments a device resonator in a peripheral maysimultaneously receive and deliver power to a device, and serve as apassive repeater for other resonators in the system. In someembodiments, resonators may be operating simultaneously as device andrepeater resonators, or they may be switched from one function to theother, periodically, or in response to some control algorithm.

In some embodiments a passive repeater resonator may be used to transferenergy around a material or object that would otherwise block energytransfer. For example, FIG. 150 shows an arrangement that allows energyto be transferred around a blocking material by using a passiverepeater. In some embodiments an active source resonator 15041, which isa resonator coupled to an energy source, may be required to becompletely integrated into a computer or behind the computer. Thecircuit boards and housing of the computer may contain lossy material ormetallic materials that may attenuate, block, or redirect the magneticfield, reducing the efficiency of the power transfer to the resonatorsof the peripherals. An additional passive repeater resonator 15042 maybe placed below the active resonator 15041, for example, to transferenergy around the blocking material to the resonators in the computerperipherals 14717, 14716. When the passive resonator is placed in thebase 14715 power is transferred through the resonator in the basewithout requiring a separate power connection to the base.

While the invention has been described in connection with certainpreferred embodiments, other embodiments will be understood by one ofordinary skill in the art and are intended to fall within the scope ofthis disclosure, which is to be interpreted in the broadest senseallowable by law. For example, designs, methods, configurations ofcomponents, etc. related to transmitting wireless power have beendescribed above along with various specific applications and examplesthereof. Those skilled in the art will appreciate where the designs,components, configurations or components described herein can be used incombination, or interchangeably, and that the above description does notlimit such interchangeability or combination of components to only thatwhich is described herein.

All documents referenced herein are hereby incorporated by reference.

What is claimed is:
 1. A vehicle powering wireless power receiver,comprising: an array of electromagnetic resonators configured forattachment to the vehicle, wherein each resonator in the array comprisesa magnetic material and a coil comprising a plurality of loops ofconducting material encircling the magnetic material; and a load coupledto the array and to a drive system of the vehicle, wherein eachresonator in the array is oriented so that electrical currentcirculating within the resonator's coil generates a magnetic dipolemoment that falls within a plane defined by the resonator's magneticmaterial; and wherein the array is configured to receive power from aresonant, non-radiative wireless power source and to deliver power tothe load.
 2. The wireless power receiver of claim 1, wherein the arrayis configured to be disposed on an under-carriage of the vehicle.
 3. Thewireless power receiver of claim 1, wherein the vehicle is an electricvehicle.
 4. The wireless power receiver of claim 1, wherein the vehicleis a hybrid vehicle.
 5. The wireless power receiver of claim 1, whereineach of the resonators in the array is individually controllablerelative to the other resonators and can be activated or de-activated toregulate power transfer between the power source and the power receiver.6. The wireless power receiver of claim 1, wherein at least a portion ofthe array is moveable relative to the power source while power istransferred from the power source to the power receiver.
 7. A vehiclewireless power system, comprising: a wireless power source comprising atleast one electromagnetic resonator and a power supply coupled to the atleast one electromagnetic resonator, wherein the wireless power sourceis configured to be positioned in proximity to the vehicle; and awireless power receiver comprising an array of electromagneticresonators configured for attachment to the vehicle, wherein eachresonator in the array comprises a magnetic material and a coilcomprising a plurality of loops of conducting material encircling themagnetic material, wherein each resonator in the array is oriented sothat electrical current circulating within the resonator's coilgenerates a magnetic dipole moment that falls within a plane defined bythe resonator's magnetic material; and wherein the power receiver isconfigured to couple to the power source to provide resonant,non-radiative wireless power transfer from the power source to the powerreceiver.
 8. The wireless power system of claim 7, wherein the powerreceiver is configured to be disposed on an under-carriage of thevehicle.
 9. The wireless power system of claim 7, wherein the vehicle isan electric vehicle.
 10. The wireless power system of claim 7, whereinthe vehicle is a hybrid vehicle.
 11. The wireless power system of claim7, wherein each of the resonators in the array is individuallycontrollable relative to the other resonators and can be activated orde-activated to regulate power transfer between the power source and thepower receiver.
 12. The wireless power system of claim 7, wherein atleast a portion of the array is moveable relative to the power sourcewhile power is transferred from the power source to the power receiver.13. The wireless power receiver of claim 1, wherein at least some of theresonators in the array are aligned so that their magnetic materialsdefine a common plane.
 14. The wireless power receiver of claim 13,wherein each of the at least some of the resonators is spaced from theother ones of the at least some of the resonators in the common plane.15. The wireless power receiver of claim 14, wherein each of the atleast some of the resonators is spaced from the other ones of the atleast some of the resonators in the common plane by an air gap.
 16. Thewireless power receiver of claim 15, wherein each air gap has a width of0.2 cm or more.
 17. The wireless power receiver of claim 15, whereineach air gap has a width of 2 cm or less.
 18. The wireless powerreceiver of claim 1, wherein: a first plurality of one or more of theresonators in the array are aligned so that their magnetic materialsdefine a first common plane; and a second plurality of one or more ofthe resonators in the array are aligned so that their magnetic materialsdefine a second common plane spaced from the first common plane in adirection normal to the first common plane.
 19. The wireless powerreceiver of claim 18, wherein the first and second common planes areparallel.
 20. The wireless power receiver of claim 18, wherein the arrayis a three-dimensional array comprising rows of resonators extending inthree orthogonal directions.
 21. The wireless power receiver of claim 1,wherein the array comprises two resonators.
 22. The wireless powerreceiver of claim 1, wherein the array comprises four resonatorspositioned in a 2×2 array.
 23. The wireless power receiver of claim 1,wherein the array comprises eight resonators positioned in a 2×2×2array.
 24. The wireless power receiver of claim 1, wherein at least someadjacent resonators in the array have a common helical direction definedby their respective coils, and wherein the respective coils of the atleast some adjacent resonators in the array are offset from one anotherin the common helical direction.
 25. The wireless power receiver ofclaim 24, wherein the respective coils of the at least some adjacentresonators in the array are interleaved in the common helical direction.26. The wireless power system of claim 7, wherein the wireless powersource comprises an array of electromagnetic resonators.
 27. Thewireless power system of claim 26, wherein each of the resonators in thewireless power source can be activated or de-activated to regulate powertransfer between the power source and the power receiver.
 28. Thewireless power system of claim 26, wherein each of the resonators in thewireless power source is oriented so that electrical current circulatingwithin the resonator's coil generates a magnetic dipole moment thatfalls within a plane defined by the resonator's magnetic material. 29.The wireless power system of claim 26, wherein the wireless power sourcecomprises a three-dimensional array of rows of resonators extending inthree orthogonal directions.
 30. The wireless power system of claim 7,wherein at least some of the resonators in the power receiver array arealigned so that their magnetic materials define a common plane.
 31. Thewireless power system of claim 30, wherein each of the at least some ofthe resonators is spaced from the other ones of the at least some of theresonators in the common plane.
 32. The wireless power system of claim31, wherein each of the at least some of the resonators is spaced fromthe other ones of the at least some of the resonators in the commonplane by an air gap.
 33. The wireless power system of claim 32, whereineach air gap has a width of 0.2 cm or more.
 34. The wireless powersystem of claim 32, wherein each air gap has a width of 2 cm or less.35. The wireless power system of claim 7, wherein: a first plurality ofone or more of the resonators in the power receiver array are aligned sothat their magnetic materials define a first common plane; and a secondplurality of one or more of the resonators in the power receiver arrayare aligned so that their magnetic materials define a second commonplane spaced from the first common plane in a direction normal to thefirst common plane.
 36. The wireless power system of claim 35, whereinthe first and second common planes are parallel.
 37. The wireless powersystem of claim 35, wherein the power receiver array is athree-dimensional array comprising rows of resonators extending in threeorthogonal directions.
 38. The wireless power system of claim 7, whereinthe power receiver array comprises eight resonators positioned in a2×2×2 array.
 39. The wireless power system of claim 7, wherein at leastsome adjacent resonators in the power receiver array have a commonhelical direction defined by their respective coils, and wherein therespective coils of the at least some adjacent resonators in the arrayare offset from one another in the common helical direction.
 40. Thewireless power system of claim 39, wherein the respective coils of theat least some adjacent resonators in the power receiver array areinterleaved in the common helical direction.